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In-House Rapid Prototyping

Product Catalog

Circuit Board Plotters


Laser Circuit Structuring
Through-Hole Plating
Multilayer Prototyping

New:at D104

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SMT/Finishing
LDS Prototyping
TechInfo

Questions about your Order?


In Need of Service and Support?
Here you will find all information related to sales and service.
Our competent staff are looking forward to assisting you.

LPKF Sales and Service


Europe (LPKF Headquarters)
Phone +49 (0) 5131-7095-0
Fax
+49 (0) 5131-7095-90

North-/Central America
Phone +1 (503) 454-4200
Fax
+1 (503) 682-7151

China
Phone
Sales +86-2223785318
Service +86-2223785328
Fax
+86-2223785398

Worldwide
LPKF representation
LPKF AG maintains a global sales
distribution network. Please see
page 134 for an overview of all
LPKF distributors.
For additional information please
visit our website at www.lpkf.com.

E-Mail

sales.rp@lpkf.com
support.rp@lpkf.com

Website www.lpkf.com

E-Mail

sales@lpkfusa.com
support@lpkfusa.com

Website www.lpkfusa.com

E-Mail

sales@lpkf.cn

Website www.lpkf.cn

Welcome to LPKF Rapid Prototyping


In this catalog you will find all that you need for Rapid Prototyping of printed circuit boards:
machines, tools, consumables, accessories and software. For the first time, systems and
consumables for LDS Prototyping have also been included: you can thus produce three-dimensional
molded interconnect devices in-house. The Technical Information appendix explains the individual
process steps and helps with tips and tricks for the practical use of LPKF systems.

Why in-house prototyping?


Because todays rapid technological progress means
prototyping can be a decisive factor in staying ahead
of the competition. Instead of waiting on external
suppliers, the prototyping is done in-house in a
time-saving fashion. It facilitates several cycles from
planning to the optimized layout. Security concerns
also play a role. With in-house prototyping, all drafts
remain securely within your company.
Production of high-quality circuit boards in your own
development department or laboratory is a decisive
advantage.

With LPKF products, one- or two-sided circuit boards,


multilayers, high-capacity circuits, RF and microwave
circuit boards, rigid or flexible circuit boards can be
produced. Now three-dimensional circuits can also be
created on (nearly) any plastic bodies offering exciting
new product options in electronics.

About LPKF
With more than 35 years of experience and many
customized solutions, LPKF is the market leader
worldwide in Rapid Prototyping, especially for PCBs.
More than 750 employees provide professional support
in sales and service around the globe.

Welcome to LPKF Rapid Prototyping

Table of Contents
Product Information
Circuit Board Plotters
Rapid PCB Prototyping
the Quicker Way to Create Circuit Boards
LPKF Circuit Board Plotters
LPKF ProtoMat S103
LPKF ProtoMat S63
LPKF ProtoMat S43
LPKF ProtoMat E33
LPKF ProtoMat D104
LPKF ProtoMat X60
LPKF Circuit Board Plotter Comparison
Options & Accessories
LPKF Drilling, Milling and Routing Tools
Consumables
LPKF CircuitPro The Intelligent Software Suite

3
4
6
8
10
12
14
16
18
19
23
27
31

Innovative Laser Technology


for Rapid PCB Prototyping
LPKF ProtoLaser S
LPKF ProtoLaser U3

35
36
38

Through-Hole Plating
LPKF ProConduct
LPKF Contac RS/LPKF MiniContac RS
LPKF EasyContac
LPKF ViaCleaner

41
42
44
46
47

Multilayer PCBs Produced In-House


LPKF MultiPress S

48
50

SMT Rapid PCB Prototyping


LPKF ProMask and LPKF ProLegend
LPKF ProtoPrint S and ProtoPrint S RP
LPKF ProtoPlace S
LPKF ProtoPlace BGA
LPKF ProtoFlow S and ProtoFlow S/N2
The LPKF E-Series
Additional Options for Through-Hole Plating,
Multilayer Production and SMT Prototyping

52
54
56
58
60
62
64

Table of Contents

66

LDS Prototyping
The LDS Process
LPKF ProtoPaint LDS
LPKF ProtoLaser 3D
LPKF ProtoPlate LDS
Information on the LDS Process and Components

71
72
74
76
78
80

Customer Testimonials

81

Specialist in Micromaterial Processing

82

TechInfo
Technical Information
Process Steps of PCB Prototyping
Basic Knowledge of Printed Circuit Boards
LPKF Software Intelligent Helper for Prototyping
Structuring and Machining PCBs
Laser Micromaterial Machining
PCB Structuring with the LPKF ProtoLaser S
An All-Purpose Tool: The LPKF ProtoLaser U3
Selecting the Mechanical Systems
for PCB Structuring
Multilayer: Fabricating and Laminating
Center-Punching, Drilling and Cutting-Out
Systems for Through-Hole Plating
LPKF ViaCleaner A Pinpoint Solution
Comparison of Through-Hole Plating Methods
Solder Resist and Screen Printing
Solder Paste Printing
SMD Assembly
Reflow Soldering
Applications
Growing with the Job: ProtoMat Upgrades
Three-Dimensional Molded Interconnect Devices

85
86
88
90
92
94
96
98
102
104
106
107
110
111
112
113
114
115
116
119
120

Technical Terms

126

Index

130

LPKF Worldwide

134

Legal Details

135

Circuit Board Plotters


Laser Circuit Structuring

Rapid PCB Prototyping the


Quicker Way to Create Circuit Boards
Fast development faster launch. With the rapid PCB Prototyping solutions from LPKF it is easy.
From structuring base materials, to generating complex multilayer designs in less than a day.

Through-Hole Plating

The cycle of a prototype (draft, production test and optimization) can be completed in just one

Structuring circuit boards

Versatile software

The LPKF ProtoMats are setting standards in precision,


flexibility and user-friendliness worldwide. These LPKF
PCB milling systems have proven virtually irreplaceable
for quick in-house production of circuit boards, whether
for individual parts of development projects or for small
series. They are ideally suited for high-performance,
analog, digital, RF and microwave applications.

All LPKF structuring systems are delivered with an


extensive software package, optimized for easy
operation, precision algorithms and quick results.
LPKF CircuitPro imports all current CAD data and
transmits the production data to the structuring
systems.

Made in Europe: For nearly four decades, LPKF circuit


board plotters have been regarded as the benchmark in
milling, drilling and contour milling of circuit boards.

Along with circuit board production in record time,


the LPKF systems have proven their versatility in a
wide variety of applications; enclosure, front panel,
aluminum and plastic depth engraving, depaneling of
assembled circuit boards, cutting and engraving of
plastic sheets and geometrically precise structuring of
RF boards on ceramics.

SMT/Finishing

Other applications

LDS Prototyping

For even more advanced methods of production, meet


our twins, circuit board laser etch structuring and
micromaterial processing with the LPKF ProtoLaser S
and ProtoLaser U3 compact laser systems which
are setting new benchmarks for quality, speed and
advanced material processing.

Multilayer

day with LPKF products.

The brand-new LPKF ProtoMat D104 offers the best


of both worlds: It works as a mechanical circuit board
plotter and comes with an additional UV laser for fine
structures.

TechInfo

Multilayer, through-hole plating


and assembly

Index

The LPKF circuit board plotters are remarkably


suited for rapid PCB Prototyping of multilayer boards.
Combined with a lamination press such as the
MultiPress S, and a through-hole plating
system, high-quality multilayer circuit
boards can be completed. Finished
designs can also be assembled with
the LPKF ProtoPlace S. The advantages
are especially seen in the development phase of
complex designs.
Rapid PCB Prototyping the Quicker Way to Create Circuit Boards

LPKF Circuit Board Plotters


In-House Development of PCB Prototypes and Small Batch
Production Designs
Quick, precise and simple circuit board plotters by LPKF have

Table of contents

been meeting these user requirements for more than 35 years.

LPKF ProtoMat S103

The latest generation offers growth potential: all ProtoMat series

LPKF ProtoMat S63

LPKF ProtoMat S43

10

LPKF ProtoMat E33

12

equipped. Three specialized systems complete the spectrum

LPKF ProtoMat D104

14

from the top down.

