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VB325SP

HIGH VOLTAGE IGNITION COIL DRIVER


POWER I.C.
TYPE
VB325SP

Vcl
380V

Icl
10A

ICC
150mA

PRIMARY COIL VOLTAGE INTERNALLY SET


COIL CURRENT LIMIT INTERNALLY SET
LOGIC LEVEL COMPATIBLE INPUT
DRIVING CURRENT QUASI PROPORTIONAL
TO COLLECTOR CURRENT
SINGLE FLAG-ON COIL CURRENT
LOW VOLTAGE CLAMP THERMAL
SHUTDOWN

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DESCRIPTION
The VB325SP is a high voltage power integrated
circuit made using the STMicroelectronics
VIPower M1-3 technology, with vertical current
flow power darlington and logic level compatible
driving circuit. The enable pin allows to externally
block the switch when the input is on. Built-in
protection circuit for coil current limiting and
collector voltage clamping allows the device to be
used as smart, high voltage, high current interface

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in advanced electronic ignition system. If the input


signal from the micro happens to remain high, the
device protects itself against over-heating by
forcing collector current to smooth decrease (low
voltage clamp feature) and no undesidered spark
occurs (see figure 4).

BD

VCC

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1

PowerSO-10

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BLOCK DIAGRAM

10

HVC

VIN

DRIVER

QUASI PROP.
BASE CURRENT

RSENSE

LIMITER

DIAGNOSTIC
OUTPUT

VCC
VR

VF1

VLIM

THERMAL
PROTECTION

REFERENCE
VTH

SN

September 2013

LGND

DocID9671 Rev 4

GND

1/9

VB325SP
ABSOLUTE MAXIMUM RATING
Symbol
HVc
IC
IC(gnd)
VCC
Is
Is(gnd)
VIN
IIN
fIN
VOUT(flag)
IOUT(flag)
Pmax
Es/b
VESD
VESD
VESD
IBD
VBD
Tj
Tstg
VE
IE

Parameter
Collector voltage (Internally limited)
Collector current (Internally limited)
DC current on Emitter Power
Driving stage supply voltage
Driving circuitry supply current
DC current on Ground pin
Input voltage
Maximum Input Current
Logic Input Frequency in Operative Mode
Output Voltage Primary Threshold Current Level
Flag Output Current
Power Dissipation (Tc=25C)
Self Clamped Energy during Output Power Clamping (See figure 2)
ESD voltage (HVc pin)
ESD voltage (Enable pin)
ESD voltage (Other pins)
Input Darlington Base Current
Input Darlington Base Voltage
Operating Junction Temperature
Storage temperature Range
Maximum Enable Voltage
Maximum Enable Current

Unit
C/W
C/W

u
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)
(s

s
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O

t
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Parameter
Thermal resistance junction-case
Thermal resistance junction-ambient

(MAX)
(MAX)

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Value
1
51

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PIN FUNCTION
No
1-5
2-3-4
6
7
8
9
10
TAB

Unit
V
A
A
V
mA
A
V
mA
Hz
V
mA
W
mJ
KV
KV
KV
mA
V
C
C
V
A

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THERMAL DATA
Symbol
Rthj-case
Rthj-amb

Value
-0.3 to Vclamp
10
10.5
-0.3 to 7
200
1
-0.3 to VCC + 0.3
100
DC to 150
-0.3 to VCC + 0.3
100
125
275
4
+ 1.5 ; -2
2
150
Internally limited
-40 to 150
-55 to 150
-0.3 to 5.5
150

Name

LGND
GND
E
VCC
BD
INPUT
FLAG
HVC

Function
Signal Ground
Emitter Power Ground
Enable (*)
Logic Supply Voltage
Base Darlington
Logic input channel (Internal Pull Down)
Diagnostic Output Signal (Open Emitter)
Primary Coil Output Driver (Open Collector)

(*) When grounded the Input is Enabled

CONNECTION DIAGRAM (TOP VIEW)

Pin 1 and Pin 5 must be externally connected to Pins 24.

