ADS Advanced Design System

2012 EEsof
2012/10/23
Volume 1
Time
Title
Speaker
Title
Speaker
Title
Speaker
Registration and Welcome
0830-0900
Juergen Hartung
0900-0940
Comprehensive RF Microwave Solutions for Wireless Applications

Agilent
Move to
Tracks(10)
Track A(RF and Mixed Signal IC Design)
Track B(Wireless and Digital system design)
0950-1040
A1: Integrated ElectroRick Poore

Thermal Solution Delivers
Thermally Aware Circuit
Agilent
Simulation
B1: Validating of
Ming-Chih Lin
Communication System
Design in C, Matlab, HDL
Agilent
Codes with SystemVue
1040-1130
A2: A complete Designer- Shuang Cai

Oriented Device Model
Verification Solution for
Agilent
Advanced Technology
B2: FPGA Simulator Work

with SystemVue
Aldec
Break & Product Fair
1130-1150
1150-1230
A3: Comprehensive
Hsieh-Hung Hsieh
Milimeter Wave Solutions
for TSMCs 60GHz CMOS
PhD,TSMC
Reference Design Kit
B3: The Agilent EEsof

Integrated EDA Design
Flow for High Speed
Digital Designers: PreLayout, Post-Layout,
Measurement
JS Wu
A4: WIN PDK in ADS
Environment Introduction
WINSEMI
1400-1440
A5: Addressing the RF

Needs in Nano-Scale
Wireless Platforms
Jason Chen
Agilent
Juergen Hartung
1500-1530
A6: Complete mm-Wave
Front-to-Back RFIC
Design Flow
Agilent
1530-1600
1650-1700
Agilent
B4: The Signal Integrity

and Power Integrity
Analysis by ADS
Craig Wang
B5: Power Integrity

Analysis for High Speed
PCB Design Using ADS
Eric Kuo
Silicon Motion
Gemtek
C4: System-Level Design Keven Chang

& Verification for Flexible
OFDM with SystemVue
Agilent
C5: Automating On-Wafer Abby Shih
Measurements with the
New Agilent IC-CAP
Agilent
WaferPro
Break & Product Fair
1440-1500
1600-1650
Heidi Barnes
Lunch
1230-1330
1330-1400
Track C(Test measurement implementation with

Simulation technology)
A8: Real World CMOS PA

Jason Chen
Design for Mobile
Applications with
Advanced Simulation
Agilent
Technologies
B6: Using ADS Momentum

Jack Hu
to Differentiate Signal
Integrity Issue Happening
on Board Level or Chip
TomTom
Level
B7: Consideration of High- Nick Chin
Speed Connector's Signal
Integrity with EMPro and
JETCONN
ADS
B8: SI, PI and EMI in High Ming-Chih Lin
Speed Digital Design with
ADS
Agilent
Survey & Lucky Draw
Yoshiyuki Yanagimoto
C6: GaN Doherty Amplifier

Design Using XParameters
Agilent
Comprehensive RF
Microwave Solutions for
Wireless Applications
Dr. Juergen Hartung

RFIC Product Marketing &
Foundry Program Manager
Agilent EEsof
October 2012
Agenda
Introduction RF/MW Design Challenges
Agilent EEsof RF/MW Solution
Device Modeling
MMIC
Silicon RFIC
3D RF Components
RF Modules
Whats New in ADS 2012

Summary & Outlook
1-1
RF/MW Design Challenges The Tablet Example
Data
Wi-Fi 802.11a/b/g/n
Communications
4G LTE
possible: 802.11ac
Also: LTE-Advanced, MIMO
Location
A-GPS
possible: Galileo, Beidou, GLONASS
HSPA, HSPA+
DC-HSDPA
Personal Connectivity
Bluetooth v4.0
Also: GSM/EDGE, WCDMA,

Multi-Standard Radio (MSR)
possible: 802.11ad/WiGIG
o Increasing Integration Multiple different complex systems placed in close proximity

o Increasing design complexity and compaction
o Concurrent design teams across companies
o Verification across design domains (IC/package/board)
3
Increasing RF content in a Tablet

Pictures are courtesy of chipworks
Murata/Peregrine SP6T
Rx diversity switch module
Tablet includes 7 PA modules:

TriQuint Quad-Band GSM
Avago Band 4 LTE
Triquint
GSM PA module
Avago Band 17 LTE

Skyworks Band 5 UMTS/HSPA
Skyworks Band 8 UMTS/HSPA
Skyworks 77468-16
W-CDMA/HSDPA/HSPA+
PA and duplexer module
Avago Band 2 UMTS/HSPA

Murata/Panasonic Dual-Band
Avago
Band 4 PA module
RF Modules require
further integration!
1-2
Integration-dependent design challenges

Smaller, cheaper, more integration, lower power consumption
Small-Scale Chips + Module
Single Large-Scale Silicon Chip (SoC)
if it can
be done in
silicon, it
WILL be
done in
silicon
SMT
components
or integrated
on IPD chip
Embedded
passives
Picture is courtesy of chipworks
More functionality
on chip
Additional chips
III-V technologies
or Silicon RFIC
New packaging
techniques
explored (TSV,
3DIC, PoP, etc.)
Higher levels of integration, lower cost

Low breakdown voltage, Low device
gain, High loss on-chip inductors,
linearity issues, poor RF models
SMD Component Designer

L, C, Filter, Active Devices
RF/MMIC
Designer
PA, LNA
RF SiP / Module
Designer
PAM, TxRx
Antenna Designer
SMD Ant, A/D Ant
Connector Designer
SMA, USB, HDMI
GaAs
Silicon
RF/MW Design Segments Application

perspective
Package
Designer
QFN, BGA
RF Board Designer *
Radio module
Modeling Engineer
GaAs, Si, SiGe,
GaN, LDMOS
RF SoC Designer *
Transceiver IC
System Integrator
Tablet, Handset, Radar, Base
station,
*) Pictures are courtesy of chipworks
1-3
RF/MW Design Segments Flow perspective
MMIC
RFIC
RF Module
RF SiP
RF Board
Design/Implementation Challenges per Segment