LPKF ProtoMat X60

16

circuit board plotters can be upgraded step-by-step until fully

LPKF Circuit Board Plotter Comparison 18


Options & Accessories

19

LPKF Drilling, Milling and Routing Tools 23


Consumables

LPKF Circuit Board Plotters

27

Circuit Board Plotters


Laser Circuit Structuring
Through-Hole Plating
Multilayer
SMT/Finishing

Top equipment: series or upgrade

The tool changer automatically switches tools during


production. This reduces set-up time and allows for
unattended operation. The automatic tool changer
features a built-in tool ramp. With this ramp the
ProtoMats automatically adjust the working depth
of the tools.

LDS Prototyping

Milling spindles with 40000, 60000 or 100000 rpm.

The optical fiducial recognition, used to accurately


determine the PCB position, is available for virtually
all circuit board plotters. The LPKF software
recognizes the fiducials and references the milling
head position accordingly.
Custom settings allow the built-in dispenser to apply
soldering paste.
The vacuum table secures the work piece, ensuring
a flat surface.

TechInfo

Features vary by series or model please refer to the


respective model for a complete list. For example:

Index

With the use of a laser tool the LPKF ProtoMat


D104 expands its application area in the ultra-fine
conductor range.

All LPKF circuit board plotters include system software to convert standard CAD data into optimized
production flows.

LPKF Circuit Board Plotters

LPKF ProtoMat S103


The Specialist for RF and Microwave Applications
Product:
LPKF ProtoMat S103
Part no.:
127410
Ordering info: See front sleeve

Applications
Milling/drilling 1- & 2-sided PCBs
Milling/drilling RF & microwave substrates
Multilayer PCBs up to 8 layers
Contour routing of circuit boards
Flexible and rigid-flex circuit milling
Front panels/sign engraving
Machining cut-outs in front panels
SMD stencil cutting
Housing production
Wave solder pallets
Depanelizing, reworking PCBs
Test adapter drilling
Inspection templates
Dispensing solder paste

High travel speed:


max. 150 mm/s (6/s)

The ProtoMat S103 is one of LPKFs top-of-the-line


circuit board plotters. The extensively equipped system
is suitable for all application areas including multilayer
and RF in FR4 18/18 Cu material it can achieve PCB
track widths up to 100 m. The high rotation speed and
precision ensures production of the latest generation
of PCBs. The pneumatic non-contact working depth
limiter allows substrates with delicate surfaces to be
machined.

Fully automated operation

The ProtoMat S103 is an indispensable tool for any


prototype or small batch production. Ease-of-use and
utmost reliability are the basis for cost-effective and
high-quality production.

Pneumatic non-contact working


depth limiter

Highest available speed (100000 rpm),


highest mechanical resolution (0.5 m)
and repeatability ( 0.001 mm)
Automatic 15-position tool changer
Automatic milling width adjustment

Optical fiducial recognition


Built-in vacuum table
Dispenser option

LPKF ProtoMat S103

Applications

Circuit Board Plotters

Features
2.5-dimensional operation with Z-axis
control

Laser Circuit Structuring

The sophisticated Z-axis drive makes the ProtoMat


S103 perfect for finishing front panels and housings as
well as depth milling microwave PCBs. Even machining
populated PCBs is no problem at all.

100000 rpm spindle motor


RF and microwave PCB

Dispensing

The ProtoMat S103 meets the highest standards


in geometry and accuracy for structuring RF and
microwave prototypes. Special carbide tools produce
straight sidewalls and reduce the penetration depth in
the substrate.

The built-in dispenser applies solder paste onto the


substrates fully automatically with minimum data
preparation.

Contour routing
and cut-outs

Dust extraction (Part no. 10033243)


Compressor incl. 50 l tank (Part no. 104863)
StatusLight (Part no. 10023555)
Measuring microscope (Part no. 10035579)

The S103 also routes


complex shapes and
cut-outs, or depanelizes
populated circuit
boards, housing parts
or front panels.

Multilayer

Options & accessories

Through-Hole Plating

The ProtoMat S103 is extremely fast and accurate with


a spindle speed of 100000 rpm, a max. travel speed
of 150 mm/s and a mechanical resolution of 0.5 m.
This ensures the accuracy required for drilling and
milling ultra fine structures especially for high-end
applications in the RF and microwave field.

SMT/Finishing

Other options and tools start on page 19.

127410

Max. material size and layout area (X/Y/Z)

229 mm x 305 mm x 35 mm/22 mm (9 x 12 x 1.4/0.9)*

Mechanical resolution (X/Y)

0.5 m (0.02 mil)

Repeatability

0.001 mm ( 0.04 mil)

Precision of front-to-back alignment

0.02 mm ( 0.8 mil)

Milling spindle

Max. 100000 rpm, software controlled

Tool change

Automatic, 15 positions

Milling width adjustment

Automatic

Tool holder

3.175 mm (1/8), automatic holder

Drilling speed

120 strokes/min

Travel speed (X/Y)

Max. 150 mm/s (6/s)

X/Y-drive, Z-drive

3-phase stepper motor, 2-phase stepper motor

Solder paste dispense rate

0.3 mm (0.011) (dot), 0.4 mm (0.015) (pad)

Dimensions (W x H x D)

670 mm x 540 mm x 840 mm (26.4 x 21.3 x 33)

Weight

60 kg (132 lbs)

TechInfo

Part no.

LDS Prototyping

Technical Specifications: LPKF ProtoMat S103

Power supply

100240 V, 5060 Hz, 450 W

Compressed air supply

6 bar (87 psi), 100 l/min (3.5 cfm)

Required accessories
* Value for Z without/with vacuum table

Index

Operating conditions

Exhaust, please refer to page 21


Technical specifications subject to change.

LPKF ProtoMat S103

LPKF ProtoMat S63


The All-Rounder for Rapid PCB Prototyping
Product:
LPKF ProtoMat S63
Part no.:
127411
Ordering info: See front sleeve

Applications
Milling/drilling 1- & 2-sided PCBs

High travel speed:


max. 150 mm/s (6/s)

Milling/drilling RF, microwave substrates


Multilayer PCBs up to 8 layers
Contour routing of circuit boards
Front panels/sign engraving
Machining cut-outs in front panels
SMD stencil cutting (vacuum table required)
Housing production
Depanelizing, reworking PCBs
Test adapter drilling
Inspection templates
Dispensing solder paste

Available upgrade kit:


ProtoMat S63 to S103
For more information about upgrades please see page 119 in the TechInfo.
The ProtoMat S63 is the ideal system for virtually
all in-house prototyping applications where speed
and security are crucial. Its also perfectly suited for
multilayer- and RF applications. The high rotational
speed ensures the fine structures of up to 100 m
required by many modern applications.
The extensive features make the S63 the perfect
addition to any development environment. The
precision and performance of this compact circuit
board plotter are the foundation for producing PCB
prototypes in just one day.

Fully automated operation


High speed (60000 rpm), highest
mechanical resolution (0.5 m) and
repeatability ( 0.001 mm)
Automatic 15-position tool changer
Automatic milling width adjustment
Optical fiducial recognition
Dispenser option
Upgradeable to ProtoMat S103

LPKF ProtoMat S63

Applications

Circuit Board Plotters

Features
Automatic tool change

Laser Circuit Structuring

Up to 15 tools are automatically changed during production.


This reduces set-up times and allows for unattended
production.

Automatic milling width adjustment


The conical milling cutters produce different insulation
channels depending on the penetration depth. The automatic
milling width adjustment maintains uniform PCB track widths.

The built-in dispenser applies solder paste onto the sub


strates fully automatically with minimum data preparation.

60000 rpm spindle motor


The 60000 rpm milling spindle ensures the shortest
machining times and highest accuracy.

Upgradeable to ProtoMat S103

Through-Hole Plating

Dispensing
Multilayer PCBs
When it comes to manufacturing multilayer prototype
PCBs the ProtoMat S63 is an indispensable tool. A
through-hole plating system (p. 44) and a multilayer
press (p. 50) complete the set-up.

Multilayer

Housings

Upgrade kit includes 100000 rpm spindle and


pneumatic non-contact working depth limiter
(Part no. 127702) and vacuum table.

Options & accessories


Dust extraction (Part no. 10033243)
Compressor incl. 50 l tank (Part no. 104863)
Vacuum table (Part no. 127688)
StatusLight (Part no. 10023555)

SMT/Finishing

In addition to machining
PCBs and signs the LPKF
ProtoMat S63 will also
machine, route-out and
depth mill materials
such as aluminum
and plastic, e.g. in housings.

Other options and tools start on page 19.

