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Internal Use Only

North/Latin America
Europe/Africa
Asia/Oceania

http://aic.lgservice.com
http://eic.lgservice.com
http://biz.lgservice.com

LCD TV
SERVICE MANUAL
CHASSIS : LA85C

MODEL : 19LG30
MODEL : 19LG31

19LG30-UA
19LG31-UB

CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CONTENTS

CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ......................................................................... 3
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 8
TROUBLE SHOOTING ........................................................................... 11
BLOCK DIAGRAM.................................................................................. 15
EXPLODED VIEW .................................................................................. 22
SVC. SHEET ...............................................................................................

Copyright 2007 LG Electronics. Inc. All right reserved.


Only for training and service purposes

-2-

LGE Internal Use Only

SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by
in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

Leakage Current Hot Check (See below Figure)


Plug the AC cord directly into the AC outlet.

General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.

Do not use a line Isolation Transformer during this check.


Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.

Leakage Current Hot Check circuit


Keep wires away from high voltage or high temperature parts.

AC Volt-meter
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.

Leakage Current Cold Check(Antenna Cold Check)


With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1M and 5.2M.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Copyright 2007 LG Electronics. Inc. All right reserved.


Only for training and service purposes

-3-

To Instrument's
exposed
METALLIC PARTS

0.15uF

Good Earth Ground


such as WATER PIPE,
CONDUIT etc.

1.5 Kohm/10W

LGE Internal Use Only

SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
Copyright 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

unit under test.


2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500F to 600F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500F to 600F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500F to 600F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

-4-

LGE Internal Use Only

IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.

Circuit Board Foil Repair


Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Copyright 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

-5-

LGE Internal Use Only

SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range

3. Test method

This specification is applied to the 19/ 22 Wide LCD TV used


LA85C chassis.

2. Requirement for Test


Each part is tested as below without special appointment.
1) Temperature: 205C
2) Relative Humidity: 6510%
3) Power Voltage : Standard input voltage(100-240V~, 50/60Hz)
* Standard Voltage of each product is marked by models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.

1) Performance: LGE TV test method followed


2) Demanded other specification
- Safety: UL, CSA, IEC specification
- EMC: FCC, ICES, IEC specification
Model

Market

Appliance

19LG30-UA

North America

Safety : UL1492, CSA C22.2.No.1

22LG30-UA

EMC : FCC Class B, IEC Class B

4. General Specification(TV)
No

Item

Specification

Option

Receivable System

ATSC/64 & 256 QAM/ NTSC-M

Available Channel

VHF : 02 ~ 13

Remark

USA only

UHF : 14 ~ 69
DTV : 02 ~ 69
CATV : 01 ~ 135
CADTV : 01 ~ 135
3

Input Voltage

100-240V~, 50/60Hz

Market

North America

Screen Size

19/22 Inch

Aspect Ratio

16:9

Tuning System

FS

LCD Module

LM190WX1 (1440*900)

Wide, LPL

Not applied.

M190A1-L07 (1440*900)

Wide, CHI MEI

19LG30-UA (07.11.05)

LM220WE1 (1680*1050)

Wide, LPL

22LG30-UA

M220Z1-L01 (1680*1050)

Wide, CHI MEI

Not applied.

Operating Environment

Temp : 0 ~ 40 deg

10

Storage Environment

Temp : -20 ~ 60 deg

Humidity : ~ 80 %
Humidity : 0 ~ 85 %

Copyright 2007 LG Electronics. Inc. All right reserved.


Only for training and service purposes

-6-

LGE Internal Use Only

5. Component Video Input (Y, CB/PB, CR/PR)


No

H-freq(kHz)

V-freq.(kHz)

1
2

720*480
720*480

Resolution

15.73
15.73

59.94
60.00

SDTV, DVD 480I(525I)


SDTV, DVD 480I(525I)

Proposed

3
4

720*480
720*480

31.47
31.50

59.94
60.00

SDTV 480P
SDTV 480P

1280*720

44.96

59.94

HDTV 720P

6
7

1280*720
1920*1080

45.00
33.72

60.00
59.94

HDTV 720P
HDTV 1080I

8
9

1920*1080
1920*1080

33.75
27

60.00
24

HDTV 1080I
HDTV 1080P

10

1920*1080

33.75

30

HDTV 1080P

11
12

1920*1080
1920*1080

67.43
67.5

59.94
60

HDTV 1080P
HDTV 1080P

6. RGB Input (PC)


No

Resolution
PC

H-freq(kHz)

