A Smart Sensor Interface For Industrial Monitoring Using ARM

A Smart Sensor Interface for Industrial Monitoring using ARM
2014-15
CHAPTER 1
INTRODUCTION
1.1 Introduction
Intelligent wireless sensor-based controls have drawn attention of the industry on
account of reduced costs, better power management, ease in maintenance, and effortless
deployment in remote and hard-to-reach areas. They have been successfully deployed in
many industrial applications such as maintenance, monitoring, control, security, etc. In
this research, the focus is on the issues of portability, reliability, flexibility and robustness
while using wireless connectivity in industrial applications such as instrumentation and
predictive maintenance, and to design a workable solution.
This project expanding the scope of the applications, investigate design choices
for the proposed system, and presents detailed experimental results of the
implementations with their analysis. The proposed Smart Sensor Platform is an attempt to
develop a generic platform with plug-and-play capability to support hardware interface,
payload and communication needs of multiple sensors, and actuators. An RF link
(ZigBee) facilitates communications in a point-to-point topology.
The design also provides means to update operating, monitoring parameters,
operational thresholds, and sensor and RF link specific firmware modules over-the-air. It
is composed of two main components a sensor-wireless hardware interface and system
integration framework, which facilitates the defining of interaction between sensors based
on process needs. The intelligence necessary to process the sensor signals, monitor the
functions against defined operational templates, and enable swapping of sensor and RF
link, resides on the microcontroller of the hardware interface.
A variety of industrial sensors (temperature, Gas detection, colour change and
light etc.) have been interfaced and successfully tested with the platform. The
organization of this project covers potential industrial applications to benefit by wireless
connectivity, and the supply chain management.
1.2 Literature survey

Wireless technology is a constantly evolving area, especially for industrial users,
which often makes wireless infrastructure deployments in industrial environments
difficult. Before taking on such a project, facility operators need to be aware of the
challenges from rapid prototyping of wireless sensors in an industrial environment and
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the best practices for radio frequency (RF) design in complex or harsh RF environments,
such as manufacturing, industrial, or power generation facilities.
The business drivers for this type of project can most often be associated with the
transition from conditioned-based monitoring to performance-based monitoring. In
addition, the data points are usually collected manually, and the lack of continuous data
does not allow for complex analytics or modelling.
Implementing wireless sensor sets create benefits across multiple areas. For
instance, scarce engineering resources can focus on data analysis rather than data
collection from disparate sources and can concentrate on few degrading trends rather than
every trend. Maintenance workers can reduce or entirely eliminate selected data
collection rounds through placement of wireless monitoring sensors. The need for deep
technical capabilities on-site and concerns about inconsistent diagnostic results due to
experience levels of individual employees can be greatly reduced.
By leveraging wireless technologies, operators can acquire critical component
monitoring data in significantly higher volumes, reduce staff impact of making collection
rounds, and focus those resources on data analysis and prognostics of issues. By
implementing a wireless infrastructure and using it for the rapid deployment of new
sensor types, operators can create significant advances in critical component monitoring.
1.3 Problem Statement

In any industrial process there may be one or more physical quantities are to be
measured simultaneously. In such cases it is required to take reading of their values at
regular interval and for that a person has to seat there and monitor it continuously. If there
are so many such processes then they require more man power. This is really wastage of
human power. Also the premises where the actual process runs may be hazardous or may
be uncomfortable for mankind. To send these values using pair of wires and connections
but in that case there will be a complex network of lots of wires that may lead to chaos.
1.4 Scope of the Project

To monitor all these physical quantities from central control room where hardly
two or three persons can easily monitor all the sensors, stores and update the records. All
the physical quantities that are measured at one place, their values are sent wirelessly to a
remote location. The values are sent at regular intervals. Their values are displayed at
both ends without change. Along with there are indication for changing in values. So this
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system is also useful in taking some decisions. So let us see how the concept is
utilized.
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CHAPTER 2
A Smart Sensor Interface for Industrial Monitoring using
ARM
Intelligent wireless sensor-based controls have drawn attention of the industry on
account of reduced costs, better power management, ease in maintenance, and effortless
deployment in remote and hard-to-reach areas. They have been successfully deployed in
many industrial applications such as maintenance, monitoring, control, security, etc. In
this research, the focus is on the issues of portability, reliability, flexibility and robustness
while using wireless connectivity in industrial applications such as instrumentation and
predictive maintenance, and to design a workable solution.
NODE SECTION
Fig 2.1 Node section
MONITORING SECTION
PC
ZIGBEE
Fig 2.2 Monitoring Section
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The block diagram shows transmitter side of the system. As shown in the block
diagram, system needs, ARM LPC2129 controller, 2x16 LCD, buzzer, ZigBee module,
CO2 sensor and a colour sensor. LCD is used to display data, Buzzer is used to alert the
user in case of high temperature, co2 sensor is used to detect excessive carbon element
and colour sensor detects colours (only fundamental colours) finally ZigBee to transmit
all measured values. Functional description of system is as follows:
Initially, to measure the temperature and light values, temperature sensor, LDR
and is used. Temperature sensor will be connected to channel 0 of ADC and LDR will be
connected to Channel 1 of ADC module which is built in in controller. Digital conversion
of these two analog inputs will be done and result will collected and displayed on the
LCD. Later, status of CO2 sensor as well as COLOUR sensor will be checked and
displayed on the LCD. COLOUR sensor works in 3 different modes i.e., RED, GREEN
and BLUE mode. In RED mode, red colour will be having higher frequency than any
other colour, similarly in GREEN mode green colour will be having higher frequency and
in BLUE mode blue colour will be having higher frequency, thus based on frequencies
COLOUR sensor will detect the colours. If temperature goes higher than the specified
value a buzzer will become on for sometimes to alert user. Finally, all the measured data,
status of CO2 and colour will be transmitted through ZigBee using serial communication
with the baud rate of 9600.
In Receiver side values will be received through ZigBee and displayed on the
screen thus the system can be monitored.
2.1 LPC2129 MICROCONTROLLER

