Freescale Semiconductor
MPXV5004G
Rev 12, 09/2009
MPXV5004
MPVZ5004
Series
0 to 3.92 kPa
(0 to 400 mm H2O)
1.0 to 4.9 V Output
Application Examples
Washing Machine Water Level
Ideally Suited for Microprocessor or
Microcontroller-Based Systems
Appliance Liquid Level and Pressure
Measurement
Respiratory Equipment
Features
1.5% Maximum Error for 0 to 100 mm H2O over +10 to +60C with Auto Zero
2.5% Maximum Error for 100 to 400 mm H2O over +10 to +60C with Auto Zero
6.25% Maximum Error for 0 to 400 mm H2O over +10 to +60C without Auto Zero
Temperature Compensated over 10 to 60C
Available in Gauge Surface Mount (SMT) or Through-Hole (DIP) Configurations
Durable Thermoplastic (PPS) Package
ORDERING INFORMATION
Device Name
Case
No.
# of Ports
None
Single
Pressure Type
Dual
Gauge
Differential
Absolute
Device
Marking
1351
MPXV5004GC6T1
482A
MPXV5004DP
MPXV5004G
MPXV5004GC6U
482A
MPXV5004G
MPXV5004GC7U
482C
MPXV5004G
MPXV5004GP
1369
MPXV5004GP
MPXV5004GPT1
1369
MPXV5004GP
MPXV5004GVP
1368
MPXV5004GVP
482
MPVZ5004G
MPVZ5004G6U
482
MPVZ5004G
MPVZ5004G7U
482B
MPVZ5004G
MPVZ5004GC6U
482A
MPVZ5004G
MPVZ5004GW6U
1735
MZ5004GW
MPVZ5004GW7U
1560
MZ5004GW
Pressure
SMALL OUTLINE PACKAGES THROUGH-HOLE
MPVZ5004G7U
CASE 482B-03
MPXV5004GC7U
CASE 482C-03
MPVZ5004GW7U
CASE 1560-02
MPVZ5004G6U/6T1
CASE 482-01
MPXV5004DP
CASE 1351-01
MPVZ5004GW6U
CASE 1735-01
MPXV5004G6U/6T1, MPVZ5004GC6U
CASE 482A-01
MPXV5004GVP
CASE 1368-01
MPXV5004GP/GPT1
CASE 1369-01
MPXV5004G
2
Sensors
Freescale Semiconductor
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.0 VDC, TA = 25C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Units
Pressure Range
POP
3.92
400
kPa
mm H2O
Supply Voltage(1)
VS
4.75
5.0
5.25
VDC
IS
10
mAdc
VFSS
3.0
4.0
Offset(3)
VOFF
0.75
1.0
1.25
V/P
1.0
V/kPa
1.5
2.5
6.25
Supply Current
kPa)(2)
Sensitivity
Accuracy (4) (5)
MPXV5004G
Sensors
Freescale Semiconductor
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Symbol
Value
Unit
PMAX
16
kPa
Storage Temperature
TSTG
30 to +100
TA
0 to +85
Operating Temperature
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
2
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Thin Film
Temperature
Compensation
and Calibration
Circuitry
Sensing
Element
3
GND
VOUT
qualification test for dry air, and other media, are available
from the factory. Contact the factory for information regarding
media tolerance in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the MPxx5004G to the A/D input of
the microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Typical, minimum and maximum output curves are shown
for operation over a temperature range of 10C to 60C using
the decoupling circuit shown in Figure 3. The output will
saturate outside of the specified pressure range.