229 mm x 305 mm x 35 mm/22 mm (9 x 12 x 1.4/0.9)*

Mechanical resolution (X/Y)

0.5 m (0.02 mil)

Repeatability

0.001 mm ( 0.04 mil)

Precision of front-to-back alignment

0.02 mm ( 0.8 mil)

Milling spindle

Max. 60000 rpm, software controlled

Tool change

Automatic, 15 positions

Milling width adjustment

Automatic

Tool holder

3.175 mm (1/8)

Drilling speed

120 strokes/min

Travel speed (X/Y)

Max. 150 mm/s (6/s)

X/Y-drive, Z-drive

3-phase stepper motor, 2-phase stepper motor

Solder paste dispense rate

0.3 mm (0.011) (dot), 0.4 mm (0.015) (pad)

Dimensions (W x H x D)

670 mm x 540 mm x 840 mm (26.4 x 21.3 x 33)

Weight

58 kg (128 lbs)

TechInfo

127411

Max. material size and layout area (X/Y/Z)

Index

Part no.

LDS Prototyping

Technical Specifications: LPKF ProtoMat S63

Operating conditions
Power supply

100240 V, 5060 Hz, 450 W

Compressed air supply

For dispensing function only: 4 bar (58 psi), 50 l/min (1.76 cfm)

Required accessories
* Value for Z without/with vacuum table

Exhaust, please refer to page 21


Technical specifications subject to change.

LPKF ProtoMat S63

LPKF ProtoMat S43


Entry Level with Upgrade Options
Product:
LPKF ProtoMat S43
Part no.:
127686
Ordering info: See front sleeve

Applications
Milling/drilling 1- & 2-sided PCBs
Contour routing of circuit boards
Front panels/sign engraving
SMD stencil cutting

Available upgrade kits:


ProtoMat S43 to S63
ProtoMat S43 to S103
For more information about upgrades please see page 119 in the TechInfo.

The LPKF ProtoMat S43 is the entry-level model in the


ProtoMat S series. It can be upgraded in two steps to
have the same features as the top-of-the-line model,
the S103.

40000 rpm spindle speed, highest


mechanical resolution (0.5 m) and
repeatability ( 0.001 mm)

The precision and capacity of the compact system


ensure quick and easy PCB prototype production in
mere hours easily handling multiple cycles in one day.

Easy handling with quick-release tool holder

The S43 is the perfect entry into the world of


professional Rapid PCB Prototyping, especially for
occasional use or limited budgets.

10

LPKF ProtoMat S43

Acoustic cabinet for quiet operation

Many options available upgradeable to


S63 or S103

Applications

Circuit Board Plotters

Features
40000 rpm
milling spindle

Upgradeable to ProtoMat S63 and S103

Upgrading to the S103 includes a milling head with


100000 rpm spindle, pneumatic non-contact working
depth limiter, 15-position tool changer, automatic milling
width adjustment, camera, dispenser and vacuum table.

Options & accessories

Single- and double-sided PCBs on different


materials
The main area of application for the LPKF ProtoMat
S43 is fabricating high-quality professional FR4-based
PCB prototypes. The included software reliably and
accurately converts the original CAD data to PCB
production data.

Multilayer

Upgrading to the S63 includes a milling head with 60000


rpm spindle, camera, 15-position tool changer, automatic
milling width adjustment, dispenser and automatic width
adjustment.

Through-Hole Plating

Laser Circuit Structuring

At a maximum travel speed


of 150 mm per second
(approx. 6/s) and a spindle
speed of 40000 rpm the
S43 is the perfect entry-level
model for high-quality circuit
board prototypes produced
in-house.

SMT/Finishing

Vacuum table (Part no. 127688)


Optical fiducial recognition (Part no. 127689)
Dust extraction (Part no. 10033243)
StatusLight (Part no. 10023555)
Other options and tools start on page 19.

229 mm x 305 mm x 27 mm (9 x 12 x 1)

Mechanical resolution (X/Y)

0.5 m (0.02 mil)

Repeatability

0.001 mm ( 0.04 mil)

Precision of front-to-back alignment

0.02 mm ( 0.8 mil)

Milling spindle

Max. 40000 rpm, software controlled

Tool change

Manual, quick-release holder

Milling width adjustment

Manual

Tool holder

3.175 mm (1/8)

Drilling speed

100 strokes/min

Travel speed (X/Y)

Max. 150 mm/s (6/s)

X/Y-drive

3-phase stepper motor

Z-drive

2-phase stepper motor

Dimensions (W x H x D)

670 mm x 540 mm x 840 mm (26.4 x 21.3 x 33)

Weight

55 kg (121 lbs)

TechInfo

127686

Max. material size and layout area (X/Y/Z)

Index

Part no.

LDS Prototyping

Technical Specifications: LPKF ProtoMat S43

Operating conditions
Power supply
Required accessories

90240 V, 5060 Hz, 450 W


Exhaust, please refer to page 21

Technical specifications subject to change.


LPKF ProtoMat S43

11

LPKF ProtoMat E33


Extra Small, Easy to Use and Precise
Product:
LPKF ProtoMat E33
Part no.:
127687
Ordering info: See front sleeve

Applications
Milling/drilling 1- & 2-sided PCBs
Front panels/sign engraving

Hardly larger than a size A3 sheet (11.7 x 16.5):


the LPKF ProtoMat E33 presents a budget-priced and
compact circuit board plotter limited to machining
PCBs. This system is sturdy and intended for application
areas where time isnt crucial. Yet the LPKF ProtoMat
E33 doesnt need to feel ashamed when its structuring
results are compared with those of its bigger brothers.
The compact system will structure single- or doublesided PCBs, drill holes for through-hole plating,
mill individual units from the base material and
also engrave front plates of housings. The powerful
software included with the machine effectively
supports the user during the machining process.
The E33 is the perfect introduction to printed
circuit boards for training or limited budgets,
when structuring without wet chemistry.

12

LPKF ProtoMat E33

33000 rpm spindle speed,


mechanical resolution 0.8 m and
repeatability 0.005 mm
Easy-to-use tool holder
Includes powerful LPKF software
package for data transfer
Cost-effective introduction to PCB
structuring

Applications

Manual tool holder

Single- and double-sided PCBs on


different materials

Like all ProtoMats each ProtoMat E33 is carefully


calibrated at the LPKF factory. This ensures it will
produce the finest structures in any common material.
With a maximum travel speed of 60 mm per second
(approx. 2/s) and a spindle speed of 33000 rpm
the E33 is the perfect entry-level model for in-house
prototyping.

Multilayer

33000 rpm spindle speed

The LPKF ProtoMat E33 is mainly used to produce


high-quality, FR4-based PCB prototypes. The software
reliably and accurately converts the original CAD data
into the respective circuitry layout.

Front panels and signs


The LPKF ProtoMat E33 engraves front panels and
signs with extraordinary precision. Use for materials
such as plastic, plexiglas, aluminum, brass and many
more.

SMT/Finishing

All common drilling and milling tools are quickly and


easily ready for use.

Max. material size and layout area (X/Y/Z)

229 mm x 305 mm x 10 mm (9 x 12 x 0.4)

Mechanical resolution (X/Y)

0.8 m (0.04 mil)

Repeatability

0.005 mm ( 0.2 mil)

Precision of front-to-back alignment

0.02 mm ( 0.8 mil)

Milling spindle

Max. 33000 rpm, software controlled

Tool change

Manual

Milling width adjustment

Manual

Tool holder

3.175 mm (1/8)

Drilling speed

100 holes/min

Travel speed (X/Y)

Max. 60 mm/s (2/s)

X/Y-drive

2-phase stepper motor

Z-drive

2-phase stepper motor

Dimensions (W x H x D)

370 mm x 300 mm x 450 mm (14.6 x 11.8 x 17.7)

Weight

15 kg (33 lbs)

TechInfo

127687
LDS Prototyping

Technical Specifications: LPKF ProtoMat E33


Part no.

Through-Hole Plating

Laser Circuit Structuring

Circuit Board Plotters

Features

Power supply
Required accessories

Index

Operating conditions
90240 V, 5060 Hz, 450 W
Exhaust, please refer to page 21

Technical specifications subject to change.

