ABSTRACT
Electron beam hardening is investigated and compared with conventional thermal hardening on a diazoquinone
novolak (DQN) photoresist. The electron beam hardening is accomplished without significant heating of the resist
thereby eliminating resist flow or melting. The electron beam cured polymer is fully cross-linked throughout its
entire thickness (full matrix cure). Thermal stability of the resist versus electron beam dose is examined. The
results of varying amounts of electron beam dose show that the shrinkage of the photoresist can be reduced almost to
zero by sufficient curing. The elimination of shrinkage of the resist also greatly reduces the amount of stress in the
cured film. After this electron beam cure, no resist stress or shrinkage is experienced even when the resist is
subjected to thermal bakes in excess of 200C. In fact, thennal stability of better than 400C has been
demonstrated. The resist shrinkage is eliminated due to the resist being fully cross-linked well below its glass
transition temperature. These fully cross-linked resists exhibit superior performance in plasma processing and yet
remain strippable by conventional plasma ashing processes.
1. BACKGROUND
1.1 Thermal hardening
Hardening of photoresist via post baking after image development is performed to strengthen the resist film so
that it can withstand the rigors ofplasma etching and other harsh processes.' Conventional post-baking or hardening
of photoresist is typically a trade-off between resist stabilization and melting. Melting temperature is proportional
to the molecular weight or degree of cross-linking in the film. As the molecular weight is increased, the glass
transition temperature is raised. In DQN resists, melting occurs above 135C. The postbake heating can cause the
exterior of the patterned resist to form an oxidized crust Nitrogen gas evolved from the DQ decomposition is
trapped by the crust inducing stress into the film which may cause edge lifting later in wet etching.2 DQN resists
baked in air at temperatures above 170C become insoluble due to oxidation and cross-linking. Below this
temperature the resist can be stripped in organic solvents. Although the chemical cross-linking of DQN competes
with physical melting, long slow bakes (120C for 16-24 hours) in air can achieve a high degree of thermal stability
(cross-linking) while minimizing resist flow (oxidation and ketene reactions harden the resist). However,
throughput considerations dictate raising the resist temperature rapidly (to increase the rate of cross-linking) while
keeping it below the glass transition temperature (Tg) to avoid melting the lithographic features.
o-194-o827-1/93/$6.OO
Electron beam curing is very energy efficient compared to other processes. Rather than heating entire ovens or
hot plates most of the beam energy goes into curing the resist. High efficiency is achieved by assuring that most of
the beam energy is absorbed in the material to be cured and not in the underlying substrate.6 Thinner resists require
less dose than thicker resists to achieve the same hardening properties. By adjusting the energy of the beam such
that the range of the incident electrons is nearly equal to the resist thickness provides for an efficient means of
maximizing throughput while providing a nearly uniform cure throughout the full thickness of the resist.
2.3 Electron beam exposure system
The electron beam exposure tool used for these experiments is specifically designed for electron beam curing of
photoresists and interlayer dielectrics.9 The electron optical column in this system produces a large collimated
electron beam which totally covers the sample being processed up to 200 mm in diameter. This electron beam tool,
further described elsewhere,'0 utilizes a cold cathode which is impervious to the gaseous products evolved from the
resist and allows it to operate in a soft vacuum environment (1-5 Pa).
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In conventional electron beam exposure systems (SEMs, etc. ) surface charging by the eleciron beam is a
problem for insulating samples. However, by operating in a soft vacuum environment electhcal charging of the
sample does not occur. The induced charge at the surface of the sample is neutralized by positive ions generated by
the electron beamS This allows exposure of insulating samples without the requirement of a conductive coating.
