Product Description of ZXMP S385 - V2 - 40

ZXMP S385(V2.
40)
SDH-Based Multi-Service Node Equipment
Product Description
ZXMP S385 Product Description
About the Document

Version
Date
Author
Approved By
Remarks
R1.0
12/19/2007
Not open to the Third Party
R1.1
01/15/2007
R1.2
12/2007
R1.3
05/2008
Copyright 2008 ZTE Corporation Shenzhen P. R. China
ZTE CONFIDENTIAL: This document contains proprietary information of ZTE Corporation

and is not to be disclosed or used except in accordance with
applicable agreements.
Due to update and improvement of ZTE products and technologies,
information of the document is subjected to change without notice.
ZTE Confidential Proprietary
Target Readers
This document is intended for any one who needs a general command of the features,
applications, structure and technical specifications of ZXMP S385(V2.40).
Structure of This Specification

This specification describes the system functions, hardware structure and configuration,
network application and technical indices of ZXMP S385.
Chapter 1 System Functions
This chapter introduces typical functions and features of ZXMP S385, including crossconnect, service access, protection functions, system control & communication, etc.
Chapter 2 System Mechanical Structure
This chapter introduces system hardware mechanical structure and the adaptable
cabinet installation of ZXMP S385.
Chapter 3 Boards And Slots
This chapter introduces the slots and boards of ZXMP S385, including names (code),
applying rule and unit power consumption, etc.
Chapter 4 Application Of MSTP
This part presents basic networking characteristics and applications of MSTP service.
Chapter 5 Networking And Protection
This chapter presents protection modes (including equipment level and network level)
and characteristics of ZXMP S385.
Chapter 6 Performances And Indexes
This chapter details the technical parameters, physical and networking performance of
the ZXMP S385.
Chapter 7 Environment Adaptability
This chapter lists the environmental indices which ZXMP S385 can operate normally for
a long term.
Appendix
This chapter lists international standards to which S385 conforms and the reference
abbreviations terms used in this specification.
II
Table of Contents
1
System Function.................................................................................................................6
1.1 System overview........................................................................................................6
1.2 Cross-connection and extension capabilities ...............................................................6
1.3 Powerful Service Access Ability ................................................................................6
1.3.1 Optical Interfaces .............................................................................................7
1.3.2 Electrical Interfaces..........................................................................................7
1.3.3 Data Interfaces .................................................................................................7
1.4 Integrated WDM Function .........................................................................................8
1.5 Complete Equipment Protection Ability .....................................................................8
1.6 Perfect Network Protection Ability.............................................................................9
1.7 Reliable Timing Synchronization Processing..............................................................9
1.8 System control and communication .......................................................................... 10
1.9 Overhead Processing................................................................................................ 10
1.10 Easy For Maintenance And Upgrade ........................................................................ 11
1.11 Alarm input/output................................................................................................... 11
1.12 System power supply ............................................................................................... 12
1.13 Perfect EMC and Operation Safety........................................................................... 12
System Mechanical Structure.......................................................................................... 13

2.1 Appearance of equipment......................................................................................... 13
2.2 Cabinet structure...................................................................................................... 13
2.3 Sub-rack structure .................................................................................................... 14
2.4 Dimensions and weights of components ................................................................... 15
Boards And Slots.............................................................................................................. 16

3.1 Introduction to the boards......................................................................................... 16
3.2 Slots......................................................................................................................... 17
3.3 Connector-type for All kinds of Service Interface..................................................... 19
Application of MSTP ....................................................................................................... 21

4.1 Application of Ethernet Service................................................................................ 21
4.1.1 EPL: Ethernet Private Line............................................................................. 21
4.1.2 EVPL (Ethernet Virtual Private Line) ............................................................. 21
4.1.3 EPLAN (Etherrnet Private LAN).................................................................... 22
4.1.4 EVPLAN (Ethernet Virtual Private LAN)....................................................... 23
4.2 Application of ATM Service .................................................................................... 23
Networking And Protection............................................................................................. 24

5.1 Application of Basic Service .................................................................................... 24
5.2 Hardware-level Protection........................................................................................ 24
5.2.1 Power supply protection ................................................................................. 24
5.2.2 Double bus design .......................................................................................... 25
5.2.3 Cross-Connect Protection and Clock Protection.............................................. 25
5.2.4 Tributary Card 1:N Protection ........................................................................ 25
5.2.5 Automatic Laser Shutdown(ALS) function ..................................................... 25
5.3
5.4
Network-level protection.......................................................................................... 26
Protection switch time.............................................................................................. 26
Performances And Indexes .............................................................................................. 27

6.1 STM-N optical interfaces performance..................................................................... 27
6.2 PDH interfaces performance and indexes ................................................................. 28
6.3 Performance of data boards ...................................................................................... 29
6.3.1 Performance of SEC24/48............................................................................ 29
6.3.2 Performance of SEE ....................................................................................... 31
6.3.3 Performance of TGE2B.................................................................................. 32
6.3.4 Performance of RSEB .................................................................................... 33
6.3.5 Performance of MSE...................................................................................... 34
6.3.6 Performance of AP18 ................................................................................... 35
6.3.7 Performance of TGSA8................................................................................ 35
6.4 Physical Performance of Ethernet............................................................................. 36
6.4.1 Ethernet interface types and followed standard ............................................... 36
6.4.2 GE interface types and followed standard ....................................................... 37
6.5 Performance of OAD ............................................................................................... 39
6.6 Performance of OBA................................................................................................ 40
6.7 Performance of OPA ................................................................................................ 41
6.8 Performance of DCM............................................................................................... 41
6.9 Error Performance.................................................................................................... 42
6.10 Jitter index at interfaces............................................................................................ 42
6.10.1 Jitter and wander tolerance of PDH input interface ......................................... 42
6.10.2 Jitter and wander tolerance of SDH input interface ......................................... 43
6.10.3 Inherent output jitter of STM-N interface ....................................................... 45
6.10.4 Mapping jitter of PDH tributary...................................................................... 45
6.10.5 Combined Jitter .............................................................................................. 45
6.10.6 Jitter transfer function of the regeneration relay .............................................. 46
6.11 Clock timing and synchronous characteristics........................................................... 46
Environment Adaptability ............................................................................................... 49

7.1 Power supply requirements ...................................................................................... 49
7.2 Grounding requirements........................................................................................... 49
7.3 Environment requirements ....................................................................................... 49
7.3.1 Operation Environment .................................................................................. 49
7.3.2 Environment for Storage ................................................................................ 51
7.3.3 Cleanness requirements .................................................................................. 51
7.3.4 Bearing Requirements of the Equipment Room .............................................. 51
7.3.5 Electronic Static Discharge (ESD) .................................................................. 52
7.4 Safety requirements.................................................................................................. 54
Appendix .......................................................................................................................... 56
8.1 Followed standards .................................................................................................. 56
8.1.1 International standards of ITU ........................................................................ 56
8.1.2 Corporate standards and other standards ......................................................... 59
8.2 Abbreviations........................................................................................................... 60
II
Figures and Tables

Figures
Figure 1
Appearance of S385 Sub-rack...................................................... 13
Figure 2
Structure and Configurations of Cabinet ...................................... 14
Figure 3
The shelf plug-in board................................................................ 15
Figure 4
Board slot layout of main subrack................................................ 18
Figure 5
Board slot layout of expansion subrack........................................ 19
Figure 6
EPL............................................................................................. 21
Figure 7
EVPL .......................................................................................... 21
Figure 8
EPLAN ....................................................................................... 22
Figure 9
EPLAN ....................................................................................... 22
Figure 10 EVPLAN..................................................................................... 23
Figure 11 ATM VP-RING........................................................................... 23
Figure 12 Basic Physical Topologies for ZSMP S385.................................. 24
Figure 13 The ALS principle ....................................................................... 26
Figure 14 The jitter and wander tolerance at E1 PDH input interface ........... 42
Figure 15 The jitter and wander tolerance at T1 PDH input interface ........... 43
Figure 16 The jitter tolerance of STM-N terminal multiplexer input interface44
Figure 17 The input jitter tolerance of STM-N SDH regenerator .................. 44
Figure 18 The jitter transfer characteristics of a regeneration relay............... 46
Tables
Table 1
Optical Interfaces Provided by ZXMP S385.................................... 7
Table 2
Electrical Interfaces Provided by ZXMP S385 ................................ 7
Table 3
Ethernet services Provided by ZXMP S385..................................... 8
Table 4
Equipment level protection provided by ZXMP S385...................... 8
Table 5
Overhead-Byte Usage List ............................................................ 10
Table 6
Configuration of ZXMP S385 ....................................................... 13
Table 7
Dimensions and Weight of Structural Parts ................................... 15
Table 8
Boards/unit list (with power consumption) .................................... 16
Table 9
Connector-type of interface........................................................... 19
Table 10 SDH system protection switch time............................................... 26
Table 11 Performance of the STM-1 optical interface .................................. 27
Table 12 Performance of the STM-4 optical interface .................................. 27
Table 13 Performance of the STM-16 optical interface ................................ 27
Table 14 Performance of the STM-64 optical interface of ZXMP S385........ 28
Table 15 Performance of the PDH electrical interface.................................. 28
Table 16 Input port permitted attenuation, frequency deviation and output port
signal bit rate tolerance .................................................................................. 28
Table 17 Requirements for the input/output port reflection attenuation ........ 29
Table 18 SEC48 and SEC24 Performance ............................................... 29
Table 19 Performance of TGE2B of ZXMP S385 ........................................ 32
Table 20 Ethernet interface index ................................................................ 36
Table 21 Transmission index of FE MMF optical interface.......................... 36
III
Table 22 Receiver index of FE MMF optical interface................................. 36

Table 23 index of FE short distance SMF optical interface........................... 36
Table 24 receiver index of FE short distance optical interface...................... 37
Table 25 Transmission index of FE long distance SMF optical nterface ....... 37
Table 26 Receiver index of FE long distance optical interface ..................... 37
Table 27 GE interface index ........................................................................ 37
Table 28 Transmission index of GE MMF optical interface ......................... 38
Table 29 Receiver index of GE MMF optical interface ................................ 38
Table 30 Transmission index of GE short distance SMF optical interface..... 38
Table 31 Receiver index of GE short distance optical interface .................... 38
Table 32 Transmission index of FE long distance SMF optical interface...... 39
Table 33 Receiver index of GE long distance optical interface..................... 39
Table 34 Performance of OADD ................................................................. 39
Table 35 Performance of OADC.................................................................. 40
Table 36 Performance of OBA Module........................................................ 40
Table 37 Performance of OPA Module ........................................................ 41
Table 38 Performance of the DCM .............................................................. 41
Table 39 SDH system error performance ..................................................... 42
Table 40 The input jitter and wander tolerance of PDH interface ................. 43
Table 41 The output jitter and wander tolerance of the PDH interface.......... 43
Table 42 Input jitter and wander tolerance (UIP-P) of SDH ......................... 44
Table 43 Input jitter and wander tolerance of the SDH................................. 44
Table 44 Input jitter tolerances of STM-N regenerators ............................... 44
Table 45 STM-N interface inherent output jitter indexes of SDH ................. 45
Table 46 STM-N network interface output jitter indexes of SDH ................. 45
Table 47 Mapping jitter specifications ......................................................... 45
Table 48 Combined jitter ............................................................................. 45
Table 49 Jitter transmission parameters of a regeneration relay.................... 46
Table 50 The SEC/SEE Index list ................................................................ 46
Table 51 The wander limit value under constant temperature (MTIE) .......... 47
Table 52 The wander limit value under temperature impact (MTIE) ............ 47
Table 53 The wander limit value under constant temperature (TDEV) ......... 47
Table 54 Climate requirement ..................................................................... 49
Table 55 Density requirements for chemical active substances..................... 50
Table 56 Density requirements for mechanical active substances ................. 50
Table 57 Requirements for mechanical stress............................................... 50
Table 58 Climate requirement ..................................................................... 51
Table 59 Requirements for mechanical stress............................................... 51
Table 60 Static discharge anti-interference................................................... 52
Table 61 RF electromagnetic radiated susceptibility .................................... 52
Table 62 Electrical fast transient burst susceptibility at the DC power port... 52
Table 63 Electrical fast transient burst susceptibilities at the signal cable and
control cable ports.......................................................................................... 52
Table 64 Surge susceptibility of DC power .................................................. 53
Table 65 Surge susceptibility of the outdoor signal cable ............................. 53
Table 66 Surge susceptibility of the indoor signal cable............................... 53
Table 67 Conductivity susceptibility of RF field .......................................... 53
IV
Table 68 Conductive emission electromagnetic interference at the direct current

port ................................................................................................................ 53
Table 69 Radioactive emission electromagnetic interference........................ 53
SYSTEM FUNCTION
1.1
System overview
ZXMP S385 is an intelligent optical transmission platform newly released by
ZTE. ZXMP S385 targets the backbone or large capacity convergent layer of
network which can satisfy present and future network requirements. It is an
ideal transmission system in constructing broadband transmission networks.
ZXMP S385 provides rich service access functions and complete protection
mechanism, facilitating its wide applications.
ZXMP S385 adopts modular design, incorporating SDH, Ethernet, ATM, PDH
and other technologies. It can transmit voice and data services efficiently on the
same platform.
The equipment has five versions, V1.10, V2.00, V2.10, V2.20 and V2.40.
V1.10 is 2.5G MSTP equipment and V2.00/V2.10/V2.20/V2.40 is 10G/2.5G
MSTP
equipment.
V1.10
can
be
smoothly
upgraded
to
V2.00/V2.10/V2.20/V2.40.
This document is based on ZXMP S385 V2.40.
1.2
Cross-connection and extension capabilities

Cross Clock board (CSF/CSE/CSA) of ZXMP S385 provides the cross-connect
function and fulfill the straight-through, broadcast, add/drop, loop back and
cross-connection (VC-4/VC-12 level) of services without blocking.
CSF board implements high-order and low-order cross-switching functions.
CSF has a space-division switching capacity of 1536 1536 VC4. In which,
256256 VC4s are assigned to the time-division cross-connect service unit, the
others are allocated to the space-division cross-connect unit of the system.
CSE board implements high-order and low-order cross-switching functions.
CSE has a space-division switching capacity of 1152 1152 VC4. In which,
CSA board implements high-order and low-order cross-switching functions.
CSA has a space-division switching capacity of 256 256 VC4. In which,
The equipment can supports maximum 14 service slots and access a large
amount of PDH, SDH and data services.
It can process 176-path ECC, and support the network topologies as linear, ring,
hinge, ring with chain, tangent ring and cross ring of STM-N levels meeting the
complex networking requirements thoroughly.
1.3
Powerful Service Access Ability