V-freq.(Hz)

Pixel clock(MHz)

Remark

Proposed
DDC

1
2

640*350
720*400

31.469
31.469

70.08
70.08

25.17
28.32

DOS
DOS

640*480

31.469

59.94

25.17

VESA(VGA)

4
5

800*600
1024*768

37.879
48.363

60.31
60.00

40.00
65.00

VESA(SVGA)
VESA(XGA)

O
O

6
7

1280*768
1360*768

47.776
47.712

59.87
60.01

79.50
85.50

VESA(WXGA)
VESA(WXGA)

O
O

8
9

1440*900
1400*1050

55.5
64.744

59.90
59.948

88.750
101.00

22LG30-UA only

WXGA
WSXGA

10

1680*1050

62.290

59.954

146.25

22LG30-UA only

WSXGA

Remark

7. HDMI input (DTV)


No

Resolution
PC

H-freq(kHz)

V-freq.(Hz)

Pixel clock(MHz)

640*480

31.469

59.94

25.17

VESA(VGA)

2
3

800*600
1024*768

37.879
48.363

60.31
60.00

40.00
65.00

VESA(SVGA)
VESA(XGA)

O
O

4
5

1280*768
1360*768

47.776
47.720

59.87
59.799

79.50
84.75

CVT(WXGA)
CVT(WXGA)

O
O

1440*900

55.5

59.90

88.750

19/22LG30-UA only

WXGA

7
8

1400*1050
1680*1050

64.744
65.290

59.948
59.954

101.00
146.25

22LG30-UA only
22LG30-UA only

WSXGA
WSXGA

DTV
720*480

31.469

59.94

27.00

SDTV 480P

2
3

720*480
1280*720

31.500
44.96

60.00
59.94

27.03
74.17

SDTV 480P
HDTV 720P

1280*720

45.00

60.00

74.25

HDTV 720P

5
6

1920*1080
1920*1080

33.72
33.75

59.94
60.00

74.17
74.25

HDTV 1080I
HDTV 1080I

7
8

1920*1080
1920*1080

27
33.75

24.00
30.00

74.25
74.25

HDTV 1080P
HDTV 1080P

1920*1080

67.43

59.94

148.35

HDTV 1080P

10

1920*1080

67.5

60.00

148.50

HDTV 1080P

Copyright 2007 LG Electronics. Inc. All right reserved.


Only for training and service purposes

-7-

Proposed
DDC

LGE Internal Use Only

ADJUSTMENT INSTRUCTION
1. Application Range
(5)

This specification sheet is applied for all of the LCD TV with


LA85C chassis.

filexxx.bin
(7) ........ OK

2. Specification
1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2) Power Adjustment : 100-240V~, 50/60Hz
3) Magnetic Field Condition : Nil.
4) Input signal Unit : Product Specification Standard
5) Reserve after operation : Above 30 Minutes
6) Adjustment equipments: Color Analyzer(CA-210 or CA110), Pattern Generator (MSPG-925L or Equivalent), DDC
Adjustment Jig equipment, SVC remote control

(6)

3.2. ADC Process


3.2.1. PC input ADC

3. Main PCB check process


* APC - After Manual-Insult, executing APC

3.1. Software download


1) Execute ISP program Mstar ISP Utility and then click
Config tab.
2) Set as below, and then click Auto Detect and check OK
message. If display Error, Check connect computer, jig,
and set.
3) Click Connect tab. If display Cant, Check connect
computer, jig, and set.
(1)

(3)

<Adjustment pattern (PC)>

Please Check Speed :


To us speed between from 200 KHz
to 400 KHz
(2)

(1) Auto RGB Gain/Offset Adjustment


1) Convert to PC in Input-source
I2C COMMAND:0xF4(SELECT INPUT) 0x00 0x60(RGB)
cf. 0x10(TV), 0x20(AV), 0x40(COMPONENT),
0x60(RGB), 0x90(HDMI)
2) Signal equipment displays
Output Voltage : 700 mVp-p
Impress Resolution XGA (1024x 768 @ 60Hz)
Model : 60 in Pattern Generator
Pattern : 29 in Pattern Generator (MSPG-925 Series)
[gray pattern that left & right is black and center is
white signal (Refer below picture)].