Also the electrical charge injected into the interior of an insulating coating is diminished or drained by electron beam
induced conductivity (EBIC) created by the curing beam. This allows the charge to be drained by positive ions on
the surface of the sample. The effect on circuit devices (oxide gates, etc.) by the high dose of electron beam curing
(typically lOx to 20x higher than E-beam direct write exposure doses) has not been determined. Researchers have
reported both beneficial and deleterious effects of e-beam exposure on semiconductor devices."2'13 E-beam curing
is being used today in areas where it is followed by an annealing step in a subsequent process or on substrates with
no active devices (i.e. thin film heads, multichip modules, etc.), or where the active device is protected by another
layer. No exhaustive study has been done to determine the effect on unprotected oxides.
insoluble. Exposures were made on Nova 2071 diazonapthoquinone novolak (DQNIn)resist (- 4 jim thick) coated
on bare silicon wafers. The solubility of the resist as a function of exposure dose was evaluated by immersing the
exposed samples in undiluted developer (Morton DE-3 O.5N) and monitoring the development rate. Development
rate was determined by measuring resist thickness remaining over a range of development times. Figure 6 shows the
solubility vs electron beam dose. In a separate set of tests, the resistance to organic solvents was evaluated. For
more aggressive strippers (i.e. acetone based) dose levels of 2000-4000 pC/cm2 or greater are required to make the
resist insoluable. At these and greater dose levels the resist is inert in wet solvents and hot strippers. It is surmised,
at these higher dose levels the cross-linked matrix of polymer chains is so dense that openings in the film are too
sniall for solvent molecules to penetrate. The amount of dose required for a given process is dependent on the resist
characteristics desired and the thickness of the resist. For example a process may require that the resist hold up to an
etching step or a plating bath and then be removed in a wet stripper (as opposed to plasma ashing). In Figure 7 the
thermal stability and solubility are plotted vs dose. A hypothetical process window established by a minimum
solubility requirement (dose '8OO .tCIcm2) and a minimum resist thermal stability of 1800 C (dose 6OO j.Lcicm2)
is shown by the vertical lines in Figure 7. If the entire resist layer is hardened uniformly than it is possible to
select a dose within this process window that either optimizes solubility or optimizes thermal stability, In a
UV/skin bake process there are large differences in the degress of hardening throughout the resist layer. In dense
lithographic areas there is a greater ratio of resist surface to bulk. In a UV skin/bake, the surface (and areas close to
the surface) are cured to a higher level than the bulk of the resist. Therefore, the denser lithographic areas have a
harder cure than those areas with fewer features. if the difference in resist hardness is larger than the process window
then a portion of the resist may have the thermal stability but not be removable via a wet solvenL Another portion
of the resist may be removable via wet stripper but not hold up to the thermal process. Electron Beam curing can
obtain a uniform cure throughout the entire resist layer. Therefore with E-beam curing one may work at either
extreme of the process window to optimize for either ease of removal or thermal stability. (i.e. if the resist is
uniformly cured at a lower level of cross-linking it is much easier to strip in subsequent operations).
3.3 Resist shrinkage and stress
Shrinkage occurs during resist post baking due to the evolution of diazoquinone and solvents not evolved in the
prebake . Since the resist layer is constrained by the substrate in two dimensions, shrinkage of the film only occurs
in the vertical dimension. A 15% - 18% resist thickness loss can occur during baking due to the evolution of
solvents, diazoquinone, water, nitrogen, hydrogen etc. Baking of the resist also induces stresses in the films due to
the mismatch of thermal expansion between the resist and the substrate. Stress induced in thermal curing has been
found to be independent of the coating thickness and solution concentration.'5 Narrow molecular weight polymers
(usually required for high contrast development) without added plasticizers can become brittle and crack High bakes
may induce internal stresses in DQN resists to cause edge lifting in aqueous etchants. The edge lifting, due to
internal stresses, can cause severe undercutting of small resist islands.
Resist shrinkage is greatly reduced in electron beam curing. Film thickness measurements made before and after
E-beam curing indicate little or no shrinkage of the resist. Measurements on Nova 2071 electron beam cured resists
showed zero to less than 2% resist thickness loss (within experimental error) as compared to 15% - 18% resist
thickness loss using thermal curing. Induced stress in electron beam cured films have shown similar improvements.