ZXMP S385 adopts modular structure, with its hardware including crossconnect card, clock card, control card, service card and service interface card.
The service access capacity is shown in following table.
A single sub-rack of ZXMP S385 has 14 slots for service boards and 10 slots
for interface boards. All slots could create protection. The equipment can
access a large amount of PDH, SDH and data services at one time.
1.3.1
Optical Interfaces
ZXMP S385 provides five types of optical interfaces: OTU2, STM-64, STM16, STM-4 and STM-1, as shown in Table 1.
Table 1
Board Type
Optical Interfaces Provided by ZXMP S385

Board Integration Maximum
Rate (Mbit/s)
(channel/board)
Access Quantity
OTU2
10709.225
14
STM-64
9953.280
14
STM-16
2488.320
1/4
56
STM-4
622.080
1/2/4
56
STM-1
155.520
2/4/8/16
192
ZXMP S385 also provides STM-64/STM-16 colored interfaces comply with

ITU-T G.692 and ITU-T G.695, which can be connected to DWDM/CWDM
directly without the OTU board.
ZXMP S385 has the one-interface OTU2 optical line board to support AFEC or
G.709 standard FEC function. By increasing the line rate, the board can correct
the bit errors in the line transmission. It may increase the receiving sensitivity
by about 2dB or the OSNR tolerance by 5-7dB, and work with OBA+OPA and
Dispersion Compensation Module (DCM) to implement the LH transmission
without electrical regeneration.
ZXMP S385 also provides OTU2/STM-64/STM-16 DWDM wavelength
interface with ITU-T standard 50GHz grid in C-band.
1.3.2
Electrical Interfaces
ZXMP S385 provides STM-1 electrical interface and PDH electrical interfaces,
as listed in Table 2.
Table 2
1.3.3
Electrical Interfaces Provided by ZXMP S385
Board Type
Rate (Mbit/s)
Board Integration
(channel/board)
Maximum Access
Quantity
STM-1
155.520
4/8/16
160
E3
34.368
60
T3
44.736
60
E1
2.048
63
630
T1
1.544
63
630
Data Interfaces
There are several data boards in ZXMP S385 V2.40SEC/SEE, TGE2B,
RSEB, MSE, AP18, TGSA8 and SEG.
SEC24 and SEC48 board provide 810M/100M+GE Ethernet services
which support L2 switching function and VC-12 virtual cascading function.
SEE board provides 810M/100M and 2GE interfaces, and it supports
Ethernet OAM function and port-level protection.
TGE2B board provides 2GE adaptive Ethernet services.
RSEB board provides 810M/100M+2GE interfaces which employs the

bandwidth of SDH/MSTP ring network to provide the dual-ring topology and
implement the ring interconnection of RPR nodes.
MSE board implements 810M/100M+2GE Ethernet service accessing, L2
data forwarding, MPLS message processing. It provides virtual bridge function
of L2 network and quality guarantee for end-to-end service.
FE Ethernet interfaces of each Ethernet board above can be optical or electrical.
It provides FE optical interface via ESFE8 and optical interface via OIS18
respectively. 10M/100M optical or electrical interfaces are available via
replacing interface board.
AP18 board is mainly used to converge or aggregate ATM service to SDH
transmission network. It provides 8155 Mbit/s optical interfaces at the ATM
side and 1622 Mbit/s non-concatenation data flow at the system side.
TGSA8 board supports 8 user interfaces which adopt SFP optical module.
The first 4 user interfaces may respectively offer GE or SAN service. SAN
service includes 1G Fiber Channel and 1G FICON services. The other 4 user
interfaces may offer 4GE services.
SEG board supports 1x10GE interface.
Table 3
Ethernet services Provided by ZXMP S385

Board Integration Maximum Access
Board Name Interface Type
(channel/board)
Capacity
1.4
SEC24/48
810M/100 M +GE
8FE+1GE
80FE+14GE
SEE
810M/100 M +2GE
8FE+2GE
80FE+28GE
TGE2B
2GE
2GE
28GE
RSEB
810M/100 M +2GE
8FE+2GE
64FE+16GE
MSE
810M/100 M +2GE
8FE+2GE
64FE+16GE
AP18
8155 Mbit/s
14
112
TGSA8
(4SAN+4GE) or 8GE
(4+4) or 8
(56+56) or 112
SEG
1x10GE
1x10GE
14
Integrated WDM Function

ZXMP S385 has OAD (Optical Add/Drop) board to add/drop or
multiplex/demultiplex 4 fixed-wavelengths of optical signals.
OAD board consists of two types in all: OADD is for DWDM signals and
OADC is for CWDM signals.
ZXMP S385 optical line board has DWDM or CWDM optical interfaces, and
OAD board can add/drop DWDM or CWDM optical signals. Both of them
work together to actualize OAD interface function.
ZXMP S385 single sub-rack supports at most 112 channels of DWDM OAD
interfaces or 112 channels of CWDM OAD interfaces.
1.5
Complete Equipment Protection Ability

Table 4 shows the equipment level protection of ZXMP S385.
Table 4 Equipment level protection provided by ZXMP S385
Items protected
Protection scheme
E1/T1 processing board
1:N (N9) tributary protection switching (TPS)

E3/T3 processing board
1:N (N4) TPS
STM-1 processing board(except

OEL116 board)
1:N (N4) TPS
FE board
1:N (N4) TPS
CSF/CSE/CSA(Cross-switch
and Synchronous-clock board)
1+1 hot backup
NCP/ENCP board
1+1 hot backup
SMI board
1+1 hot backup
48 V power interface board
1+1 hot backup
ZXMP S385 supports the co-existence of several different TPS protection.

ZXMP S385 adopts a dual-bus hierarchical design for service bus, overhead
bus and clock bus, which improves system reliability and stability.
1.6
Perfect Network Protection Ability

In terms of the network level protection, ZXMP S385 supports multiplex
section protection (MSP) ring, linear MSP, unidirectional path switched ring
(UPSR), subnet connection protection (SNCP) and logical subnet protection
(LSNP), etc.
ZXMP S385 can implement all networking features recommended by ITU-T. It
supports the route reconstruction of Ethernet and IP, and meets IEEE802.3E.
1.7
Reliable Timing Synchronization Processing

The clock timing/synchronization unit is composed of Cross Clock board
(CSF/CSE/CSA) and SCI board. The unit completes system timing and
network synchronization. It implements the following functions:
1.
2.
3.
Providing system clock signals and system frame header signals for all the
units of the SDH equipment.
Providing overhead bus clock and frame header
Providing the corresponding interface for upper-level controller to
configure and monitor the clock unit.
SCI board of ZXMP S385 provides 4 external reference clock output and 4
external reference clock input. The interface type is 2Mbit/s or 2MHz.
SCI can be configured with four external 2.048M clock input references and 28
lines (or tributary) 8K timing input references. Synchronization can select
external clocks, line clocks or E1/T1 tributary clocks.
The protection switching of clock reference sources bases on the alarm
information and clock synchronization status message (SSM) algorithm-based
automatic switching.
ZXMP S385 provides E1 tributary re-timing function. It supports synchronous
priority switching based on the SSM algorithm, optimizes synchronous timing
distribution of the network, prevents the occurrence of timing loops and keeps
network synchronization the optimal status.
ZXMP S385 supports synchronization receiving from following clock sources:
1.
STM-N tributary signal
2.
Besides dedicate signal of 2048kHz, receive from BITS or from other

SDH network elements.
Internal oscillator is controlled by crystal
3.
A software-controlled or a hardware phase lock circuit is used to implement

four working modes: a. Fast pull-in; b. Locked; c. Holdover; d. Free run.
1.8
System control and communication

1.
2.
3.
4.
5.
6.
7.
8.
1.9
The Net Control Processor (NCP) and Enhanced Net Control Processor
(ENCP) implement the system control and communication function, which
includes sending the configuration commands to all MCUs via S interface
and collecting their performance and alarm information.
NM information intercommunicates between NEs via the ECC channel.
The order-wire board (OW) performs the order-wire function. It actualizes
the intercommunication of order-wire phones between NEs via E1 and E2
bytes. It employs an independent CPU for order-wire and communicating
with NCP processor via S interface.
The Qx interface board is the communication interface between NE and
subnet management control center (SMCC). With Qx interface, NCP can
report to SMCC the alarm and performance information of the NE and
subnet and receive the commands and configurations sent from SMCC to
the NE and subnet. The f interface is the LMT access interface of local
NM, which is for the access management of portable PC.
The reset and ring trip are on the rack. Other interfaces are on QXI and
SCI boards.
The NCP/ENCP boards monitor the fan plug-box of the NE. The power
distribution unit performs the over/under voltage monitoring of input
voltage.
The alarm I/O: the NCP/ENCP boards offers 8-path external alarm switch
quantity interfaces, collects the alarm signal of NE and transmits it to the
alarm box and the first-cabinet-in-a-row.
It offers 2-path switch quantity (UC) interface and may output 2-path
switch quantity for user.
Overhead Processing
The overhead process of ZXMP S385 is performed by NCP/ENCP board, OW
board, CSF/CSE/CSA board, optical line boards and ATM board.
ZXMP S385 supports overhead transparent transmission, i.e. low rate service
signal and overhead can transfer transparently in STM-16 frame. It greatly
improves the network construction flexibility, abates the tension of insufficient
optical fiber resources, and ensures the NM integrity and the NM information
continuity.
Table 5
Overhead-Byte Usage List
Overhead
type
Overhead
name
ZXMP S385 application
RSOH/MSOH
A1, A2
Frame position indication

A1:11110110,A2:00101000
J0
S385 may identify, set and transparent transmit J0 byte
Z0
Not applied
D1~D12
E1, E2
for
regeneration
section,
S385 may set DCC of D1D3 or D1D12, and support

the transparent transmission of D1D12
S385 supports E1, E2 order wire telephone, as well as
E1,E2 transparent transmission.
10
AU pointer
F1
S385 provides F1 64kbps co-directional data interface,

and the transparent transmission of F1 byte
B1
Used for the error code monitor of regeneration section
B2
Used for the error code monitor of MS
K1, K2
Used for the auto-protection switchover (APS) command of MS
S1
b5~b8 used for synchronous status message
M1
Used for MS far-end difference indication
AU PTR
The rate adjustment on AU level
J1
Used for high-order path trace, able to be set
B3
C2
G1
POH
1.10
Used for path error code monitoring

Used for expressing the composition or maintenance status of
VC-3/VC-4/VC-4X, able to read and write
Used for returning the status and performance of path terminal to
the path origin of VC3/VC4/VC4XC
F2, F3
Not applying
H4
Affording the general position indication to payload, as well as

the special payload Position (i.e. H4 may be the multi-frame
position indication of VC12 and VC2); and performing
VC3/VC4 virtual concatenation
K3
Not applied
N1
Not applied
V5
Providing the functions of error code test, signal mark and

channel status for VC1/VC2
J2
VC1, VC2 path trace byte, able to be set
N2
Not supported
K4
Used for the virtual concatenation process of low-order path
Easy For Maintenance And Upgrade

With the following functions, the system becomes more reliable, featuring
good maintainability and easy scalability:
1.
2.
3.
4.
5.
6.
7.
1.11
It supports optical power monitoring functions.

It supports online loading and remote upgrading of card software
(including FPGA logic).
It provides the daily maintenance function. In case of a fault, it can quickly
locate the fault to the card level.
All cards provide the temperature monitoring function.
Pluggable optical module (SFP module, LC connector).
The actions of plugging in or removing plug-in modules while equipment
is powered and operating wont cause any danger or problem to any part
of the system.
The rate of SFP module could be changed by NMS.
Alarm input/output
NCP provides 8 external alarm Boolean value input interfaces and 4 external
alarm out put interfaces.
11
NCP collects alarm indication signals from NEs and sends them to the alarm
box and the first cabinet of the line.
The system provides two user alarm output interfaces and level alarms. It
shares a DB9 interface with F1 interface at the backplane side.
1.12
System power supply

ZXMP S385 equipment employs the dual-power system to access the -48V
power in the equipment room and distributes the -48V DC power in the power
distribution box.
It adopts separate power supply mode. No power boards in the sub-rack, the 48V power directly powers each board via the MB board through a DC/AC
conversion module.
Two lines of independent external -48V DC power supply, -48VGND and the
system protection GND are led from the connectors on the distribution frame
and then connected to the sub-rack power distribution board. The power
distribution (PD) board provides the equipment with the following functions
such as -48V power switch, distribution, isolation, EMI filtering, protection
against lightening and surge, fan power supply and control
1.13
Perfect EMC and Operation Safety

EMC, operation safety and fire/explosion protection of the equipment are fully
considered in the circuit board design.
12
SYSTEM MECHANICAL STRUCTURE
2.1
Appearance of equipment
A standard "ETSI cabinet + sub-rack" structure is used for ZXMP S385. Both
the cabinet and sub-rack unit are designed in the principle of front-facing
installation and maintenance to save equipment space and allow for back-toback installation, front-facing operations and maintenance.
Figure 1
2.2
Appearance of S385 Sub-rack
Cabinet structure
The basic units of equipment includes cabinet, sub-rack and power distribution
box.
ZXMP S385 uses the uniform transmission cabinet. A 2.2m or 2.6m cabinet
can accommodate one sub-rack. Rack supports back to back mode. The cabinet
structure and configuration are shown in Table 6.
Table 6
Configuration of ZXMP S385
Cabinet Height
Power Distribution Box
Sub-rack
2.2 m (Valid height 47U)
3U
43U+1U(wind-guide self)
2.6 m (Valid height 56U)
3U
43U+1U(wind-guide self)
13
1. Cabinet; 2. Power distribution shelf; 3. Cabling area;

4. Sub-rack; 5. Dust-proof shelf; 6. Alarm indicators; 7. Front door
Figure 2
2.3
Structure and Configurations of Cabinet
Sub-rack structure
ZXMP S385 sub-rack includes board, fan plug-in box and dustproof unit.
Structure of sub-rack is shown in Figure 3.
ZXMP S385 sub-rack consists of two parts, main subrack and expansion
subrack, with similar board slot layout. The plug-in board area of main subrack
or expansion subrack, each subrack is separated into 2 layers, where, the top
layer is for interface boards with 10 slots and the low layer is for service boards
with 14 slots.
14
Figure 3
2.4
The shelf plug-in board
Dimensions and weights of components

The dimensions and weight of the structural parts are shown in Table 7.
Table 7
Structural Part
Dimensions and Weight of Structural Parts

Dimensions(mm)
Weight (kg)
2,000 (H) 600 (W) 300/600 (D)
47/85
2,200 (H) 600 (W) 300/600 (D)
50/90
2,600 (H) 600 (W) 300/600 (D)
55/100
Sub-rack
1874.8 (H) 482.6 (W) 270 (D)
63
Power distribution box
132.5 (H) 482.6 (W) 269.5 (D)
Fan shelf
43.6 (H) 436 (W) 245 (D)
--
Dust-proof shelf
43.6 (H) 482.6 (W) 250 (D)
Ventilation unit
43.6 (H) 482.6 (W) 250 (D)
Upper cabling area
133 (H) 482.6 (W) 250 (D)
--
Service interface board
277.8 160 2 (H W D)
--
Service board
PCB320 (H)210 (W)2(D)

panel345.6 (H)5HP(W)
--
Cabinet
Note:
1. The cabinet weight refers to the weight of an empty cabinet.
2. the depth of CS, NCP/ENCP, OW, the interface boards in the upper-layer interface
area and the function boards in the lower-layer interface area service board refers to the
thickness of PCB.
3. 1HP=5.08mm.
15
BOARDS AND SLOTS
3.1
Introduction to the boards

The board names (code), applying rule and unit power consumption of ZXMP
S385 is shown in Table 8. The maximum input current of shelf is 32A.
Table 8
Board
NCP
ENCP
LKNCP
SMI
OW
QxI
Boards/unit list (with power consumption)
Board name and

configuring explanation
Net Control Processor, 1 for standard configuration,
2 able to practice 1+1 protection
Enhanced Net Control Processor, 1 for standard
configuration, 2 able to practice 1+1 protection
Link board for Net Control Processor
Service and management interface
Order-wire
Power
consumption(W)
6
10
0
25
15
2
TCS64
Qx interface 1 for standard configuration

Cross-switch and Synchronous-clock (256x256
VC4 high order with 32x32 VC4 low order)
VC4 high order)
VC4 high order)
Cross-switch with low-order
TCS128
26.3
TCS256
45.5
SCIB
B-type clock interface board (2Mbit/s)
SCIH
H-type clock interface board (2MHz)
OL64FEC
Optical Line of OTU2, with L-64.2cIf, L-64.2c

IIf or L-64.2pf. Supports FEC function
35
CSA
CSE
CSF
OL64
OL16
OL164
Optical Line of STM-64, with S-64.2b, L-64.2cI, L64.2cII, P1L1-2D2 or L-64.2p.