LPKF ProtoMat E33

13

LPKF ProtoMat D104


Fine Pitch and Highest Precision
Product:
LPKF ProtoMat D104
Part no.:
10030011
Ordering info: See front sleeve

Applications
Milling/drilling 1- & 2-sided PCBs
Milling/drilling RF & microwave substrates
Multilayer PCBs up to 8 layers
Contour routing of circuit boards
Laser structuring of ultra-fine conductor areas
Flexible and rigid-flex circuit milling
Front panels/sign engraving
Machining cut-outs in front panels
Structuring ceramic materials
SMD stencil cutting
Wave solder pallets
Depanelizing, reworking PCBs
Test adapter drilling
Inspection templates

Integrated UV laser for ultrafine conductor structuring

The LPKF ProtoMat D104 is an advanced PCB milling


system improving upon the proven LPKF ProtoMat
design, with a maximum spindle speed of 100000 rpm,
15 position automatic tool exchange with light sensor
used to set the depth of cut for each tool. True Fiducial
Alignment is also included and a repeat accuracy of
1 m is provided with this machine. As a new addition,
the D104 includes an integrated UV laser which can
produce circuit track widths and spaces of just 50
m/15 m without mechanically stressing the material.

Fully automated operation

The highly developed LPKF CircuitPro software decides


when the precise laser or the faster mechanical tools
are used. The laser can also simulate conventional
contours to ensure an ideal geometry of conductive
traces, e.g., for RF circuits.

Non-contact working depth limiter

Highest available speed (100000 rpm),


highest mechanical resolution (0.3 m) and
repeatability ( 0.001 mm)
15 tools and UV laser
Automatic tool changer
Contactless tool setting (depth/milling width)
Integrated measuring camera/vision system
Optical fiducial recognition
Built-in vacuum table
UV laser tool for highly precise structuring

14

LPKF ProtoMat D104

Applications

Circuit Board Plotters

Features
Combines mechanical tools and laser

Laser Circuit Structuring

The LPKF ProtoMat D104 automatically chooses the


optimal tool. A protective hood integrated on the
laser ensures laser class 1 in operation. In addition, it
improves exhausting of the ablation debris.

Milling spindle, 100000 rpm

Fine-focus UV laser

Ultra-fine structures on ceramic carrier material. No tool wear due

Pitch: 65 m (50 m traces, 15 m spacing). With a


focused beam of only 15 m, the laser tool is especially
suited for contact fields of highly integrated circuits and
for RF applications.

to use of laser

Through-Hole Plating

A high rotary spindle speed increases the processing


speed and precision. It reduces the mechanical stress
and allows structuring of sensitive substrates.

Vacuum table

Multilayer

The integrated table holds rigid and flexible materials


securely on the working surface.

Other options and tools start on page 19.

HDI board with extremely fine structures such as ball grid array or
SMT/Finishing

chip scale packages, incl. holes and cutout with one system

10030011

Max. material size and layout area (X/Y/Z)

305 mm x 229 mm x 10 mm (12 x 9 x 0.4)

Mechanical resolution (X/Y)

0.3 m (0.01 mil)

Repeatability

0.5 m (0.02 mil)

Milling spindle

Max. 100000 rpm, software controlled

Tool change

Automatic, 15 positions

Milling width adjustment

Automatic

Tool holder

3.175 mm (1/8)

Drilling speed

120 strokes/min

Travel speed (X/Y)

Max. 100 mm/s (3.7/s)

X/Y-drive

3-phase stepper motor

Z-drive

2-phase stepper motor

Dimensions (W x H x D)

660 mm x 700 mm x 870 mm (26 x 27.6 x 34.3)

Weight

99 kg (218.3 lbs)

TechInfo

Part no.

LDS Prototyping

Technical Specifications: LPKF ProtoMat D104

Power supply

85/260 V, 5060 Hz, 440 W

Compressed air supply

6 bar (87 psi), 100 l/min (3.5 cfm)

Required accessories

Index

Operating conditions

Exhaust, please refer to page 21

Technical specifications subject to change.

LPKF ProtoMat D104

15

LPKF ProtoMat X60


Big in Rapid PCB Prototyping
Product:
LPKF ProtoMat X60
Part no.:
109643
Ordering info: See front sleeve

Applications
Milling/drilling 1- & 2-sided PCBs
Multilayer PCBs up to 8 layers
Contour routing circuit boards
Front panels/sign engraving
Machining cut-outs in front panels
SMD stencil cutting
Depanelizing

530 mm (20.8)

Inspection templates

650 mm (25.6)

Specifically for
large substrates

The LPKF ProtoMat X60 is the pro for machining large


substrates. Despite the large working space it offers
the stability, speed and precision LPKF machines are
known for. It features a non-contact, pneumatic depth
working limiter for delicate substrates.

For large material sizes up to


650 mm x 530 mm (25.5 x 20.8)
Spindle speed up to 60000 rpm,
mechanical resolution 1 m,
repeatability 0.001 mm
Optical fiducial recognition
Pneumatic non-contact working depth
limiter
Reliable, solid technology

16

LPKF ProtoMat X60

Circuit Board Plotters

Applications

Maximum material size

60000 rpm spindle motor


The ProtoMat X60 delivers superior precision: the
mechanical resolution of the ProtoMat X60 yields up
to 1 m (0.04 mil). The circuit board plotter is ideal for
producing fine structures in any material including RF and
microwave PCBs. The powerful 60000 rpm spindle motor
makes the X60 the first choice for Rapid PCB Prototyping
large, high-quality PCBs.

Non-contact working depth limiter


The pneumatic non-contact working depth limiter glides
across the surface of the base material on an air cushion.
Only the tool touches the base material for machining.

Options & accessories

The LPKF ProtoMat X60 is a cost-effective and flexible


option in utilizing production lines to full capacity, for
example when depanelizing unpopulated PCBs. Even
complex contours, cut-outs and other routings can
easily be programmed.

SMT/Finishing

Dust extraction (Part no. 10033243)


Compressor incl. 50 l tank (Part no. 104863)
Brush head (Part no. 113815 plus 109688
[micrometer screw])

Through-Hole Plating

Laser Circuit Structuring

The ProtoMat X60 features an extended layout area of


650 mm x 530 mm (25.6 x 20.8) and is ideal for large
PCBs, antennas and depanelizing, but also for engraving
plastics and soft metals. The ProtoMat X60 can quickly
and easily engrave or mill 19 front plates.

Multilayer

Features

Other options and tools start on page 19.

Max. material size and layout area (X/Y/Z)

650 mm x 530 mm x 14 mm (25.6 x 20.8 x 0.55)

Mechanical resolution (X/Y)

1 m (0.04 mil)

Repeatability

0.001 mm ( 0.04 mil)

Precision of front-to-back alignment

0.02 mm ( 0.8 mil)

Milling spindle

Max. 60000 rpm, software controlled

Tool change

Manual, quick-change holder

Milling width adjustment

Manual

Tool holder

3.175 mm (1/8)

Drilling speed

120 strokes/min

Travel speed (X/Y)

Max. 100 mm/s (3.94/s)

X/Y-drive

3-phase stepper motor

Z-drive

Pneumatic, 14 mm (0.55)

Machine baseplate

Al-Plan precision plate

Dimensions (W x H x D)

750 mm x 420 mm x 900 mm (29.5 x 16.5 x 35.4)

Weight

69 kg (151.8 lbs)

TechInfo

109643

Index

Part no.

LDS Prototyping

Technical Specifications: LPKF ProtoMat X60

Operating conditions
Power supply

115/230 V, 5060 Hz, 300 W

Compressed air supply

6 bar (87 psi), 100 l/min (3.5 cfm)

Required accessories
Technical specifications subject to change.