Complete characterization of
component level designs
3
IC design enablement beyond

broad and qualified PDK support
2
1
Accurate device models
for emerging technologies
1-4
Integration challenges with

multi-technology designs
1 Accurate Device Models for Emerging

Technologies
NeuroFET Model
(Extract in IC-CAP, Simulate in ADS)
Artificial Neural Network Measurement-based FET Model

Complete Solution: data acquisition, extraction and simulation in ADS)
Equations and derivatives are infinitely continuous
Accurate 2nd, 3rd, Nth order effects
Robust RF & DC convergence
Symmetric: switch, mixer & amplifier applications (Vds<=0)
Measured vs. Simulated
Better than current data-based models
Improved convergence
Improved small-signal distortion
More accurate S-parameters vs. bias
More accurate PAE
More accurate than Compact Models
Applications: GaN, InP, GaAs
10
1-5
Fund
2nd
3rd
4th5th

3

2
1

11
2 MMIC/RFIC Design Enablement
12
1-6
Complete ADS Desktop Design Flow

Agilent EEsof Chip/Module/Board Design
MMIC
Most widely used MMIC Design Platform!
13
ADS 2011 PDK Support GaAs / GaN

G28V3
G28V4
G40V4
G50V3
under dev.
InGaP HBT - P2
InGaP HBT D1
ED02AH
D01PH
FD30
FD25
TQTRx
HP07
TQHiP
D01MH
TQHBT3
PH25
InP SHBT1 InP DHBT2
TQPED
PPH25X
H01U-xx H02U-xx MP15-01 PL15-xx
D007IH
TQP13
HB20M
THz Schottky
Diode
GaN HEMT
0.25um
GaN HEMT
0.50um
DH15IB
TQP15
TQP25
HB20P
TQRLC
TQBihemt
BES100
PP10-xx PP15-xx PP25-xx PP50-xx PS50-xx PH50-xx PD50-xx
Paper: WIN PDK for ADS, by JS Wu (WINSEMI)
1-7
>40
Getting started with MMIC Design

MMIC Design Seminar Material
Seminar Videos
Presentations & Demos
ADS projects
Hands-on Workshops
X-Parameters
http://www.agilent.com/find/eesof-mmic-seminar
ADS2011 Complete MMIC-Module-MultiTech

Design - JS
Page 15
ADS 2012 Electro-Thermal Simulator
Applications: high power RFIC / MMIC

design
Deliver thermally aware circuit

simulation results by including effects
of on-chip temperature rise
Include effects of package and PCB
Easy to set up and use from within the

ADS environment
Works with all simulation types:

DC, AC, SP, HB, Transient, Envelope
ADS Schematic
ADS Layout
Integrated Thermal Solver
Paper: Integrated Electro-Thermal Solution Delivers

Thermally Aware Circuit Simulation, by Rick Poore
16
1-8
17
ADS for Silicon RFIC Applications

Small-scale RFIC
Si RF Components
Front-end modules (PA, Mixer, LNA-Mixer) or Antenna switches in
CMOS-SOI starting to displace discrete GaAs power components
Si-MMICs
Silicon components and transceivers for millimeter wave products,
like Optical Networks ( 10 to 40Gb/s), Automotive Collision
Avoidance, 60GHz WLAN
IPD
Integrated Passive Device (IPD) silicon process technology for
the production of passive devices such as baluns, filters, couplers,
and diplexers that are used in portable, wireless and RF
applications
LDMOS
RF power transistors used for basestation, broadcast /
ISM and aerospace & defense applications
18
1-9
ADS 2011 Extending towards Silicon RFIC

Design
Schematic Entry
Simulators
System
Circuit
EM
Data Display
Layout
DRC/LVS
DFM support
Major (& continued) improvements with ADS 2011
19
Agilent Technologies Advanced Design System Selected by

Sivers IMA for Front-to-Back Silicon RFIC Implementation
We are expanding our peak-performance millimeter wave product

portfolio toward silicon-based, proprietary MMIC designs to leverage the
advantages of higher integration and reduced cost,
said Christer Stoij, chief technology officer at Sivers IMA.
We selected ADS for the complete front-to-back implementation of
corresponding devices because it delivers proven RF circuit
simulation, integrated EM solvers and RF-relevant backend support.
ADS is designed for our type of application, allowing us to introduce new
unique products for E-band and V-band radio links, with full control of the
millimeter wave architecture.
20
1-10
ADS 2011 RFIC Design Flow Status

Inputs from System-level
Proven ADS front-end solution for RFIC

Schematic Entry
Major advantages through integrated EM

ADS layout provides all relevant capabilities
Circuit Design &

Simulation
Automatic Metal Fill to be added
Assura & Calibre DRC support for sign-off
Layout
ADS DRC covers most recurring checks
ADS LVS natively supported without need

for dedicated rule files
DRC/LVS
Calibre LVS supports complements offering

EM Extraction
EM-based extraction through Momentum

Parasitic Extraction support to be added
GDSII or SOC integration
Paper: Complete mm-Wave front-to-back

RFIC Flow, by Juergen Hartung
21
ADS 2011 PDK Support SiGe / BiCMOS / IPD

Full Front-to-Back PDKs
BiCMOS8HP
Front-end PDKs
CMRF7SF
CSOI7RF
CSOI7RF
BiCMOS8HP
BiCMOS5PAe
under dev.
SG25H3
SG13S
SG25H1
SG13G2
BiCMOS9MW
SGB25V
under dev.
under dev.
TSL018
CA18HB
CA18QC
SBC18H3
CMOS065 RF
H9SOI RF
BiCMOS7RF
BiCMOS9MW
BiCMOS6G
H9SiGe
SBC18HA SBC18H2 SBC18HXL

CS13Q1
under dev.
CM013RF
IPD 0.18um
CM090rf
New
High-Q IPD
22
1-11
018CMOS
SIGE018
CM055
ADS 2011 RFIC Design Flow Licensing & Bundles