Optical Line of STM-16, with S-16.1, L-16.2, L16.2JE, L-16.2U or L-16.2P
Optical Line of STM-164, with S-16.1, L-16.2 or
L-16.2U
49.5
36
40 (without TCS)
15
30
25
30
OL42
Optical Line of STM-42
15
OL44
13
OL14
OL18
OEL116

Optical Line/Electrical Line Process of STM-116
Line Process of STM-14, used together with
electric interface switchover board or bridge board
Line Process of STM-18, used together with
electric interface switchover board or bridge board
15
18
20
ESS14
Electrical Interface of STM-14
12
ESS18
Electrical Interface of STM-18
12
EP36
Electrical Process of E3/T36
23
ESE36
Electrical Interface Switching of E3/T36
3.2
LP14
LP18
6.5
6.5
16

BIE3
Bridge Interface of STM-1e/E3/T3/FE,used for the

interface slot corresponding to protection board
9.5
EPE163(75)
Electrical Process of E163 (75)
15
EIE163(75)
Electrical Interface of E163 (75)
0.5
ESE163(75)
Electrical Interface Switching of E163 (75)
Before switchover 0.5,

after switchover 16
EPE163(120)
Electrical Process of E163 (120)
15
EPT163(100)
Electrical Process of T163 (100)
15
EIT163
EST163
BIE1
SEC48
SEC24
SEE
RSEB
MSE
AP18
TGE2B
TGSA8
SEG
OIS18
OEIS1x8
Bridge Interface of E1/T1

Enhanced
Intelligent
Ethernet
Processing
Board(48:1) customer side 8FE(optical or
electrical)+GE
Enhanced
Intelligent
Ethernet
Processing
Board(24:1) customer side 8FE(optical or
electrical)+GE
Enhanced Intelligent Ethernet Processing Board,
customer side 8FE(optical or electrical)+ 2GE
Embedded RPR Ethernet Processing Board,
customer side 8FE(optical or electrical)+2GE
Embedded MPLS Ethernet Processing Board,
customer side 8FE(optical or electrical)+2GE
8155Mbit/s optical board at the ATM side and
1622Mbit/s non-concatenation data flow at the
system side.
GE transparent process board
SAN service processing board, customer side
4SAN+4GE or 8GE
10GE process board
Optical interface board cooperating with Ethernet
board
Optical/Electric interface of 8STM-1
0.5
Before switchover 0.5,
after switchover 16
0.5
38
25
28
35
45
26
25
37
30
7
3
FAN
Ethernet electric board cooperating with Ethernet

board
Optical add/drop unit board for 4 channels of fixed
wavelength DWDM optical signals.
Optical add/drop unit board for 4 channels of fixed
wavelength CWDM optical signals.
Fan board
4.2
OBA12
Optical Booster Amplifier board(12dBm) built-in
25
OBA14
Optical Booster Amplifier board(14dBm), built-in
25
OBA17
25
OBA19
25
OPA32
Optical Pre-Amplifier(-32dBm), built-in
25
OPA38
Optical Pre-Amplifier(-38dBm), built-in
25
ESFE8
OADD
OADC
3.2
Electrical Interface of T163 (100) or E163

(120)
Electrical Interface Switching of T163 (100) or
E163 (120)
2.5
6
6
Slots
The board slot layout of main subrack is shown in Figure 4. The following
matters should be noted:
17
1.
2.
3.
4.
5.
6.
7.
8.
9.
The optical boards in the service slots

(OL64FEC/OL64/OL16/OL4/OL1/GE/10GE) can be interchanged.
The electrical interface boards (such as EPE1/EPT1/EP3/LP1) can only be
inserted in ten slots (slots 1 ~ 5 and 12 ~ 16). OEL1x16 can be inserted in
slots 1 ~ 7 and 10 ~ 16.
The correspondence between the electrical interface boards and the
cabling boards is as follows: Slots 1 ~ 5 correspond to Slots 61 ~ 65 in
sequence and Slots 12 ~ 16 correspond to Slots 68 ~ 72 in sequence.
The slots of the EPE1/EPT1 protection boards are not fixed and they can
be inserted any of the ten slots to implement 1:N (N 9) protection. The
bridge boards and the protection boards are configured in the paired slots.
The OBA OPA and OAD boards can be inserted in any of the service slots.
When no tributary protection function is to be implemented, the electrical
interface boards should be configured with the corresponding interface
boards and the paired relationship is shown in Item 3. To implement the
63*2M function, an EPE1 board and an EIE1 board should be configured.
The QxI/SCI boards are mandatory, and the QxI should be configured in
Slot 66 and the SCI in Slot 67.
Slots 8 and 9 are used to hold the two CSF/CSE/CSA boards that form hot
backup for each other. CSF board can support 5Gb/s bandwidth for
expansion subrack.
Slots 18 and 19 are used to hold the two NCP/ENCP boards that form hot
backup for each other.
Figure 4
Board slot layout of main subrack
The board slot layout of expansion subrack is shown in Figure 5. The following
matters should be noted:
1. When the expansion subrack is used, the main subrack must be configured
with ENCP and CSF (CSF boards must be configured to 1+1 mode and
ENCP board may be configured to 1+1 mode). The low speed service
18
2.
3.
4.
5.
6.
7.
8.
must be configured with SMI board which must be configured to 1+1

mode and inserted into slot 108 and 109.
Slot 117 is idle. Slot 118 or 119 is inserted with one passive board LKNCP.
The QxI/SCI boards are mandatory, and the QxI should be configured in
Slot 166 and the SCI in Slot 167.
Service slots in the expansion subrack may be configured with such boards
as OA, OAD, E1/T1 electrical processing board, E3/T3 electrical
processing board and SEC/SEE boards.
The OBA OPA and OAD boards can be inserted in any of the service slots.
EPE1/EPT1/EP3/SEC/SEE boards can only be inserted in ten slots (slots
102 ~ 105 and 112 ~ 116).
Slot 101 and 116 may be inserted with 34/45M board and FE protection
board. Slot 161 and 172 may be inserted with 34/45M board and FE
bridging board instead of such boards as ESFEx8 (the same as the main
subrack).
The correspondence between the electrical interface boards and the
cabling boards is as follows: Slots 101 ~ 105 correspond to Slots 161 ~
165 in sequence and Slots 112 ~ 116 correspond to Slots 168 ~ 172 in
sequence.
Figure 5
3.3
Board slot layout of expansion subrack
Connector-type for All kinds of Service Interface

Table 9
Connector-type of interface
Service Interface
Connector Type
E1/T1(75/100Ohm)
SCI
E1 (120 Ohm)
SCI
E3,T3,STM-1e(75 Ohm)
CC4
External Clock(75 Ohm)
CC4/DB9
remark
19

External Clock(120 Ohm)
DB9
FE(100Base-Tx)
RJ45
Full-Duplex/Half-Duplex
FE(100Base-Fx)
LC/PC
Full-Duplex
STM-1/4/16/64
LC/PC
STM-1/4/16 support SFP
Alarm
DB25/DB9
20
APPLICATION OF MSTP
4.1
Application of Ethernet Service
4.1.1
EPL: Ethernet Private Line
Figure 6
EPL
MSTP access node accesses data of important clients via FE interface, as

shown in the above figure. After adapted with GFP encapsulation rate rather
than L2 switching, user data is mapped into SDH VCG, then transmitted from
end to end via SDH network to destination node. In the above process, link
bandwidth depends on VCG. It is occupied only by a user just like a physical
private line, so end-to-end QoS of services can be ensured. Different from
conventional private line, MSTP can employ LCAS protocol or NM
configuration to adjust link bandwidth flexibly and dynamically, and support
traffic control.
EPL can ensure transparent transmission of Ethernet service, e.g., Ethernet
MAC frame and VLAN label. Ethernet service can be protected in SDH
protection mode.
4.1.2
EVPL (Ethernet Virtual Private Line)
Figure 7
EVPL
In the above figure, user data are accessed via several user ports, and share the
bandwidth of one network-side port (WAN port), i.e., one VCG The bandwidth
at WAN port can also be configured. It is required to adopt VLAN technique to
ensure isloation between different user ports.
21
The advantage of the scheme is that all user ports can share bandwidth at WAN
port, CIR and PIR should be configured to ensure QoS at user ports, and user
Ethernet service adopts SDH physical-layer protection.
EVPL is applied to virtual private line interconnection of different users
(interconnected via VLAN) between two nodes. For example, VLAN1 and
VLAN2 are two branches of industrial and commercial systems, and VLAN3
and VLAN4 are two branches of tax system.
4.1.3
EPLAN (Etherrnet Private LAN)
Figure 8
EPLAN
The services at 3 branches can be converged to headquarter via star network

composed of SDH timeslot links. MSTP at central node is embedded with L2
switching function. For central converged services, link bandwidth from
branches to headquarter is exclusive, so end-to-end QoS can be ensured. And
the network is highly reliable. When a branch fails, services at other branches
still work. User Ethernet service adopts SDH physical-layer protection.
Figure 9
EPLAN
The services between 3 branches and headquarter can form Ethernet shared
ring through SDH virtual connections via VCAT. But it is required in the
configuration that each MSTP node in the ring support L2 switching and STP.
In this way, less fiber bandwidth is occupied when large quantities of nodes are
available in the ring. In order to avoid unfair bandwidth allocation among the
nodes, the supervision is required to control LAN port traffic at each node. The
ring adopts SDH physical-layer protection. Because Ethernet ring crosses
several SDH rings, STP protection can also be used.
22
4.1.4
EVPLAN (Ethernet Virtual Private LAN)
Figure 10
EVPLAN
The services between branches and headquarters of company A and B can form
virtual Ethernet shared ring through SDH virtual connections via VCAT. But it
is required in the configuration that each MSTP node in the ring support L2
switching and STP. The services of two companies are isolated by VLAN. In
this way, less fiber bandwidth is occupied when large quantities of nodes are
available in the ring. In order to avoid unfair bandwidth allocation among the
nodes, the supervision is required to control LAN port traffic at each node. The
ring adopts SDH physical-layer protection. Because Ethernet ring crosses
several SDH rings, STP protection can also be used.
EPL is applied to private line interconnection between two users.
4.2
Application of ATM Service

ATM service can be converged to one 155M channel in VP-RING. In the
following figure, one 155M channel can carry ATM services of node B,C,D, all
the converged services go to BAS via node A.
Figure 11
ATM VP-RING
155M VP-RING is based on SDH network. It can coexist with SDH ring
transmitting other services. In addition, ATM transparent transmission on SDH
network can connect several VP-RINGs in serial to form a mixed ring.
23
NETWORKING AND PROTECTION
5.1
Application of Basic Service

ZXMP S385 is mainly applied to the local, metropolitan and backbone
transmission networks.
ZXMP S385 can provide all the networking features recommended by ITU-T,
such as TM, REG, ADM, and MADM. The following picture is the basic
physical topology of ZXMP S385. ZXMP S385 can support Chain, Star, Tree,
Ring and MESH connection and protection.
TM
1. Chain
2. Star
ADM
ADM
DXC/ADM
TM
TM
3. Tree
DXC/ADM
TM
TM
TM
TM
ADM
ADM
TM
TM
TM
TM
ADM
4. Ring
ADM
ADM
ADM
5. Mesh
Figure 12
DXC/ADM
DXC/ADM
DXC/ADM
DXC/ADM
Basic Physical Topologies for ZSMP S385
5.2
Hardware-level Protection
5.2.1
Power supply protection

1. Out-of-cabinet power protection
For ZXMP S385 equipment, one or two -48V power cables are introduced to
the cabinet via the air switch in the power distribution box. When two groups
of equipment room power supplies are introduced to the device, the power
24
supply works in 1+1 protection mode to make sure that the device works well
in the case of either the power group failure.
2. Inside-cabinet power protection
The dual-air switch control ensures the power supplies of every input power
and every shelf are isolated and with no influence on each other.
QxI/SCI carries out the 1:1 protection for input power, the power filtering, and
the protections as anti-reverse connection and anti-overcurrent; and it may
practice the normal application even with no self-own rack (with customers
rack).
On shelves, it supplies power to boards separately to guarantee no power
influence on the boards inside all boards, and actualizes the hot powered plug
of boards.
The switchover control circuit is under 1:N protection and the 3.3V power
supply is under 1:1 protection.
5.2.2
Double bus design

ZXMP S385 adopts dual-bus design for hardware and applies the hierarchy of
service bus, overhead bus and clock bus, which improves the reliability and
stability of system.
5.2.3
Cross-Connect Protection and Clock Protection