3) Adjust by commanding AUTO_COLOR _ADJUST


(0xF1) 0x00 0x02 instruction.

OK

4) Click Read tab, and then load download file(XXXX.bin) by


clicking Read.
(4)

* Manual ADC process using Service Remote control. After


enter Service Mode by pushing ADJ key, execute Autoadjust by pushing G key at 0. ADC CALIBRATION.

filexxx.bin

EZ ADJUST
0. ADC CALIBRATION
: RGB
1. ADC ADJUST
2. SUB B/C ADJUST
3. W/B ADJUST
4. WHITE PATTERN
: OFF
5. 2HOUR OFF
: ON
6. OAD
7. UART DOWNLOAD
8. FACTORY MODE
: ON
9. DEBUG MODE
: OFF

5) Click Auto tab and set as below


6) click Run.
7) After downloading, check OK message.
Copyright 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

(2) Confirmation
1) We confirm whether 0xB6 address of EEPROM
0xA2 is 0xAA or not.
2) If 0xB6(RGB) address of EEPROM 0xB2 isnt
0xAA, we adjust once more.
3) We can confirm the ADC values from 0xB0~0xB5
(RGB) addresses in a page 0xA2

-8-

LGE Internal Use Only

3.2.2. COMPONENT input ADC

3.3. Function Check

(1) Component Gain/Offset Adjustment


1) Convert to Component in Input-source
I2C command : 0xF4(Select input) 0x00 0x40(Component)
cf. 0x10(TV), 0x20(AV), 0x40(COMPONENT),
0x60(RGB), 0x90(HDMI)

3.3.1. Check display and sound


- Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (CVBS/ S-Video)
3) COMPONENT (480i)
4) RGB (PC : 1024 x 768 @ 60hz)
5) HDMI
6) PC Audio In and H/P Out
* Display and Sound check is executed by Remote control.

<Adjustment pattern (COMPONENT)>


2) Signal equipment displays
Impress Resolution 480i
MODEL : 209 in Pattern Generator(480i Mode)
PATTERN : 08 in Pattern Generator(MSPG-925 Series)
3) Adjust by commanding AUTO_COLOR_ADJUST (0xF1)
0x00 0x02 instruction.
4) Signal equipment display
-Impress Resolution : 1080i
- MODEL: 223 in Pattern Generator(1080i Mode)
- PATTERN: 08 in Pattern generator(MAPG-925 series)
5) Adjust by commanding AUTO_COLOR ADJUST(0xF1)
0x00 0x02 instruction.
* Manual ADC process using Service Remote control. After
enter Service Mode by pushing ADJ key, execute Autoadjust by pushing G key at 0. ADC CALIBRATION.
EZ ADJUST
0. ADC CALIBRATION : COMPONENT
1. ADC ADJUST
2. SUB B/C ADJUST
3. W/B ADJUST
4. WHITE PATTERN
: OFF
5. 2HOUR OFF
: ON
6. OAD
7. UART DOWNLOAD
8. FACTORY MODE
: ON
9. DEBUG MODE
: OFF

4. Total Assembly line process


4.1. Adjustment Preparation
1) Heat-run above 30 minutes in RF no signal.
2) 15 Pin D-sub jack is connected to the auto W/B equipment.

4.2. Adjust color coordinate of Cool


1) Set Input to RGB.
2) Set Temperature : Cool
3) Adjust x=0.2850.005, y=0.2930.005 (9300K1000K) or
not.

4.3. Adjust color coordinate of Medium


1) Set Input to RGB.
2) Set Temperature : Medium
3) Adjust x=0.2950.005, y=0.3050.005 (8000K1000K) or
not.

4.4. Adjust color coordinate of Warm


1) Set Input to RGB.
2) Set Temperature : Warm
3) Adjust x=0.3130.005, y=0.3290.005 (8000K1000K) or
not.

