1.
Copper has 20 orbiting electrons with only one electron in the outermost shell. The fact that
the outermost shell with its 29th electron is incomplete (subshell can contain 2 electrons) and
distant from the nucleus reveals that this electron is loosely bound to its parent atom. The
application of an external electric field of the correct polarity can easily draw this loosely
bound electron from its atomic structure for conduction.
Both intrinsic silicon and germanium have complete outer shells due to the sharing (covalent
bonding) of electrons between atoms. Electrons that are part of a complete shell structure
require increased levels of applied attractive forces to be removed from their parent atom.
2.
Intrinsic material: an intrinsic semiconductor is one that has been refined to be as pure as
physically possible. That is, one with the fewest possible number of impurities.
Negative temperature coefficient: materials with negative temperature coefficients have
decreasing resistance levels as the temperature increases.
Covalent bonding: covalent bonding is the sharing of electrons between neighboring atoms to
form complete outermost shells and a more stable lattice structure.
3.
4.
W = QV = (6 C)(3 V) = 18 J
5.
6.
GaP
ZnS
Gallium Phosphide
Zinc Sulfide
Eg = 2.24 eV
Eg = 3.67 eV
7.
8.
A donor atom has five electrons in its outermost valence shell while an acceptor atom has
only 3 electrons in the valence shell.
9.
Majority carriers are those carriers of a material that far exceed the number of any other
carriers in the material.
Minority carriers are those carriers of a material that are less in number than any other carrier
of the material.
10.
Same basic appearance as Fig. 1.7 since arsenic also has 5 valence electrons (pentavalent).
11.
Same basic appearance as Fig. 1.9 since boron also has 3 valence electrons (trivalent).
12.
13.
14.
For forward bias, the positive potential is applied to the p-type material and the negative
potential to the n-type material.
15.
TK = 20 + 273 = 293
k = 11,600/n = 11,600/2 (low value of VD) = 5800
(5800)(0.6)
kVTD
293
1
ID = Is e K 1 = 50 u 109 e
16.
(5800)(0.6 V)
373
17.
(5800)( 10 V)
ID = Is e K 1 = 0.1PA e 293
1
6 197.95
6
= 0.1 u 10 (e
1) = 0.1 u 10 (1.07 u 1086 1)
# 0.1 u 106 0.1PA
ID = Is = 0.1 PA
(b) The result is expected since the diode current under reverse-bias conditions should equal
the saturation value.
18.
(a)
x
0
1
2
3
4
5
y = ex
1
2.7182
7.389
20.086
54.6
148.4
(b) y = e0 = 1
(c) For V = 0 V, e0 = 1 and I = Is(1 1) = 0 mA
19.
T = 20qC:
T = 30qC:
T = 40qC:
T = 50qC:
T = 60qC:
Is = 0.1 PA
Is = 2(0.1 PA) = 0.2 PA (Doubles every 10qC rise in temperature)
Is = 2(0.2 PA) = 0.4 PA
Is = 2(0.4 PA) = 0.8 PA
Is = 2(0.8 PA) = 1.6 PA
20.
For most applications the silicon diode is the device of choice due to its higher temperature
capability. Ge typically has a working limit of about 85 degrees centigrade while Si can be
used at temperatures approaching 200 degrees centigrade. Silicon diodes also have a higher
current handling capability. Germanium diodes are the better device for some RF small signal
applications, where the smaller threshold voltage may prove advantageous.
21.
From 1.19:
VF
@ 10 mA
Is
75qC
1.1 V
25qC
0.85 V
0.01 pA
1 pA
125qC
0.6 V
1.05 PA
22.
An ideal device or system is one that has the characteristics we would prefer to have when
using a device or system in a practical application. Usually, however, technology only
permits a close replica of the desired characteristics. The ideal characteristics provide an
excellent basis for comparison with the actual device characteristics permitting an estimate of
how well the device or system will perform. On occasion, the ideal device or system can be
assumed to obtain a good estimate of the overall response of the design. When assuming an
ideal device or system there is no regard for component or manufacturing tolerances or any
variation from device to device of a particular lot.
23.
In the forward-bias region the 0 V drop across the diode at any level of current results in a
resistance level of zero ohms the on state conduction is established. In the reverse-bias
region the zero current level at any reverse-bias voltage assures a very high resistance level
the open circuit or off state conduction is interrupted.
24.
The most important difference between the characteristics of a diode and a simple switch is
that the switch, being mechanical, is capable of conducting current in either direction while
the diode only allows charge to flow through the element in one direction (specifically the
direction defined by the arrow of the symbol using conventional current flow).