ADS Platform
Schematic Entry
Circuit Design &
Simulation
ADS Core
(incl. Schematic Entry, Linear
Simulation, Optimization, Monte
Carlo, Data Display, )
HB, Tran, Envelope Elements
HB
Circuit
Sim
ADS Layout Element
Layout
Layout
Momentum
Momentum
Layout
DRC/LVS
EM Extraction
W2205
W2214
Bundle
Bundle
ADS Core ADS Core
incl. DRC & LVS,

Connectivity-driven layout, )
Momentum Element
New
23
ADS 2012 New Via Simplification for faster EM

Layers are generated for EM only
Can be viewed in 3D Viewer
Can be used in combination with standard layers for EM simulation
24
1-12
25
Agilent EEsof RFIC solutions within Virtuoso

SystemVue Verification

Component Options
GoldenGate FCE
Schematic Entry
Broadband
SPICE
Model
Generator
S-parameter
Momentum Simulator
RF-ESL Analysis &

Design support
GoldenGate RFIC Design and Verification
Circuit Simulation
GoldenGate
Inductor & Passive

Component Design
Layout
Package & Bond

wire modeling
QFN Designer
DRC/LVS
Parasitic Extraction

26
1-13
New GoldenGate 2012.10 release
27
TSMC 60 GHz RDK Example

Covers complete RF Design Flow
Top-down ESL architecture verification
Verify at every level vs. consistent 802.11ad

TX/RX references
RFIC circuit simulation & verification
Full characterization of complete RF transceiver

prior to tape-out
EM analysis & verification
Enable EM analysis early and often through

integrated solvers
Add off-chip effects & components in overall

verification
Addressing integration issues early in the

design cycle
Paper: Addressing the RF needs in nanoscale Wireless Platforms, by Jason Chen

28
1-14
Paper: TSMC 60 GHz

reference design kit, by
Hsieh-Hung Hsieh (TSMC)

3

2


29
3 EMPro 3D EM Modeling Environment

Interactive, Intuitive, Efficient, 3DEM design
Environment
Full Wave 3D EM FEM and FDTD Simulation
Technologies
Parameterize 3D EM components for cosimulation & optimization in ADS
Transfer ADS Layouts to EMPro for additional
3D-EM simulation
Full scripting (Python) and parameterization
capability
Windows & Linux
Paper: The best 3DEM Tool for ADS,
by Agilent
30
1-15
New Release: EMPro 2012

Electromagnetic Professional Software
Key New Features:
New level of integration with Advanced
Design System
Common database allows 3D
components built in EMPro to be
placed on ADS schematics and
layout directly.
New low-frequency analysis algorithm
Improves accuracy <100 MHz to DC
Accurate, stable results at DC & lowfrequencies required for higherfrequency circuit simulations.
50% faster FEM meshing technology
31
NEW: Enhanced EMPro-ADS Integration

Common Database
ADS Layout (3D View)
EMPro 3D Design
ADS Schematic
32
1-16
NEW: FEM DC/Low Frequency w/iterative solver

Legacy solver (wo LF enhancement)
cannot converge below 0.1 GHz.
5 hours @ 1MHz and aborted.
Rollback to 1st order,

direct solver.
1.5 hour per freq
Iterative solver converges beyond 1 kHz, 3550 iterations, 10 min per freq
33

3

2
1
34
1-17

4 Interoperable RF Module / SiP Co-Design Flow
35
Integration Challenges with Multi-Technologies

Enable
end-to-end
simulation
Behavioral
model for PA IC
(X-parameters)
Multiple ICs on
different fabrication
technologies
Passive EM
Simulation of
Entire Laminate
Model Package,
solder bumps,
bond wires
Thermal
Considerations
Model
connector
Amalfi AM7802
PA Front End Module
36
Chip, module,
board
interactions
Paper: Real world CMOS PA design form mobile applications

with advanced simulation technologies, by Cheng-Cheng Xie
1-18
Integration Challenges with Multi-Technologies

Behavioral
model for PA IC
(X-parameters)
Enable
end-to-end
simulation
Multiple ICs on
different fabrication
technologies
Passive EM
Simulation of
Entire Laminate
Model Package,
solder bumps,
bond wires
Thermal
Considerations
Model
connector
Amalfi AM7802
PA Front End Module
Chip, module,
board
interactions
37
Continues changes requires Interoperable Flows

Typical PA Module
Possible next steps
and new constraints like board-driven chip (re-)design.
38
1-19
ADS 2012: Side-by-Side EM Simulation Setup &

FEM Analysis
analyze electromagnetic
interactions between ICs of
differing technologies and
interconnects, wire bond and
flip-chip solder bumps in
typical in multi-chip RF PA
modules.
39
IC Interoperability through OpenAccess

Agilent is a member of Si2, OA Coalition and IPL Alliance
ADS 2011 moved to OpenAccess as industry-standard database
40
1-20
Virtuoso Export To EMPro

Transfers shapes, materials, ports from
Virtuoso into EMPro 3D modeler
Allows using both FEM and FDTD solvers
41
Board/PKG Interoperability through ODB++
Board/Packag
e Enterprise
Tools
ODB++
High
Capacity
Layout PreProcessor
42
1-21
ADFI
ADS
Amkor Package Design Kit for ADS

Predict Packaged Performance in Minutes
Configure QFN package
43
Vendor Component Library

GSM/DCS band filters
use many SMT parts
from Murata and TDK
All SMT parts are 0201
type
Download and use ADS
component library from
the vendors website
44
1-22
Whats New in ADS 2012 Main focus areas

New Technologies
Side-by-Side FEM & DC/LF Solution
Electro-Thermal Simulation
NeuroFET Model
Usability
Easily Share workspaces (Archive/Unarchive)
Docking Windows
Search & Navigator
3D EM Components Almost unbelievable Integration
Layout Flight-lines replace wires in layout
45
ADS 2012 User Interface Improvements
Component Search
Layer Visibility
Net Navigator
Comp Information
Comp Information
46
1-23
New Docking Windows
Can
Can stack
stack windows
windows
Can
Can tab
tab the
the windows
windows
Or
Or easily
easily drag
drag window
window
into
place
into place
Can
Can float
float the
the window
window
Or
Or easily
easily drag
drag window
window
into
into place
place
47
New Navigator Tool