(2) Confirmation
1) We confirm whether 0xBF(480i)/0xC8(1080i) address
of EEPROM 0xA2 is 0xAA or not.
2) If 0xBF(480i)/0xC8(1080i) address of EEPROM 0xA2
isnt 0xAA, we adjust once more.
3) We can confirm the ADC values from 0xB9~0xBE(480i)/
0xC2~(1080i) addresses in a page 0xA2.
* Manual ADC Confirmation using Service Remocon. After
enter Service Mode by pushing INSTART key.
MODEL : 22LG30_UA_UA/LPL_LM220WT7
S/W VER : 3.00.1
UTT : 6
ADC CAL.
RGB : OK
YPbPr(SD) : OK
YPbPr(HD) : OK
0. STEREO DETECT
1. SYNC LEVEL
2. DTV SNR
3. SCREEN MUTE
4. POWER OFF HISTORY

Copyright 2007 LG Electronics. Inc. All right reserved.


Only for training and service purposes

* Manual ADC Confirmation using Service Remocon. After


enter Service Mode by pushing INSTART key.
EZ ADJUST
0. ADC CALIBRATION : RGB
1. ADC ADJUST
2. SUB B/C ADJUST
3. W/B ADJUST
4. WHITE PATTERN
: OFF
5. 2HOUR OFF
: ON
6. OAD
7. UART DOWNLOAD
8. FACTORY MOD
: ON
9. DEBUG MODE
: OFF

* Adjust R/G/B - GAIN by pushing F, G key at Cool


* Adjust R/G/B - GAIN by pushing F, G key at Medium
* Adjust R/G/B - GAIN by pushing F, G key at Warm

-9-

LGE Internal Use Only

4.6. HDCP setting

W/B ADJUST
0. MODE : RGB
1. WHITE PATTERN : White
2. TEMPERATURE : Cool
3. R - GAIN : 128
4. G - GAIN : 128
5. B - GAIN : 128
6. R OFFSET : 128
7. G OFFSET : 128
8. B OFFSET : 128
9. RESET

(High-Bandwidth Digital Contents Protection)


1) Connect D-sub Signal Cable to D-Sub Jack.
2) Input HDCP key with HDCP-key- in-program.
3) HDCP Key value is stored on EEPROM(AT24C512) which
is 80~A1 addresses of 0xA0~0xA2 page
4) AC off/ on and on HDCP button of MSPG925 and confirm
whether picture is displayed or not of using MSPG925
5) HDCP Key value is different among the sets.

4.5. DDC EDID WRITE


1) Connect D-sub Signal Cable to D-Sub Jack.
2) Connect HDMI Signal Cable to HDMI Jack.
3) Write EDID DATA to EEPROM (24C02) by using DDC2B
protocol.
4) Check whether written EDID data is correct or not. (Refer to
Product spec).
5) Remark : A week manufacture in address 0x10 can be
changed. And thus Checksum (Address: 0x7F)
can be also changed.

4.5.1. 19LG30 EDID DATA


(1) ANALOG DATA 128Byte

- Remark: A week manufacture in address 0x10 can be


changed. And thus Checksum (Address: 0x7F)
can be also changed.
(2) DIGITAL DATA 256Byte

- Remark: A week manufacture in address 0x10 can be


changed. And thus Checksum (Address: 0x7F)
can be also changed.

1) All Data : HEXA Value


2) Changeable Data :
*: Serial No : Controlled / Data:01
**: Month : Controlled / Data:00
***:Year : Controlled
****:Check sum
Copyright 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 10 -

LGE Internal Use Only

TROUBLE SHOOTING
1. No Power (LED indicator off)
Start check

Fail

Check 15V or
5V of P701.

Check short
of Main board or
change LIPS.

Pass

Pass

Pass

Check Output
of IC705.

Check output
of Q701.

Fail
Change Q701.

Fail
Change IC705.

Pass

Fail
Check LED Assy.

Change LED Assy.

Pass
Check P304 & Connector.

Copyright 2007 LG Electronics. Inc. All right reserved.


Only for training and service purposes

- 11 -

LGE Internal Use Only

2. No RASTER
Start check

Check LED status


On Display Unit.

Fail
Repeat No power (1) PROCESS.

Pass
Check
IC700, IC702,
IC703, IC704, IC705, IC706,
IC708, IC709,
IC710.

Fail

Change IC700, IC702, IC703, IC704,


IC705, IC706, IC708, IC709, IC710.

Pass

Check input/output
of IC00.

Fail
Change IC100

Pass

Check the
inverter connector or
inverter.

Fail
Change inverter connector or inverter

Pass

Check LVDS cable


or module.

Fail
Change LVDS cable or module.

Pass
Check input source cable & jack.