5
4
3

6
7
8
9

E
VCC
BD
INPUT
FLAG

10

1
TAB

HVC

2/9

LGND
GND
GND
GND
LGND

VB325SP
ELECTRICAL CHARACTERISTICS (5.3V < Vbat < 24V; VCC=5V 10%; -40C < Tj < 125C; Rcoil=580m;
Lcoil=3.75mH unless otherwise specified; See note 1)
Symbol
Vcl
Vlcl
Vce(sat)
ICC(stdby)

DC Logic Current

ICC
ICC(peak)
VCC
Icl
Ic(off)
VINH
VINL
VIN(hyst)
IINH
IINL
IINpd
VdiagH
VdiagL
IdiagTH
IdiagTD
Idiag
Idiag(leak)

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Peak DC Logic Current


during On Phase
DC Logic Voltage
Coil Current Limit
Output Off State Current
High Level Input Voltage
Low Level Input Voltage
Input Threshold Hysteresis
High Level Input Current
Low Level Input Current
Input Active Pull Down
High Level Flag Output
Voltage
Low Level Flag Output
Voltage
Coil Current Level
Threshold
Coil Current Level
Threshold Drift
High Level Flag Output
Current
Leakage Current on Flag
Output
Antiparallel Diode Forward
Voltage
Single Pulse Avalanche
Energy

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tON

Turn-on time

tOFF

Turn-off time

Tsd
VEH
VEL

Test Conditions
Icoil=6.5A
Icoil=6.5A; Tj=Tsd

Min
320
30

IC=6A; VIN=4V

Typ
380
40

Max
420
50

Unit
V
V

1.5

11

mA

40

mA

IN=Off
Vb=16V; IC=6.5A; f=100Hz; Load = Coil;
VCC=5.5V
IC=6.5A

100
4.5
9

-40C < Tj < 125C (See note 2)


IN=Off; VHVC=24V; VCC=5V; Tj=25C
VCC=4.5V
VCC=5.5V
VIN=4V
VIN=0.8V
VIN=4V

let

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t(s

mA

5.5
11
5
VCC
0.8

0
10

100
30
100

VCC - 1

VCC

0.5

4.75

4
-0.3
0.4

u
d
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REXT=22K; CEXT=1nF (See note 3)


Tj=25C

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150

V
A
mA
V
V
V
A
A
A

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REXT=22K; CEXT=1nF (See note 3)

uc

od

let

VF
Es/b

Parameter
High Voltage Clamp
Low Voltage Clamp
Power Stage Saturation
Voltage
Stand-by Supply Current

4.25

4.5

(See figure 1)
IC > IdiagTH; Vdiag=3V

0.5

mA

VIN=Low; VCC=5.5V

10

IC= -1A

L=6mH; IC= 8A

180

Rc=0.5; Lc=3.75mH; Tj=25C;


Vbat=13V (See figure 6)
Rc=0.5; Lc=3.75mH; I C=6.5A; Tj=25C;
Vbat=13V (See figure 6)

Thermal shut-down
intervention
High Level Enable Voltage VIN=VINH; OUT=Off (See Note 4)
Low Level Enable Voltage VOUT free to follow VIN

mJ

15

25

150

2
0.40

V
V

Note 1: parametric degratation are allowed with 5.3<Vb<10V and Vb>24V.


Note 2: the primary coil current value Icl must be measured 1ms after desaturation of the power stage.
Note 3: no internal Pull-down.
Note 4: if ENABLE pin is floating OUT=Off for every input status.
(*) Internally Limited

3/9

VB325SP
ELECTRICAL CHARACTERISTICS (continued)
Symbol
IEH
IEL
VBD(off)
VBD(on)

Parameter
High Level Enable Current
Low Level Enable Current
Base Darlington Voltage Off
Base Darlington Voltage On

Test Conditions
VE=5V
VE<0.4V
VE=VEH
VIN=VINH; VE=VEL; IC=6.5A

PRINCIPLE OF OPERATION

The VB325SP is mainly intended as a high voltage


power switch device driven by a logic level input
and interfaces directly to a high energy electronic
ignition coil.
The input VIN of the VB325SP is fed from a low
power signal generated by an external controller
that determinesboth dwell time and ignition point.
During Vin high ( 4V) the VB325SP increases
current in the coil to the desired, internally set
current level.
After reaching this level, the coil current remains
constant until the ignition point, that corresponds
to the transition of Vin from high to low (typ. 1.9V
threshold).
During the coil current switch-off, the primary
voltage HVC is clamped at an internally set value

)
(s

Min

Typ

Max
500

- 200
1
1.8

Unit
A
A
V
V

Vcl, typically 380V. The transition from saturation


to desaturation, coil current limiting phase, must
have the ability to accomodate an overvoltage.
A maximum overshoot of 20V is allowed.
FEEDBACK
When the collector current exceeds 4.5A, the
feedback signal is turned high and it remains so,
until the input voltage is turned-off.
OVERVOLTAGE
The VB325SP can withstand the following
transients of the battery line:
-100V/2msec(Ri =10 )
+100V/0.2msec (Ri =10 )
+50V/400msec (Ri = 4.2 , with VIN= 3V)

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Figure 1: Flag current Vs. temperature

o
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Figure 2: Single pulse avalanche energy capability