The LPC2129 are based on a 16 bit ARM7TDMI-SCPU with real-time emulation
and embedded trace support, together with 128 kilobytes (kB) of embedded high speed
flash memory. A 128-bit wide memory interface and unique accelerator architecture
enable 32-bit code execution at maximum clock rate. For critical code size applications,
the alternative 16-bit Thumb Mode reduces code by more than 30 % with minimal
performance penalty.
With their compact 64 pin package, low power consumption, various 32-bit timers, 4channel 10-bit ADC, 2 advanced CAN channels, PWM channels and 46 GPIO lines with
up to 9 external interrupt pins these microcontrollers are particularly suitable for
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automotive and industrial control applications as well as medical systems and faulttolerant maintenance buses. With a wide range of additional serial communications
interfaces, they are also suited for communication gateways and protocol converters as
well as many other general-purpose applications. The features of the lpc2129
microcontroller is given below:
16/32-bit ARM7TDMI-S microcontroller in a tiny LQFP64 package.
16 kB on-chip Static RAM.
128/256 kB on-chip Flash Program Memory. 128-bit wide interface/accelerator
enables high speed 60 MHz operation.
In-System Programming (ISP) and In-Application Programming (IAP) via onchip boot-loader software. Flash programming takes 1ms per 512 byte line. Single
sector or full chip erase takes 400ms.
Embedded ICE-RT interface enables breakpoints and watch points. Interrupt
service routines can continue to execute while the foreground task is debugged
with the on-chip Real Monitor software.
Embedded Trace Macro cell enables non-intrusive high speed real-time tracing of
instruction execution.
Two interconnected CAN interfaces with advanced acceptance alters.
Four channel 10-bit A/D converter with conversion time as low as 2.44ms.
Multiple serial interfaces including two UARTs (16C550), Fast
I 2 C (400
Kbits/s) and two SPIs

60 MHz maximum CPU clock available from programmable on-chip
Phase-Locked Loop with settling time of 100ms.
Vectored Interrupt Controller with configurable priorities and vector addresses.
Two 32-bit timers (with four capture and four compare channels), PWM unit (sixoutputs), Real Time Clock and Watchdog.
Single-chip 16/32-bit microcontrollers
Up to forty-six 5 V tolerant general purpose I/O pins. Up to nine edge or level
sensitive external interrupt pins available.
On-chip crystal oscillator with an operating range of 1 MHz to 30 MHz
Two low power modes, Idle and Power-down.
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Processor wake-up from Power-down mode via external interrupt.

Individual enable/disable of peripheral functions for power optimization.
Architecture of LPC2129 is given below:
Fig 2.1.1 Block Diagram

The LPC2129 consists of an ARM7TDMI-S CPU with emulation support, the
ARM7 Local Bus for interface to on-chip memory controllers, the AMBA Advanced
High-performance Bus (AHB) for interface to the interrupt controller, and the VLSI
Peripheral Bus (VPB, a compatible superset of ARMs AMBA Advanced Peripheral Bus)
for connection to on-chip peripheral functions. The LPC2129 configures the
ARM7TDMI-S processor in little-endian byte order.
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AHB peripherals are allocated a 2 megabyte range of addresses at the very top of
the 4 gigabyte ARM memory space. Each AHB peripheral is allocated a 16 kilobyte
address space within the AHB address space. LPC2129 peripheral functions (other than
the interrupt controller) are connected to the VPB bus. The AHB to VPB bridge interfaces
the VPB bus to the AHB bus. VPB peripherals are also allocated a 2 MB range of
addresses, beginning at the 3.5 GB address point. Each VPB peripheral is allocated a 16
kilobyte address space within the VPB address space.
The connection of on-chip peripherals to device pins is controlled by a Pin
Connection Block. This must be configured by software to fit specific application
requirements for the use of peripheral functions and pins.
LPC2129
Fig 2.1.2 Pin Diagram of LPC2129.

The LPC2129 incorporate a 256 kB Flash memory system. This memory may be
used for both code and data storage. Programming of the Flash memory may be
accomplished in several ways: over the serial built-in JTAG interface, using In System
Programming (ISP) and UART0, or by means of In Application Programming (IAP)
capabilities. The application program, using the In Application Programming (IAP)
functions, may also erase and/or program the Flash while the application is running,
allowing a great degree of flexibility for data storage field firmware upgrades, etc.
The LPC2129 provide a 16 kB static RAM memory that may be used for code
and/or data storage. The SRAM supports 8-bit, 16-bit, and 32-bit accesses. The SRAM
controller incorporates a write-back buffer in order to prevent CPU stalls during back-toDR.SMCE
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back writes. The write-back buffer always holds the last data sent by software to the
SRAM. This data is only written to the SRAM when another write is requested by
software (the data is only written to the SRAM when software does another write). If a
chip reset occurs, actual SRAM contents will not reflect the most recent write request (i.e.
after a "warm" chip reset, the SRAM does not reflect the last write operation). Any
software that checks SRAM contents after reset must take this into account. Two identical
writes to a location guarantee that the data will be present after a Reset. Alternatively, a
dummy write operation before entering idle or power-down mode will similarly guarantee
hat the last data written will be present in SRAM after a subsequent Reset.
2.2 LM35 Precision Centigrade Temperature Sensors
The LM35 series are precision integrated-circuit temperature sensors, with an