Displays all the objects in a design
Traces, paths, rectangles, polygons, circles, pins,
components, cell instances, etc.
Shows all the nets in a design
Shows all the objects through the entire design
hierarchy
Cross selection/highlighting between design and
Navigator
Auto Zoom feature automatically windows in to the
target objects
Works in both Layout and Schematic
Easily locate objects, even in complex designs
48
1-24
New Navigator Tool
Cross
Cross selection
selection between
between
Navigator
Navigator and
and design
design
Easily
Easily filter
filter what
what
is
visible
is visible in
in
Navigator
Navigator
Expand
Expand to
to see
see full
full design
design hierarchy
hierarchy
49
Powerful New Search Utility

Great for
Finding specific objects in large, complex designs
Quickly make edits to objects fitting a specific criteria
Features
Easily locate specific design objects

Searches through the entire design hierarchy
Type search strings in directly, or use search wizard
Intuitive search language supports Boolean search strings
Auto zoom opens required cell, zooms then selects object
Use the search results to easily visit and edit specific objects
50
1-25
Whats New in ADS 2012 New Capabilities

User Interface & Design Management
Simulation Improvements
Docking & Tabbed Windows & Dialog Boxes
Faster Linear Speed
Component Search: Find objects in the design hierarchy
Net Navigator to confirm nodal connectivity
Improved Convergence/Sweep behavior
Flexible Archive & Unarchive: share parts of your workspace
Dozens of additional Schematic & Layout UI refinements
Parallel Computing
Support for 3rd party Design Management/Version Control Tools

(Cliosoft)
Automation of Linear Network Collapser in Linear Controller

Ignore and Continue if encounters a convergence issue
Faster Transient GPU
Simulation Manager to setup and control parallel sims
With Transient/Convolution 8-pack license
Layout
Flight-wires replaces wires in layout
Power Amplifier Design Applications
Improved and Flexible Connectivity modes
Enhancements to the Load Pull DesignGuide: Added mismatch

simulation to indicate device or amplifier sensitivity to load VSWR
or phase angle.
Enhancements to the Amplifier DesignGuide: Extensive update

makes it easy to see amplifier performance at a specific output
power or a specific amount of gain compression.
Multi-layer Interconnect creation
Lock components to fixed position
Dimension-Line Improvements
Direct mouse entry of array spacing
ADS Desktop LVS Improvements
Connection Manager Instrument Support
Layout Command Line Editor
copy and oversize simple & complex structures
Cookie Cutter
Remove all wires in layout
ADS Support for PNA-X N524x series and the new PNA N522X
51
Improvements to Layout Connectivity

Overview
Connectivity better reflects users intent
User selectable connectivity modes
Better display of missing or incorrect connections
More user control over connectivity
Easier editing of connectivity information
New
New Flight
Flight Wires
Wires
New
New Copy
Copy and
and Oversize
Oversize Utility
Utility
Retain
Retain individual
individual shapes
shapes
or
or merge
merge objects
objects
52
1-26
New
New Navigator
Navigator docking
docking
window
provides
window provides easy
easy
browsing
browsing of
of nets
nets
Highlight
Highlight complete
complete nets
nets
Highlight
Highlight individual
individual objects
objects
attached
attached to
to net
net
Show
Show complete
complete physical
physical
interconnect
interconnect associated
associated
with
with aa net
net
ADS 2012 Support for Version Control Software

Cliosoft SOS via ADS
53
ADS 2012 High Speed Digital

Mid-channel repeater and opto link channel
simulation based on IBIS AMI
New on Sept CPL!
W2312 Transient Convolution Distributed
Computing Eight-packs September CPL
W2324 High Capacity Layout Pre-processor
IBIS 5.1 and IBIS 5.2 support
Via drawing utility
Enhanced Net Explorer
S-parameter port names and differential pairings,
enhanced symbol generation
Built-in DesignGuides, DesignKit, and Examples
(SI and PI)
HSPICE Compatibility s_element support
54
Paper: The Agilent EEsof Integrated Design Flow

for High Speed Digital Designer, by Heidi Barnes
1-27
Key RF/MW Technology Investments

Wireless Verification
LTE-A Library
802.11ac/ad/n Library
Radar Library
Circuit Simulation
Complete Flow
Physical Modeling Modeling
Multi-Technology
Layout
Integration
Device (III-IV, Si)
Performance
Manufacturing Flow
3D Multi-layer Planar
NeuroFET/GaN
Convergence
Desktop DRC & LVS
Full 3D EM
Packaging
Multi-Technology
Behavioral Modeling Nonlinear Stability

Parallel Computing
X-Parameters
Thermal
Model Verification
Interoperability
Packaging
OpenAccess
Interconnect
Interoperable PDKs
3D passives
Integration with
IC/PCB frameworks
Usability Innovations
Circuit Simulation
EM-Circuit Co-Simulation
Interconnect Design
Design Management
Optimization Cockpit
55
Comprehensive RF Microwave Solutions

for Wireless Applications
Summary
Advanced RF design and simulation support
with industry-leading RF simulation speed
and capacity
Best-in-class modeling solutions for

passives, interconnects, packaging and
active devices
Unique RF & mm-Wave design support

Access to scalable system-level solutions
from algorithm development through RF
architecture exploration
Interoperable solutions for RFIC / SiP /

Module / Board co-design
Leverage the most complete RF EDA

portfolio for your next-generation products!
1-28
Key benefits
Best-in-class RF fidelity among todays baseband/PHY environments,
which allows baseband designers to virtualize the RF and eliminate excess
margin
Superior integration with test accelerates real-world maturity and
streamlines your model-based design flow, from architecture to verification
World-class reference IP puts Agilent instrument-grade interoperability and
Layer
1 compliance inside your block diagram, before you have hardware
Unified, open, polymorphic modeling simplifies tool flow, reduces
department costs and supports a customizable, vendor-neutral
environment
Priced for networked workgroups to maximize design re-use and capitalize
on baseband and RF synergies
Integrated Electrothermal Solution

