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BZX84C2V4 - BZX84C51

350mW SURFACE MOUNT ZENER DIODE

Features

Mechanical Data

Planar Die Construction

350mW Power Dissipation

Zener Voltages from 2.4V - 51V

Case: SOT23
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0

Ideally Suited for Automated Assembly Processes

Moisture Sensitivity: Level 1 per J-STD-020

Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)

Halogen and Antimony Free. Green Device (Note 3)

Terminals: Matte Tin Finish annealed over Alloy 42 leadframe


(Lead Free Plating). Solderable per MIL-STD-202, Method 208 e3

Qualified to AEC-Q101 Standards for High Reliability

Polarity: See Diagram

Weight: 0.008 grams (approximate)

SOT23

Top View

Device Schematic

Ordering Information (Note 5)


Part Number
(Type Number)-7-F
(Type Number)Q-7-F
(Type Number)-13-F
(Type Number)Q-13-F

Compliance
Standard
Automotive
Standard
Automotive

Case
SOT23
SOT23
SOT23
SOT23

Packaging
3,000/Tape & Reel
3,000/Tape & Reel
10,000/Tape & Reel
10,000/Tape & Reel

*For (Type Number), please see the Electrical Characteristics Table. Example: 6.2V Zener = BZX84C6V2-7-F.
Notes:

1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporateds definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. BZX84C2V4-BZX84C39 products manufactured with Date Code OW (week 42, 2009) and newer are built with Green Molding Compound. BZX84C2V4BZX84C39 products manufactured prior to Date Code OW are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire
Retardants. BZX84C43-BZX84C51 products manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound.
BZX84C43-BZX84C51 products manufactured prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3
Fire Retardants.
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html

Date Code Key


Year
1998
Code
J
Month
Code

Jan
1

xx = Product Type Marking Code


(See Electrical Characteristics Table)
YM = Date Code Marking for Shanghai
Assembly / Test site
Y = Year (ex: Z = 2012)
M = Month (ex: 9 = September)

2002
N

2003
P

Feb
2

BZX84C2V4 - BZX84C51
Document number: DS18001 Rev. 32 - 2

Mar
3

2004
R

2005
S
Apr
4

2006 2007
T
U
May
5

2008
V

Kxx

2009
W

Jun
6

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Jul
7

2010
X

YM

Kxx

YM

Marking Information

2011
Y
Aug
8

xx = Product Type Marking Code


(See Electrical Characteristics Table)
YM = Date Code Marking for Chengdu
Assembly / Test site
Y = Year (ex: Z = 2012)
M = Month (ex: 9 = September)

2012
Z
Sep
9

2013
A

2014
B
Oct
O

2015
C
Nov
N

2016
D

2017
E
Dec
D

February 2014
Diodes Incorporated

BZX84C2V4 - BZX84C51
Maximum Ratings (@TA = +25C, unless otherwise specified.)
Characteristic
Forward Voltage

@ IF = 10mA

Symbol
VF

Value
0.9

Unit
V

Symbol
PD

Value
300

Unit
mW

Thermal Characteristics
Characteristic
Power Dissipation (Note 6)

PD

350

mW

Thermal Resistance, Junction to Ambient Air (Note 6)

RJA

417

C/W

Thermal Resistance, Junction to Ambient Air (Note 7)

RJA

357

C/W

TJ, TSTG

-65 to +150

Power Dissipation (Note 7)

Operating and Storage Temperature Range

Electrical Characteristics (@TA = +25C, unless otherwise specified.)


Type
Number

Maximum Zener
Impedance
f = 1KHz

Zener Voltage
Range
(Note 8)

Marking
Code

VZ @ IZT

Maximum Reverse
Current
(Note 8)

IZT

ZZT @ IZT

IR

VR

Nom (V)

Min (V)

Max (V)

(mA)

()
600
600
600
600

ZZK @ IZK
(mA)

(A)

(V)