output voltage linearly proportional to the Centigrade temperature. Thus the LM35 has an
advantage over linear temperature sensors calibrated in Kelvin, as the user is not
required to subtract a large constant voltage from the output to obtain convenient
Centigrade scaling. The LM35 does not require any external calibration or trimming to
provide typical accuracies of C at room temperature and C over a full 55C to
+150C temperature range. Low cost is assured by trimming and calibration at the wafer
level. The low output impedance, linear output, and precise inherent calibration of the
LM35 make interfacing to readout or control circuitry especially easy. The device is used
with single power supplies, or with plus and minus supplies. As the LM35 draws only 60
A from the supply, it has very low self-heating of less than 0.1C in still air. The LM35
is rated to operate over a 55C to +150C temperature range, while the LM35C is rated
for a 40C to +110C range (10 with improved accuracy). The LM35 series is
available packaged in hermetic TO transistor packages, while the LM35C, LM35CA, and
LM35D are also available in the plastic TO-92 transistor package. The LM35D is also
available in an 8-lead surface-mount small outline package and a plastic TO-220 package.
The FEATURES of LM35 is given below:
Calibrated Directly in Celsius (Centigrade)
Linear + 10 mV/C Scale Factor

0.5C Ensured Accuracy (at +25C)
Rated for Full 55C to +150C Range
Suitable for Remote Applications
Low Cost Due to Wafer-Level Trimming
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Operates from 4 to 30 V
Less than 60-A Current Drain
Low Self-Heating, 0.08C in Still Air
Nonlinearity Only C Typical
Low Impedance Output, 0.1 for 1 mA Load
Fig 2.2.1 LM35 Temperature Sensor
The LM35 is applied easily in the same way as other integrated-circuit

temperature sensors. Glue or cement the device to a surface and the temperature should
be within about 0.01C of the surface temperature.
This presumes that the ambient air temperature is almost the same as the surface
temperature. If the air temperature were much higher or lower than the surface
temperature, the actual temperature of the LM35 die would be at an intermediate
temperature between the surface temperature and the air temperature, which is especially
true for the TO-92 plastic package where the copper leads are the principal thermal path
to carry heat into the device, so its temperature might be closer to the air temperature than
to the surface temperature.
To minimize this problem, ensure that the wiring to the LM35, as it leaves the
device, is held at the same temperature as the surface of interest. The easiest way to do
this is to cover up these wires with a bead of epoxy which will insure that the leads and
wires are all at the same temperature as the surface, and that the temperature of the LM35
die is not affected by the air temperature.
The Parameters of the LM35 is given by:
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Table 2.1
2.3 LIGHT DEPENDENT RESISTOR (LDR Sensor)

A Light-dependent resistor (LDR) or photocell is a light-controlled variable
resistor. The resistance of a photo-resistor decreases with increasing incident light
intensity; in other words, it exhibits photoconductivity. A photo-resistor can be applied in
light-sensitive detector circuits, and light- and dark-activated switching circuits.
A photo-resistor is made of a high resistance semiconductor. In the dark, a photoresistor can have a resistance as high as a few meg-ohms (M), while in the light, a
photo-resistor can have a resistance as low as a few hundred ohms. If incident light on a
photo-resistor exceeds a certain frequency, photons absorbed by the semiconductor give
bound electrons enough energy to jump into the conduction band. The resulting free
electrons (and their whole partners) conduct electricity, thereby lowering resistance. The
resistance range and sensitivity of a photo-resistor can substantially differ among
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dissimilar devices. Moreover, unique photo-resistors may react substantially differently to

photons within certain wavelength bands.
Fig 2.3.1 LDR symbol and material used
A photoelectric device can be either intrinsic or extrinsic. An intrinsic

semiconductor has its own charge carriers and is not an efficient semiconductor, for
example, silicon. In intrinsic devices the only available electrons are in the valence band,
and hence the photon must have enough energy to excite the electron across the entire
bandgap. Extrinsic devices have impurities, also called dopants, added whose ground
state energy is closer to the conduction band; since the electrons do not have as far to
jump, lower energy photons (that is, longer wavelengths and lower frequencies) are
sufficient to trigger the device. If a sample of silicon has some of its atoms replaced by
phosphorus atoms (impurities), there will be extra electrons available for conduction. This
is an example of an extrinsic semiconductor.
Photo-resistors
are
less
light-sensitive
devices
than
photodiodes
or
phototransistors: the two latter components are true semiconductor devices, while a
photo-resistor is a passive component and does not have a PN-junction. The photoresistivity of any photo-resistor may vary widely depending on ambient temperature,
making them unsuitable for applications requiring precise measurement of or sensitivity
to light.
Photo-resistors also exhibit a certain degree of latency between exposure to light
and the subsequent decrease in resistance, usually around 10 milliseconds. The lag time
when going from lit to dark environments is even greater than, often as long as one
second. This property makes them unsuitable for sensing rapidly flashing lights, but is
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sometimes used to smooth the response of audio signal compression. The LDR
characteristic curve is shown below:
Fig 2.3.2 resistance VS Illumination
The cell resistance increases with increasing light intensity Light dependent
resisters have a particular property in that they remember the lighting conditions in which
they have been stored. This memory effect can be minimised by storing LDRs in light
prior to use. Light storage reduces equilibrium time to reach steady resistance values.
2.4 MQ-7 (CO2)