Delivers Thermally-Aware
Circuit Simulation
Rick Poore
Principal Engineer, R&D
Agilent Technologies
Marc Petersen
Product Manager
Agilent Technologies
Agenda
Introduction
Thermal Problems in RFIC/MMIC Design
Solutions: Traditional Approaches
Solutions: A New Approach
Case Study
MMIC PA Design Example
Thermal and Electrical Results
Conclusion and Q&A
Copyright Agilent Technologies 2012

2
2-1_1
The Problem:
Thermal Effects Impact RFIC/MMIC Design
High Power Devices
+ High Level of Integration
= On-Chip Temperature Rise
IC performance depends on device

temperature
Device temperature depends on:

Power dissipation
Layout position
IC / packaging material thermal properties
This is a nonlinear problem

Thermal conductivities vary with temperature!
????

3
Traditional Approach:
Self-Heating Models
Many transistor models now include
self-heating effects
Requires accurate extraction of thermal
parameters RTH, CTH
Does not include thermal coupling
between transistors
Does not include impact on nearby
passive components
Does not include impact of packaging

4
2-1_2
Stand-alone Thermal Solvers
Requires user to manually transfer
layout and expand to 3-D
heat sources locations
power dissipation values
computed device temperatures
and perform any required iteration

5
Equivalent RC Thermal Network
Extract thermal RC network from
FEM data, add to schematic
Must be re-extracted for any layout
change
Requires device models to have
thermal nodes
Large device count make cause slow
extraction of RC network
Large thermal networks may cause
significant slowdown
Does not account for nonlinear thermal
properties

6
2-1_3
Thermal Equation
The thermal problem
c and N are both functions of temperature and spatial location

(material)
g is a function of temperature, time and spatial location
(electrical devices)

7
A New Approach Full Electro-Thermal Simulation

Thermal
technology
files
Circuit Simulator
Read temperatures
Solve electrical equations
Write power dissipation
TDEVICES
PDISS
Thermal Simulator
Read power dissipation
Solve thermal equation
Write temperatures
Iteration loop is
done automatically
until powers and
temperatures are
self-consistent

8
2-1_4
Electro-Thermal Simulation Results

More accurate circuit simulation results,
showing performance degradation due
to temperature rise
3D temperature maps, providing design
insight, leading to more robust layout
designs
Device temperature data, to uncover
potential reliability issues and failures

9
Thermal Solver Technology

Provided by Gradient Design Automation
Focused on IC thermal simulation
Full-chip (high capacity) 3-D FEM temperature
simulation with device- and wire-level resolution
Linux-based
Proven for large digital and mixedsignal applications
Used by major IC companies
On Semi, TI, AMD,
Works with any IC process
GaAs, Si, SiGe, GaN,
Mixed-Signal IC
45nm Digital Block with 800k Transistors
http://www.gradient-da.com/resources/technical-papers.php

10
2-1_5
Agenda
Introduction
Case Study
Conclusion and Q&A

11
Case Study: Two Stage LTE PA

Two-Stage LTE PA
GaAsFET; uses EEsof DemoKit
Gain >25 dB
Pout > 25 dbm with Pin >1 dbm

12
2-1_6

Gain >25 dB; Pout > 25 dBm @ Pin >1 dBm

13
Two Stage LTE PA

6- InitialDesign_lay out3aa.gif
Stage 1 FET
4 fingers
100 um wide
PDC=900 mW
6- InitialDesign_lay out3bb.gif
Stage 2 FET
6 fingers
200 um wide
PDC=2100 mW

14
2-1_7
Two Stage LTE PA Layout

Thermal analysis using Rth calculations
Simple calculation of thermal resistance
RTH for each transistor
Assume power is dissipated uniformly
throughout the transistors channel
FET1 channel: 100 x 46.6 um: RTH = 168 K/W
Power dissipation = 900 mW
'T=RTH PDISS=168 K/W x 0.9W = 151qC T1=25+151=176qC
FET2 channel: 200 x 79.9 um: RTH = 98 K/W
Power dissipation = 2100 mW
'T=RTH PDISS=98 K/W x 2.1W = 206qC
T2=25+206=231qC
15
Two Stage LTE PA Layout

Electro-thermal simulation

16
2-1_8
Electrothermal Simulation Setup

Step 1 Add an Electrothermal Controller to the schematic page

17

Step 2 Open the Electrothermal Controller
and specify a few parameters as shown below
Thermal
technology
Thermal
boundary
conditions

18
2-1_9

Step 3 Click the Simulate button
and electro-thermal simulation starts
Simulate
Thermal profiles,
plots and data output
results are
automatically
displayed at the end
of simulation

19
Thermal Profile @ Pin=0dBm

Simulation time = 6 minutes
8 point input
power sweep:
from -10 dBm
to
+4 dBm

20
2-1_10
Thermal Profile Max @ DC

Simulation time = 56 seconds

21
Thermal Profile Max @ DC

22
2-1_11
Electro-thermal Device Temperatures

Initial hand calculation with RTH predicted TFET1=176C and TFET2=231C
Electrothermal results TFET1=135C and TFET2=158-181C

23
Electro-thermal On vs Off
3 dB loss in gain
Electro-thermal OFF
Electro-thermal ON

24
2-1_12
HB Pin/Pout
Pin Vs Pout
Electro-thermal OFF
Electro-thermal ON

25
HB Power Dissipation Vs Pin
Electro-thermal OFF
Electro-thermal ON

26
2-1_13
Harmonics
Electro-thermal ON
Electro-thermal OFF

27
Modify the Layout of FET2

Spread the fingers and place ground/thermal vias
FET2 temperatures were too high for reliability

RF performance no longer met specs
Modify the layout of FET2 to spread the heat out and cool the devices
Initial Design
Modified Design
Tmax
TFET1 =135qC
TFET2 =158-181qC
TFET1 =135qC
TFET2 =107-115qC
28
2-1_14
Modified Stage 2 FET Layout