ZXMP S385 adopts two CSF/CSE/CSA boards to enable 1+1 protection. In the
system, two CSF/CSE/CSA boards adopt the active/standby work mode. In
case the active card is failed, the NMS controls the switching of the two cards.
5.2.4
Tributary Card Protection

PDH service cards enable 1:N hardware service protection. E1/T1 service cards
adopt 1:N (N<=9) protection. E3/T3, STM-1e and FE(e) cards of above levels
adopt 1:N (N<=4) protection. Tributary STM-1 cards support 1+1 protection.
5.2.5
Automatic Laser Shutdown(ALS) function

All STM16 interface of ZXMP S385 support the ALS function and satisfy
G.664 and G.958 standards. The course of ALS illustrates in Fig.5-1. When the
cable broke at A point, the receive port detects the loss of continuity of optical
transmit signal (LOC-OTS) at R2, which will cause T2 transmit port shutting
down, and the LOC-OTS of receive port at R1 also, thus, the transmit port T1
shuts down. In such way, it guarantees the optical power, in the OTS section at
A point where failure occurred, being in safety.
25

Figure 13
5.3
The ALS principle
Network-level protection
ZXMP S385 can provide all networking features recommended by ITU-T.
Protection modes include:
1. MSP 1+1/1:N
2. UPSR
3. BPSR
4. DNI protection
5. SNCP (at path layer VC12/VC3/VC4)
6. Logic subnet protection (LSNP)
Protection features of ZXMP S385 equipment also include ETHERNET/IP rerouting that is in compliance with IEEE802.3E specification.
5.4
Protection switch time

Table 10
Protection scheme
Unit protection
Network level
SDH system protection switch time

Type
Time
CSF/CSE/CSA
<50ms
STM-1/e
<50ms
Ethernet(e)
<50ms
34M
<50ms
45M
<50ms
1.5M/2M
<50ms
MS-ring
<50ms
SNCP
<50ms
26
PERFORMANCES AND INDEXES
6.1
STM-N optical interfaces performance

Performance of the OTU2/STM-64/16 /4/1 optical interfaces is shown as
follows.
Table 11 Performance of the STM-1 optical interface
Nominal bit rate
155520kbit/s
Classification code
S-1.1
L-1.1
L-1.2
Working wavelength (nm)
1310
1310
1550
Source type
MLM
SLM
SLM
Min transmitting optical power (dBm)
-15
-5
-5
Max transmitting optical power (dBm)
-8
Minimum extinction ratio (dB)
8.2
10
10
Poorest sensitivity (dBm)
-28
-34
-34
Minimum overload point (dBm)
-8
-10
-10
Transmitter at reference point S

Optical path between Point S and R
G.957-compliant
Receiver at reference point R

Nominal bit rate
622080kbit/s
Classification code
S-4.1
L-4.1
L-4.2
1310
1310
1550
Source type
MLM
SLM
SLM
-15
-3
-3
-8
8.2
10
10
-28
-28
-28
-8
-8
-8

G.957-compliant

Nominal bit rate
2488320kbit/s
Classification code
S-16.1
L-16.2
L-16.2JE
L-16.2P
L-16.2U
1310
1550
1550
1550
1550
Source type
SLM
SLM
SLM
SLM
SLM
Min transmitting optical power

(dBm)
-5
-2
+2
-2
-2
Max transmitting optical power

(dBm)
27

8.2
8.2
8.2
8.2
8.2
-18
-28
-28
-28
-28
-9
-9
-9
-9

Optical path between Point S and
R
G.957-compliant

Table 14 Performance of the STM-64 optical interface of ZXMP S385
Nominal bit rate
9953280kbit/s
Classification code
S-64.2b
L-64.2c1
L-64.2c2
P1L1-2D2
1550
1550
1550
1550
Source type
SLM
SLM
SLM
SLM
-1
-2
8.2
8.2
8.2
-14
-22
-22
-24
-1
-9
-9
-7

G.691 or G.959.1-compliant
6.2
PDH interfaces performance and indexes

Performance of PDH electrical interfaces is shown as Table 15.
Table 15 Performance of the PDH electrical interface
Type
1544kbit/s
2048kbit/s
34368kbit/s
44736kbit/s
155520kbit/s
Code pattern
AMI
B8ZS
HDB3
code
HDB3 code
B3ZS code
CMI code
G.703compliant
G.703compliant
G.703compliant
or
Bit rate of signals at

output port
Attenuation
tolerance at
port
input
Frequency deviation
tolerance at input
port
Anti-interference
capability of input
port
G.703compliant
G.703compliant
Permitted input port attenuation, permitted frequency deviation and output port
signal bit rate tolerance are listed in the following table.
Table 16 Input port permitted attenuation, frequency deviation and output
port signal bit rate tolerance
Permitted input port
frequency
Interface
Permitted input port Output port rate
rate
deviation(regular
frequency deviation tolerance
squared attenuation)
28

1544kbit/s
--
Greater than 32ppm
Less than 32ppm
2048 kbit/s
0dB~6dB, 1024kHz
Greater than 50ppm
Less than 50ppm
34368 kbit/s
0dB~12dB, 17,184kHz
Greater than 20ppm
Less than 20ppm
44736 kbit/s
--
Greater than 20ppm
Less than 20ppm
155520 kbit/s
0dB~12.7dB, 78MHz
Greater than 20ppm
Less than 20ppm
Reflection attenuation at the input/output ports
For input/output port reflection attenuation index of various electronic ports of

ZXMP S385, please refer to Table 17.
Table 17 Requirements for the input/output port reflection attenuation
Test frequency Reflection attenuation
Interface bit rate
range
(dB)
2048Kbit/s input port
34368Kbit/s input port
155520Kbit/s input/output port
51.2kHz~102.4kHz
12
102.4kHz~2048kHz
18
2048kHz~3072kHz
14
860kHz~1720kHz
12
1720kHz~34368kHz
18
34368kHz~51550kHz
14
8MHz~240MHz
15
Anti-interference capability of the input port
The ratio of main signals to interference signals is 18dB.

l
Output port waveform
The output port waveform complies with template specified in G.703

Recommendation.
l
Over-voltage protection of the input and output interfaces
The input and output interfaces must bear 10 continuous standard pulses (5
positive and 5 negative) without being damaged. The rising time of a standard
pulse is 1.2s, the width is 50s and the voltage amplitude is 20V.
6.3
Performance of data boards

There are several data boards in ZXMP S385 V2.40: SEC/SEE, TGE2B, RSEB,
MSE, AP18 and TGSA8.
6.3.1
Performance of SEC24/48
SEC24 and SEC48 board provide 810M/100M+GE Ethernet services
which support L2 switching function and VC-12 virtual cascading function.
Table 18
SEC48 and SEC24 Performance
Characteristics of Ethernet board
Explanation of board function and size
Property sort
Board name
Processing board SEC48,

interface board OIS18 and
ESFE8
Ethernet port
Interface type
Connector
Processing board
SEC24, interface
board OIS18 and
ESFE8
10BASE-T/100BASE-TX,100BASEFX,1000BASE-SX/LX/ZX
RJ45/LC
29

QTY
of
board
interface
Port work mode
(rate, full duplex,
half duplex and
auto-negotiation)
Optical
module
able to plug
Support (100BASE-FX and 1000BASE support

only full duplex)
Support
Front-outlet for GE panel; Interface board outlet
for FE;
Provide optical interface in cooperation with
OIS1x8,
Provide electrical interface in cooperation with
ESFEx8
Interface mode
FE
electrical
protection
810/100M+1GE
interface
1:N
Support N < -4
Remote download and upgrade
Support
Max. port QTY at system SDH side

(WAN port)
48
24
1.25G
Total backplane mapping bandwidth
Virtual
concatenation
VC12
Virtual
concatenation
VC3
Virtual
concatenation
VC4 mapping
Multi-direction convergence ratio
LCAS
protocol,
satisy ITU-T
G.7042
standard
Encapsulation
protocol
Dynamic
VCG
bandwidth
increase/decrease,
no damage with
service
LCAS management
functions
Multi-path
protection of VCG
level,
protecting
time <300ms
Support
GFP
encapsulation,
satisfy
ITU-T
G.7041 standard
support
PPP
encapsulation
protocol
Support
frame
Jumbo
622M
Support
4VC4
Support 8VC4 (Each VCG
(Each
VCG
supports 1VC4);
supports 1VC4);
Support 12VC3
Support 24VC3 (Each
(Each
VCG
VCG supports at most
supports at most
3VC3);
3VC3);
Support
Support 504VC12 (Each
252VC12 (Each
VCG supports at most
VCG supports at
63VC12).
most 63VC12).
Support (The multipath delay compensation
supported by VC12 is 32ms)
Support (The delay supported by VC3 is 32ms)
Support (VCG includes only one VC4)
48
24
support
support
support
support
support
support
support
support
support
Support
Support (maximum 9600

byte)
Support
(maximum
byte)
30
9600

Bandwidth
adjustment
based on port and stream
granule
Support the flow control based on

port
Port trunk function
2-layer switching capacity
2-layer exchange
Support 2-layer exchange transfer,
the exchange of local side and the
exchange of SDH side
Supported MAC address address
space
Support
Stacked
VLAN/QinQ
function
Support STP and RSTP
Support IGMP Snooping
Broadcast
function
packet
suppression
Granule based on
port 64K rate limit
Full duplex 802.3x PAUSE frame flow control

Trunk of even ports, up to 8FE
Bi-direction
Bi-direction 6.6Gbps
4.2Gbps
support the dynamic learning and static
configuration
of
MAC
address,
satisfy
IEEE802.1D bridge connecting function; MAC
address study rate satisfies the index >1024/s,
and able to set the aging time
support
support
8K. Support 2 study modes: IVL and SVL.

Support
Support RSTP, which is compatible with STP.
Support IGMP Snopping Support
IGMP
V2.0
Snopping V2.0
support
support
Supported VLAN QTY and scope
Support 1022 VLAN, where 2 VLAN are

remained and used for transparent transmission.
The VLAN quantity will be decreased by 2 each
time the transparent transmission quantity is
increased by 1.
COS function
Support the service classification by following

port, port+VLAN and port+802.1p. The level of
COS is 5 levels.
QoS
Support CIR and EIR
2-layer
VPN
function
EVPLAN services)
6.3.2
Flow policing supports

bandwidth granularity in
steps of 64kbps
Support Policing + PQ based on flow

Support CIR & EIR rate at level of 64kbps
(EVPL,
Support in Stack VLANQ-in-Qmode.
The intercommunication of different

products inside company
Intercommunicating with EOS series boards, RPR

functional RSEB board and MPLS functional
board
Support
Ethernet
monitor of port level
Support
performance
support
Performance of SEE
l
Providing 810M/100M+2GE interfaces.
Support 48VCG. VCG mapping mode may be VC-12-Xv/VC-3-Xv/VC4-Xv. VCG supports at most 1.25G bandwidth.
The total mapping bandwidth of SDH backplane is 1.25Gbps.
The unidirectional Ethernet switching capacity is 2.2Gbps.
Support E-Line, E-Tree and E-LAN services.
Configure S-VLAN according to port or customer CE-VLAN.
31
6.3.3
Support Ethernet OAM to facilitate fault locating and performance

inspection.
Support GFP RDI-CSF alarm.
Support Ethernet access rate control and DifferServ.
Support EPS protection.
Support port dispatching fairness of best-effort service.
Performance of TGE2B
TGE2B board provides 2GE adaptive Ethernet services.
Table 19
Performance of TGE2B of ZXMP S385
Characteristics of Ethernet board

Property
Board name
sort
Ethernet port characteristics
Connector
Ethernet
QTY of board interface
port
Port work mode (rate, full
duplex and auto-negotiation)
Optical module able to plug
Interface
mode
Explanation of board function

TGE2B
1000BASE-SX/LX/ZX
LC
2
Support
Support
Front-outlet on panel
Remote download and upgrade
Support
Max. Port QTY at system SDH side (WAN

port)
2
2.5G
Total backplane mapping bandwidth
Virtual
concatenation
LCAS
protocol
Support 16VC4 (Each VCG supports

at most 8VC4), or 48VC3 (Each
VCG supports at most 24VC3).
VC3 Virtual concatenation
Support (The delay supported by VC3

is 8ms. The board adopts the V3-AU3AUG mode and the mapping is not
made via VC4. Some problems occur in
the interconnection with other vendors
equipment and in the test. The
interconnection and test adopt VC4
instead of VC3. )
VC4 Virtual concatenation
Support
(The
delay
supported by VC4 is 8ms.)
Dynamic VCG bandwidth

increase/decrease,
no
damage with service
Support
(The
dynamic
service
bandwidth adjustment leads to 100ms
loss. There is no problem in the
function and interconnection.)
LCAS
management
functions (enable, alarm,
event report)
Multi-path protection of
VCG level, protecting time
tolerance
Support
Support
32

<300ms
Encapsulation
protocol
Support
GFP
encapsulation, satisfy ITU-T
G.7041 standard
support LAPS protocol,
satisfy ITU-T X.86 standard
support PPP encapsulation
protocol
Support Jumbo frame
Support
the
flow control
based on port
6.3.4
Support
Support
Support (maximum 9600 byte)
Full duplex
control
Support port transparent

transmit, the service frame
format might be (Eth II,
802.3, 802.1QTAG)
Point-to-point
transparent
transmit
(private
service mode)
Support
802.3x PAUSE
Support. Support the transfer of the port

Link state to the opposite end, and the
Link State Transfer technique (LST),
which will greatly reduce the switching
time of the router.
The transparent transmit

performance
satisfies
MSTP
recommendation,
refer to MSTP standard
6.2.1
for
details,
key Support
performance
parameters:
package losing rate, burst
interval, transfer rate, and
delay
The
intercommuni
cation
of
different
products
inside
company
VC4
intercommunication
Ethernet
performance
Support
performance
port level
level
Ethernet
monitor of
VC4-level intercommunicating with