A carbon dioxide sensor or CO 2 sensor is an instrument for the measurement of
carbon dioxide gas. The most common principles for CO2 sensors are infrared gas sensors
(NDIR) and chemical gas sensors. Measuring carbon dioxide is important in monitoring
indoor air quality, the function of the lungs in the form of a capnograph device, and many
industrial processes.
Chemical CO2 gas sensors with sensitive layers based on polymer- or
heteropolysiloxane have the principal advantage of very low energy consumption, and
can be reduced in size to fit into microelectronic-based systems. On the downside, shortand long term drift effects as well as a rather low overall lifetime are major obstacles
when compared with the NDIR measurement principle. Most CO sensors are fully
calibrated prior to shipping from the factory. Over time, the zero point of the sensor needs
to be calibrated to maintain the long term stability of the sensor.
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Fig 2.4.1 MQ-7 (CO2)
The surface resistance of the sensor Rs is obtained through effected voltage signal
output of the load resistance RL which series-wound. The relationship between them is
described:
Rs\RL = (Vc-VRL) / VRL
Fig 2.4.2 Graph of CO2 Sensor
Fig. 2.4.2 shows alterable situation of RL signal output measured by using Fig 2.4.3
circuit output signal when the sensor is shifted from clean air to carbon Dioxide (CO2)
output signal measurement is made within one or two complete heating period (2.5
minute from high voltage to low voltage).Sensitive layer of MQ-7 gas sensitive
components is made of SnO2 with stability, so, it has excellent long term stability. Its
service life can reach 5 years under using condition. The feature of the MQ-7 is given by:
High sensitivity to carbon dioxide.
Stable and long life.
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The STANDARD CIRCUIT OF MQ-7 as shown in below Fig 2.4.3
Fig 2.4.3 standard measuring circuit of MQ-7
The sensitive components consist of 2 parts.

One is heating circuit having time control function (the high voltage and the low
voltage work circularly).
The second is the signal output circuit; it can accurately respond changes of
surface resistance of the sensor.
Resistance value of MQ-7 is difference to various kinds and various concentration

gases. So, when using these components, sensitivity adjustment is very necessary. We
recommend that you calibrate the detector for 200ppm CO in air and use value of Load
resistance that (RL) about 10 K (5K to 47 K).
When accurately measuring, the
proper alarm point for the gas detector should be determined after considering the
temperature and humidity influence. The sensitivity adjusting program: a. Connect the
sensor to the application circuit. b. Turn on the power; keep preheating through electricity
over 48 hours. c. Adjust the load resistance RL until you get a signal value which is
respond to a certain carbon monoxide concentration at the end point of 90 seconds. d.
Adjust the another load resistance RL until you get a signal value which is respond to a
CO concentration at the end point of 60 seconds .
The application of MQ-&: They are used in gas detecting equipment for carbon
monoxide (CO) in family and industry or car.
2.5 COLOR LIGHT-TO-FREQUENCY CONVERTER

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The TCS3200 programmable colour light-to-frequency converters that combine

configurable silicon photodiodes and a current-to-frequency converter on a single
monolithic CMOS integrated circuit. The output is a square wave (50% duty cycle) with
frequency directly proportional to light intensity (irradiance). The full-scale output
frequency can be scaled by one of three pre-set values via two control input pins. Digital
inputs and digital output allow direct interface to a microcontroller or other logic
circuitry. Output enable (OE) places the output in the high-impedance state for multipleunit sharing of a microcontroller input line.
In the TCS3200, the light-to-frequency converter reads an 8 x 8 array of
photodiodes. Sixteen photodiodes have blue filters, 16 photodiodes have green filters, 16
photodiodes have red filters, and 16 photodiodes are clear with no filters.
The four types (colours) of photodiodes are interdigitated to minimize the effect of
non-uniformity of incident irradiance. All photodiodes of the same colour are connected
in parallel. Pins S2 and S3 are used to select which group of photodiodes (red, green,
blue, clear) are active. Photodiodes are 110m x 110m in size and are on 134m centres.
Fig 2.5.1 Colour sensor
The features of colour Sensor is given below:

High-Resolution Conversion of Light
Intensity to Frequency
Programmable Colour and Full-Scale Output Frequency
Communicates Directly With a Microcontroller
Single-Supply Operation (2.7 V to 5.5 V)
Power down Feature
Nonlinearity Error Typically 0.2% at 50 kHz
Stable 200 ppm/C Temperature Coefficient
Low-Profile Lead (Pb) Free and RoHS
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Compliant Surface-Mount Package
Fig 2.5.2 Colour sensor functional block diagram.
The Application of Colour Sensor is given below:

Power supply considerations
Power-supply lines must be decoupled by a 0.01-F to 0.1-F capacitor with short
leads mounted close to the device package.
Input interface
A low-impedance electrical connection between the device OE pin and the device
GND pin is required for improved noise immunity. All input pins must be either driven by
a logic signal or connected to VDD or GND they should not be left unconnected
(floating).
Output interface
The output of the device is designed to drive a standard TTL or CMOS logic input
over short distances. If lines greater than 12 inches are used on the output, a buffer or line
driver is recommended. A high state on Output Enable (OE) places the output in a highimpedance state for multiple-unit sharing of a microcontroller input line.
Power down
Powering down the sensor using S0/S1 (L/L) will cause the output to be held in a
high-impedance state. This is similar to the behaviour of the output enable pin, however
powering down the sensor saves significantly more power than disabling the sensor with
the output enable pin.
Photodiode type (colour) selection
The type of photodiode (blue, green, red, or clear) used by the device is controlled
by two logic inputs, S2 and S3.
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Output frequency scaling