Spread out fingers and place ground/thermal vias

29
Thermal Profile of Modified Layout @ Pin=0dBm
Initial Design
TFET2 = 158-181qC
Modified Design
TFET2 = 107-115qC
FET1 Temp now
dominates at
135qC

30
2-1_15
Thermal Profile Max @ DC of Modified Layout

31
Thermal Profile of Modified Layout

32
2-1_16

Original layout
Modified layout
TFET1=135C and TFET2=158-181C


33
Modified Design - Dashed Traces

34
2-1_17
Modified Design - Dashed Traces
Initial Design Electro-thermal OFF

Initial Design Electro-thermal ON
Modified Design Electro-thermal ON

35
Modified Design
HB power dissipation

36
2-1_18
Modified Design


37

Mounted on a QFN Package

38
2-1_19
Mounting the IC onto a Package
Layer summary:
725 m
5 m
100 m
150 m
plastic package k=1.0

metal stack on chip
GaAs substrate k(25)=46
copper lead frame k=401

39
Thermal Profile of Modified Design and Package

40
2-1_20

Thermal profiles of all layers IC and package

41

Original layout
Modified layout
Modified, packaged


42
2-1_21

Simulation results S-parameters

43

Simulation results S21

44
2-1_22

Simulation results Pin / Pout

45

Simulation results HB power dissipation

46
2-1_23

Simulation results fundamental and harmonics

47
Agenda
Introduction
Case Study
Conclusion and Q&A

48
2-1_24
Summary: ADS Electro-thermal Solution
Applications: high power RFIC / MMIC

design
Deliver thermally aware circuit
simulation results by including effects
of on-chip temperature rise
Include effects of package and PCB
Easy to set up and use from within
the ADS environment
Works with all simulation types:
DC, AC, SP, HB, Transient, Envelope
Available in ADS 2012
ADS Schematic
ADS Layout
Integrated Thermal Solver
QUESTIONS?

49
2-1_25
A complete designer-oriented device

model verification solution for
advanced technology
Cai Shuang
Senior Application Engineer
Agilent EEsof
October 2012
Agenda
Increasing process complexity a challenge to models
Complete solutions for model verification
MQA (Model Quality Assurance)
de-facto industry standard SPICE model validation platform
AMA (Advanced Model Analysis)

layout dependent effects model validation platform
Whats New in MQA2012.07 and AMA 2012.07

Summary & Outlook
Copyright 2012 Agilent Technologies

2
2-2_1
Design Requirement for PDK

Industry standard model required
Physical model and scalable model required
Process variation awareness required for ensuring the yield
Mismatch model for AMS design required

3
Model Challenge with Advanced Technology
Stress, Lithography and Well Proximity Effect

have made models more complex
Comprehensive QA and verification on the

Models are required in order to ensure design
success
Foundry often encrypts the model principle

for proximity models and make it more difficult for verifying the models

4
2-2_2
Model QA Challenges And Requirements

When a model/library has been obtained from the foundry,
it should be checked against
- consistency (simulation convergence, model explosion etc.)
- physical behavior
- performance in different simulators
- etc.
This means:
Creating a lot of netlists
Handling of huge amount of data
Intelligent flagging of issues
Detailed reporting & documentation
and this requires a
comprehensive, flexible and customizable tool
5
Complete QA Solutions
MQA/AMA helps designers to remove uncertainties for sub45nm technologies
MQA/AMA is flexible enough to be adjusted to any design
flow and compatible to all popular EDA tools
MQA/AMA integrates the entire flow and all the related tools
for PDK verification purposes
MQA/AMA can be easily adjusted for future challenges
Agilent has developed an automated yet flexible

platform to access foundry proximity models with a
click of button
6
2-2_3
Agenda
- Modeling Challenges
- Introduction to MQA (Model Quality Assurance)
- Introduction to AMA (Advanced Model Analysis)
Accelerating Analog Silicon

7
End-to-end Silicon Device Modeling Flow

8
2-2_4
Agilents Validation Tools

Model
Validation
Physical
Validation
MQA
AMA
Design Variability
What is MQA?
MQA
the industry standard assurance tool that assists

modeling experts and model users to perform comprehensive
model QA with an knowledge-based, rule-driven approach.
It qualifies device models/libraries of ever growing complexity.

It is an automated device model verification and documentation
tool that
modeling engineers at IDMs/Foundries use to perform comprehensive
model QA and to release verified model files/libraries.
Fabless Design Houses use to evaluate and accept the model libraries
from Foundries.
10
2-2_5
What is MQA?
11
OS, Simulators, Input Format

Supported operating systems
Windows XP, Windows Vista, Windows 7
Linux
Supported simulators
All major EDA simulators: HSPICE, SPECTRE, Eldo, SPICE3, ADS,
Golden Gate (2012H2), AFS, Titan..
Input format
Data
Native MBP/MQA data format

IC-CAP mdm format (2012H2)
Model
Of all supported simulators

12
2-2_6
MQA Rule-Based, Knowledge-Driven Model QA
A rule-based, knowledge-driven
automatic platform for SPICE
model quality assurance through
device- and circuit-level figures of
merit
Knowledge
Rules
Device physics, technology impact on

circuit design, model-simulator
interaction, key FOMs
Text files to describe FOMs, PVT
coverage, expectations, graphing
options, flagging criteria
Automation
Plotting, analysis, flagging, reporting,

documentation
13
MQA de-facto Industry Standard Acceptance

Tool
Minimizes costly late-stage
design surprises
Comprehensive acceptance QA
Design-specific checks
Increased efficiency for all design

teams
Consolidated QA efforts
Model library version control
Bridge between foundry and design
house
14
2-2_7
MQA Ideal Solution for Library Benchmarking
Exploding varieties of libraries
CAD-centric benchmarking
Cross-simulator equivalence
check
Cross-model (ex., BSIM4 vs.
PSP) equivalence check
Addresses key technology

benchmarking challenges
What has changed from previous

library release?
What has improved or worsened
from 32nm to 28nm?
How identical is the 2nd source
foundry to the primary foundry?
15
MQA Lib Explorer