EOS series boards, RPR functional
RSEB board and MPLS functional
board
support
Performance of RSEB
RSEB maps Ethernet service to RPR, and performs the unique functions of
RPR. It uses the channel bandwidth resource of SDH/MSTP ring network to
provide the dual-ring topology required by RPR and implement the ring
interconnection of RPR nodes.
RSEB provides user Ethernet interfaces as 8FE (optical/electrical) +2GE
(optical). It provides FE optical or electrical board by cooperating with OIS18
or ESFE interface board respectively.
RSEB board provides two RPR ports and four EOS port at system side:
(1) RPR at system side contains two RPR SPAN: RPR SPAN1 and RPR
SPAN2 with mapping methods of VC-4-Xv, VC-3-Xv, backplane bandwidth is
2.5G, capable of constructing 1.25G RPR.
(2) RPR board at system side provides four EOS ports with mapping method of
VC-12-Xv and a maximum bandwidth of 63VC12.
flow
33
EOS system port can be used for RPR service cross-ring, or

intercommunication with EOS boards as SEC/SEE and MSE. It supports LCAS
protocol.
RPR SPAN port and EOS system port share the 2.5 Gbit/s SDH processing
bandwidth. They support maximum 2.5 Gbit/s of RPR ring total bandwidth,
and maximum 155 Mbit/s of EOS bandwidth (RPR ring total bandwidth and
EOS bandwidth cannot reach the maximum values simultaneously).
RSEB board has the following functions:
l Switching capacity: 5G, backplane bandwidth:2.5G;
6.3.5
Providing 8FE2GE user Ethernet interfaces;
Compliant with IEEE802.17, support for two RPR SPAN, capable of

forming 1.25G bidirectional ring at most;
Support for interoperation of RPR ring and EOS chain, implementing

conversion of mapping granules;
Support for Bypass RPR MAC function, used as EOS transparent

transmission board to support transparent transmission of two GE+4 FEs;
EOS port supporting CSF OAM function, with point-to-point LST

function available;
Support for IGMP Snooping broadcast protocol, support for IPTV

application;
Support for LACP protocol, providing large-capacity dynamic link

aggregation function with protection;
Good service security isolation, support for Q in Q-based VLAN VPN;
Support for VC-12-Xv/VC-3-Xv/VC-4-Xv, LCAS and GFP.
Performance of MSE
MSE board is applicable to the MAN access layer and convergence layer,
focusing on accessing or aggregating distributed services to the upper layer
network. MSE board performs the following operations on services from
different locations: stream classification, destination address identification, rate
control, dispatch, service reshaping. The services are transmitted via Ethernet
or SONET/SDH interface after the message is encapsulated by specific
protocol.
MSE implements Ethernet service access, L2 data forwarding, MPLS message
process and mapping from Ethernet data to SDH data. MSE board provides
customer interfaces as 8FE+2GE which are compliant with IEEE802.3
specification. FE can be electrical or optical interface.
MSE adopts the flow method to process Ethernet message, supports multiple
switch methods such as MPLS/VLAN/MAC and provides virtual bridge
function of L2 network and quality guarantee for end-to-end service. It is one
of the critical equipment to construct the network for virtual private line and
virtual private service network.
l
System-side capacity: MSEB backplane bandwidth is 2.5G, supports

maximally sixty-four VCGs which can select different VC granules.
Maximally 252VC12 (with each VCG containing 63VC12 at most) can
be configured to cooperation with VC4/VC3;
34
6.3.6
Supports MPLS label switching with switching capacity of 3.6G;
Supported protocols: supports virtual concatenation compliant with ITU-T

G.707, supports VC-12-Xv/VC-3-Xv/VC-4-Xv; supports LCAS functions
compliant with G.707 and G.7042; supports GFP encapsulation method
compliant with G.7041.
It supports OSPF-TE route protocol and RSVP-TE resource reservation

protocol.
Support EPL, EVPL, EPLAN and EVPLAN applications.
Supports CoS (classification of service) based on port and VLAN, offers

VFI forwarding adapting to pseudo-wire;
Features control plane functions, supports RSVP-TE signaling distribution

tunnel tag, supports OSPF-TE routing.
Supports OAM function of LSP, supports LSP 1+1/1:1 protection.
Performance of AP18
AP18 board is mainly used to converge or aggregate ATM service data to
SDH transmission network. It provides 8155 Mbit/s optical interfaces at the
ATM side to perform functions as ATM layer processing and mapping from
ATM cell to VC-4. It provides 1622 Mbit/s non-concatenation data flow at the
system side. With 622M backplane bandwidth and 622Mbps cell switching
capacity, it can select 1-4 VC-4 channels to transmit ATM services.
l Backplane bandwidth: 622M, cell switching capacity: 622Mbps.
6.3.7
Supports four ATM service types as constant bit rate (CBR), realtime
variable bit rate (rt-VBR), non-realtime variable bit rate (nrt-VBR) and
unspecific bit rate (UBR).
Supports VP/VC switching.
Support VP uni-directional/bidirectional 1+1 and 1:1, supports VPRing,

VCRing functions.
Support OAM function of ATM, supports VP protection switching, the

switching request can be alarms as VP-AIS (Virtual path-based alarm
indication signal), LOS (loss of signal), LOF (loss of frame), OOF (out of
frame), LAIS (line alarm indication signal), LCD (loss of cell delineation),
and LOP (loss of pointer).
Supports ATM space, logic multicast, when performing ATM exchange, it

can copy one input ATM cell flow (VP, VC) to multiple output ATM links.
Performance of TGSA8
TGSA8 has SAN and GE transparent transmission interface. It supports 8 user
interfaces which adopt SFP optical module. The first 4 user interfaces may
respectively offer GE or SAN service. SAN service includes 1G Fiber Channel
and 1G FICON services. The other 4 user interfaces may offer 4GE services.
TGSAx8 provides 42.5G service bus at the system side. The total bandwidth
is 10G.
Other characteristics of TGSAx8 are showed as follows:
35
l
l
Support GFP and comply with G.7041.

Support LOF, OOF, AU-AIS and AU-LOP alarm check.
l
l
Provide line-side and user-side loopback functions of user interface.

Support VC-3 and VC-4 mixed concatenation. Any VCG may be
respectively configured to VC-3 or VC-4 virtual concatenation. VC-3
supports VC-3-->TU-3-->AU-4 mapping path.
Support LCAS protocol and complies with G.7042.
6.4
Physical Performance of Ethernet
6.4.1
Ethernet interface types and followed standard

Table 20
Ethernet interface index

followed
Interface type
standard
Type
Rate (bps)
interface
10BASE-T
10M
IEEE 802.3
Electronic interface
100BASE-TX
100M
IEEE 802.3u
Electronic interface
100BASE-FX
100M
IEEE 802.3u
M-1.1/S-1.1/L-1.1
RJ45, category 3
UTP
RJ45, category 3
UTP
SFP-LC
All optical interface indices are described as following.

1.
FE MMF optical interfaceM-1.1

Table 21 Transmission index of FE MMF optical interface
Item
62.5/125m MMF
Unit
Transmission unit type
MMF LD
Transmission distance
Interface
SFP-LC
Wavelength (, range)
1270~1380
nm
Trise/Tfall (maximum;10%~90%)
ns
RMS spectrum width (maximum)
63
nm
Output optical power (maximum)
-14
dBm
Output optical power (minimum)
-20
dBm
Output optical power when the LD is

shut down (maximum)
-45
dBm
Extinction ratio (minimum)
10
dB
KM
Table 22 Receiver index of FE MMF optical interface

Item
62.5/125m MMF
Unit
Wavelength(, range)
1270~1380
Nm
input optical power (maximum)
-14
dBm
Receiver sensitivity
-30
dBm
2.
FE short distance SMF optical interfaceS-1.1

Table 23 index of FE short distance SMF optical interface
Item
10/125m SMF
SMF LD
15
Unit
KM
36

Interface type
SFP-LC
Wavelength(, range)
1261~1360
nm
2.5
ns
RMS spectrum width(maximum)
7.7
nm
output optical power(maximum)
-8
dBm
output optical power(minimum)
-11.5
dBm

shut down(maximum)
-45
dBm
Extinction ratio(minimum)
dB
Table 24 receiver index of FE short distance optical interface

Item
10/125m SMF
Unit
1261~1360
nm
Input optical power (maximum)
-8
dBm
-31
dBm
3.
FE long distance SMF optical interfaceL-1.1

Table 25 Transmission index of FE long distance SMF optical nterface
Item
10/125m SMF
Unit
SMF LD
40
Interface type
SFP-LC
Wavelength (,range)
1261~1360
nm
2.5
ns
nm
dBm
-5
dBm

shut down(maximum)
-45
dBm
Extinction ratio (minimum)
10
dB
KM
Table 26 Receiver index of FE long distance optical interface
6.4.2
Item
10/125m SMF
Unit
Wavelength (,range)
1261~1360
Nm
-9
dBm
-34
dBm
GE interface types and followed standard

Table 27
GE interface index
Type
Rate(bps)
followed
standard
Interface
type
interface
1000BASE-SX
1000M
IEEE 802.3z
M-1.8
SFP-LC
1000BASE-LX
1000M
IEEE 802.3z
S-1.1
SFP-LC
1000BASE-ZX
1000M
IEEE 802.3z
L-1.2
SFP-LC
37
All optical interface indices are described as following:

4.
GE MMF optical interfaceM-1.8

Table 28 Transmission index of GE MMF optical interface
Item
62.5/125m MMF
Unit
MMF LD
275
Interface
SFP-LC
830~860
nm
0.26
ns
0.85
nm
Output optical power(maximum)
-4
dBm
Output optical power(minimum)
-9.5
dBm
Output optical power when the LD is shut

down(maximum)
-35
dBm
RIN(maximum)
-117
dB/Hz
dB
Table 29 Receiver index of GE MMF optical interface

Item
62.5/125m MMF
Unit
Wavelength(range)
770~860
nm
input optical power(maximum)
dBm
-17
dBm
Minimum return loss
12
dB
Intensified receiving sensitivity (maximum)
-12.5
dBm
5.
GE short distance SMF optical interfaceS-1.1

Table 30 Transmission index of GE short distance SMF optical interface
Item
10/125m SMF
Unit
SMF LD
10
Interface type
SFP-LC
Wavelength(,range)
1270~1355
nm
0.26
ns
2.8
nm
-3
dBm
-9.5
dBm

down(maximum)
-35
dBm
dB
RIN(maximum)
-120
dB/Hz
KM
Table 31 Receiver index of GE short distance optical interface

Item
10/125m SMF
unit
38

Wavelength ( range)
1270~1355
nm
-3
dBm
-20
dBm
-14.4
dBm
6.
GE long distance SMF optical interfaceL-1.2

Table 32 Transmission index of FE long distance SMF optical interface
Item
10/125m SMF
Unit
SMF LD
80
Interface type
SFP-LC
Wavelength (,range)
1540~1570
nm
2.5
ns
0.16
nm
dBm
dBm

down(maximum)
-45
dBm
dB
RIN(maximum)
-120
dB/Hz
Km
Table 33 Receiver index of GE long distance optical interface
6.5
Item
10/125m SMF
Unit
Wavelength(,range)
1270~1600
nm
Input optical power(maximum)
dBm
-22
dBm
-14.5
dBm
Performance of OAD
OAD board consists of OADD and OADC.
l OADD can add/drop 4 wavelengths of DWDM optical signals. These 4
wavelengths are among C-band 40 wavelengths.
l OADC can multiplex/demultiplex 4 wavelengths of CWDM optical
signals and 1 channel of 1310nm optical signal. These 4 wavelengths are
1471/1491/1511/1531nm or 1551/1571/1591/1611nm.
l OADD/OADC can be upgraded. With board cascading, it can
multiplex/demultiplex 8 wavelengths of optical signals.
OAD board may process the control commands from NM to make the online
upgrade of board software.
Table 34
Performance of OADD
Item
Unit
Parameter
Min
Max
Frequency Range
THz
192.1
196.0
Wavelength Range
nm
1529.55
1560.61
39

Channel Spacing
GHz
100
0.5 dB Passband
nm
0.11
20dB Passband
nm
1.20
In-drop
dB
2.5
3.3
Add-out
dB
2.5
3.3
In-out
dB
2.4
dB
1.0
Insertion Loss
Insertion Loss Uniformity
Table 35
Item
Unit
Parameter
Channel Number
Central wavelength
nm
1471/1491/151
1/1531
1471/1491/151
1/1531
1551/1571/159
1/1611
Passband @ 0.5dB
nm
6.5
6.5
6.5
Wavelength range of upgrade port
nm
1544.5~1621
1544.5~1621
dB
0.5
0.5
0.5
dB
0.7
12601360
Ln- CWDM
nm
dB
2.3
2.0
UPGCWDM
dB
1.7
Ln UPG
dB
2.3
2.0
Ln -1310nm
dB
1.2
Ripple
@ 1310 Port
Passband @ 1310 Port
Insertion Loss
(Including
connectors)
6.6
Performance of OADC
Performance of OBA
Table 36
Performance of OBA Module
Performance
Unit
OBA12
OBA14
OBA19
Operating wavelength
nm
1530~1565
1530~1565
1530~1565
Input power
dBm
-12~4
-12~4(10G)
-6~4
-6~4(2.5G)
Output power(maximum)
dBm
12
14
19
Dynamic range of
output power (dB)
dB
Gain
dB
5~24
7~26(10G)
12~25
7~20(2.5G)
Small Signal Gain
dB
>25
>25
>25
Noise Index
dB
Input return loss
dB
45
45
45
output return loss
dB
45
45
45
Output pump leakage
dBm
-30
-30
-30
Input pump leakage
dBm
-30
-30
-30
PDG
dB
0.5
0.5
0.5
PMD
ps
Power(full temperature range)
<25
<25
<25
40

Operating temperature
-15~65
-15~65
-15~65
Operating humidity
5~95
5~95
5~95
Storage temperature
-40~75
-40~75
-40~75
LC/PC
LC/PC
LC/PC
Optical Connector
NoteOBA19 Only operating at 155M and 622M bit rate.
6.7
Performance of OPA
Table 37
Performance of OPA Module
Performance
unit
OPA38
OPA32
Operating wavelength
nm
1550.12
1550.12
Filter-3dB bandwidth
nm
0.45
0.45
Filter -20dB bandwidth
nm
1.2
1.2
Input power
dBm
-38~20
-32~15
Output power(maximum)
dBm
-9
-6
Dynamic range of output power (dB)
dB
Gain
dB
26~32
25~31
Small Signal Gain
dB
30
30
Noise Index
dB
4.5
4.5
Input return loss
dB
45
45
output return loss
dB
45
45
Output pump leakage
dBm
-30
-30
Input pump leakage
dBm
-50
-50
Forward ASE level
dBm
-30
-30
Backward ASE power level
dBm
-30
-30
Pump wavelength
nm
980
980
PDG
dB
0.2
0.2
PMD
ps
Power
15
15
Power supply
-4810%
-4810%
Operating temperature
-15~65
-15~65
Operating humidity
5~95
5~95
Storage temperature
-40~75
-40~75
LC/PC
LC/PC
Optical Connector
6.8
Performance of DCM
The Dispersion Compensating Modules compensates the dispersion of
conventional single mode fiber (G.652/G.655)
Table 38
Performance of the DCM
Type
DCM-20
DCM-40
DCM-60
DCM-80
DCM-100
Dispersion
compensated
range(ps/nm)
-32915
-68021
-102031
-136041
-164041
Insert loss(dB)
4.1
5.1
7.0
8.9
12.1
typical value
-3.2
-4.4
-6
-7.7
-11.5
41