Output-frequency scaling is controlled by two logic inputs, S0 and S1. The
internal light-to-frequency converter generates a fixed-pulsewidth pulse train. Scaling is
accomplished by internally connecting the pulse-train output of the converter to a series
of frequency dividers. Divided outputs are 50%-duty cycle square waves with relative
frequency values of 100%, 20%, and 2%. Because division of the output frequency is
accomplished by counting pulses of the principal internal frequency, the final-output
period represents an average of the multiple periods of the principle frequency.
The output-scaling counter registers are cleared upon the next pulse of the principal
frequency after any transition of the S0, S1, S2, S3, and OE lines. The output goes high
upon the next subsequent pulse of the principal frequency, beginning a new valid period.
This minimizes the time delay between a change on the input lines and the resulting new
output period. The response time to an input programming change or to an irradiance step
change is one period of new frequency plus 1 s. The scaled output changes both the fullscale frequency and the dark frequency by the selected scale factor.
The frequency-scaling function allows the output range to be optimized for a variety of
measurement techniques. The scaled-down outputs may be used where only a slower
frequency counter is available, such as low-cost microcontroller, or where period
measurement techniques are used.
The choice of interface and measurement technique depends on the desired resolution and
data acquisition rate. For maximum data-acquisition rate, period-measurement techniques
are used. Pin diagram and description of colour sensor pin numbres is show in fig 2.15
and table 2.1 respectively.
Fig 2.5.3 Pin diagram of colour sensor.
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Pin Function Descriptions

Pin
Pin name
1
2
3
4
5
6
7
GND
OUT
S2
S3
VCC
VCC
S1
S0
LED
10
GND
Pin Description
Power supply ground.
Output frequency
Photodiode type selection inputs.
Photodiode type selection inputs.
Supply Voltage.2.7-5v
Supply Voltage.2.7-5v
Output frequency scaling selection
inputs.
Output frequency scaling selection
inputs.
LED CONTROL 1:ON,
0:OFF
Power supply ground
Table 2.2 Pin Function Descriptions
Output data can be collected at a rate of twice the output frequency or one data
point every microsecond for full-scale output. Period measurement requires the use of a
fast reference clock with available resolution directly related to reference clock rate.
Output scaling can be used to increase the resolution for a given clock rate or to maximize
resolution as the light input changes. Period measurement is used to measure rapidly
varying light levels or to make a very fast measurement of a constant light source.
Maximum resolution and accuracy may be obtained using frequencymeasurement, pulse-accumulation, or integration techniques. Frequency measurements
provide the added benefit of averaging out random- or high-frequency variations (jitter)
resulting from noise in the light signal. Resolution is limited mainly by available counter
registers and allowable measurement time. Frequency measurement is well suited for
slowly varying or constant light levels and for reading average light levels over short
periods of time. Integration (the accumulation of pulses over a very long period of time)
can be used to measure exposure, the amount of light present in an area over a given time
period.
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2.6 ZIGBEE
Zigbee modules (Tarang modules) are designed with low to medium transmit
power and for high reliability wireless networks. The modules require minimal power and
provide reliable delivery of data between devices. The interfaces provided with the
module help to directly fit into many industrial applications. The modules operate within
the 2.4-2.4835 GHz frequency band with IEEE 802.15.4 baseband. A feature of Zigbee is
as follows:
Range - Indoor/Urban: up to 300 mts.

Range - Outdoor line of sight: up to 50kms with directional antenna.
Transmit Power: up to 1 watt / 30 dBm nominal.
Receiver Sensitivity: up to 107 dBm.
RF data rate: 250 kbps.
AT Command Modes for configuring Module Parameters
Direct sequence spread spectrum technology.
Analog to digital conversion and digital I/O line support.
Tarang can be interfaced with a micro controller or a PC using serial port with the
help of appropriate level conversion.
Fig2.6.1 Interfacing ZigBee Module
Specification of the Tarang is given in the following table 2.3:
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General
Operating
Frequency
Indoor/Urban
range
Transmit
Power output
RF data rate
Antenna
Options
Table2.4 Specification of the
ZigBee is a low-
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ISM 2.4 GHz