Powerful Lib Parser
Parse large model libraries
Corner View / Model View
Model Analysis / Benchmark
2-2_8
Apply MQA as
Qualification tool
Knowledge based and rule driven
Validate model file/library and measurement data
Documentation tool
Overlay with measurement data
Easy to customize report
Design interface (foundry interface) tool
Comparison
Sharing the new technology characterization
Model QA result sharing tool
Bridge between foundry and design house
Communication between different groups
17
MQA Default Rule Sample:
18
2-2_9
Time Cost (2807 plots, 21 tables)
Slow & Error-prone
89.8%
66.7%
56.7%
20
2-2_10
Inside the .rule File
ts
tes
A Rule file in MQA is a ASCII text file

which defines how MQA performs
certain checks on certain objects
under certain conditions
Example: Rule Check Idsat vs. L

[common]
appliedmodel = binning, global, macro
[Group: 4:Title=Model Scalability]
A rule (ASCII, customizable) is typically organized like this:

1. ID and title for selection in the GUI.
2. Conditions, which determine when it is valid,
i.e. when it will be executed.
3.
Loops, which defines the variations like bias, W/L/T sweeping,
etc.
4. Target, which defines target, normally it will be Y-axis on plot.
5. Check functions, to define which MQA checks to be applied,
also to define the warning message if check failed.
[Label: 4001:title= Check Idsat vs. L] *for NMOS

[Condition:(devtype=1)and(application=1 or application=2 or application=3)]
[Loops
: X=L(start=g_lmin,stop=g_lmax,perdec=10)
: P=W (start=g_wmin,stop=g_wmax, num=3)
: P1=Vgs(vgg)
: P2=Vds(vdd)
: P3=Vbs(0)
: P4=T(tmin, tnom, tmax)]
[Target: y=Idsat]
[Check: 01:Check Trend: CheckTrend2D (p,x,y,"times=1","incAtFirst=-1"): error: Trend is not right]
[Check: 02:Check Kink: CheckKink2D (p,x,y): error: Kink occurs]
21
Example of MQA Check functions, called by a Rules file:

CheckTrend
CrossCheck

22
2-2_11
After all is
set up,
execute the
MQA test
the problem is
automatically indicated !
and obtain
a detailed
report

23
MQA Demos
Multi-library comparison using Lib Explorer
Multi-targets Table
RF Applications:
9 S parameter
9 Harmonic Balance
Statistical Applications:
9 NP correlation + Monte Carlo
9 Mismatch
24
2-2_12
MQA Summary
As the first commercial SPICE model validation solution, MQA is
the de-facto industry standard tool for SPICE model validation,
comparison and documentation.
Broad customer acceptance: MQA has been widely adopted by
100+ customers around the world. Dominate in the validation
market.
Comprehensive checking routines built-in.
e.g. BSIM4: default 110 rules from 17 rule-groups
Support all mainstream models and simulators.
Compare differences between model versions, SPICE simulators,
and foundry technologies.
Powerful and Flexible Reporting Function. Easy to share QA
results.
25
Agenda
- Overview
- Introduction to MQA (Model Quality Assurance)
- Introduction to AMA (Advance Model Analysis)

26
2-2_13
Why AMA?
A MOS transistors drive capability is no longer primarily determined by its
width and length. Rather, it is heavily influenced by the layout of its
surrounding structures, which has become known collectively as layout
dependent effects (LDEs).
Stress, Lithography and Well Proximity Effects have made models more complex.
Need solution to:
Verify foundry Models
Access Variability using foundry input
Remove Uncertainty before tape out.
27
Why AMA?
Schematic
Schematic
Layout
Layout
LVS
Modified
Netlist
SPICE
Customized
instance
Layout instance correlate

model parameters through equations
BSIM
Macro Model
28
2-2_14
LVS
Extracted
Netlist
SPICE
Macro Heavy
LVS Heavy
Modeling approach: LVS + Macro SPICE model
45nm/32nm Special Effects
Layout Dependent Variations
29
Foundry Solutions for Addressing Variability

Proximity Models
Stress
Lithography
Well Proximity
Proximity Model Means

LVS heavy
Need Solution to
Macro SPICE model heavy

LVS+Macro SPICE model
1. Verify foundry Models

2. Access Variability
using foundry input
30
2-2_15
What AMA does

Model QA with layout dependent parameter consideration.
Sweep layout parameters and generate Test Structure automatically.
Extract layout parameters
Check SPICE model electrical performance vs. layout parameters.
Pin-point issues or abnormal behaviors due to LDEs before Tape-Out
Built-in Modules and Flow
AMAs architecture
SPICE
Model
Generic
Rule File
Corner model
Statistical model
Mismatch
Assura
Calibre
Hercules
AMA
Netlist
SPICE
PCELL or
Generator
Layout
DB
LVS Decks
Characterization
Comparison
Documentation
User layout or
from stand cell
32
2-2_16
Built-in Modules and Flow

Layout Generation
Layout
Generation
PCell mode
SKILL Template mode
Layout mode
Layout
Extraction
Layout Extraction
Mentor Graphic Calibre
Synopsys Hercules & StarRCXT
Cadence Assura & QRC
SPICE simulation
SPICE Simulation
HSPICE or Spectre
Data Analysis
Data Analysis
33
AMA Sample Result
2-2_17
AMA directory structure
bin: contains key executable of AMA.

lib: contains library files for program, such as ".so"
and ".jar" files.
skill: contains SKILL files to initiate AMA program from Virtuoso.
etc: contains default settings files.

icf: contains Instance Connection Files.
checker: contains testing cases to check connectivity to 3rd
party tools.
checkfunctions: contains built-in check functions.
skill: contains built-in SKILL template files to create layout.
lic: contains license related configuration files.