Exhaust, please refer to page 21


LPKF ProtoMat X60

17

LPKF Circuit Board Plotter Comparison


Performance and features
Feature

ProtoMat
S103

S63

S43

E33

D104

X60

Max. material size and layout area (X/Y)

3-Phase SM

3-Phase SM

3-Phase SM

2-Phase SM

3-Phase SM

3-Phase SM

mm

229 x 305

229 x 305

229 x 305

229 x 305

229 x 305

650 x 530

inch

9 x 12

9 x 12

9 x 12

9 x 12

9 x 12

25.6 x 20.8

0.5

0.5

0.5

0.8

0.3

mil

0.02

0.02

0.02

0.04

0.01

0.04

150

150

150

60

100

100

mm

0.001

0.001

0.001

0.005

0.001

0.001

mil

0.04

0.04

0.04

0.2

0.04

0.04

mm

0.02

0.02

0.02

0.02

0.02

mil

0.8

0.8

0.8

0.8

0.8

Max. material size and layout area (Z)

Stepper motor

Stepper motor

Stepper motor

Stepper motor

Stepper motor

Pneumatic

mm

22

35

27

10

10

14

inch

0.9

1.4

0.4

0.39

0.55

0.2

0.2

0.4

0.85

0.2

mil

0.008

0.008

0.016

0.033

0.008

25

25

25

20

25

(x1000 rpm)

100

60

40

33

100

60

Drilling speed strokes/min

120

120

100

100

120

120

Temperature sensor

Dispenser

Optional

Software LPKF CircuitPro

Full

Full

Lite

Lite

Full

Full

Automatic tool change

15

15

Optional

15

Vacuum table

Optional

Optional

Optical fiducial recognition

Optional

Optional

Brush head

Optional

Acoustic cabinet

Automatic milling width adjustment

Optional

Working depth limiter

Pneumatic

Mechanical

Mechanical

Mechanical

Pneumatic

Pneumatic

StatusLight

Optional

Optional

Optional

Ports

USB

USB

USB

USB

USB

RS-232

mm

670 x 840

670 x 840

670 x 840

370 x 450

660 x 870

750 x 900

inch

26.4 x 33

26.4 x 33

26.4 x 33

14.6 x 17.7

26 x 34.3

29.5 x 35.4

kg

60

58

55

15

99

69

lbs

132

127

121

33

218.3

151.8

Compressed air supply required?

For operation

For dispensing

Not required

For operation

For operation

bar

With upgrade to
S63 or S103

psi

87

58

87

87

l/min

100

100

100

cfm

3.5

1.76

3.5

3.5

Mechanical resolution (X/Y)

Travel speed (X/Y)


(mm/s)
Repeatability

Precision of front-to-back alignment

Mechanical resolution (Z)

Travel speed (Z)


(mm/s)
Spindle speed

Footprint (W x D)

Weight

Upgrade (see also page 119)

= Standard

X = Not available

S634 S103

LPKF Circuit Board Plotter Comparison

S434 S103

Optional = Optionally available for upgrade/accessories

All specifications are subject to technical modifications.


18

S434 S63

Circuit Board Plotters

Advanced functionality
Quality components
High-quality construction

SMT/Finishing

Multilayer

Through-Hole Plating

Laser Circuit Structuring

Perfectly matched

LDS Prototyping

Options & Accessories for


LPKF Circuit Board Plotters
The capabilities of LPKF circuit board plotters and other LPKF systems can be upgraded with
long life for all upgrades. The accessories can quickly and easily be installed on-site. The ProtoMat S

Index

series circuit board plotters can be upgraded to turn an entry-level system into a high-end model.

TechInfo

accessories and options. High-quality materials and precise machining ensure high reliability and a

Ordering info: See front sleeve.

Options & Accessories

19

Options
Upgrade kits
The LPKF ProtoMat S43 and S63 circuit board plotters can be upgraded to
a S103 high-end system at any time. All thats needed is the corresponding
upgrade kit.
Upgrade

Part no.

ProtoMat S43/S63

Upgrade ProtoMat
S43 to S63

127700

Milling head S63 with tool change bar (automatic


tool change and milling width adjustment), camera,
dispenser with pneumatic components and software
upgrade LPKF CircuitPro Full

Upgrade ProtoMat
S43 to S103

127701

Milling head S103 with pneumatic non-contact


working depth limiter, tool change bar (automatic
tool change and milling width adjustment), camera,
dispenser with pneumatic components, vacuum table
and software LPKF CircuitPro Full

Upgrade ProtoMat
S63 to S103

127702

Milling head S103 with pneumatic non-contact


working depth limiter (milling head S103 without
camera, already installed on S63) and vacuum table.

Optical fiducial recognition


Referencing a PCB with optical fiducial recognition is more precise and
significantly faster than front-to-back alignment making it virtually
indispensable for structuring multilayer boards. The LPKF softwaresupported camera automatically locates fiducials, then determines the
material position. The camera system further provides a direct measuring
function. The camera of the S series merely requires a computer with a
USB 2.0 port, the ProtoMat X60 requires a Windows computer with an
empty PCI slot.
Optical fiducial recognition

ProtoMat S43

ProtoMat X60

Part no.

127689

114487

Vacuum table
The vacuum table secures the work piece tightly across the entire work
surface and prevents the substrate from buckling. The use of a vacuum table
allows flexible and rigid-flex PCBs to be machined.
Vacuum table

ProtoMat S43/S63

Part no.

127688

20

Options & Accessories

Circuit Board Plotters

Accessories
Dust extraction

ProtoMat S + E, X60

ProtoL. S + U3, ProtoM. D104

Part no.

10033243

124391

Vacuum pressure

Max. 22500 Pa

Max. 21000 Pa

Air flow rate

241 m3/hour (142 cfm)

320 m3/hour (188 cfm)

Power consumption

800 W (230 V) or
960 W (120 V)

1.6 kW (230 V, 50/60 Hz)

Dimensions
(W x H x D)

250 mm x 300 mm x 350 mm


(10 x 12 x 14)

365 mm x 1245 mm x 501 mm


(14.4 x 49 x 19.7)

Acoustic pressure

50 dB(A)

Approx. 65 dB(A)

Absolute filter

HEPA filter

HEPA filter

Remote control

Software controlled

Software controlled

Through-Hole Plating

Dust extraction

Laser Circuit Structuring

The LPKF dust extraction with absolute filter ensures a clean workspace
no fibers, no shavings, no fine dust. The built-in AutoSwitch automatically
turns the vacuum on and off. This ensures safety and an extended vacuum
life while eliminating unnecessary noise when the machine is not in
operation.

Multilayer

All specifications are subject to technical modifications.

Measuring microscope
The LPKF measuring microscope with its 100x magnification and metric
scale facilitates setting the isolation widths and quality control.

Part no.

SMT/Finishing

Measuring microscope
10035579

Precision ring setter

Precision ring setter

ProtoMat S43/E33

Part no.

116698

LDS Prototyping

The LPKF precision ring setter, consisting of an adjustment unit with


measuring microscope, accurately places distance rings on the tool.
The tools can then be used with ease without the need for readjustments.

TechInfo

Brush head (for ProtoMat X60 only)

Brush head

ProtoMat X60

Part no.

113815 (plus 109688 [micrometer screw])

Index

The brush head, used primarily for reworking populated PCBs, maintains
low-pressure for dust extraction. The workspace is kept dust-free without
damaging the placed components.

Options & Accessories

21

Accessories (continued)
Compressor
The LPKF compressors ensure a constant, reliable supply of compressed air
for LPKF systems using compressed air supply.
Compressor

Compressor 24l

Compressor 50l

Compressor 60l*

Part no.

10032687

104863

122805

Tank size

24 liter

50 liter

60 liter

Max.
pressure

8 bar (116 psi)

10 bar (145 psi)

10 bar (145 psi)

Output

50 l/min (1.8 cfm)

165 l/min (5.8 cfm)

240 l/min (8.5 cfm)

Outside dims.
(W x H x D)

400 x 540 x 400 mm


(15.7 x 21.3 x 15.7)

1000 x 770 x 390 mm


(39.4 x 30.3 x 15.4)

970 x 770 x 480 mm


(38 x 30 x 19)

Weight

29 kg (64 lbs)

56 kg (123.2 lbs)

90 kg (198.4 lbs)

Acoustic
noise at a
distance of
4 m (157.5)

40 dB(A)

68 dB(A)

83 dB(A)

LPKF ProtoPlace S

LPKF ProtoMat S103


LPKF ProtoMat X60

LPKF ProtoLaser S & U3


LPKF ProtoMat D104

Recommended for

All specifications are subject to technical modifications.

*incl. refrigerant-type dryer

StatusLight
The LPKF StatusLight indicates the LPKF ProtoMat operating status.
This allows a constant monitoring of the ProtoMat in large production halls
without the need for operating personnel to be in close proximity.

StatusLight

ProtoMat S-Series

Part no.

10023555

Adjustment tool (ProtoLaser S&U3)


This precision tool set is helpful for adjusting the work bench and laser.
Adjustment tool

ProtoLaser S & U3

Part no.

118005

22

Options & Accessories

Multilayer

Through-Hole Plating

Laser Circuit Structuring

Developed Specifically for LPKF Circuit Board Plotters

Circuit Board Plotters

LPKF Drilling, Milling and Routing Tools

LPKFs commitment to the highest-quality


components extends to every piece of tooling.
The drill and router bits developed specifically for
LPKF are premium carbide tools. They ensure long
life, precise cuts and clean milling edges.