25.
VD # 0.66 V, ID = 2 mA
V
0.65 V
RDC = D
= 325 :
2 mA
ID
26.
27.
At ID = 15 mA, VD = 0.82 V
V
0.82 V
RDC = D
= 54.67 :
I D 15 mA
As the forward diode current increases, the static resistance decreases.
VD = 10 V, ID = Is = 0.1 PA
V
10 V
= 100 M:
RDC = D
I D 0.1 P A
VD = 30 V, ID = Is= 0.1 PA
V
30 V
RDC = D
= 300 M:
I D 0.1P A
As the reverse voltage increases, the reverse resistance increases directly (since the diode
leakage current remains constant).
28.
(a) rd =
30.
31.
32.
ID = 10 mA, VD = 0.76 V
V
0.76 V
RDC = D
= 76 :
I D 10 mA
'Vd 0.79 V 0.76 V
#
rd =
'I d 15 mA 5 mA
RDC >> rd
0.03 V
=3:
10 mA
ID = 1 mA, rd =
26 mV
ID = 1 mA, rd = 2
= 2(26 :) = 52 : vs 55 : (#30)
ID
26 mV 26 mV
ID = 15 mA, rd =
= 1.73 : vs 2 : (#30)
15 mA
ID
rav =
'Vd
'I d
0.9 V 0.6 V
= 24.4 :
13.5 mA 1.2 mA
33.
rd =
34.
rav =
35.
36.
'Vd
'I d
0.9 V 0.7 V
14 mA 0 mA
0.2 V
= 14.29 :
14 mA
1.25 pF 0.75 pF
10 V 25 V
0.5 pF
= 0.033 pF/V
15 V
1.25 pF 3 pF
10 V 1 V
1.75 pF
= 0.194 pF/V
9V
38.
The transition capacitance is due to the depletion region acting like a dielectric in the reversebias region, while the diffusion capacitance is determined by the rate of charge injection into
the region just outside the depletion boundaries of a forward-biased device. Both
capacitances are present in both the reverse- and forward-bias directions, but the transition
capacitance is the dominant effect for reverse-biased diodes and the diffusion capacitance is
the dominant effect for forward-biased conditions.
39.
40.
VD = 0.2 V, CD = 7.3 pF
1
1
= 3.64 k:
XC =
2S fC 2S (6 MHz)(7.3 pF)
VD = 20 V, CT = 0.9 pF
1
1
XC =
= 29.47 k:
2S fC 2S (6 MHz)(0.9 pF)
10 V
= 1 mA
10 k:
ts + tt = trr = 9 ns
ts + 2ts = 9 ns
ts = 3 ns
tt = 2ts = 6 ns
If =
41.
42.
As the magnitude of the reverse-bias potential increases, the capacitance drops rapidly from a
level of about 5 pF with no bias. For reverse-bias potentials in excess of 10 V the capacitance
levels off at about 1.5 pF.
43.
44.
Log scale:
TA = 25qC, IR = 0.5 nA
TA = 100qC, IR = 60 nA
The change is significant.
60 nA: 0.5 nA = 120:1
Yes, at 95qC IR would increase to 64 nA starting with 0.5 nA (at 25qC)
(and double the level every 10qC).
45.
46.
47.
48.
'VZ
u 100%
VZ (T1 T0 )
0.75 V
u 100
0.072 =
10 V(T1 25)
7.5
0.072 =
T1 25
7.5
T1 25q =
= 104.17q
0.072
T1 = 104.17q + 25q = 129.17q
49.
TC = +0.072% =
50.
TC =
'VZ
u 100%
VZ (T1 T0 )
(5 V 4.8 V)
u 100% = 0.053%/qC
=
5 V(100q 25q)
51.
(20 V 6.8 V)
u 100% = 77%
(24 V 6.8 V)
The 20 V Zener is therefore # 77% of the distance between 6.8 V and 24 V measured from
the 6.8 V characteristic.
53.
24 V Zener:
0.2 mA: # 400 :
1 mA: # 95 :
10 mA: # 13 :
The steeper the curve (higher dI/dV) the less the dynamic resistance.
54.
VT # 2.0 V, which is considerably higher than germanium (# 0.3 V) or silicon (# 0.7 V). For
germanium it is a 6.7:1 ratio, and for silicon a 2.86:1 ratio.
55.
56.
57.
(a)
0.75
= 0.25
3.0
From Fig. 1.53 (i) ( # 75q
(b) 0.5 ( = 40 q
58.
0.2 mA 20 mA
x
qC
20 mA
= 100qC
x=
0.2 mA/ qC