Copyright 2007 LG Electronics. Inc. All right reserved.


Only for training and service purposes

- 12 -

LGE Internal Use Only

3-1. No Raster on AV signal (AV/ COMPONENT/ S-VIDEO RGB-PC)


3-2. NO Raster on RF signal (TV)
Start Check 3-1

Start Check 3-2

Pass

Pass
Fail

Repeat No power(1)
process.

Check output
of TU400.

Pass

Check
the signal of R622,
R623, R681, R615, R616,
R617, R640,R641,
R642.

Fail

Check 5V of TU400.
Re-Soldering or change
the defect part.

Pass

Fail

Change signal of
R622, R623, R681,
R615, R616, R617,
R640,R641,R642.

Pass

Check input/output
of IC100.

Fail

Re-soldering or change defect part.


Check X100.

Pass
Check input source cable and jack.

Copyright 2007 LG Electronics. Inc. All right reserved.


Only for training and service purposes

- 13 -

LGE Internal Use Only

4. No sound
Start Check

Check the input


Source.

Fail
Change source input.

Pass

Check input/Output
of IC100.

Fail

Re-soldering or change the defect part.


Check the X100.

Fail

Re-soldering or change
the defect part.

Pass

Check the input/


output of IC500.

Pass

Fail
Check the Speaker.

Change the speaker.

Pass

Check the Speaker wire.

Copyright 2007 LG Electronics. Inc. All right reserved.


Only for training and service purposes

- 14 -

LGE Internal Use Only

[3]

[N:11]
[P:10]

SCL[8]

[12]

Copyright 2007 LG Electronics. Inc. All right reserved.


Only for training and service purposes

1.0Vp-p

96dBuV

[16]

[15]

SDA[7]

- 15 -

EAG31022001

USB(SVC only)

6630G00001A

RS232C(SVC only)

6612F00099A

PC Audio IN

6630G70016A

PC(VGA)

6612J10031C

Tx_Out

IF-P
IF-N

SIF

TPA6110A20

Tx/Rx
EAN41348201

ST-5V

R232C_Tx

R232C_Rx

ST-5V

HPDCTRL[12]

PC IN

Comp1

DDC_SDA/UART_TX12V

DDC_SCL/UART_RX

HP_L/r[70,71]

TXCLK-[2]
TXCLK+[3]

IN1

IN1

SIFP0

SIFM0

TUNER_CVBS

VCOM0

OUT_P_R[8]
OUT_N_R[14]

OUT_P_L[35]
OUT_N_L[29]

(YDA148-EZ)
EAN40130001

D-AMP

MUTE[6]

Audio_R
IN_R[5]

HP_DET[37]
IN_L[38]

Audio_L

PR_IN[31]
SAR3[121]
AUL_IN1[56]CVBS OUT*1
SAR2[120]
AUR_IN1[57]HDMI*1
SAR1[119]
COMP_SW[112]
SAR0[118]
BIN[21]SOGIN[22]GIN[23]RIN[24] IR_RX[114]
VS_RGB[17]
HS_RGB[16]
RGB_SW[80]
SCL/RX[117]
SDA/TX[116]
AUOUTL0[72] AUOUTR0[73] GPIO12[79]

SIF

LGE1854C

EAN42961201

Flash
Flash(64M)
(64M)
S25FL064A
S25FL064A

0IMMRAL025A

EEPROM(512K)
EEPROM(512K)
24C512
24C512

LVDS(8Bit)

HY5DU561622F
256M (DDR)

HY5DU561622F
256M (DDR)

L OUT

R OUT

2.5V
VDD_DDR

3.3V
AVDD_DVI

KEY_CTL[1,2]

1.25V 3.3V

CVBS1[42]
AUL_IN0[54]
AUR_IN[55]
AV1_SW[111]
SV_C0[38]
SV_Y0[39]
MSTAR
S_SW[82]
EAN37156404SCL_EEPROM[136]
SDA_EEPROM[135]
B_TX0-[4] Air : 8VSB
B_TX0+[5]
Cable : 256/64QAM
G_TX1-[7]
RGB/YPbYr*2
G_TX1[8]
R_TX2-[10] CVBS*3
SPI_CK[129]
R_TX2+[11]
SPI_DI[130]
PB_IN[26] YC*2
SPI_DO[131]
SOY[29]
L/R-IN*3
SPI_CZ[132]
Y_IN[28]