PMD(2-step)
0.5
1.0
1.2
1.3
PMD(Typical)(ps)
-0.4
-0.4
-0.5
-0.6
0.1
0.1
0.1
PMD cost(dB)
Note
1. Each DCM needs a 1U-high DCM-Box.;
2. Generally Only 10G system need to consider dispersion problem;
3. DCM80 can only be located in front of OBA and cannot be located after OPA
6.9
Error Performance
For each circuit direction and for bi-directional section and path, the error
performance is monitored separately, the SDH performance of ZXMP complies
with ITU-T G.784, G.828 and G.826. The SDH performance includes
performance items such as BBE, ES, SES, FBBE, FEES, FESES, PSC, PJC+,
PJC-, UAS, etc.
The long term and short-term error performances of ZXMP S385 are complied
with ITU-T G.828 and M.2101 recommendation. According to ITU-T G.821
and G.826, in 420km HRDP (Hypothetical Reference Digital Path), SDH
system error performance of ZTEs transmission product is as follows, these
figures are tested in field and test duration is not less than 24 hour.
Table 39
SDH system error performance
Bit
rate(kbit/s)
ESR
2048
44736
155520
622080
2488320
1.84810-6
3.46610-6
7.39210-6
1.84810-5
3.710-5
SESR
9.2410-8
9.2410-8
9.2410-8
9.2410-8
9.2410-8
BBER
9.2410-9
9.2410-9
9.2410-9
9.2410-9
9.2410-9
The performance is better than ITU-T recommendation.
6.10
Jitter index at interfaces

For ZXMP S385, the jitter and wander tolerance for G.703 PDH and SDH
interface conform to ITU-T G.823, G.824 (45Mbps) and G.825 respectively.
6.10.1
Jitter and wander tolerance of PDH input interface

The jitter and wander tolerance at ZXMP S385 PDH input interface meets the
requirements shown in Figure 14, Figure 15 and Table 40.
Peak-peak jitter and wander
(logarithm)
A0
Slope: -20dB/10 octave
A3
A1
A2
f0
f10 f9
f8 f1
f2
f3
f4
Jitter frequency
(logarithm)
Figure 14 The jitter and wander tolerance at E1 PDH input interface
42
Figure 15 The jitter and wander tolerance at T1 PDH input interface

Table 40 The input jitter and wander tolerance of PDH interface
Interface
rate
UIp-p
(kbit/s)
A0
A1
A2
1544
18
5.0
UI
0.1
UI
2048
36.9
18
0.2
18
4.8810-3
0.01
34368
618.6
1.5
0.15
ffs
ffs
ffs
44736
18
5.0
UI
0.1
UI
Pseudorandom
Frequency (Hz)
A3
f10(T1/
T3 is f0)
f9
f8
f1
f2
f3
f4
signal
10
120
6k
40K
220 1
1.667
20
2.4k
18k
100k
215-1
ffs
100
1k
10k
800k
223-1
10
600
30k
400k
220 1
1.2105
1.2 105
Jitter and wander tolerance of PDH output interface
Table 41 The output jitter and wander tolerance of the PDH interface
Parameter
Network limit
Measurement filter bandwidth
value
B1
unit B2
unit Band-pass filter having a lower
interval
interval
cut-off
peak-topeak-tofrequency f1 or f3 and an upper
Digit
rate
peak
peak
cut-off
(kbit/s)
frequency f4
f1
f3
f4
8kHz
40KHz
1 544
0.1
10Hz
2 048
1.5
0.2
20 Hz
18 kHz
100 kHz
(700 Hz)
34 368
1.5
0.15
100 Hz
10 kHz
800 kHz
44736
0.1
10Hz
30kHz
400kHz
Note:
1. For the codirectional interface only.
2. The frequency values shown in parenthesis only apply to certain national interfaces.
3. UI Unit Interval:for 2048 Kbit/s 1 UI = 488 ns; for 34 368 Kbit/s 1 UI = 29.1 ns
6.10.2
Jitter and wander tolerance of SDH input interface

The capability of STM-N input interface to stand jitter and wander is specified
and tested with the digital test signal of sine modulated phase.
The input jitter and wander tolerance of ZXMP S385 SDH terminal multiplexer
satisfies the requirements in Figure 16, Table 42 and Table 43.
43
The input jitter and wander tolerance of ZXMP S385 SDH regenerator satisfies
the requirements shown in Figure 17 and Table 44.
Peak-peak jitter and wander (logarithm)
A0
A1

A2
A3
A4
f12
f0
f11
f10
f9
f8
f1
f2
f3
f4
Frequency
Figure 16 The jitter tolerance of STM-N terminal multiplexer input interface

Table 42 Input jitter and wander tolerance (UIP-P) of SDH
STM
A0 (18s)
A1 (2 s)
A2 (0.25 s)
A3
interface
A4
STM-1
2800
311
39
1.5
0.15
STM-4
11200
1244
156
1.5
0.15
STM-16
44790
4977
622
1.5
0.15
Table 43 Input jitter and wander tolerance of the SDH

STM
interface
f0
f12
f11
f10
f9
f8
f1
f2
f3
f4
STM-1
1.210-5
1.7810-4
1.610-3
1.5610-2
0.125
19.3
500
6.5k
65k
1.3M
STM-4
1.210-5
1.7810-4
1.610-3
1.5610-2
0.125
9.65
1000
25k
250k
5M
STM-16
1.210-5
1.7810-4
1.610-3
1.5610-2
0.125
12.1
5000
100k
1M
20M
Input jitter amplitude
UI P-P
A2
A1
f2
f1
Frequency
Figure 17 The input jitter tolerance of STM-N SDH regenerator

Table 44 Input jitter tolerances of STM-N regenerators
STM interface
STM-1
STM-4
STM-16
f1 (kHz)
f2 (kHz)
A1 (UIP-P)
A2 (UIP-P)
65
6.5
0.15
1.5
12
1.2
0.15
1.5
250
25
0.15
1.5
12
1.2
0.15
1.5
1000
100
0.15
1.5
44

B
6.10.3
12
1.2
0.15
1.5
Inherent output jitter of STM-N interface

For the ADM, TM and DXC equipment of ZXMP S385, the STM-N output
jittering indexes meet the requirements in Table 45 and Table 46. Because of
the randomness of jitter, the test value might exceed, and it is acceptable when
over 99% test values satisfy the indexes during the test (for 1 to 2 minutes).
Table 45 STM-N interface inherent output jitter indexes of SDH
STM interface
STM-1
STM-4
STM-16
Test filter
Peak value of jitter
500Hz~1.3MHz
0.50 UI
65kHz~1.3MHz
0.10 UI
1000Hz~5MHz
0.50 UI
250kHz~5MHz
0.10 UI
5000Hz~20MHz
0.50 UI
1MHz~20MHz
0.10 UI
Table 46 STM-N network interface output jitter indexes of SDH

f3
B2
STM interface
f1 (Hz)
f4 (MHz)
B1 (UIp-p)
(kHz)
p)
(UIp-
STM-1 optical interface
500
65
1.3
1.5
0.15
STM-1 electrical interface
500
65
1.3
1.5
0.075
1000
250
1.5
0.15
5000
1M
20
1.5
0.15
For the REG equipment, when the test filter adopts 12kHz high-pass filter, its
root mean square value (RMS) created from jitter should not be greater than
0.01UIrms.
6.10.4
Mapping jitter of PDH tributary

The mapping jitter at the ZXMP S385 PDH tributary can satisfy the
requirements listed in Table 47.
Table 47
G.703
interface
f1 (Hz)
f3 (Hz)
f4 (Hz)
Maximum
peak
value of mapping
jitter
f1~f4
f3~f4
High-pass filter 20dB/10

multiplication
Tolerance
(ppm)
(kbit/s)
6.10.5
Mapping jitter specifications
2048
50
20
18k
100k
Undetermined
0.08
34368
20
100
10k
800k
Undetermined
0.08
44736
20
100
10k
800k
Undetermined
0.08
Combined Jitter
In the SDH system, generally, there are both mapping jitter and pointer
adjusting jitter. The combined jitter of both is called the combined jitter. Under
various test sequences, the value detected by ZXMP S385 should meet the ones
listed in Table 48.
Table 48
PDH
Bit
rate
High
pass
Combined jitter
filter
Maximum peak-peak value combined jitter

45

interface
tolerance
20dB/10 octave
UIP-P
(kbit/s)
(ppm)
f1
(Hz)
f3
(Hz)
f4
(Hz)
f1~f4 (UIp-p)
f3~f4 (UIp-p)
0.075
0.075
0.075
2048
50
20
18k
100k
0.4
0.4
0.4
34368
30
100
10k
800k
0.4
0.4
0.4
0.75
0.075
0.075
0.075
0.075
44736
30
100
10k
800k
0.4
0.4
0.4
0.75
0.075
0.075
0.075
0.075
Test sequence
6.10.6
Jitter transfer function of the regeneration relay

The jitter transfer function of the regeneration relay is defined the ratio of
output STM-N signal jitter to the input STM-N signal jitter versus frequency.
The jitter transmission characteristic of ZXMP S385 SDH regeneration relay is
shown in Figure 18.
Input jitter amplitude
(UI P-P )
A2
A1
f2
f1
Frequency
Figure 18 The jitter transfer characteristics of a regeneration relay
The jitter transmission parameters of regeneration relay are shown in Table 49.
Table 49 Jitter transmission parameters of a regeneration relay
STM-N
STM-1
STM-4
STM-16
6.11
fc (kHz)
P (dB)
130
0.1
30
0.1
500
0.1
30
0.1
2000
0.1
30
0.1
Clock timing and synchronous characteristics

l
The SEC/SEE Index list

Table 50
The SEC/SEE Index list
Vendor
ISOTEMP
Type
OCXO
Standard Central Frequency
77.76MHz
Day aging rate
110-8
Year aging rate
510-7
Central frequency precision
110-7(0V)
Short time stability
110-10/s
46

510-8(050C)
Temperature characteristic
Output jitter
When there is no input jitter, the inhered jitter of ZXMP S385 2M clock output
interface should not be over 0,05 UIP-P. The test is conducted at an interval of
every 60 seconds with a single-pole band-pass filter in 20Hz and 100kHz
turnover frequencies.
l
Permitted input/output attenuation and others
For ZXMP S385 the bit rate tolerance of clock output signal is 4.6ppm.
l
Long-term phase variation in clock locking mode
The long-term phase variation in the clock locking mode refers to the phase
noise generated at the SEC/SEE output terminal when there is an ideal input
reference signal. Usually, they are expressed by the Maximum Time Interval
Error (MTIE) and time deviation error (MTIE). ZXMP S385 can satisfy the
requirements shown in Table 51, Table 52 and Table 53.
Table 51 The wander limit value under constant temperature (MTIE)
MTIE limits
Observation interval
40 ns
0.1s
1s
40
0.1 ns
1s
100s
25.25
0.2 ns
100s
1000s
Table 52 The wander limit value under temperature impact (MTIE)

Additional MTIE permitted value
0.5ns
0.1s
50ns
118s
100s
Table 53 The wander limit value under constant temperature (TDEV)

MTIE limits
3.2 ns
0.1s
25s
25s
100s
100s
1000s
0.64
0.5 ns
6.4 ns
Clock accuracy in the hold mode
Once all the timing references are lost, SEC/SEE will enter the hold mode after
instantaneous phase variation. Now, SEC/SEE will use the last frequency
information saved before the timing reference signal loss as its timing reference.
Meanwhile, the oscillation frequency of the oscillator will slowly wander, but
can still ensure that SEC/SEE frequency only has very small frequency
deviation from the reference frequency in a long time base; therefore, the
sliding loss will be within the allowed index requirement. This mode can be
used to deal with an external clock failure lasting several days.
When SEC/SEE loses its reference source and enters the hold mode, the phase
error T of the SEC/SEE output signal to the input signal should not be over
the following limits when observation time S is greater than 15s from the
moment that the reference source loses.
T (S) = [(a1+a2)S+0.5bS2+c] ns
a1= 50ns/s corresponds to the initial frequency deviation of 510-8.
47
a2=2000ns/s refers to the frequency deviation caused by the temperature

change after the clock enters the hold mode. If there is no temperature change
in 2 10-6, there will be no a2S in the phase error.
b = 1.1610-4ns/s. It is caused by aging, corresponding to 110-8/day frequency
wander.
c = 120ns, includes any additional phase deviation that might be generated after
entering the transition stage of hold mode.
ZXMP S385 meets the above requirements.
l
Frequency Accuracy of Internal Oscillator in the Free-run Mode
When the internal oscillator of SEC/SEE works in the free-run mode if

SEC/SEE loses all of the clock references, and their memories or SEC/SEE has
no hold mode at all, it is required that its output frequency accuracy be within a
certain range.
For a reference that can follow the G.811 clock, the SEC/SEE output frequency
accuracy in the free-run mode should not be greater than 4.6ppm for SDH
terminal equipment and 20ppm for REG equipment. ZXMP S385 can satisfy
the above requirements.
48
ENVIRONMENT ADAPTABILITY
7.1
Power supply requirements

Working voltage and current:
Rated working voltage: -48V
Rated working current: 16A
Nominal voltage: -48VDC
Range: -75VDC~-40VDC or -60VDC~-40VDC
Power consumption: 720W (max)
7.2
Grounding requirements
If separate grounding is adopted in the equipment room, the grounding
resistance should meet the following requirements:
1.
2.
3.
The grounding resistance in case of 48V DC is less than or equal to 4.