1.0
1.0
1.0
1.0

50
20
10
5.0

Temperature
Coefficient
@ IZT mV/C
Min

Max

1.0
1.0
1.0
1.0

-3.5
-3.5
-3.5
-3.5

0
0
0
0

BZX84C2V4
BZX84C2V7
BZX84C3V0
BZX84C3V3

ZB
ZC
ZD
ZE

2.4
2.7
3.0
3.3

2.2
2.5
2.8
3.1

2.6
2.9
3.2
3.5

5.0
5.0
5.0
5.0

()
100
100
95
95

BZX84C3V6
BZX84C3V9
BZX84C4V3
BZX84C4V7
BZX84C5V1
BZX84C5V6

ZF
ZG
ZH
Z1
Z2
Z3

3.6
3.9
4.3
4.7
5.1
5.6

3.4
3.7
4.0
4.4
4.8
5.2

3.8
4.1
4.6
5.0
5.4
6.0

5.0
5.0
5.0
5.0
5.0
5.0

90
90
90
80
60
40

600
600
600
500
480
400

1.0
1.0
1.0
1.0
1.0
1.0

5.0
3.0
3.0
3.0
2.0
1.0

1.0
1.0
1.0
2.0
2.0
2.0

-3.5
-3.5
-3.5
-3.5
-2.7
-2.0

0
0
0
0.2
1.2
2.5

BZX84C6V2
BZX84C6V8
BZX84C7V5
BZX84C8V2
BZX84C9V1
BZX84C10
BZX84C11

Z4
Z5
Z6
Z7
Z8
Z9
Y1

6.2
6.8
7.5
8.2
9.1
10
11

5.8
6.4
7.0
7.7
8.5
9.4
10.4

6.6
7.2
7.9
8.7
9.6
10.6
11.6

5.0
5.0
5.0
5.0
5.0
5.0
5.0

10
15
15
15
15
20
20

150
80
80
80
100
150
150

1.0
1.0
1.0
1.0
1.0
1.0
1.0

3.0
2.0
1.0
0.7
0.5
0.2
0.1

4.0
4.0
5.0
5.0
6.0
7.0
8.0

0.4
1.2
2.5
3.2
3.8
4.5
5.4

3.7
4.5
5.3
6.2
7.0
8.0
9.0

BZX84C12
BZX84C13
BZX84C15
BZX84C16
BZX84C18
BZX84C20

Y2
Y3
Y4
Y5
Y6
Y7

12
13
15
16
18
20

11.4
12.4
13.8
15.3
16.8
18.8

12.7
14.1
15.6
17.1
19.1
21.2

5.0
5.0
5.0
5.0
5.0
5.0

25
30
30
40
45
55

150
170
200
200
225
225

1.0
1.0
1.0
1.0
1.0
1.0

0.1
0.1
0.1
0.1
0.1
0.1

8.0
8.0
10.5
11.2
12.6
14.0

6.0
7.0
9.2
10.4
12.4
14.4

10.0
11.0
13.0
14.0
16.0
18.0

BZX84C22
BZX84C24
BZX84C27
BZX84C30
BZX84C33
BZX84C36
BZX84C39

Y8
Y9
YA
YB
YC
YD
YE

22
24
27
30
33
36
39

20.8
22.8
25.1
28.0
31.0
34.0
37.0

23.3
25.6
28.9
32.0
35.0
38.0
41.0

5.0
5.0
2.0
2.0
2.0
2.0
2.0

55
70
80
80
80
90
130

250
250
300
300
325
350
350

1.0
1.0
0.5
0.5
0.5
0.5
0.5

0.1
0.1
0.1
0.1
0.1
0.1
0.1

15.4
16.8
18.9
21.0
23.1
25.2
27.3

16.4
18.4
21.4
24.4
27.4
30.4
33.4

BZX84C43
BZX84C47
BZX84C51

YF
YG
YH

43
47
51

40.0
44.0
48.0

46.0
50.0
54.0

2.0
2.0
2.0

150
170
180

375
375
400

0.5
0.5
0.5

0.1
0.1
0.1

30.1
32.9
35.7

37.6
42.0
46.6

Notes:

6. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com.
7. Valid provided the terminals are kept at ambient temperature.
8. Short duration pulse test used to minimize self-heating effect.

BZX84C2V4 - BZX84C51
Document number: DS18001 Rev. 32 - 2

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500

50

400

40
IZ, ZENER CURRENT (mA)

PD, POWER DISSIPATION (mW)

BZX84C2V4 - BZX84C51

300
Note 6
Note 7

200

100

100
TA, Ambient Temperature, (C)
Fig. 1 Power Derating Curve

30

T j = 25C

30

20

10

200

3
4
5
6
8
9 10
7
VZ, ZENER VOLTAGE (V)
Fig. 2 Typical Zener Breakdown Characteristics

10

C10

TJ = 25C

C47
C43

C51

IZ, ZENER CURRENT (mA)

IZ, ZENER CURRENT (mA)

C12

C15

20

C18
Test current IZ
2mA

C22

10

C27

Test current IZ
5mA

C33

C36

4
Test Current IZ
2mA

C39

0
0

10
20
30
40
VZ, ZENER VOLTAGE (V)
Fig. 3 Typical Zener Breakdown Characteristics

20
30
40
50
70
60
VZ, ZENER VOLTAGE (V)
Fig. 4 Typical Zener Breakdown Characteristics
10

100

1,000

VR = 1V

CT, TOTAL CAPACITANCE (pF)

CT, TOTAL CAPACITANCE (pF)

TJ = 25C

VR = 2V

100
VR = 1V

VR = 2V

10
1

100
10
VZ, NOMINAL ZENER VOLTAGE (V)
Fig. 5 Typical Total Capacitance vs. Nominal Zener Voltage

BZX84C2V4 - BZX84C51
Document number: DS18001 Rev. 32 - 2

10

100
VZ, NOMINAL ZENER VOLTAGE (V)
Fig. 6 Typical Total Capacitance vs. Nominal Zener Voltage

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BZX84C2V4 - BZX84C51
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
SOT23
Dim
Min
Max
Typ
A
0.37
0.51
0.40
B
1.20
1.40
1.30
C
2.30
2.50
2.40
D
0.89
1.03 0.915
F
0.45
0.60 0.535
G
1.78
2.05
1.83
H
2.80
3.00
2.90
J
0.013 0.10
0.05
K
0.903 1.10
1.00
K1
0.400
L
0.45
0.61
0.55
M
0.085 0.18
0.11
0
8

All Dimensions in mm

B C

H
K
J

K1
D

Suggested Pad Layout


Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for latest version.

Y
Z

BZX84C2V4 - BZX84C51
Document number: DS18001 Rev. 32 - 2

Dimensions Value (in mm)


Z
2.9
X
0.8
Y
0.9
C
2.0
E
1.35

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BZX84C2V4 - BZX84C51

IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright 2014, Diodes Incorporated
www.diodes.com

BZX84C2V4 - BZX84C51
Document number: DS18001 Rev. 32 - 2

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