Up to 100ml with 2db
antennas
19dbm Typical
250 Kbps
MMCX Connector, Chip
Antenna, Wire Antenna
Power
Supply Voltage
3.3 to
(vcc)
3.6v
Transmit
Current
120mA
Idle/receive
Current
65mA
Power-down
<10uA
Tarang
cost, low-power, wireless
mesh network standard. The low cost allows the technology to be widely deployed in
wireless control and monitoring applications. Low power usage allows longer life with
smaller batteries. Mesh networking provides high reliability and more extensive range.
ZigBee chip vendors typically sell integrated adios and microcontrollers with between 60
KB and 256 KB flash memory.
ZigBee operates in the industrial, scientific and medical (ISM) radio bands: 868
MHz in Europe, 915 MHz in the USA and Australia and 2.4 GHz in most jurisdictions
worldwide. Data transmission rates vary from 20 kilobits/second in the 868 MHz
frequency band to 250 kilobits/second in the 2.4 GHz frequency band.
ZigBee is not intended to support power line networking but to interface with it at
least for smart metering and smart appliance purposes. Because ZigBee nodes can go
from sleep to active mode in 30 ms or less, the latency can be low and devices can be
responsive, particularly compared to Bluetooth wake-up delays, which are typically
around three seconds. Because ZigBee nodes can sleep most of the time, average power
consumption can be low, resulting in long battery life.
TARANG supports the following types of networks:
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Unicast Network
Broadcast Network
Peer to peer Network or Point to point Network
In Unicast Network the communication happens only between the two modules with
respective source and destination addresses. In such network the destination address of
the TARANG 1 is source address to TARANG 2, and vice versa. For any effective
communication the source address and destination address should be configured properly.
Example:
TARANG 1
TARANG 2
Source address(MY)
0X100
0X2000
Destination
address(DA)
0X2000
0X1000
PARAMETER
Table2.6.1
Fig2.6.2 Unicast Network
In Broadcast Network only one module will broadcast the data to all other
modules, and then each individual module will respond to that. There is no
communication between the individual modules except Broadcasting Module. Consider
the fig, only master module will broadcast to all the slave modules and then each slave
module will respond to master module only. There is no communication between slave
modules. The source address of the master will be destination address to all the slaves and
destination address of the master is set to broadcast address 0xFFFF.
Example:
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Table2.6.2
PARAMETER
Source
address(MY)
MASTER
0X0004
SLAVE 1
0X0001
SLAVE 2
0X0002
SL
0X
Destination
address(DA)
0XFFFF
0X0004
0X0004
0X
MASTER
SLAVE 1
SLAVE 2
SLAVE 3
Fig2.6.3 Broadcast Network
In peer to peer network the modules in a network can communicate with any
module without any restrictions like master and slave. Each module will share the role of
both master and slave and communicate with each other. By default Tarang modules work
with this mode of network. The addressing is chosen based on the application needs.
Example:
Table2.6.3
PARAMETER
Source
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TARANG1
0XFFFF
TARANG2
0XFFFF
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TARANG3
0XFFFF
2014-15
address(MY)
Destination
address(DA)
0XFFFF
0XFFFF
0XFFFF
Fig2.6.4 peer to peer network
It is likely that Zigbee will increasingly play an vital role in the future of computer
and communication technology. In terms of protocol stack size, Zigbee's 32 KB is about
one third of the stack size necessary in other wireless technologies.
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Fig2.6.5 Zigbee Module
The IEEE 802.15.4based ZigBee is designed for remote controls and sensors,
which are very many in number, but need only small data packets and, extremely low
power consumption for longer life.
Therefore they are naturally different in their
approach to their respective application arenas. The ZigBee Alliance targets applications
across consumer, commercial, industrial and government markets worldwide. Unwired
applications are extremely sought after in many networks that are characterized by
copious nodes consuming minimum power and enjoying long battery lives. ZigBee
technology is designed to best suit these applications, for the reason that it enables lesser
costs of development and very swift market adoption. Properties of zigbee is given below:
Performance
Power Output:
1mW (0 dBm)
Indoor/Urban Range:
up to 100' (30m)
Outdoor/RF
Line-of-sight
Range:
up to 300' (100m)
RF Data Rate:
250 Kbps
Interface Data Rate:
up to 115.2 Kbps
Receiver Sensitivity:
-92 dBm
Networking
Spread Spectrum Type:
DSSS (Direct Sequence Spread Spectrum)
Networking Topology:
Peer-to-peer, point-to-point & point-to-multipoint
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Error Handling:
Retries & acknowledgements
Filtration Options:
PAN ID, channel and addresses
Channel Capacity:
16 Direct Sequence Channels (software selectable)
Addressing:
65,000 network addresses available for each channel
Encryption:
128-bit AES (coming soon)
Power
Supply Voltage:
2.8 - 3.1 V
Transmit Current:
45 mA (@ 3.3 V)
Receive Current:
50 mA (@ 3.3 V)
Power-down Sleep Current:
<10 A
General
Frequency Band:
2.4000 2.4835 GHz
Serial Data Interface:
3V CMOS UART No configuration required
Physical Properties
Size:
0.960" x 1.087" (2.438 cm x 2.761 cm)
Weight:
0.10 oz (3g) - w/ U.FL. Connector
Antenna Options:
U.FL. RF connector, chip antenna, or whip antenna
Operating Temperature:
-40 to 85 C (industrial)
Table2.6.4
There are a number of applications that can benefit from the ZigBee protocol:
Building automation networks, home security systems, industrial control networks,
remote metering and PC peripherals are some of the many possible applications.
Security systems & lighting controls.
Home automation & building control.
Home appliances & fire alarms.
Monitoring of remote systems.
Sensor data capture in embedded networks.
2.7 Power Supply
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The main building block of any electronic system is the power supply, to provide
required power for their operation. For the microcontroller, audio amplifier, keyboard,
edge connector, +5V required. For driving the motor, +12V is required. The power supply
provides regulated output voltage of +5V, and non-regulated output voltage +12V.Three
terminal IC 7805 meets the requirement of +5V regulated. The secondary voltage from
the main transformer is rectified by diodes D1-D4 (Bridge rectifier) and is filtered by
capacitor C1 (2200 f). This unregulated dc voltage is supplied to input pin of regulator
IC. C2 (0.1 f) is an input bypass capacitor and C2 (f) is to improve ripple rejection.
The IC used are fixed regulator with internal short circuit current limiting and thermal
shut down capability.
Fig 2.7.1 Power supply
2.8 LIQUID CRYSTAL DISPLAY
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Alphanumeric displays are used in a wide range of applications, including

palmtop computers, word processors, photocopiers, point of sale terminals, medical
instruments, cellular phones, etc. The 16 x 2 intelligent alphanumeric dot matrix display
is capable of displaying 224 different characters and symbols. A full list of the characters
and symbols is printed on pages 7/8 (note these symbols can vary between brand of LCD
used). This booklet provides all the technical specifications for connecting the unit, which
requires a single power supply (+5V).
Fig2.8.1 Alphanumeric display
It was following features:

Interface with 8-bit or 4-bit MPU is available.
192 Kind of alphabets, numerals, symbols and special characters can be displayed
by built in character generator (ROM).