SIFP0[51]

VCOM0[45]
CVBS0[44]
SIFM0[50]
1CH LVDS[137-146]
2CH LVDS[137-146,
150-159]
RXE/RXO

TS0-7[86,87,88,89,90,91,92,93]

IN[255] OUT[254]

MSCL SCLM1[127]
SDAM1[126]
MSDA
TSCLK[96]
TSSYNC[95]
TSVALID[94]

TP DATA[0-7]

DDCDA_SDA[14]
DDCDA_SCL[15]
POWER_HDMI[110]

Video/Audio SW

Buffer
Buffer

TPVALID[19]
TPERR[17]

0ICTMLG019C
TPSOP[34]

(LGDT3304)
SDA_TU[13]
TPCLK[33]

MAX3232CDR

USB_DM[251]
USB_DP[252]
USB_OCD_N[83]

IN[55] OUT[54]

VSB/QAM
[20,22,24,26,
27,28,29,31]
SCL[38]
Receiver
SCL_TU[11]
SDA[36]

IFP[3]
IFN[4]

12MHz
2

6212AB2872A
2

X100

1.2V 3.3V

CLK_ 25MHz

IFAGC[22]

OP-AMP

CVBS(ATV)

IF_AGC

EEPROM
EAN35989901

Rx_In

AUR_IN[59]
AUL_IN[58]

6612F00001D

Comp_1 YPbPr/LR

Head Phone

5V

YC EAG35541101

EEPROM
EAN35989901

6612B00015C

6612B00015C

HDMI

Rear S_1

Rear AV_1 V, LR EAG35541101

ATSC/NTSC Tuner
(TDVF-H051F)
LG Innotek

5V

AIR CABLE

L
C
D

Power
15V/ST-5V

19/22

Power/LIPS

3.3V

3.3V

G-5V

BLOCK DIAGRAM

1. Main

LGE Internal Use Only

15V

Copyright 2007 LG Electronics. Inc. All right reserved.


Only for training and service purposes

ST5V

ST15V

From LIPs
(19 ,22 W)

INV_BR 11

DIM 10

INV_CTL 9

NC 8

GND 7

ST5V 6

ST5V 5

GND 4

GND 3

15V

- 16 5V

Q704
FET
(SI49258 )

IC708
SC4215ISTRT

3.3V

IC704
AZ1085S-3.3

IC600
CAT24C02WI

IC705
AZ1085S-ADJ

IC709
AZ1085S-ADJ

IC703
AZ1085S-3.3

IC706
AZ1117H-3.3

IC700
KIA7809F

IC702
MP2305DS

1.2V

3.3V

ST3.3V

ST2.6V

ST3.3V

ST3.3V

9V

12V

Pannel
19, 22
IC800
CAT24C02WI

VDD
AVDD

VDD33
AVDD33
IC400
LGDT3304

IC200 / IC201
SDRAM *2
HY57V641620ETP

IC710
AZ1085S-ADJ

IC701
KIA7805F

ST1.25V

5V

IC601
MAX3232CDR

IC104
MC74LCX140I

IC102
AT24C512W

IC103 / IC105
Flash Memory

IR receiver

IC501
HP Amp (TPA6110A)

VDDP
AVDD_OTG

VDD_DDR

LGE1854C

AVDD_ADC, AVDD_SIF
AVDD_AU , AVDD_MemPLL
AVDD_MPLL, AVDD_LPLL
AVDD_DVI, AVDD_XTAL
AVDD_DVI
IC100
VDDC

TU400
TUNER (TDVF-H051F)

IC500
Sound Amp (YDA148)

2. POWER

LGE Internal Use Only

Copyright 2007 LG Electronics. Inc. All right reserved.


Only for training and service purposes

- 17 -

CVBS[16]

SIF[15]

AS[9]

TDVFH051F

SDA[7]
SCL[8]

IF_AGC[12]

IF1[10]

IF1[11]

B+[3]

Buffer

IF_AGC

IF_P

IF_N

64Kbyte

TUNER_CVBS

SIF

LPF

TS[20,22,24,26,
27,28,29,31]

TU_SDA[13]
TU_SCL[11] MSDA[36]
MSCL[38]

IF_AGC[15]

TS_VALID

TS_CLK
TS_SYNC

TS[0-7]

I2C MSCL / MSDA

TS_CLK[33]
TS_SYNC[34]
TS_VALID[19]

LGDT3304
[8VSB,QAM]

IF_N[4]
IF_P[3]

DDC_I2C
E2PROM_I2C

CVBS_0

SIF

MAIN I2C

TS_DATA

[MSTAR]

LGE1854C

E2PROM

EDID / ISP

3. TUNER + VSB

LGE Internal Use Only

Copyright 2007 LG Electronics. Inc. All right reserved.


