MCB 3033 Heat Transfer

Assignment 1
(Due date: Tuesday June 16th, 2015, at 5.00 pm)

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Q1. a)
b)
c)
d)

What is the difference between thermodynamics and heat transfer?

Explain three mechanism of heat transfer
What is the mechanism of conduction in solid, liquid and gas?
How does transient heat transfer differ from steady heat transfer? How does onedimensional heat transfer differs from two dimensional heat transfer?
e) Hot air is to be cooled as it is flow through the tubes exposed to atmospheric air. To
improve heat transfer, will you recommend to attach the fins inside or outside the
tube? Why? When would you recommend attaching fins both inside and outside?
f) Consider two fins that are identical except that the fins on the first surface are formed
by casting or extrusion whreas the fins on the second surface were attached by
welding or tight fitting. Which one provide better heat transfer? Justify your answer.

Q2. (Problem 1-94) Consider steady heat transfer between two large parallel plates at constant
temperature of T1 = 290 K and T2 = 150 K that are L = 2 cm apart. Assuming the surface to be
black (emissivity = 1), determine the rate of het transfer between the plates per unit area ( per
m2) assuming the gap between the plates is (a) filled with stationary atmospheric air (k = 0.01979
W/mK), (b) evacuated (vacuum), (c) filled with fiberglass insulation (k = 0.036 W/mK), and filled
with superinsulation having an apparent thermal conductivity of 0.00015 W/mK.

Q3. (Problem 3-53) A thin electronic component with surface area of 950 cm2 is cooled by have
a heat sink attached to its top surface. The thermal contact conductance of the interface between
the elevtronic component and the heat sink is 25,000 W/m2K. According to the manufacturer, the
heat sink has combined convection and radiation thermal resistance of 1.3 K/W. If the electronic
component dissipates 45 W of heat through the sink in a surrounding of 30C, determine the
temperature of the electronic component. Does the contact resistance at the interface of the
electronic component and the heat sink play a significant role in the heat dissipation?

Q4. (Problem 3-68) A 25-cm-thick, 9-m-long, and 3-m-high wall is to be constructed using a 23cm-long solid bricks (k = 0.70 W/mC) of cross section 18 cm 18 cm, or identical size bricks
with nine square air holes (k = 0.026 W/mC) that are 23 cm long and have cross section of 4 cm
4 cm. There is 1-cm thick plaster layer (k = 0.17 W/mC) between two adjacent bricks on all
four sides and both sides of the wall. The
houses is maintained at 27C and the
ambient temperature outside is 2C. Taking
the heat transfer coefficients at the inner and
outer surfaces of the wall to be 9 and 34
W/m2C, respectively, determine the rate
of heat transfer through the wall constructed
of (A) solid bricks and (b) bricks with air
holes.

Q5. (Problem 3-173) Steam at 235C is flowing inside a steel pipe (k = 61 W/mK) whose inner
and outer diameters are 10 cm and 12 cm, respectively, in an environment of 20C. The heat
transfer coefficients inside and outside the pipe are 105 and 14 W/m2C, respectively. Determine
(a) the thickness of the insulation (k = 0.038 W/mK) needed to reduce the heat loss by 95 percent
and (b) the thickness of insulation needed to reduce the exposed surface temperature of the
insulated pipe to 40C for safety reason.

Q6. (Problem 3-178) A 10-cm-long bar with a square cross section, as shown in fig. P3-178,
consist of a 1-cm-thick copper layer (k = 400 W/mK) and a 1-cm-thick epoxy composite layer(k
= 0.4 W/mK). Calculate the rate of heat transfer under ther mal driving force (T) of 50C, when
the direction of steady one-dimensional heat transfer is (a) from front to back (i.e., along its length),
(b) from left to right, and (c) from top to bottom.

Q7. (Problem 3-183) Steam in a heating system flows through tubes whose outer diameter is 3
cm and whose walls are maintained at temperature of 120 C. Circular aluminum alloy fins (k =
180 W/mK) of outer diameter 6 cm and constant thickness t = 2 mm are attached to the tube, as
shown in Fig. P3-183. The space between the fins is 3 mm and thus there are 200 fins per meter
length of the tube. Heat is transferred to the surrounding air at 25C with a combined heat transfer
coefficient of 60 W/m2K. Determine the increase in heat transfer from the tube per meter of its
length as a result of adding fins

Q8. (Problem 3-184) A 0.2-cm-thick, 10-cm-high, and 15-cm-long circuit board houses electronic
components on one side that dissipate a total of 15 W of heat uniformly. The board is impregnated
with conducting metal fillings and has an effective thermal conductivity of 12 W/mK. All the heat
generated in the components is conducted across the circuit board and is dissipated from the back
side of the board to a medium at 37C with a heat transfer coefficient of 45 W/m2K. (a) Determine
the surface temperature oon the two sides of the circuit board. (b) Now, a 0.1-cm-thick, 10-cmhigh, and 15-cm-long aluminum plate (k = 237 W/mK) with 20 pieces 0.2-cm-thick, 2-cm-long,
and 15-cm-wide aluminum fins of rectangular profile are attached to the back side of the circuit
board with a 0.03-cm-thick epoxy adhesive (k = 1.8 W/mK). Determine the new temperatures on
the two sides of circuit board