Limei Xu
Weibin Tang
twb0609@163.com
rjf314@tom.com
xulimei@uestc.edu.cn
Index Terms
I. INTRODUCTION
Currently, the electronic apparatus used on plane or ship
are suffered from a vile vibration. The consideration on
vibration problems in electronic system starts with two of the
earliest references: books by Eshleman (1972) [1] and
Steinberg (1988) [2]. In some case, the response of a shock
and/or vibration environment will be a significant contributor
to the overall damage. These dynamic effects, whether owing
to environment, manufacturing, shipping, handing, operation
or other cause, may results in large amplitudes and/or
acceleration levels being sustained by the structure [3]. The
855
G
H
(1)
A'H average
856
area of the sample cross section, 'H average is the average value
of increment of strain under the increment force.
Another material property that is required is the effective
density. This smeared density can be calculated from the
expression:
M .
(2)
U
LWt
Where M is the total sample mass, L is the length, and W
is the width. The procedure for finding the various material
properties is independent of whether the samples are local
regions or the entire board. The typical material parameters
are shown in Table I:
stress
sample
strain-flack
Output the change
of resistance value
Fig. 3 Strain measurement of component of the PCB.
measuring
R gi
R3
D
Rg
temperature
compensation
U01
Youngs/GPa
Density/kg/m3
aluminum
70
2780
Integrate chip
39
2150
FR-4
22
4100
857
Fig. 6 The glue mode as the boundary condition.
Fig. 7 The coupling mode as the boundary condition.
TABLE II
THE COMPARISON OF TWO BOUNDARY CONDITION
Mode
Frequency (glue) / Hz
Frequency(coupling) / Hz
419.9
215
569.0
288
915.0
480
1141
522
1254
634
build the transfer matrix and then perform the curve fitting
necessary to obtain estimates of the modal properties of the
structure. The FRFs (above) and curve fitting (below) are
shown in Fig. 9. There are four hundred and eighty points are
tested and the FRFs shown good superposition. From Fig. 9, it
can be found the clear formants. These formants are used to
pick-up the nature frequencies of the structure. The fitting
curve of all the FRFs is to help to pick-up the nature
frequencies more exactly. It is assumed that the vibration
modes are globally defined. That is, evidence of the mode can
be measured from practically any point on the structure. Each
transfer function describes the complete dynamic properties of
the structure. The curve below is the curve fitting of all the
FRFs. All of the mode frequencies can be distinctly identified
from it. Software of Mescope4.0 was used for experimental
modal analysis. The result of experiment is shown in Table III.
Compared Table II and Table III, it can be found that the data
when using coupling not glue to simulate the boundary
condition of soldering in ANSYS is more approaching to the
results of measurement. The errors all of the six modes of
frequency using coupling are less than 7.1% comparing with
the results of experiment, while the errors of the glue mode is
V. EXPERIMENTAL PROCEDURES
Experimental modal analysis is the process whereby the
natural frequencies, mode shapes, and damp values are
estimated from measurements made on an existing structure
[16]. These modal parameters are determined via data
curve-fitting algorithms from a set of frequency response
functions (FRFs) obtain from measurements taken at various
points throughout the structure [3]. The FRFs are acquired by
exciting the structure, usually by way of a random motion
shaker or an instrumented impact hammer, and measuring the
response by means of an accelerometer.
The vibration testing-rig is shown below in Fig8, the
dynamic signal analysis instrument SignalCalu730 export an
initial drive signal. The initial signal is amplified by the power
amplifier to serve for driving the shaker to generate a power
force. The shaker is used to excite the electronic apparatus at
858
TABLE IV
PREDICTED AND MEASURED MODAL RESPONSE OF THE MODULE
TABLE III
Mode
MAC
FrequencyHz
RESULTS OF EXPERIMENT
FEA(coupling)
Measured
215
213
0.94
310
288
310
0.86
460
480
460
0.82
558
522
558
0.90
623
634
623
0.76
Mode
Frequency / Hz
213
From Fig. 10, it can even found that most of the two
corresponding mode shape are close similar. But the fifth
mode shape shows some discrepancy. This may due to the
over simplification of the processor, the crystal oscillator and
integrated circuit modules as simple homogeneous, isotropic
block or cylinders. In addition, all the simple blocks or
cylinders in the FEM were defined perfectly rigid connection
with all DOFs to the FR-4. While in practice, the solder joints
connecting the components to the board have finite rigidity.
{) e }T {) f }k
{) e }Tj {) e } j {) f }TK {) f }K
(3)
859
Fig. 10 Mode shapes comparison of the measured (left) and the FEA (right).
VII. CONCLUSION
This paper addresses basic modeling issues regarding the
dynamic response of a typical PCB populated with
components of an electronic apparatus. A detailed finite
element modeling approach is used. This approach proves to
be an accurate predictor of the modal behaviour and an
effective analysis technique. An electromotive test was
performed to determine the stiffness of these components. The
plate and brick elements were used to represent the PCB. Then
the glue mode and the coupling mode respectively simulated
the solder joints on the PCB. It can be found that the data
when using coupling not glue to simulate the boundary
condition of solder joints in ANSYS is more approaching to
the results of measurement. The errors all of the five modes of
frequency using coupling are less than 7.1% comparing with
the results of experiment, while the errors of the glue mode is
too large because it results in the increase of structure rigidity
and exorbitant frequency. The predicted nature frequencies
and mode shapes are correlated with that of measurement
using MAC. It shows very good correlations although there
are some poor correlations.
This method of PCB modeling not only provides supports
for choosing the right shock absorber and optimises the shock
absorb area, but also provides reliable qualitative basis for
how to improve anti- vibration design of PCB. The modal
analysis of vibration for PCB has some reference values to
similar structures.
REFERENCES
[1] Eshleman, Ronald,L, Shock and Vibration Technology with Application
to Electrical Systems, A survey, NASA, 1972.
[2] Steinberg, Vibration Analysis for Electronic Equipment, Wiley, 1988.
[3] Pitarresi JM, Caletka DV, Caldwell R, Smith DE, The 'smeared' property
technique for the FE vibration analysis of printed circuit cards, Journal
of Electronic Packaging, vol.113, no.3, pp.250-7, Sept. 1991.
[4] Pitarresi JM, Modeling of printed circuit cards subject to vibration,
1990 IEEE International Symposium on Circuits and Systems, pp.2104-7
vol.3, 1990.
[5] Pitarresi JM. and Di Edwardo, Optimal Support Locations for Circuit
Cards Populated with Modules, ASME Winter Conference, 1991.
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