Measurements made after electron beam curing and during subsequent baking have also shown little or no stress in
the cured films. To evaluate resist shrinkage after E-beam cure, DQN resist coated samples were exposed at varying
dose and subsequently baked at high temperature. Figure 8 shows the amount of shrinkage of a DQN based resist
(2.3 pin thick original thickness) as a function of dose when postcured baked at 225C. Note that dose levels of
2000-4000 jiC/cm2 are required to minimize shrinkage. It is believed that the shrinkage which occurs below
exposure doses of 4000 iC/cm2 is due to the expulsion of solvents or other volatiles not yet evolved (or not broken
down and cross-linked into an unreactive component of the film). For doses below 4000 j.tCIcm2 components in
the solvents may react with some etchant gases (in certain processes) to create surface films which would necessitate
an additional descum process. Therefore, for resist films that will see very harsh process environments or are required
to become permanent structures and remain inert, an electron beam curing dose of at least 4000 ixC/cm2 appears
necessary. With little or no resist shrinkage using electron beam curing, the possibility exists for eliminating some
steps required to planarize resist that has shrunk unevenly over circuit features of differing elevations.
4.0 CONCLUSIONS
Electron Beam cunng/har&ing ofDQN photoresists was investigated and compared with conventional thennal
curing. Electron Beam hardening of photoresist can attain distortionless stabilization of DQN resists by utilizing
full matrix cross-linking of the resist. The thermal glass transition temperature can be raised to over 400C without
resorting to long slow bakes. Thermal stability can be improved which preserves lithographic features. Solubiity
of the resist is dose dependent which means etch resistance can be determined by needs of downstream processes.
Little or no shrinkage is experienced in the cured resist layer providing a means of improving planarization on wafers
with large topographical differences. The elimination of shrinkage also reduces the stress in the film even for
subsequent thermal processes. In many applications E-Beam curing of resist provides improved performance over
traditional curing methods.
5.0 ACKNOWLEDGEMENTS
The authors gratefully acknowledge the contributions of the following individuals whose support made this
paper possible: Tom Eichenberg and Ken Bell of Morton International for helpful discussions and the thennal
stability micrographs and processing, Tyler Curtis of AMCC for thin film measurements.
6.0 REFERENCES
1. W. Moreau, Semiconductor Lithography, 545,Plenum (1988)
2. H. Vanazawa, N. Hasegawa and K. Donta, J Appl. Polym. Sci. 30,547(1985)
3. J. C. Matthews, J. Wilmott, SPifi Proc. 470, 194 (1984)
4. U.S. Patent 4,548,688 (1985) Fusion Semiconductor Systems
5. P. Burggraaf, Semiconductor International, P.89 April 1987
Table 1
Resist:
Film Thickness:
3.7 microns
CD:
5 microns
Softbake:
85C/i 10 seconds
120C/hO seconds
Exposure:
Develop:
360
Ultratech 1000 (NA=0.315)
Immersion (1 Minute)
DE-4, 23C
SPIE
Table 2
Resist:
Film Thickness:
3.7 microns
CD:
5 microns
Softbake:
85C/i 10 seconds
120C/i 10 seconds
Exposure:
Develop:
Resist Hardening:
360 mi/cm2
Ultratech 1000 (NA=0.315)
Immersion (1 Minute)
DE-4,23C
ElectronCure 30X-200A
Figure 2a. No bake
Table 3
Resist:
Film Thickness:
3.7 microns
CD:
5 microns
Softbake:
85C/i 10 seconds
120C/i 10 seconds
Exposure:
360 mJ/cm2
Ultratech 1000 (NA=0.315)
Develop:
Immersion (1 Minute)
DE-4,23C
Table 4
iIpI7
Resist:
Film Thickness:
3.7 microns
CD:
5 microns
Softbake:
85C/i 10 seconds
120C/i 10 seconds
Exposure:
360 ipJ/cm2
Ultratech 1000 (NA=0.315)
Develop:
Immersion (1 Minute)
DE-4,23C
Resist Hardening:
5KV X15888
h'i
1D19
Figure 4c. 180C/60 Seconds
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Table 5
Resist:
Film Thickness:
3.7 microns
CD:
5 microns
Softbake:
85C/lb seconds
120C/lb seconds
Exposure:
360 mi/cm2
Ultratech 1000 (NA=0.315)
Develop:
Immersion (1 Minute)
DE-4,23C
Resist Hardening:
ElectronCure 30X&200A
C)
Resist:
Nova 2071
.0
(I)
i3O0
o 250
. 200
150
C,)
50
0 500 1000150020002500300035004000
Dose (pC/cm2)
Figure 7. Solubility & Tg vs. dose
1
16
ci)
0)
12
E 10
C,)
0)4.
C,)
2
0
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