Only for training and service purposes

Audio path

Video path

- 18 DSUB RGB_L/R

COMPONENT_L/R

AV1_L/R

SIF

HDMI_DATA

TS_DATA

HDMI

RGB

Component

S-Video

AV

AU_OUT0_
L/R

LGE1854C

LGDT3304

(From
Tuner)

LGE1854C

TS Data

HDMI

RGB

[TPA6110A]

Head Phone
AMP

[YDA148]

CLASS-D
AMP

Head Phone
Output

SPEAKER
Output

Component ( Y/
Cb/Cr )

SVIDEO ( Y/C )

CVBS1

CVBS0

YAMAHA

DTV_IN

HDMI_DATA

RGB_IN

Y/Cb/Cr_IN

Y/C IN

CVBS1

AT_TU_V

4. VIDEO, AUDIO

LGE Internal Use Only

Copyright 2007 LG Electronics. Inc. All right reserved.


Only for training and service purposes

- 19 -

SDA[7]
SCL[8]

TU400
TUNER

IC600
24C02
[EDID]

IC800
24C02
[EDID]

DDC_SCL
DDC_SDA

JK605
D-SUB

DDCDA_SDA
DDCDA_SCL

MSDA
SDA [36] MSCL
SCL [38]

IC400
LGDT3304

SCL_HDMI
SDA_HDMI

SDA_TU
SCL_TU

J800
HDMI

IC102
24C512

SCL
SDA

SCL_EEPROM [136]
SDA_EEPROM [135]

IC103/IC105
Flash Memory

SPI_CK
SPI_DI
SPI_DO
SPI_CZ

SCK [129]
SDI [130]
SDO [131]
SCZ [132]

IC100
LGE1854C

DDCDA_DA [14]
DDCDA_CK [15]

DDCR_DA [126]
DDCR_CK [127]

DDCA_SC [116]
DDCA_DA [117]

UART_TX1 [196]
UART_RX1 [195]

AR[0:12]
MDATA[16:31]
DQM0/1

CKE
MCLK

AR[0:12]
MDATA[0:15]
DQM0/1

CKE
MCLK

RS232C_TXD
RS232C_RXD

IC601
MAX3232CDR

JK606
RS232C

IC201
SDRAM

IC200
SDRAM

5. CONTROL

LGE Internal Use Only

Copyright 2007 LG Electronics. Inc. All right reserved.


Only for training and service purposes

- 20 -

SCK

SDI

SDO

CSZ

IC100
[LGE1854C]

DDC_ROM
SCL/SDA

MSCL/MSDA

IC100
[LGE1854C]

I2C_5V

SPI_CK

SPI_DI

SPI_DO

SPI_CSZ

ST3.3V
/5V

5VST

SCLK

SI

SO

S25PFL064A
or
MX25L64050MI
CS#
[Serial Flash]

EEPROM
EEPROM (EDID)
(EDID)
IC102,
IC102, IC600,IC800
IC600,IC800

LGDT3304

TUNER

0xA0

0x1C

0xC2

I2C Address

6. I2C

LGE Internal Use Only

MEMO

Copyright 2007 LG Electronics. Inc. All right reserved.


Only for training and service purposes

- 21 -

LGE Internal Use Only

EXPLODED VIEW
IMPORTANT SAFETY NOTICE

521

920
500
501

300

123

122

120

200

530

540

LV1

820

910

900

510

511

400

410

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by
in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

Copyright 2007 LG Electronics. Inc. All right reserved.


Only for training and service purposes

- 22 -

LGE Internal Use Only

Copyright 2008 LG Electronics. Inc. All right reserved.


Only for training and service purposes

LGE Internal Use Only

Copyright 2008 LG Electronics. Inc. All right reserved.


Only for training and service purposes

LGE Internal Use Only

P/NO : MFL41524405

Jan., 2008
Printed in Korea

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