SUMMARY
PROFESSIONAL EXPERIENCE
Managed a group of 15 engineers who were responsible for developing and qualification of
semi-conductor packages to support communication and wireless products and chipsets. The
team was responsible for designing packages, developing signal integrity and reliability models,
qualifying the products and working with marketing and sales to provide new product data to
customers.
• Saved the company over twenty million dollars in packaging cost by qualifying a lower
cost package with fewer metal layers and fewer vias.
• Taught statistical process control and reliability to over 120 engineers and technicians
Received recognition from the company’s CEO for improving the statistical knowledge
for the Folsom engineering team.
• Managed a team that successfully resolved a bond pad delamination problem on one of
the most complex wire bond packages in the industry,
• Qualified new products at subcontractor sites and resolved all factory excursions.
• Performed regular process audits at factory sites and managed all outstanding process
audits.
• Reduced the incoming package and material cost by over ten million dollars in one year
by improving supplier yields.
• The team Implemented a statistical based qualification models that use mean time to fail
approach. This allowed the team to identify a higher level of early life failures which
resulted in 10 % reduction in customer returns.
• Reduced outgoing quality rejects rates by 5 % per year allowing the factory to receive a
Supplier Quality Award from IBM
EDUCATION
TRAINING