help: contains user manual and built-in contextsensitive help files.
35
Rule File Generator
This rule file is more complicated than MQAs and since

it involves layout generation, we provide a separate
module to generate rule files.
36
2-2_18
Rule File Generator-Layout Source
Test Bench can have the following three sources:
From Foundry PCELL
From SKILL based layout generator
From existing or user layout
37
Sample Rule Syntax
[Group: 1:Title=MOS Devices]
[Condition:1]
[Path: $AMAHOME/etc/tb/mos/nmos/xxxx65ng_nch.il] * user has the option to link to foundry PCELL.
[SPICE: HSPICE$AMAHOME/examples/hb3v3.lib:tt:nmos]
* for circuit, model is defined within circuit definition.
[Loops
: A1(values for A1)
: A2(values for A2)
: A3(values for A3)
[Target: Idsat, Vth, Ioff]
[Check: 01:Check Trend: CheckTrend2D (a1,a2,a3,"times=1","incAtFirst=-1"): error: Trend issue]
[Compare: CompPlot(a1,a2,a3): error: TBD]
38
2-2_19
Example: Lithography rounding effects for 32nm
A predictive 32nm Model is used

A Litho-aware extraction deck of a 45nm technology is
used (we expect more rounding effect at 32nm).

An AMA run is executed and is finished in less than 30 seconds. One
can clearly see that the variability due to layout parameter B (OD
rounding height) is almost 20% at certain A value, and if A exceeds
certain value say 0.1um, OD rounding effects becomes negligible
(the number may not make sense, but you get the idea).
W=60nm
L=32nm
2-2_20

And we have observed using the input from foundry, the following
plot is observed, and it obviously doesnt make sense, so user can
define a criteria and let the tool pick up the issue automatically and
feedback to foundry.
Example: WPE effect
42
2-2_21
Example: WPE effect (cont.)
43
AMA Summary
AMA is the extension of MQA to qualify the layout dependent
effects model for cutting-edge technologies.
Built-in complete workflow for model-LVS co-validation.
Technology based and rule driven.
Open interface to support popular physical verification tools
and SPICE simulators.
Accurately predict design margin due to process/design
variability before tape-out.
Flexible to be adjusted (extended) to other applications.
44
2-2_22
Whats New
MQA 2012.07
Java Version Update
Support of Project-level Parallelism
Seamless Data Flow for ICCap .mdm data format
Enhanced Support of ADS (HPEESOFSIM)
Support for III-V Technologies
AMA 2012.07
Expanded CDF Support
StarRCXT, Assura Support
Support of Layout Mode in Rule Generator
For more: http://edocs.soco.agilent.com/display/mqa201207/MQA+Release+Notes
MQA/AMA in a nut shell:

A tool to test simulation or measurement results under all kinds of conditions
Drawn by: Franz Sischka

46
2-2_23
Roadmap
Database preparation to deal with huge amount of data.
More flexible parallelization to further speed-up.
Continue to contribute to the seamless integration of
simulation modules with focus on the interplay and
interfacing of EDA tools in order to:
Enhance design effectiveness
Reduce development cycle times
Reduce costs
Build unified platform for modeling verification to combine

MQA and AMA functionalities and more.
Thank you for your attention !

48
2-2_24
www.agilent.com.tw
Agilent Email Updates

www.agilent.com.tw/find/emailupdates
http://210.244.49.188/library
0800-047866
www.agilent.com.tw/find/open
104 2 7
(02) 8772-5888
324 20
(03) 492-9666
www.agilent.com/find/removealldoubt
8026251
(07) 535-5035
2012
Issued date : 2012 / 10
Printed in Taiwan
2012/10

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2012 EEsof

Registration and Welcome

Comprehensive RF Microwave Solutions for Wireless Applications

Track A(RF and Mixed Signal IC Design)

Track B(Wireless and Digital system design)

A1: Integrated ElectroRick Poore

A2: A complete Designer- Shuang Cai

B2: FPGA Simulator Work

Break & Product Fair

B3: The Agilent EEsof

A5: Addressing the RF

B4: The Signal Integrity

B5: Power Integrity

C4: System-Level Design Keven Chang

Break & Product Fair

Track C(Test measurement implementation with

A8: Real World CMOS PA

B6: Using ADS Momentum

Survey & Lucky Draw

C6: GaN Doherty Amplifier

Dr. Juergen Hartung

Whats New in ADS 2012

RF/MW Design Challenges The Tablet Example

Also: LTE-Advanced, MIMO

Also: GSM/EDGE, WCDMA,

o Increasing Integration Multiple different complex systems placed in close proximity

Increasing RF content in a Tablet

Tablet includes 7 PA modules:

Avago Band 17 LTE

Avago Band 2 UMTS/HSPA

Integration-dependent design challenges

Single Large-Scale Silicon Chip (SoC)

Picture is courtesy of chipworks

Higher levels of integration, lower cost

SMD Component Designer

RF/MW Design Segments Application

RF/MW Design Segments Flow perspective

Design/Implementation Challenges per Segment

IC design enablement beyond

Integration challenges with

1 Accurate Device Models for Emerging

Artificial Neural Network Measurement-based FET Model

Design/Implementation Challenges per Segment

IC design enablement beyond

Integration challenges with

2 MMIC/RFIC Design Enablement

Complete ADS Desktop Design Flow

Most widely used MMIC Design Platform!

ADS 2011 PDK Support GaAs / GaN

InP SHBT1 InP DHBT2

H01U-xx H02U-xx MP15-01 PL15-xx

PP10-xx PP15-xx PP25-xx PP50-xx PS50-xx PH50-xx PD50-xx

Paper: WIN PDK for ADS, by JS Wu (WINSEMI)

Getting started with MMIC Design

ADS2011 Complete MMIC-Module-MultiTech

ADS 2012 Electro-Thermal Simulator

Applications: high power RFIC / MMIC

Deliver thermally aware circuit

Include effects of package and PCB

Easy to set up and use from within the

Works with all simulation types:

Integrated Thermal Solver

Paper: Integrated Electro-Thermal Solution Delivers

2 MMIC/RFIC Design Enablement