Fluorosilicone
Gel Die Coat
Die
Stainless
Steel Cap
P1
Thermoplastic
Case
Wire Bond
Lead Frame
P2
Differential Sensing Element
Die Bond
MPXV5004G
4
Sensors
Freescale Semiconductor
Pressure
+5 V
OUTPUT
Vout
Vs
IPS
1.0 F
GND
0.01 F
470 pF
5.0
5.0
TRANSFER FUNCTION:
Vout = VS*[(0.2*P) + 0.2] 6.25% VFSS
VS = 5.0 Vdc
TEMP = 10 to 60C
4.0
4.0
3.0
MAX
Output (V)
Output (V)
3.0
TYPICAL
2.0
MIN
1.0
0
TRANSFER FUNCTION:
Vout = VS*[(0.2*P) + 0.2] 2.5% VFSS
VS = 5.0 Vdc
TEMP = 10 to 60C
TYPICAL
2.0
MIN
1.0
2.0
1.0
MAX
3.0
4.0
1.0
2.0
3.0
4.0
Part Number
Case Type
MPXV5004DP
1351
MPXV5004GC6U/6T1,
MPVZ5004GC6U
482A
MPXV5004GC7U
482C
MPXV5004GP/GPT1
1369
MPXV5004GVP
1368
MPVZ5004G6U/6T1
482
MPVZ5004G7U
482B
MPVZ5004GW6U
1735
MPVZ5004GW7U
1560
MPXV5004G
Sensors
Freescale Semiconductor
Pressure
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE
MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
0.100 TYP 8X
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
0.100 TYP 8X
2.54
inch
mm
SCALE 2:1
MPXV5004G
6
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
-A-
D 8 PL
0.25 (0.010)
4
5
T B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
-BG
8
1
N
H
-TSEATING
PLANE
PIN 1 IDENTIFIER
DIM
A
B
C
D
G
H
J
K
M
N
S
INCHES
MIN
MAX
0.415 0.425
0.415 0.425
0.212 0.230
0.038 0.042
0.100 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0
7
0.405 0.415
0.709 0.725
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
5.38
5.84
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0
7
10.29
10.54
18.01
18.41
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
SURFACE MOUNT
-A-
D
4
0.25 (0.010)
8 PL
M
T B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
-BG
8
1
V
C
H
J
-TK
PIN 1 IDENTIFIER
DIM
A
B
C
D
G
H
J
K
M
N
S
V
W
INCHES
MIN
MAX
0.415 0.425
0.415 0.425
0.500 0.520
0.038 0.042
0.100 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0
7
0.444 0.448
0.709 0.725
0.245 0.255
0.115 0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0
7
11.28
11.38
18.01
18.41
6.22
6.48
2.92
3.17
SEATING
PLANE
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
SURFACE MOUNT
MPXV5004G
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4
5
B
G
8
1
0.25 (0.010)
T B
D 8 PL
S A
DETAIL X
S
PIN 1 IDENTIFIER
C
T
SEATING
PLANE
DIM
A
B
C
D
G
J
K
M
N
S
INCHES
MIN
MAX
0.415
0.425
0.415
0.425
0.210
0.220
0.026
0.034
0.100 BSC
0.009
0.011
0.100
0.120
0_
15 _
0.405
0.415
0.540
0.560
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
5.33
5.59
0.66
0.864
2.54 BSC
0.23
0.28
2.54
3.05
0_
15 _
10.29
10.54
13.72
14.22
K
M
J
DETAIL X
CASE 482B-03
ISSUE B
SMALL OUTLINE PACKAGE
THROUGH-HOLE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
-A4
5
-BG
0.25 (0.010)
8
1
T B
D 8 PL
S
A
S
DIM
A
B
C
D
G
J
K
M
N
S
V
W
DETAIL X
S
W
PIN 1
IDENTIFIER
-T-
INCHES
MILLIMETERS
MAX
MAX MIN
MIN
10.79
0.425 10.54
0.415
10.79
0.425 10.54
0.415
13.21
0.520 12.70
0.500
0.864
0.66
0.034
0.026
0.100 BSC
2.54 BSC
0.28
0.23
0.011
0.009
3.05
2.54
0.120
0.100
15
0
15
0
11.38
0.448 11.28
0.444
14.22
0.560 13.72
0.540
6.48
6.22
0.255
0.245
3.17
2.92
0.125
0.115
SEATING
PLANE
K
M
J
DETAIL X
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
THROUGH-HOLE
MPXV5004G
8
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
SURFACE MOUNT
MPXV5004G
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
SURFACE MOUNT
MPXV5004G
10
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 3
CASE 1368-01
ISSUE B
SMALL OUTLINE PACKAGE
SURFACE MOUNT
MPXV5004G
Sensors
Freescale Semiconductor
11
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 3
CASE 1368-01
ISSUE B
SMALL OUTLINE PACKAGE
SURFACE MOUNT
MPXV5004G
12
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 3 OF 3
CASE 1368-01
ISSUE B
SMALL OUTLINE PACKAGE
SURFACE MOUNT
MPXV5004G
Sensors
Freescale Semiconductor
13
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPXV5004G
14
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPXV5004G
Sensors
Freescale Semiconductor
15
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 3
1560-03
ISSUE C
SMALL OUTLINE PACKAGE
MPXV5004G
16
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 3
CASE 1560-03
ISSUE D
SMALL OUTLINE PACKAGE
MPXV5004G
Sensors
Freescale Semiconductor
17
Pressure
PACKAGE DIMENSIONS
PAGE 3 OF 3
CASE 1560-03
ISSUE D
SMALL OUTLINE PACKAGE
MPXV5004G
18
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 3
CASE 1735-02
ISSUE B
SMALL OUTLINE PACKAGE
MPXV5004G
Sensors
Freescale Semiconductor
19
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 3
CASE 1735-02
ISSUE B
SMALL OUTLINE PACKAGE
MPXV5004G
20
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 3 OF 3
CASE 1735-02
ISSUE B
SMALL OUTLINE PACKAGE
MPXV5004G
Sensors
Freescale Semiconductor
21
MPXV5004G
Rev. 12
09/2009