Other preferred characters can be displayed by characters generator(RAM).
Compact and light weight design which can be easily assembled in devices.
Single power supply +5v drive (except for extended temp. type).
Low power consumption.
Item
Power voltages
Input H-level
voltage
Input L-level
DR.SMCE
Symbo
l
Vdd
standard
value
min typ. max
4.5 5
5.5
VIH
VIL
2.2
0.3
V
V
Condition
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Vdd
0.6
Unit
voltage
Output H-level
voltage
Output L-level
voltage
I/O leakage
current
Supply current
LCD operating
voltage
VOH
IOH
2014-15
2.4
VOL
V
0.4
IIL
Idd
1
2
a
mA
VLCD
11
Table2.8.1
Table2.3 Electrical Characteristics
Fig 2.8.2 Pin Diagram of LCD 2X16
Pin Description
Pin
No
1
Function
Name
Ground (0V)
Ground
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2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Supply voltage; 5V (4.7V 5.3V)

Contrast adjustment; through a variable resistor
Selects command register when low; and data register
when high
Low to write to the register; High to read from the
register
Sends data to data pins when a high to low pulse is
given
2014-15
Vcc
VEE
Register
Select
Read/write
Enable
DB0
DB1
DB2
DB3
DB4
DB5
DB6
DB7
Led+
Led-
8-bit data pins
Backlight VCC (5V)

Backlight Ground (0V)
Table2.8.2 Pin description of LCD 2X16.
2.9 SOFTWARE ASPECTS

2.9.1 COMPILER: Keil uVision
It is the Software which we have used to develop the program using Embedded C
Language. It has inbuilt compiler in it which is used to convert Embedded C program into
Hex file. The hex file is dumped into the microcontroller by which it will understand the
code we have return in Embedded C language and operates according to the logics which
we have written.
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Fig:2.9.1 Snapshot of Keil uVision
Steps for executing the Keil software:
2.9.2
On the desktop select keil uvision4 icon

Select the new vision project in the project header
Create new project
Save the program in lpc2129
Add the files in the group source
Create the program
Save & build the target
Press alt+f7
Debug the program
Build the target
Start the execution
UPLOADER: Proload
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This is the programmer which we have used to dump the hexadecimal code into
the Microcontroller which we have generated using Kiel Micro vision Software.
Fig 2.9.2 Snapshot of Proload
2.9.3 Development of Microsoft visual basic

Steps for executing the visual basic software:
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Select the visual basic icon

Create a new project file
Create a new table layout in MS excel
Save the table layout
Create a new MS access
Label the components to the project file in visual basic
Select project header files & references
Select the Microsoft active data objects 2.5 library
Start the execution
Fig 2.9.3 Create New Visual basic page
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Fig 2.9.4 page opened to create project
Fig 2.9.5 TO create reference Sheets
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Fig 2.9.6 Front pannel
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CHAPTER 3
METHODOLOGY AND IMPLEMENTATION
In this project we implement Different sensors for the different functions like CO2
sensor, LED sensor, Temperature sensor, Colour Sensor. The following shows flow
diagrams of sensors used in this project.
Temperature Sensor Working flow diagram:
Fig 3.1 Flow chart of Temperature Sensor
Algorithm of the Temperature sensor:

Step1: On Board computer verifies the Plant temperature or Boiler Temperature
periodically.
Step2: System checks temperature less than 35C or greater.
Step3: If temperature greater than 35C than Buzzer will ON for 1sec.
Step4: If temperature Leas than 35C than Keep on monitoring.
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CO2 Sensor Working flow diagram:
Fig 3.2 Flow chart of the CO2 sensor
Algorithm of the CO2 sensor:

Step1: On Board computer verifies the battery temperature periodically.
Step2: System checks CO2 surrounding.
Step3: If detected CO2 high than LCD will display High.
Step4: If detected CO2 LOW than LCD will display LOW.
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LED Sensor Working flow diagram:
Fig 3.3 Flow chart of LED Sensor
Algorithm of the LED sensor:

Step2: System checks Light Intensity surrounding.
Step3: If detected Light Intensity high than LCD will display High.
Step4: If detected Light Intensity LOW than LCD will display LOW.
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COLOUR Sensor Working flow diagram:
Fig 3.4 Flow chart of colour Sensor
Algorithm of the Colour sensor:

Step2: If sensor detects Red colour, then LCD display 00.
Step3: If sensor detects Green colour, then LCD display 11.
Step4: If sensor detects Blue colour, then LCD display 10.
Step5: If sensor detects other colour, then LCD display Default value 00.
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3.2 CIRCUIT DIAGRAM
V C C _3 .8
ZIGBEE
+5V
R1
U 3A
U 4A
74LS14
16X2
LCD
R2
R
16
4 5 6 7 8 9 1011121314
15
74LS14
+5V
PO.8
PO.9
LM 35
PO.0
PO.1
PO.2
PO.3
PO.4
PO.5
PO.6
PO.7
+5V
LDR
R6
R
PO.10
P1.27
P1.28
P1.29
R7
R
P1.30
L
P
C
2
1
2
9
10k
S2
S3
S0
S1
PO.4
SSA_PLL
OUT
+ 1 .8 v
+ 3 .3 v
V3_1
V3_2
V3_3
V3A
VSS1
VSS2
VSS3
VSS4
VSS5
VSSA
XTAL1
XTAL2
TD1
+ 3 .3 v
+5V
PO.12
PO.13
PO.14
PO.15
V18
V18
V18A
+5V
CO2
SENSOR
P0.21
P0.22
P1.16
PO.17
PO.18
PO.19
PO.20
PO.22
PO.21
PO.23
PO.24
PO.25
PO.26
PO.27
PO.28
PO.29
PO.30
RESET
Y1
C1
Fig 3.5 Circuit Diagram
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C R YS TAL
C2
COLOR
SENSOR
2014-15
CHAPTER 4
RESULTS
4.1 An Overview of A Smart Sensor Interface for Industrial Monitoring
using ARM
Model:
Fig4.1 Model A SMART SENSOR INTERFACE FOR INDUSTRIAL MONITORING USING ARM
The
model
A SMART SENSOR
INTERFACE
FOR
INDUSTRIAL
MONITORING USING ARM uses lpc-2129 LM35, LCD screen, COLOUR sensor,CO
sensor zigbee and buzzer.
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MONITORING SECTION:
Fig 4.2 of Monitoring Section
In this section Sensors parameters are wireless Monitored through PC
4.2 Expected Result at Various Point of Operation
Fig 4.3 of sensors output Displayed through LCD
This above result shows the Sensors result, showing temperature, CO, Light intensity and
Colour.
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Fig 4.4 output of smart sensors
Expected result of sensors Temperature, Carbon Dioxide, Light intensity, colour
This fig 4.5 shows the result of senor parameters, wireless monitored through PC
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CHAPTER 5
CONCLUSION AND FUTURE SCOPE

5.1 CONCLUSION
For Boiler Plants and large scale industries, monitoring and controlling systems
are of crucial importance with respect to safety and efficient operation. Since the system
operation mainly depends on high level programming, we can extend the system as our
interest. In this system, all the measurement is sent to the analog channel of the LPC-2129
microcontroller and displayed. The performances of the channels are distinguished on the
basis of its accuracy. The accuracy indicates how closely the sensor can measure the
actual or real world parameter value. The more accurate a sensor is, better it will perform.
Then temperature displayed in LCD is compared with the standard temperature .This
system is time saving, portable, affordable, consumes less power and can be made easily
available so that the user can use this system whenever and wherever.
5.2 FUTURE SCOPE
The work on something innovative which has many applications in the real world.
At the same time wanted the project to be a wireless based project. Which we can control
through mobile in remote area. By creating wireless sensor nodes (WSN) to large industry
can be monitored in IOT Environment
5.3 ADVANTAGES
Have a capacity to integrate a lot of sensors on a same wireless medium.
Time saving, continuous and efficient monitoring system.
More Reliable than that as compared to the wired Home Automation.
Portable and can be changed as per our requirement unlike the Wired ones.
5.4 DISADVANTAGES
Battery consumption is more due to simultaneous data transfer.
The Installation charge is very high.
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5.5 APPLICATIONS
Home Control
Personal Health Care
Industrial control
Building automation
Environment monitoring.
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REFERENCE
[1] The Internet-of-Things Architecture (IoT-A) project Sep 2010-Nov 2013. Available
online: http://www.iot-a.eu/public. (Accessed on October 2013].
[2] D. Guinard, A Web of Things Application Architecture Integrating the Real-World into
the Web, PhD thesis, ETH Zurich, 2011.
[3] Web-of-Objects (WoO)-ITE2 project Jan 2012Dec 2014. Available online:
http://www.itea2.org/project/index/view?project=10097. (accessed on 20 July 2013).
[4] Vlacheas, P.; Giaffreda, R.; Stavroulaki, V.; Kelaidonis, D.; Foteinos, V.; Poulios, G.;
Demestichas, P.; Somov, A.; Biswas, A.R.; Moessner, K. Enabling smart cities through a
cognitive management framework for the Internet of Things. IEE Communications
Magazine 2013, 51, 102- 110.
[5] Zia Ush Shamszaman, An Implementation of Web of Objects (WoO) Based Context
aware Emergency Management Systems, Masters thesis, CICE, HUFS, Korea, 2013
[6] Tomic, S., Fensel, A., and Schwanzer, M., Veljovic, M.K. and Stefanovic, M. (2012):
Semantics for energy efficiency in smart home environments, In Applied Semantic Web
Technologies,
[7] Tang, Y. and Meersman, R. (2011): Towards Directly Applied Ontological C onstrains
i n a S emantic D ecision T able, i n proc. o f 5 the International Symposium (RuleML
2011) Springer LNCS 7018, pp. 193-207, F. Olken, M. Palmirani, D. Sottara (eds.), Nov.
3-5, 2011, Ft. Lauderdale, FL, USA
[8] Sestito, S ., L eung, S ., D illon, T .S. ( 1991) S hort t erm l oad f orecasting using an
adaptive neural network, Journal of Electrical Power and Energy Systems, vol. 13(4), pp.
186-192.
[9] Szkuta, B.R., Sanabria, L.A., Dillon, T.S. (1999) Electricity price shortterm
forecasting using Artificial Neural Networks. In IEEE transactions on power systems,
14(3):851-857.
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1.2 Literature survey