SMT/Finishing

The tools are divided into two main groups:


Surface machining tools with 36 mm (1.42) total
length for surface work (cutter and end mills) and
penetrating tools with 38 mm (1.5) total length
for working through the base material (spiral drills,
contour router and end mills).

LDS Prototyping

Conical tools

Universal Cutter

Cylindrical tools

End Mill (RF)

End Mill

Tools (1/8 shaft)


Penetrating tools
(l = 38 mm/1.50)

End Mill (long)

Contour Router

Spiral Drills

Index

Surface machining tools


(l = 36 mm/1.42)

Micro Cutter

TechInfo

Ordering info: See front sleeve.

Drilling, Milling and Routing Tools

23

Micro Cutter/Fine-Line Milling Tool 1/8


Conical custom-designed tool with orange distance ring.
1

Part no.

Length, milling width

Application

115836

36 mm, 0.100.15 mm (46 mil)

For fine isolation tracks on 18 m


thick Cu.

Part no.

Length, milling width

Application

115835

36 mm, 0.20.5 mm (820 mil)

For milling different isolation track


widths in any copper-plated base
material.

Part no.

Length, milling width

Application

115832
115833
115834

36 mm, d = 0.15 mm (6 mil)


36 mm, d = 0.25 mm (10 mil)
36 mm, d = 0.40 mm (16 mil)

Finest isolation tracks in RF


applications.

0.10.15 mm
(46 mil)
copper layer

base material

Universal Cutter 1/8


Conical custom-designed tool with orange distance ring.
2

0.20.5 mm
(820 mil)

base material

End Mill (RF) 1/8


Cylindrical custom-designed tool with blue distance ring.
3

0.150.4 mm
(616 mil)

End Mill 1/8


Cylindrical custom-designed tool with violet distance ring.
4

isolation
0.83.0 mm
(31118 mil)

engraving
0.83.0 mm
(31118 mil)

Part no.

Length, milling width

Application

115839
115840
129100*
129101*

36 mm, d=0.80 mm (31 mil)


36 mm, d=1.00 mm (39 mil)
36 mm, d=2.00 mm (79 mil)
36 mm, d=3.00 mm (118 mil)

For wider isolation tracks, rub-out


areas and engraving aluminum front
panels.

aluminum

* Shaft 25 mm (984 mil)


24

Drilling, Milling and Routing Tools

Cylindrical custom-designed tool with light green distance ring.


5

12 mm
(3979 mil)

12 mm
(3979 mil)

aluminum

dieletric
material

Part no.

Length, milling width

Application

115837
129102*

38 mm, d = 1.00 mm (39 mil)


38 mm, d = 2.00 mm (79 mil)

For cutting aluminum and routing


soft base materials for RF and
microwave applications.

* Shaft 25 mm (984 mil)

Through-Hole Plating

Contour router 1/8


Cylindrical custom-designed tool with yellow distance ring.
6

Part no.

Length, milling width

Application

115844
129099*

38 mm, d = 1.00 mm (39 mil)


38 mm, d = 2.00 mm (79 mil)

For milling inner and outer contours


and holes > 2.4 mm (> 94 mil).

Laser Circuit Structuring

Circuit Board Plotters

End Mill long 1/8

routing
12 mm
(3979 mil)

Multilayer

* Shaft 25 mm (984 mil)

Spiral Drill 1/8

min. 0.2 mm
(8 mil)

max. 3.0 mm
(118 mil)

Length, milling width

Application

115846
115847
115848
115849
115850
115851
115852
115853
115854
115855
115856
115857
115858
115859
115860
115861
115862
115863
115864
115865
115866
115867
115868
115869
115870
115871

38 mm, d = 0.20 mm (8 mil)


38 mm, d = 0.30 mm (12 mil)
38 mm, d = 0.40 mm (16 mil)
38 mm, d = 0.50 mm (20 mil)
38 mm, d = 0.60 mm (24 mil)
38 mm, d = 0.70 mm (28 mil)
38 mm, d = 0.80 mm (31 mil)
38 mm, d = 0.85 mm (33 mil)
38 mm, d = 0.90 mm (35 mil)
38 mm, d = 1.00 mm (39 mil)
38 mm, d = 1.10 mm (43 mil)
38 mm, d = 1.20 mm (47 mil)
38 mm, d = 1.30 mm (51 mil)
38 mm, d = 1.40 mm (55 mil)
38 mm, d = 1.50 mm (59 mil)
38 mm, d = 1.60 mm (63 mil)
38 mm, d = 1.70 mm (67 mil)
38 mm, d = 1.80 mm (71 mil)
38 mm, d = 1.90 mm (75 mil)
38 mm, d = 2.00 mm (79 mil)
38 mm, d = 2.10 mm (83 mil)
38 mm, d = 2.20 mm (87 mil)
38 mm, d = 2.30 mm (91 mil)
38 mm, d = 2.40 mm (94 mil)
38 mm, d = 2.95 mm (116 mil)
38 mm, d = 3.00 mm (118 mil)

For drill holes < 2.4 mm (< 94 mil).

TechInfo

LDS Prototyping

Part no.

Index

SMT/Finishing

Cylindrical tool with green distance ring.

Drilling, Milling and Routing Tools

25

Tool set with 1/8 shaft and distance rings


For all LPKF ProtoMat models. Includes tools with pressed-on distance rings.
Part no.

Contents

129103

10x Universal cutter 1/8, 36 mm (1.4), 0.20.5 mm (820 mil)


2x Micro cutter 1/8, 36 mm (1.4), 0.100.15 mm (46 mil)
1x End mill 1/8, 36 mm (1.4), d = 0.8 mm (31 mil)
2x End mill 1/8, 36 mm (1.4), d = 1.00 mm (39 mil)
2x End mill 1/8, 36 mm (1.4), d = 2.00 (79 mil)
1x End mill long 1/8, 38 mm (1.5), d = 1.00 mm (39 mil)
1x End mill long 1/8, 38 mm (1.5), d = 2.00 (79 mil)
2x Contour router 1/8, 38 mm (1.5), d = 1.00 (39 mil)
2x Contour router 1/8, 38 mm (1.5), d = 2.00 (79 mil)
2x Spiral drill 1/8, 38 mm (1.5), d = 0.40 (16 mil)
2x Spiral drill 1/8, 38 mm (1.5), d = 0.50 (20 mil)
2x Spiral drill 1/8, 38 mm (1,5), d = 0.60 (24 mil)
2x Spiral drill 1/8, 38 mm (1.5), d = 0.70 (28 mil)
2x Spiral drill 1/8, 38 mm (1.5), d = 0.80 (31 mil)
2x Spiral drill 1/8, 38 mm (1.5), d = 0.90 (35 mil)
2x Spiral drill 1/8, 38 mm (1.5), d = 1.00 (39 mil)
1x Spiral drill 1/8, 38 mm (1.5), d = 1.20 (47 mil)
1x Spiral drill 1/8, 38 mm (1.5), d = 1.40 (55 mil)
2x Spiral drill 1/8, 38 mm (1.5), d = 1.50 (59 mil)
1x Spiral drill 1/8, 38 mm (1.5), d = 1.60 (63 mil)
1x Spiral drill 1/8, 38 mm (1.5), d = 1.80 (71 mil)
2x Spiral drill 1/8, 38 mm (1.5), d = 2.00 (79 mil)
2x Spiral drill 1/8, 38 mm (1.5), d = 3.00 (118 mil)

RF and microwave tool set with distance rings


Part no.

Contents

116394

Tools with distance rings:


5x End mill (RF) 1/8, 36 mm, d = 0.25 mm (10 mil)
3x End mill (RF) 1/8, 36 mm, d = 0.40 mm (16 mil)
3x End mill (RF) 1/8, 36 mm, d = 0.15 mm (6 mil)
5x End mill 1/8, 36 mm, d = 1.00 mm (39 mil)
2x End mill 1/8, 36 mm, d = 2.00 mm (79 mil)
2x End mill 1/8, 38 mm, d = 2.00 mm (79 mil)

Please note:
LPKF recommends using only original LPKF tools and assumes no warranty for machine or secondary failures resulting
from the use of non-LPKF tools. All specifications are subject to technical modifications.

26

Drilling, Milling and Routing Tools

Circuit Board Plotters


Laser Circuit Structuring
Through-Hole Plating
Multilayer
SMT/Finishing
LDS Prototyping

Consumables for
LPKF Circuit Board Plotters
LPKF offers only high-quality consumables. From copper-clad base materials to cleaning pads or
custom adhesive tape, LPKF guarantees first-class product quality because a high-quality end

Index

TechInfo

product starts with the basic raw material.

