MET 2110 STUDY GUIDE EXAM 1

General characteristics and bonding

Metals metallic bonding ductile and conductive
Ceramics covalent/ionic bonding brittle, insulators, stiff, high melting point
Polymers covalent, van der Waals bonding weak, low temperatures, not stiff, insulators
Metallic bonds nondirectional, free electrons that give conductivity Electron Sea
Covalent bonds directional, strong, no free electrons sharing of electrons
Ionic bonds involves two elements, strong, no free electrons, donating and accepting electrons
Crystal structures
simple cubic

FCC

BCC

HCP

atom locations

corners

corners and faces

corners and center

forget!

atoms/cell

relationship

A=2r

A=4r / 2

A=4r / 3

forget!

coordination number

12

12

packing factor

0.52

0.74

0.68

0.74

stacking sequence

none

ABCABCABC

none

ABABAB

close packed directions

<100>

<110>

<111>

forget!

close packed planes

none

(111)

none

(0001) = basal

critical resolved shear

forget!

100 psi

10,000 psi

100 psi

major property

forget

ductile

strong

brittle

typical metals

none

Al, Cu, Ni

Fe, W

Mg, TI, Be

Miller indices
Directions subtract tail from head, clear fractions, reduce to lowest integers
Planes find intercepts, take reciprocals, clear fractions find a corner of the cube that makes it
easiest to find the intercepts
0,1,0
- (1,0,1)
-1,1,-1
[1 1

1]

Defects
Lattice

x=1, y=1/2, z=1

1/x=1, 1/y=2, 1/z=1

x=-1, y=1, z=-1

1/x=-1, 1/y=1, 1/z=-1

(121)

( 11 1)

Line defect: dislocations: movement (slip) permits metals to have ductility!

Blocking slip or dislocation movement causes strengthening!
Increasing number of dislocations = strain hardening (cold working)
Surface defects: grain boundaries, stacking faults (ABCBCBCABC)
Small grains give large amount of grain boundaries and higher strength
n-1
N = 2 where n = ASTM grain size number; big n means small size
Point defects: substitutional, interstitial (small atoms), vacancies
More defects block dislocations and increase strength
Substitutional and interstitial = solid solution strengthening
Number of substitutional and interstitial independent of temperature
Number of vacancies increases with increasing temperature

The secret to metallurgy is:

INCREASING NUMBER OF LATTICE DEFECTS MAKES IT HARDER FOR DISLOCATIONS TO
SLIP AND INCREASES STRENGTH!!!!!!!
Diffusion
Movement of atoms through crystal structure
D = Doexp(-Q/RT) where Q = activation energy and D = diffusion coefficient
Increasing T or decreasing Q gives more rapid diffusion!
Low Q (fast diffusion) for: interstitial, low packing factor, along surface or grain boundary, weak
bonding, low melting point metals, metals vs. ceramics
Flux J is how many atoms pass a given area per unit time:
J = -D(c/x) where c/x is concentration gradient
High flux means a heat treatment will be done quickly
Diffusion important for: grain growth, recrystallization, age hardening, tempering, solidification, creep,
manufacturing processes such as sintering, diffusion bonding, etc. NOT important in room temperature
strength, fatigue, hardness, martensite reaction, etc.
Diffusion becomes important when T > 0.4 Tm(in Kelvin)
Mechanical properties
Know stress-strain curve and what various points mean
Tensile test gives: yield strength (dislocations move)
tensile strength (maximum load, necking occurs)
modulus of elasticity (stiffness) slope of elastic region
%elongation = (lf -lo)/ lo X 100 = ductility
%reduction in area = (Ao Af )/Ao X 100 = another measure of ductility
YS, TS, Modulus decrease with high temperature; %E and %RA increase
Hardness test: measure of penetration of surface by hard object; good indication of wear resistance;
correlates with other properties (TSsteel = 500*BHN); Brinell and Rockwell tests.
Impact test gives: energy absorbed in sudden blow (high for FCC, increases with temperature).
transition temperature (in BCC metals) ductile above this T; we want a material
to have a transition temperature below the service temperature.
Charpy is typical test.
Fatigue test gives: ability to withstand a cyclical load or vibration. Stress < yield strength
endurance limit = stress below which failure does not occur
endurance ratio = endurance limit / tensile strength ~ 0.5
get an S-N curve (stress vs. number of cycles)
Creep test gives: ability to resist deformation at high temperature. Stress < yield strength
creep rate = strain or elongation per unit time slope of creep curve
rupture time = time required to break during creep
stress-rupture curve = time to break as function of stress and temperature
rupture time decreases and creep rate increases as stress and T increase
Fracture toughness: ability of material to resist crack growth when stress is applied. Anything we do to
permit the material to absorb more energy before a flaw causes failure improves toughness.
Allotropic = material exists in more than one crystal structure
Isotropic = same properties in all directions
Anisotropic = different properties in different directions