700
650

600
550

Tc=25
C

500
450

E (mJ)

400
350
300
250

Tc=150

200
150
100
50
0
0

10

20

30

40

50

60

L (mH)

4/9

70

80

90

100

110

VB325SP
Figure 3: Self Clamped Inductive Switching
Current Vs. Time

Figure 4: Low voltage clamp feature

10

Inductive Current (A)

T=25
6

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T=150
2

u
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0
200

300

400

500

600

700

800

900

1000

Time in Clamp (sec)

r
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(s

Figure 5: Typical application diagram

+5V

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Vbat
1F

100nF
1K

VIN

VCC

BD
HVC

1K

1K

FLAG
1nF

18K

LGND

GND

ENABLE pin can be alternatively connected to LGND

5/9

VB325SP
Figure 6: Switching time for inductive load

Vbat

Rgen

D.U.T

Vgen

)
s
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ct
E

Vgen

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t
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VCC

)
(s

d
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3V

bs

6/9

s
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t
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100V

Vbat

tOFF
tON

VB325SP

PowerSO-10 MECHANICAL DATA


mm.

DIM.

MIN.

A
A (*)
A1
B
B (*)
C
C (*)
D
D1
E
E2
E2 (*)
E4
E4 (*)
e
F
F (*)
H
H (*)
h
L
L (*)

(*)

TYP

3.35
3.4
0.00
0.40
0.37
0.35
0.23
9.40
7.40
9.30
7.20
7.30
5.90
5.90

s
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MAX.

MIN.

3.65
3.6
0.10
0.60
0.53
0.55
0.32
9.60
7.60
9.50
7.60
7.50
6.10
6.30

0.132
0.134
0.000
0.016
0.014
0.013
0.009
0.370
0.291
0.366
0.283
0.287
0.232
0.232

1.35
1.40
14.40
14.35

0.049
0.047
0.543
0.545

1.80
1.10
8
8

s
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c

u
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o

Pr

MAX.
0.144
0.142
0.004
0.024
0.021
0.022
0.0126
0.378
0.300
0.374
300
0.295
0.240
0.248

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0.050
0.053
0.055
0.567
0.565

0.002

0.047
0.031
0
2

0.070
0.043
8
8

0.10 A B

10

E2

E4

SEATING
PLANE
e

DETAIL "A"

0.25

o
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O
)

0.50
1.20
0.80
0
2

TYP.

let

1.27
1.25
1.20
13.80
13.85

(*) Muar only POA P013P

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inch

D
= D1 =
=
=
SEATING
PLANE

A
F

A1

A1

L
DETAIL "A"

P095A

7/9

VB325SP
PowerSO-10 SUGGESTED PAD LAYOUT

TUBE SHIPMENT (no suffix)

14.6 - 14.9

CASABLANCA

10.8- 11

MUAR

6.30
C

A
A

0.67 - 0.73
10
9

9.5

2
3

0.54 - 0.6

All dimensions are in mm.

8
7

4
5

1.27

Base Q.ty Bulk Q.ty Tube length ( 0.5)

Casablanca
Muar

50
50

1000
1000

532
532

C ( 0.1)

10.4 16.4
4.9 17.2

0.8
0.8

)
s
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ct

TAPE AND REEL SHIPMENT (suffix 13TR)

u
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REEL DIMENSIONS

e
t
e
ol

)
(s

s
b
O

d
o
r

600
600
330
1.5
13
20.2
24.4
60
30.4

All dimensions are in mm.

t
c
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TAPE DIMENSIONS

Pr

Base Q.ty
Bulk Q.ty
A (max)
B (min)
C ( 0.2)
F
G (+ 2 / -0)
N (min)
T (max)

According to Electronic Industries Association


(EIA) Standard 481 rev. A, Feb 1986

P
e

Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing

t
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o

s
b
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W
P0 ( 0.1)
P
D ( 0.1/-0)
D1 (min)
F ( 0.05)
K (max)
P1 ( 0.1)

All dimensions are in mm.

24
4
24
1.5
1.5
11.5
6.5
2
End

Start
Top

No components

Components

No components

cover
tape

500mm min
Empty components pockets
saled with cover tape.

500mm min

User direction of feed

8/9

VB325SP

Please Read Carefully:

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Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (ST) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.

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All ST products are sold pursuant to STs terms and conditions of sale.

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Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.

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No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.

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UNLESS OTHERWISE SET FORTH IN STS TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

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ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE
SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B)
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DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY.

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Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.

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ST and the ST logo are trademarks or registered trademarks of ST in various countries.


Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.

2013 STMicroelectronics - All rights reserved


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