Ordering info: See front sleeve.

Consumables

27

Starter sets (for initial ProtoMat set-up)


LPKF starter sets include an extensive assortment of work materials, tools, and other accessories needed for
quick set-up. We offer customized starter sets for each circuit board plotter.
LPKF ProtoMat S103
Part no.

Contents

122159

For use with vacuum table: 2 x Sinter backing plate white 315 mm x 239 mm x 5 mm (12.4 x 9.4 x 0.2)

Also included:

10 x Base material FR4, 229 mm x 305 mm (9 x 12), 0/35 m (predrilled)


5 x Base material FR4, 229 mm x 305 mm (9 x 12), 35/35 m (predrilled)
5 x Base material FR4, 229 mm x 305 mm (9 x 12), 18/18 m (predrilled)
5 x Micro cutter with 1/8 distance ring, 36 mm (1.4), d = 0.10.15 mm (46 mil)
3 x End mill (RF) with 1/8 distance ring, 36 mm (1,4), d = 0.15 mm (6 mil)
10 x End mill (RF) with 1/8 distance ring, 36 mm (1.4), d = 0.25 mm (10 mil)
3 x End mill (RF) with 1/8 distance ring, 36 mm (1.4), d = 0.40 mm (16 mil)
5 x End mill with 1/8 distance ring, 36 mm (1.4), d = 1.00 (39 mil)
2 x End mill with 1/8 distance ring, 36 mm (1.4), d = 2.00 (79 mil)
2 x End mill with 1/8 distance ring, 38 mm (1.5), d = 2.00 (79 mil)
1 x Custom adhesive tape, 3 x board cleaning pad
1 x Tool set with 1/8 shaft and distance rings (Part no. 129103, see page 26 for contents)

LPKF ProtoMat S63


Part no.

Contents

115791

For use without vacuum table: 10 x Drill underlay material 229 x 305 mm (9 x 12), d = 2 mm (0.08) (predrilled)

122157

For use with vacuum table: 2 x Sinter backing plate white 315 mm x 239 mm x 5 mm (12.4 x 9.4 x 0.2)

Also included
in both sets:

10 x Base material FR4, 229 mm x 305 mm (9 x 12), 0/35 m (predrilled)


5 x Base material FR4, 229 mm x 305 mm (9 x 12), 35/35 m (predrilled)
5 x Base material FR4, 229 mm x 305 mm (9 x 12), 18/18 m (predrilled)
5 x Micro cutter with 1/8 distance ring, 36 mm (1.4), d = 0.10.15 mm (46 mil)
5 x End mill (RF) with 1/8 distance ring, 36 mm (1.4), d = 0.25 mm (10 mil)
1 x Custom adhesive tape, 3 x circuit board cleaning pad
1 x Tool set with 1/8 shaft and distance rings (Part no. 129103, see page 26 for contents)

LPKF ProtoMat S43


Part no.

Contents

117717

For use without vacuum table: 10 x Drill underlay material 229 x 305 mm (9 x 12), d = 2 mm (0.08) (predrilled)

122158

For use with vacuum table: 2 x Sinter backing plate white 315 mm x 239 mm x 5 mm (12.4 x 9.4 x 0.2)

Also included
in both sets:

10 x Base material FR4, 229 mm x 305 mm (9 x 12), 0/35 m (predrilled)


5 x Base material FR4, 229 mm x 305 mm (9 x 12), 35/35 m (predrilled)
1 x Custom-designed adhesive tape, 3 x board cleaning pad
1 x Tool set with 1/8 shaft and distance rings (Part no. 129103, see page 26 for contents)

LPKF ProtoMat D104


Part no.

Contents

10035172

For use with vacuum table: 1 x Sinter backing plate white 315 mm x 239 mm x 5 mm (12.4 x 9.4 x 0.2)

Also included:

5 x Base material FR4, 229 mm x 305 mm (9 x 12), 18/18 m (predrilled)


5 x Base material FR4, 229 mm x 305 mm (9 x 12), 35/35 m (predrilled)
5 x Micro cutter with 1/8 distance ring, 36 mm (1.4), d = 0.10.15 mm (46 mil)
3 x End mill (RF) with 1/8 distance ring, 36 mm (1,4), d = 0.15 mm (6 mil)
10 x End mill (RF) with 1/8 distance ring, 36 mm (1.4), d = 0.25 mm (10 mil)
3 x End mill (RF) with 1/8 distance ring, 36 mm (1.4), d = 0.40 mm (16 mil)
5 x End mill with 1/8 distance ring, 36 mm (1.4), d = 1.00 (39 mil)
2 x End mill with 1/8 distance ring, 36 mm (1.4), d = 2.00 (79 mil)
2 x End mill with 1/8 distance ring, 38 mm (1.5), d = 2.00 (79 mil)
1 x Custom adhesive tape, 3 x board cleaning pad
1 x Tool set with 1/8 shaft and distance rings (Part no. 129103, see page 26 for contents)

LPKF ProtoMat X60: Upon request

28

Consumables

Please note: tool set contents may vary by country.


Please contact your local distributor for details (see page 134).
All specifications are subject to technical modifications.

Contents

127696

10 x Drill underlay material, 229 mm x 305 mm, (9 x 12), d = 2 mm (predrilled)


10 x Base material, 229 mm x 305 mm, (9 x 12), 0/35 m (predrilled)
5 x Base material FR4, 229 mm x 305 mm, (9 x 12), 35/35 m (predrilled)
1 x Custom adhesive tape
3 x Board cleaning pad
1 x Tool set with 1/8 shaft and distance rings (Part no. 129103, see page 26 for contents)

Laser Circuit Structuring

Part no.

Circuit Board Plotters

LPKF ProtoMat E33

Multilayer sets for multilayer PCB production

121103

4-layer multilayer set for MultiPress S,


S series/electroplating

Material size: 229 mm x 305 mm (9 x 12)


Base and auxiliary material for 10 multilayers consisting of:
20 x Laminate multilayer 0/5 m, (229 mm x 305 mm x 0.2 mm) with protective foil
40 x Prepreg (200 mm x 275 mm x 0.1 mm)
5 x Pressing cardboard cushion (229 mm x 305 mm)
10 x Base material FR4 18/18 m, (229 mm x 305 mm x 1 mm)
1 Pack seal rings

121102

4-layer multilayer set for MultiPress S,


S series/chemical-free through-hole
plating

Material size: 229 mm x 305 mm (9 x 12)


Base and auxiliary material for 10 multilayers consisting of:
20 x Laminate multilayer 0/18 m, (229 mm x 305 mm x 0.2 mm) without protective foil
40 x Prepreg (200 mm x 275 mm x 0.1 mm)
5 x Pressing cardboard cushion (229 mm x 305 mm)
10 x Base material FR4 18/18 m (229 mm x 305 mm x 1 mm)
1 Pack seal rings

121093

6-layer multilayer set for MultiPress S,


S series/electroplating

Material size: 229 mm x 305 mm (9 x 12)


Base and auxiliary material for 10 multilayers consisting of:
20 x Laminate multilayer 0/5 m (229 mm x 305 mm x 0.2 mm) with protective foil
60 x Prepreg (200 mm x 275 mm x 0.1 mm)
5 x Pressing cardboard cushion (229 mm x 305 mm)
20 x Base material FR4 18/18 m (229 mm x 305 mm x 0.36 mm)
1 Pack seal rings

124481

8-layer multilayer set for MultiPress S,


S series/electroplating

Material size: 229 mm x 305 mm (9 x 12)


Base and auxiliary material for 10 multilayers consisting of:
20 x laminate multilayer 0/5 m (229 mm x 305 mm x 0.2 mm) with protective foil
80 x Prepreg (200 mm x 275 mm x 0.1 mm)
5 x Pressing cardboard cushion (229 mm x 305 mm)
30 x Base material FR4 18/18 m (229 mm x 305 mm x 0.36 mm)
4 x Set screw with slot, 13 mm
1 x Package reinforcing rings

Multilayer

Contents

SMT/Finishing

Description

LDS Prototyping

Part no.

Through-Hole Plating

The LPKF multilayer starter sets include all the materials necessary for producing high-quality multilayers
using an LPKF circuit board plotter and a MultiPress S.

