Experience
Volumes run to date: Pilot Scale
Yield data:
Lessons learned:
Proprietary
Obstacles to implementation:
Design tools, simulation ability, major OEM qualification, regulatory (UL)
qualification, established test standards and PCB processes
Outline
Material Technology and History
PCB Processing
Basic Electrical and Material Properties
Environmental Data
High-Frequency Electrical Data
Summary
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2
Electrode (Cu)
Dielectric (k)
Thickness (t)
Electrode (Cu)
Capacitance
Capacitanceper
perunit
unitarea
area(C/A)
(C/A)isisproportional
proportionalto
tokkand
and
inversely
inverselyproportional
proportionalto
tott
3M
3M uses
uses aa very
very thin
thin layer
layer (<25
(<25 microns)
microns)of
ofaaprecision
precision
coated
loaded
polymer
coated loaded polymer
Vary
VaryC/A
C/Aby
byvarying
varyingthickness
thickness(t)
(t)
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1996 - 1999
DARPA Program
1998 - 2000
1999 -
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4
PCB Processing
Supply panels up to 18.5 wide
Pattern Capacitors
C-Pl y layer
8 micron
2
Capacitance/area
10 nF/in
Adhesion (1 peel)
>4 lbs.
T260 Life
>5 mins.
Dielectric Constant
16
meet X7R
Dielectric Strength
~130 V/m
Breakdown
>50 V
Tolerances
10%
Copper Thickness
35 m
Environmental Testing
Test
Property
Change
Capacitance
Thermal Cycle
Capacitance
High Humidity
(85C/85% RH)
TMA (T260)
Capacitance
Dissipation Factor
Life
5-15% Increase*
0.4% to 0.9%*
>5 minutes**
THB
Life
ESD
Short
Capacitance
None
No Change
UL Approval
Various
In Process
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7
1.5
1-1-1
1-2-1
1 -3 - 1
1 -3 - 1
1-3-1
1-3-1
FR4
FR4+d
BC2000
Hi-K
EM C A P
C-Ply
Volts
0.5
-0.5
-1
-1.5
-2.5
-2
-1.5
-1
-0.5
0.5
1.5
2.5
x 10 ns
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1 GHz to 3 GHz
3 GHz to 5 GHz
-5
dBm
-10
-15
-20
-25
-30
-35
-40
No Caps (FR4)
Decoupling
Caps
BC2000
EmCap
HiK DuPont
3M C-Ply
Material
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