The grounding resistance for the system working ground is less than or
equal to 4.
The grounding resistance for the lightning protection ground is less than or
equal to 4.
If the combined grounding is adopted in the user equipment room, the

grounding resistance should be less than or equal to 1.
The voltage difference among lightning protection ground, system working
ground and -48V GND should be less than 1V.
The tandem requirements between all groundings are as follows:
1.
2.
The -48V ground of the board is isolated from the -48V GND.
The board shielding plate is connected to the cabinet via the front panel,
and there is an electrical connection with the co-module filter capacitor
inside a board.
The lightening protection GND only connects to the protection component, and
converges with the system working GND at the grounding terminal on the bus
bar of the rack. The -48V GND can converge with the PGND, or the combined
GND on the bus bar of the rack, or be grounded outside.
7.3
Environment requirements
7.3.1
Operation Environment
1.
Climate
Table 54
Climate requirement
Item
Range
Altitude
4000m
Air pressure
70 ~ 106kPa
Temperature (Long-term Operating)
+5 ~+40
Temperature (Short-term Operating)
0 ~+45
49

Temperature change rate
0.5 /min
Relative humidity (Short-term Operating)
20%~80%
Relative humidity (Long-term Operating)
10%~90%
Heat radiation
300W/s
In the normal working environment, the measuring point of the temperature

and humidity refers to data obtained at the place 1.5 meters above the floor and
0.4m meters in front of the equipment. The short-term working refers to
working continuously for no more than 48 hours and no more than accumulated
15 days in a year.
2. Biological environment
Avoid multiplication of microbe, such as eumycete and mycete.
Avoid the rodent, e.g., mice.
3.
Air cleanliness
Table 55 Density requirements for chemical active substances
Content
Chemical active substance
mean (mg/m)
Max( mg/m)
SO2
0.3
H2S
0.1
0.5
NH3
Cl2
0.1
0.3
HCl
0.1
0.5
HF
0.01
0.03
O3
0.05
0.1
NO2
0.5
Table 56 Density requirements for mechanical active substances

Mechanical active substance
Content
Precipitable dust
= 15 mg/mh
4.
Mechanical stress
Table 57
Requirements for mechanical stress
Item
Unit
Value
Acceleration
m/S2
0.1
Frequency range
Hz
5100, 1005
direction
X,Y,Z
duration
Min
5.
90
Condition of earthquake
According withNEBS GR-63

IEC721-2-6 Environmental conditions appearing in nature-Earthquake
vibration
IEC68-3-3 Environmental testing - Part 3: Background information - Subpart
3: Guidance. Seismic test methods for equipment
50
7.3.2
Environment for Storage

The following international standards are taken as the reference for framing the
environment requirements
IEC721-3-1 Classes
1.
1K4/1Z2/1Z3/1Z5/1B2/1C2/1S3/1M2
Climate
Table 58
Climate requirement
Item
Range
Altitude
4000m
Air pressure
70 ~ 106kPa
Temperature
-40~ +70
Temperature change rate
0.5C/min
Relative humidity
10% ~ 100%
Solar radiation
600W/s
Air speed
30m/s
2.
Mechanical stress
Table 59
Requirements for mechanical stress
Item
unit
value
Acceleration
m/S2
0.1
Frequency range
Hz
5100, 1005
direction
X,Y,Z
duration
Min
90
The earthquake-proof performance of the whole equipment complies with

Earthquake-proof Performance Detection for SDH Optical Communications
Equipment (Provisional) and Earthquake-proof Performance Detection for
SDH Optical Communications Equipment (Provisional). The earthquake-proof
performance detection reaches the eight-level intensity
7.3.3
Cleanness requirements
Cleanness involves dust and harmful gases in the air. The equipment should be
operated in the equipment room that meets the cleanness requirements
described below:
1. In the transmission equipment room, there is no explosive, electrically
conductive, magnetically conductive or corrosive dust.
2.
The density of dust particles with the diameter greater than 5m should be
no more than 3104 particles/m3.
3.
No corrosive metal or gases that are detrimental to the insulation exist in

the equipment room, such as SO2 and NH3.
The equipment room should be always kept clean, with doors and
windows being closed.
4.
7.3.4
Bearing Requirements of the Equipment Room

The bearing capability of the equipment room should be over 450kg/m2 to hold
ZXMP S385 equipment.
Electromagnetic Compatibility (EMC) requirements
51
Before introducing the EMC requirements, firstly specifies 3 criteria for test
results:
Performance A: Continuous phenomenon. Neither error nor alarm is allowed.
After the electromagnetic interference, the number of errors shall not exceed
the maximum of the normal requirement.
Performance B: Transient phenomenon. During the electromagnetic
interference, the degradation of function is allowed, the equipment can work as
expected without the operators interference, the loss of frame and
synchronization is not allowed, and neither pattern out-of-sync, nor AIS alarm
is generated. The equipment shall work normally after the electromagnetic
interference.
Performance R: Resistive phenomenon. The fuse or other special devices can
be replaced or restarted.
7.3.5
Electronic Static Discharge (ESD)

1. Anti-interference for static discharging
The static discharge anti-interference index of ZXMP S385 equipment is shown
in Table 60. During the operation in the interface area, be sure to wear an
antistatic wrist strap.
Table 60
Static discharge anti-interference
Contact discharge
Air discharge
Criterion for test results
6kV
8kV
Performance B
8kV
15kV
Performance R
2. RF electromagnetic radiated susceptibility

The RF electromagnetic radiated susceptibility of ZXMP S385 equipment is
shown in Table 61.
Table 61
RF electromagnetic radiated susceptibility
Test frequency (80MHz~1000MHz)

Electric field intensity
Amplitude modulation
10V/m
80%AM (1kHz)
Performance A
3.
Electrical fast transient burst susceptibility
The electrical fast transient burst susceptibility of ZXMP S385 equipment is

shown in Table 62 and Table 63.
Table 62 Electrical fast transient burst susceptibility at the DC power port
Generator waveform 5/50ns
Test voltage
Repeated frequency
1kV
5kHz
Performance B
Table 63 Electrical fast transient burst susceptibilities at the signal cable and
control cable ports
Generator waveform 5/50ns
Test voltage
Repeated frequency
1kV
5kHz
Performance B
4. Surge susceptibility
The surge susceptibility of ZXMP S385 equipment is shown in Table 64, Table
65 and Table 66.
52

Table 64
Surge susceptibility of DC power
The waveform of generators 1.2/50us (8/20s), internal resistance 12

Test mode
Test voltage
Line to ground
1kV
Performance B
Line to ground
2kV
Performance R
Table 65 Surge susceptibility of the outdoor signal cable

The waveform of generators 10/700s, internal resistance 40
Test mode
Line to line
Test voltage
2kV
Performance B
4kV
Performance R
Line to ground
Line to line
Line to ground
Table 66 Surge susceptibility of the indoor signal cable

Generator waveform 1.2/50s (8/20s), internal resistance 42
Test mode
Test voltage
Line to ground
1kV
Performance B
Line to ground
2kV
Performance R
5. Conductivity susceptibility of RF field

The conductivity susceptibility of RF field of ZXMP S385 equipment is shown
in Table 67.
Table 67
Conductivity susceptibility of RF field
Test frequency 0.15MHz ~ 80MHz

Test intensity
Amplitude modulation
3V
80%AM (1kHz)
Performance A
Electromagnetic Interference (EMI)
6. Conductive emission electromagnetic interference

The conductive emission electromagnetic interference of ZXMP S385
equipment is shown in Table 68.
Table 68 Conductive emission electromagnetic interference at the direct
current port
Limits (dBuV)
Testing frequency (MHz)
Quasi-peak
Mean value
0.02~0.15
79
--
0.15~0.5
79
66
0.5~30
73
60
7.
Radioactive emission electromagnetic interference
The radioactive emission electromagnetic interference of the ZXMP S385

equipment is shown in Table 69.
Table 69 Radioactive emission electromagnetic interference
Testing frequency (MHz)
30~230
Quasi-peak demodulating limit (dBV/m)

10m
3m
40
50
53

230~1000
7.4
47
57
Safety requirements
This product adopts the technical requirements specified in the following
standard:
IEC/EN 60950:2000 Safety of information technology equipment
1. Working voltage and current
Rated working voltage: -48V
Max. working voltage: -75V
Min. working voltage: -40V
Rated working current: 16A
2. Insulation classification of the equipment
The power supply of the equipment provides the SELV circuit with safe and
excessively low voltage, without self-generating dangerous voltage. It belongs
to the equipment of the class III insulation (Class III equipment).
3. Optical interface
The optical module of the maximum power belongs to (Class 3A). All the
optical modules shall be under strict control and certified by authorities (such
as UL, TUV and NEMKO), and comply with EN60825.
4. Fuse
All the fuses and power modules, including recoverable fuses, shall be certified
by authorities such as CE, UL and TUV.
5. Safety mark
On the package of the equipment, there are striking labels about antistatic,
fragile, waterproof, and damp-proof.
The maximum optical power satisfies the 3A safety standard. An obvious label
warning against the laser shall be pasted at the optical interface.
Cables of different colors shall be used for the power input, shielding GND and
lightening protection GND to avoid incorrect connection. Different power
connectors shall use coding keys. There shall be a power label at the power
inlet.
Both the equipment and each board shall have an antistatic label.
Grounding symbol
switch-off.
indicates switch-on, and
indicates
6. Mechanical structure
In installation, four bolts are designed at the rack bottom (may also be used to
adjust balance) to fix the rack to the ground. At the rack top, the corresponding
screws are designed to fix the rack to the cabling rack. When installed in the
equipment room, the rack shall be fixed both at the top and bottom to ensure
the stability and safety of the equipment.
The corners of both the rack and sub-rack are processed to avoid hurting people.
7. Fire protection
The materials of the circuit boards in the equipment use the fireproof materials
of the V-2 level to prevent the circuits from burning in case of failure.
54
The structural parts use unburnable materials with a good fireproof

performance, including surface processing materials.
With the effective heat dissipation design, it ensures that the temperature does
not exceed 70C to prevent heat aggregation and reduce the possibility of
burning.
Safe parts passing the safety authentication (CE, UL, etc.) are used.
8. High temperature protection
In abnormal conditions, the temperature does not exceed 70C. The plastic parts,
components, wires and cables, and safety labels shall all comply with the
requirements specified in the safety standard-GB4943/EN60950.
9. Lightening protection
In this system, good grounding and isolation and protection of electrical
interfaces are used to prevent the dangerous voltage of lightening.
55
APPENDIX
8.1
Followed standards
8.1.1
International standards of ITU

1.
Overall concept recommendations G.707, G.709 and G.780
G.707(03/1996)
Network Node Interface for the Synchronous Digital Hierarchy.
G.709/Y.1331(03/2003)
Interfaces for the Optical Transport Network (OTN)
G.780(11/1994)
Vocabulary of Terms for Synchronous Digital Hierarchy (SDH)

Networks and Equipment
2.
Recommendations G.783, G.784, G.785 and G.813 for SDH equipment
G.783(04/1997)
Characteristics of Synchronous Digital Hierarchy (SDH) Equipment

Functional Blocks.
G.784 (01/1994)
Synchronous Digital Hierarchy (SDH) Management. It involves SDH

management, including the control and supervision functions related to
SDH network elements (NE).
G.785 (11/1996)
Characteristics of a Flexible Multiplexer in a Synchronous Digital

Environment.
G.813
J.132, Transport of MPEG-2 Signal in SHD Networks. .
Recommendations G.957, G.958, G.681, G.691, G.692 and F.751 for the physical
layer transmission
3. They include G.652~G.958, G.681, G.691, G.692, and F.751 recommendations.
G.957 (07/1995)
Optical Interfaces for Equipment and Systems Relating to

Synchronous Digital Hierarchy.
G.958 (11/1994)
Digital Line Systems based on the Synchronous Digital Hierarchy for

use on Optical Fiber Cables
G.959.1(03/2006)
Optical transport network physical layer interfaces
G.691(original
G.scs)
Optical Interfaces for Single-Channel SDH Systems with Optical

Amplifiers, and STM-64 Systems.
G.652 (04/1997)
Characteristics of a Single-Mode Optical Fiber Cable. The optical

fiber specified in G.652 has been widely used; namely, it is called as a
normal single-mode optical fiber.
G.653 (04/1997)
Characteristics of Dispersion-Shifted Single-mode Optical Fiber

Cable.
G.654 (04/1997)
Characteristics of a Cut-off Shifted Single-mode Optical Fiber Cable.
G.655 (10/1996)
Characteristics of a Non-zero Dispersion Shifted Single-mode Optical

Fiber Cable
G.661 (10/98)
Definition and test methods for the relevant generic parameters of

optical amplifier devices and subsystems
G.662 (07/1995)
Generic Characteristics of Optical Fiber Amplifier Devices and SubSystems.
G.663 (10/1996)
Application Related Aspects of Optical Fiber Amplifier Devices and

Sub-Systems
G.671(02/1998)
Transmission Characteristics of Passive Optical Components
G.681 (10/1996)
Functional Characteristics of Interoffice and Long-haul Line Systems

Using Optical Amplifiers, Including Optical Multiplexing
56
G.861 (08/1996)
Principles and Guidelines for the Integration of Satellite and Radio

Systems in SDH Transport Networks
G.702
Digital hierarchy bit rates
G.703(04/1991)
Physical/Electrical Characteristics of Hierarchical Digital Interfaces.
F.751-2(09/1997)
Transmission Characteristics and Performance Requirements of

Radio-relay Systems for SDH Based Networks.
4.
G.803 (06/1997)
Architecture of transport Networks based on the Synchronous

Digital Hierarchy (SDH).
G.805 (11/1995)
Generic Functional Architecture of Transport Networks.
F.750-3 (09/1997)
Architectures and Functional Aspects of Radio-Relay Systems for

SDH-Base Networks
5.
Recommendations G.810~G.813 and G.synce (G.781) for synchronization and

timing
G.810 (08/1996)
Definitions and Terminology for Synchronization Networks
G.811 (02/1997)
Timing Requirements at the Outputs of Primary Reference Clock

Suitable for Plesiochronous Operation of International Digital
Links.
G.812 (02/1997)
Timing Requirements at the Outputs of Slave Clocks Suitable for

Plesiochronous Operation of International digital Links
G.813 (08/1996)
Timing Characteristics of SHD Equipment Slave Clocks.
G.synce (G.781)
Synchronization Layer Functions.
6.
Recommendation G.803 (G.805, F.750-3) for network structure
Protection and interworking recommendations G.841 and G. 842
G.841(07/1995)
Types and Characteristics of SHD Network Protection Architecture
G.842 (04/1997)
Interworking of SDH Network Protection Architecture.
7.
Performance and measure recommendations G.825, G.826, O.172, O.181,

M.1201, M.2110 and M.2120
G.825 (03/1993)
The Control of Jitter and Wander within Digital Networks which

are based on the Synchronous Digital Hierarchy (SDH).
G.826 (08/1996)
Error Performance Parameters and Objectives for International,

constant Bit Rate Digital Paths at or Above the Primary Rate.
O.181 (05/1996)
Equipment to Assess Error Performance on STM-N Interfaces.
O.172
Timing Jitter and Wander Measuring Equipment for Digital

Systems Which are Based on the Synchronous Digital Hierarchy
(SDH)
M.2101.1 (04/1997)
Performance Limits for Bringing-into-service and Maintenance of

International SDH Paths and Multiplex Sections.
M.2110 (04/1997)
Bringing-into-service of International PDH Paths, Sections and

Transmission Systems and SDH Paths and Multiplex Sections.
M2120 (04/1997)
PDH Path, Section and Transmission System and SDH Path and
Multiplex Section Fault Detection and Localization Procedures.
8.
Network management recommendations G.784, G.831, G.774,

G.774.01~G774.09 and G.773 (G.851~G.854, M.3010, M.3100, Q.811, Q.812)
G.784 (01/1994)
SDH management
G.831 (08/1996)
Management Capabilities of Transport Networks Based on the

Synchronous Digital Hierarchy (SDH).
G.774 (11/1996)
Synchronous Digital Hierarchy (SDH) Performance Monitoring for

the Network-Element View.
57
G.774.02 (11/1996)
Synchronous Digital Hierarchy (SDH) configuration of the Payload

Structure for the Network Element View. This recommendation
offers an information model for the payload management of SDH
network.
G.774.03 (11/1996)
Synchronous Digital Hierarchy (SDH) Protection Management for

the Network Element View.
G.774.04 (11/1996)
Synchronous Digital Hierarchy (SDH) management of Sub-network

Connection Protection for the Network Element View.
G.774.05 (11/1996)
Synchronous Digital Hierarchy (SDH) management of Sub-network

Connection Supervision Functionality (HCS/LCS) for the Network
Element View.
G.774.06 (04/1997)
Synchronous Digital Hierarchy (SDH) Unidirectional Performance

Monitoring for the Network Element View
G.774.07 (11/1996)
Synchronous Digital Hierarchy (SDH) - G.774 Implementers

Guide.
G.774.08 (04/1997)
Synchronous Digital Hierarchy (SDH) Management of Radio-Relay

Systems for the Network Element View.
G.774.09 (02/1998)
Synchronous Digital Hierarchy (SDH) Configuration of Linear

Multiplex Section Protection for the Network Element View.
ITUT/M.3010(02/00)
Principles for a Telecommunications management network
ITU-T/M.3010
(2000)
Amendment 1 (12/03)
ITU-T
TMN management functions
9.
M.3400
TMN conformance and TMN compliance
EMC, Safety and Environmental Standard
For EMC Standard:

1) EMI Standard---CISPR22(EN55022)
2) EN50082-1:1992 or EN55024:1998 (Mandatory by 1 July 2001)
EN61000-4-2, 3, 4, 5, 6 series
FOR TNE (Telecommunication network equipment)
10
3) ETSI EN 300 386 V1.2.1 (2000-03)

Electromagnetic compatibility and Radio spectrum Matters (ERM);
Telecommunication network equipment; Electromagnetic Compatibility (EMC)
requirements
Safety Standard---IEC950(EN60950)
Environmental standard--ETS 300 019 (T/TR02-12)
Storage: Environmental class 1.1
15
Transport: Environmental class 2.3

Operation: Environmental class 3.4
The relevant recommendations are as follows:
G.773 (03/1993)
Protocol Suites for Management of Transmission Systems.
G.851.1 (11/1996)
Management of the Transport Network-Application of the RMODP Framework.
G.852.1 (11/1996)
Management of the Transport Network-Enterprise Viewpoint for

Simple Sub-network Connection Management.
G.853.1 (11/1996)
Common Element of the Information Viewpoint for the

Management of a Transport Network.
G.853.2 (11/1996)
Sub-network connection Management Information Viewpoint.
58
G.854.1 (11/1996)
Management of the Transport Network-Computational

Interfaces for Basic Transport Network Model.
M.3030 (05/1996)
Principles for a Telecommunications Management Network.
M.3100 (07/1995)
Generic Network Information Model.
G.664(03/2003)
Optical safety procedures and requirements for optical transport

systems.
ITU-T G.7041
Generic frame procedureGFP
ITU-T G.7042
Link capacity alignment scheme LCAS for virtual

concatenated signals
G.828 (03/00)
Error performance parameters and objectives for international,

constant bit rate synchronous digital paths
G.823 (03/00)
The control of jitter and wander within digital networks which

are based on the 2048 Kbit/s hierarchy.
G.824 (03/00)
The control of jitter and wander within digital networks which

are based on the 1544 Kbit/s hierarchy.
ITUT/V.11/V.11(10/96)
Electrical characteristics for balanced double-current

interchange circuits operating at data signaling rates up to 10
Mbit/s.
ITUT/V.24/V.24(02/00)
List of definitions for interchange circuits between data terminal

equipment (DTE) and data circuit-terminating equipment (DCE)
ITU-T V.28(03/93)
Electrical characteristics
interchange circuits
ETSI EN 300 119-3
Environmental Engineering (EE) European

telecommunication standard for equipment practice; Part 3:
Engineering requirements for miscellaneous racks and cabinets
ETSI EN 300 119-4
"Environmental Engineering (EE); European telecommunication

standard for equipment practice; Part 4: Engineering
requirements for sub-racks in miscellaneous racks and cabinets"
IEEE 802.1d
Information Technology- Telecommunications and information

exchange between systems--Local and metropolitan area
networksCommon Specific requirements--Part 3: MAC
Bridge
IEEE 802.1q
IEEE Standards for Local and metropolitan area networks

Virtual Bridged Local Area Networks
IEEE 802.1ad
IEEE Standards for VLAN stack
IEEE 802.1s
Multiple spanning tree
IEEE 802.3
IEEE Standard for Information technology

--Telecommunications and information exchange between
systems--Local and metropolitan area networks--Specific
requirements--Part 3: Carrier Sense Multiple Access with
Collision Detection (CSMA/CD) Access Method and Physical
Layer Specifications
IEEE 802.3ad
IEEE Standard for Link Aggregation
for
unbalanced
double-current
Ethernet standard is ISO/IEC 8802-3 (ANSI/IEEE Std 802.3)

Fast Ethernet standard is IEEE Std 802.3u-1995
8.1.2
Corporate standards and other standards

Q/ZX04 001-1997
Component Derating Principles
Q/ZX 23.011.04-2001
Guide to Electromagnetic Compatibility Test of Electronic

Communication Equipment---Transmission Equipment
59
8.2
Q/ZX 04.0141998
Regulations regarding Product Testability Design
Q/ZX04.030999A
Technological Requirement for PCB Design
Abbreviations
Abbreviations
Full Name
ADM
Add-Drop Multiplexer
AFEC
Advanced Forward Error Correction
AIS
Alarm Indication Signal
ANSI
American National Standards Institute
APS
Automatic Protection Switching
ASIC
Application Specific Integrated Circuit
ATM
Asynchronous Transfer Mode
AU
Administrative Unit
AUG
Administration Unit Group
AU-n
Administration Unit, level n
AU-PTR
Administration Unit Pointer
BBE
Background Block Error
BBER
Background Block Error Ratio
BER
Bit Error Ratio
BITS
Building Integrated Timing Supply
BML
Business Management Layer
CBR
Constant Bit Rate
CDM
Code Division Multiplexing
CLP
Cell Loss Priority
CMI
Coded Mark Inversion
C-n
Container- n
CORBA
Common Object Request Broker Architecture
CV
Code Violation
CWDM
Coarse Wavelength Division Multiplexing
DB
Data Base
DBMS
Data Base Management System
DCC
Data Communications Channel
DCE
Data Circuit-terminating Equipment
DCF
Data Communications Function
DCN
Data Communications Network
DDN
Digital Data Network
DLL
Dynamic Link Libraries
DNA
Distributed Network Architecture
DNI
Dual Node Interconnection
DQDB
Distributed Queue Double Bus
DTE
Data Terminal Equipment
DWDM
Dense Wavelength-division Multiplexing
DXC
Digital Cross Connect
ECC
Embedded Control Channel
60

Abbreviations
Full Name
EDFA
Erbium Doped Fiber Amplifier
EM
Element Management
EMC
ElectroMagnetic Compatibility
EMI
ElectroMagnetic Interference
EML
Element Management Layer
EMS
Element Management System
EOS
Ethernet Over SDH
ES
Error Second
ESD
Electronic Static Discharge
ESR
Error Second Ratio
ETSI
European Telecommunication Standards Institute
FDDI
Fiber Distributed Data Interface
FDM
Frequency Division Multiplexing
FE
Fast Ethernet
FEBBE
Far End Background Block Error
FEC
Forward Error Correction
FEES
Far End Errored Second
FESES
Far End Severely Errored Second
GUI
Graphical User Interface
HDLC
High Digital Link Control
HPC
Higher order Path Connection
HW
High-Way
IEC
International Electrotechnical Commission
IEEE
Institute of Electrical & Electronic Engineers
IP
Internet Protocol
ITU-T
International
Telecommunication
Standardization Sector
L2
Layer 2
LAN
Local Area Network
LAPD
Link Access Procedure On D-channel
LAPS
Link Access Procedure for SDH
LCD
Loss of ATM Cell Delineation
LCT
Local Craft Terminal
LOF
Loss Of Frame
LOP
Loss Of Pointer
LOS
Loss Of Signal
LPC
Lower order Path Connection
MAC
Medium Access Control
MAN
Metropolitan Area Network
MCF
Message Communication Function
MCU
Micro Control Unit
MD
Mediation Device
MF
Mediation Function
MII
Medium Independent Interface
MM
Multi Mode
Union-Telecommunication
61

Abbreviations
Full Name
MS
Multiplex Section
MS-AIS
Multiplex Sections - Alarm Indication Signal
MSOH
Multiplex Section OverHead
MSP
Multiplex Section Protection
MS-PSC
Multiplex Sections - Protection Switching Count
MS-PSD
Multiplex Sections - Protection Switching Duration
MS-SPRing
Multiplexer Section Shared Protection Ring
MST
Multiplex Section Terminal
MTIE
Maximum Time Interval Error
NE
Network Element
NEF
Network Element Function
NEL
Network Element Layer
NML
Network Manager Layer
NMS
Network Management System
NRZ
Non-Return-to-Zero
OAM
Operation, Administration and Maintenance
OFS
Out of Frame Second
OOF
Out of Frame
OS
Operation System
OSF
Operation System Function
OSI
Open System Interconnect
PCB
Printed Circuit Board
PCM
Pulse Code Modulation
PDH
Plesiochronous Digital Hierarchy
PGND
Protection GND
PHY
physical Layer Device
PJE-
Pointer Justification Event -
PJE+
Pointer Justification Event +
POH
Path OverHead
PPP
Point to Point Protocol
PRC
Primary Reference Clock
QA
Q Adaptor
QAF
Q Adaptor Function
QoS
Quality of Service
RAM
Random Access Memory
RDI
Remote Defect Indication
REG
Regenerator
REI
Remote Error Indication
RFI
Remote Failure Indication
RIP
Router Information Protocol
RMII
Reduced Medium Independent Interface
RS
Regenerator Section
RSOH
Regenerator Section OverHead
SAR
Segmentation and Reassembly
SDH
Synchronous Digital Hierarchy
62

Abbreviations
Full Name
SEC
SDH Equipment Clock
SEMF
Synchronous Equipment Manage Function
SES
Severely Errored Second
SESR
Severely Errored Second Ratio
SETS
Synchronous Equipment Timing Source
SM
Single Mode
SMCC
Sub-network management control center
SML
Service Management Layer
SMN
SDH Management Network
SMS
SDH Management Sub-Network
SMT
Surface Mount Technology
SNC
Sub-network Connection
SNCP
Sub-network Connection Protection
SOH
Section Overhead
SPRING
Shared Protection Ring
SSF
Service Signal Fail
SSM
Synchronization status messaging
SSM
Synchronous State Message
STM-N
Synchronous Transport Module Level-N
TCP
Transport Control Protocol
TDEV
Time Deviation
TDM
Time Division Multiplex
TM
Terminal Multiplexer
TMN
Telecommunications Management Network
TTL
Transistor-Transistor Logic
TU
Tributary Unit
TUG-m
Tributary Unit Group, level m
TU-m
Tributary Unit, level m
UART
Universal Asynchronous Receiver Transmitter
UAS
Unavailable Second
UBR
Unspecified Bit Rate
UNI
User-Network Interface
UPC
Usage Parameter Control
VBR
Variable Bit Rate
VC
Virtual Channel
VC
Virtual Container
VCI
Virtual channel Indicator
VC-n
Virtual Container, level n
VDN
Virtual Data Network
VLAN
Virtual Local Area Network
VP
Virtual Path
VPI
Virtual Path Indicator
VPG
VP Group
WAN
Wide Area Network
WDM
Wavelength Division Multiplexing
63

Abbreviations
Full Name
WS
Work Station
WSF
Work Station Function
ZXMP
Zhong Xing MSTP
64

Product Description of ZXMP S385 - V2 - 40

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ZXMP S385(V2.

ZXMP S385 Product Description

ZXMP S385 Product Description

About the Document

Not open to the Third Party

Not open to the Third Party

Not open to the Third Party

Not open to the Third Party

Copyright 2008 ZTE Corporation Shenzhen P. R. China

ZTE CONFIDENTIAL: This document contains proprietary information of ZTE Corporation

ZTE Confidential Proprietary

ZXMP S385 Product Description

Structure of This Specification

ZTE Confidential Proprietary

ZXMP S385 Product Description

System Mechanical Structure.......................................................................................... 13

Boards And Slots.............................................................................................................. 16

Application of MSTP ....................................................................................................... 21

Networking And Protection............................................................................................. 24

ZTE Confidential Proprietary

ZXMP S385 Product Description

Performances And Indexes .............................................................................................. 27

Environment Adaptability ............................................................................................... 49

ZTE Confidential Proprietary

ZXMP S385 Product Description

Figures and Tables

ZXMP S385 Product Description

Table 22 Receiver index of FE MMF optical interface................................. 36

ZTE Confidential Proprietary

ZXMP S385 Product Description

Table 68 Conductive emission electromagnetic interference at the direct current

ZTE Confidential Proprietary

ZXMP S385 Product Description

Cross-connection and extension capabilities

Powerful Service Access Ability

ZTE Confidential Proprietary

ZXMP S385 Product Description

Optical Interfaces Provided by ZXMP S385

ZXMP S385 also provides STM-64/STM-16 colored interfaces comply with

Electrical Interfaces Provided by ZXMP S385

ZTE Confidential Proprietary

ZXMP S385 Product Description

RSEB board provides 810M/100M+2GE interfaces which employs the

Ethernet services Provided by ZXMP S385

Integrated WDM Function

Complete Equipment Protection Ability

ZTE Confidential Proprietary

1:N (N9) tributary protection switching (TPS)

ZXMP S385 Product Description

1:N (N4) TPS

STM-1 processing board(except

1:N (N4) TPS

1:N (N4) TPS

1+1 hot backup

1+1 hot backup

1+1 hot backup

48 V power interface board

1+1 hot backup

ZXMP S385 supports the co-existence of several different TPS protection.

Perfect Network Protection Ability

Reliable Timing Synchronization Processing

STM-N tributary signal

Besides dedicate signal of 2048kHz, receive from BITS or from other