Drill underlay material and parts for vacuum table

Description

Plates per package

116148

Vacuum table honeycomb plates for ProConduct and ProtoMat S series, 5 mm thick,
3.5 mm

116099

Vacuum table sinter backing plates for ProtoMat S series

SET-10-1086

Drill underlay material, DIN A4, d = 2 mm

10

106389

Drill underlay material, DIN A3, d = 2 mm

10

SET-10-1052

Drill underlay material (predrilled), 229 mm x 305 mm (9 x 12), d = 2

10

Index

Part no.

TechInfo

Drill underlay materials line the base material and prevent damage to the machine table. The honeycomb or
anchoring plates safely secure the base material to the vacuum table and can be changed individually.

Consumables

29

Copper-clad FR4 board material


(1.5 mm thick)
Part no.

Description

Plates per package

SET-10-1053

Base material FR4, 229 mm x 305 mm (9 x 12), 5/5 m with protective film,
predrilled with 3 mm registration holes

10

115968

Base material FR4, 229 mm x 305 mm (9 x 12), 0/18 m with protective film,
predrilled with 3 mm registration holes

10

115967

Base material FR4, 229 mm x 305 mm (9 x 12), 18/18 m, predrilled with 3 mm


registration holes

10

SET-10-1001

Base material FR4, 229 mm x 305 mm (9 x 12), 0/35 m, predrilled with 3 mm


registration holes

10

SET-10-1000

Base material FR4, 229 mm x 305 mm (9 x 12), 35/35 m, predrilled with 3 mm


registration holes

10

112059

Base material FR4, DIN A3, 5/5 m with protective film

10

106398

Base material FR4, DIN A3, 18/18 m

10

106400

Base material FR4, DIN A3, 0/35 m

10

106401

Base material FR4, DIN A3, 35/35 m

10

Multilayer material
Part no.

Description

Plates per package

119574

Base material FR4 18/18 m, 229 mm x 305 mm (k) x 1 mm (9 x 12 x 0.04)

119575

Base material 104 ML, 18/18 m, 229 mm x 305 mm (k) x 0.36 mm


(9 x 12 x 0.01)

119571

Thin laminate 104 ML, 0/5 m, 229 mm x 305 mm (k) x 0.2 mm (9 x 12 x 0.008)
with protective film for electroplating multilayer set

119818

Thin laminate 104 ML, 0/18 m, 229 x 305 (k) x 0.2 mm (9 x 12 x 0.008)
without protective film for ProConduct multilayer set

119572

Prepreg type 2125, 275 mm (k) x 200 mm x 0.1 mm (10.8 x 7.9 x 0.004)
for multilayer

120999

Pressing pad for MultiPress S, 229 mm x 305 mm x 1.7 mm (9 x 12 x 0.067)


with alignment pin holes

120345

Pressing metal sheet for MultiPress S, 229 mm x 305 mm x 1.6 mm


(9 x 12 x 0.063) with alignment pin holes

Cleaning pads
Part no.

Description

Pads per package

106403

The metal-free, ultra fine board cleaning pads remove oxidation from the copper
surface of a work piece.

10

Custom adhesive tape


Part no.

Description

106373

The custom adhesive tape secures the base material flat to the work surface and ensures it can be removed without leaving
residue.

30

Consumables

Circuit Board Plotters


Multilayer

Through-Hole Plating

Laser Circuit Structuring

CircuitPro

SMT/Finishing

LPKF CircuitPro
The Intelligent Software Suite
All LPKF circuit board plotters include powerful system software for converting layout data into
actual printed circuit boards: it takes the data from the design software, edits it for production,
manufacturing process.

TechInfo

LPKF CircuitPro will import all data exchange formats,


offers extensive editing options and controls the circuit
board plotters. In addition the software produces
stencils for solder resist masks and assembly prints.

LDS Prototyping

breaks it down into individual process steps and guides the user, step-by-step, through the

Index

LPKF CircuitPro Lite is a simpler version of LPKF


CircuitPro for entry-level LPKF circuit board plotters.

Software LPKF CircuitPro

31

The CAD/EDA software interface


Powerful yet user friendly: these two attributes were at the top of the list of requirements for developing the new
LPKF CircuitPro system software. Even less experienced users can fabricate complex circuit board prototypes with the
well-thought-out user interaction and helpful wizards. The sophisticated functions for calculating control commands
are hidden behind a simple control concept.
LPKF CircuitPro processes precisely the data required by circuit board manufacturers. CircuitPro automatically
imports aperture tables and tool lists, Gerber and NC data:
Data import: Gerber, GerberX, HP-GL, Excellon, Sieb & Meier, DXF, IGES, LMD, STEP.
Data export: LMD.
Creating blanks: copies individual PCB layouts and arranges them into one blank on the PCB.
Intelligent isolation: time- and tool-optimized milling in milling cycles with all tools available per cycle. Arbitrary
rub-out areas, including polygons.
Design Rule Check: checks conductor path spacing.
Contour generator: generates milling paths for depaneling PCBs with automatically defined spacing.
Direct entry: text entry and direct drawing to create front-boards or PCBs.
Editor: data manipulation for parameters specific to electronics, such as conductor path width, drill hole diameter,
moving drill holes, adding copper areas, etc.
TrueType Fonts: text function uses TrueType fonts.
User interface: hides controls depending on the task.
Technology dialogue: simple and clear merging of various editing processes.
Ground plane: produces ground planes with automatically exempted conductor paths.
Automatic milling depth adjustment: measures and calibrates the milling depth in conjunction with circuit board
plotter hardware options.
Automated production control: automatically swaps available tools in a tool magazine. LPKF CircuitPro minimizes
tool changes.
Project profiles: once jobs are defined they can be saved and later opened for reproduction.
User-friendly user interface: WYSIWYG display and color coding the editing layer/layout layer. Quickly and easily
navigate complex layouts.
Monitoring: permanently displays the current milling status and the current milling head position.

Data import: LMD, GerberX, Excellon, DXF

32

Software LPKF CircuitPro

Design Rule Check: checks PCB track width/distance

Circuit Board Plotters

Intelligent assistants

Through-Hole Plating

Laser Circuit Structuring

The LPKF CircuitPro wizards will confidently and


quickly guide even occasional users through the
entire process. They help with preparing data
and show required user interaction. This reduces
training time and yields quick results.

SMT/Finishing

Multilayer

Process wizard guides you through the production of multilayer PCBs:

2. Select substrate

3. Set throughplating method

4. Select solder resist mask and assembly print

TechInfo

LDS Prototyping

1. Select number of layers

Software LPKF CircuitPro

Index

The wizard controls LPKF CircuitPro according to the data entered and suggests the most efficient
production method. For example galvanized throughplating requires the structuring process to be carried
out after the PCB has been galvanized which the wizard considers.

33

Technical specifications
LPKF CircuitPro Lite

LPKF CircuitPro Full

Import formats

Gerber Standard (RS-274-D), Extended Gerber


(RS-274-X), Excellon NC Drill (Version 1 and 2),
Sieb & Meier NC Drill, IGES

Gerber Standard (RS-274-D), Extended Gerber


(RS-274-X), Excellon NC Drill (Version 1 and 2),
Sieb & Meier NC Drill, HP-GL, DPF, Auto-CAD
DXF, IGES, LMD, STEP

Supported shapes

Circle, square, rectangle (also rounded or angled), octagon, oval, step, special (arbitrarily definable)

Editing functions

Original modification, relocating, duplicating, rotating, mirroring, erasing, extending/severing lines, line/
path extension/shortening, line path/segment parallel shifting, line path/object polygon conversion (Fill),
curve linking/closing

Special functions

Contour routing path generator with breakout tabs

Display functions

Zoom window (freely definable), zoom in/out, overview, redraw, individual layers selectable/visible, panning
(keyboard), layer in solid/outline/center line display, 16 pre-set colors (up to 16 million freely available),
different colors for tracks and pads of the same layer, different colors for insulation tools

Marker functions

Single element, total layer, all layers, pad groups, selection and limiting to specific layers possible for lines/
polygons/circles/rectangles/pads/holes (multiple choice and restriction to specific layers possible)

Graphic functions

Lines (open/closed), circle, polygon, rectangle, pad, hole, text (TTF, TTC)

Control functions

Measuring

Insulation methods

Single insulation method, additional multiple insulation of pads, removal of residual copper spikes (spike
option), milling out of large insulation areas (rub-out), concentric or in serpentines maintaining minimum
insulation spaces, inverse insulation

Insulation tools

12 tools

Languages

English, German (other languages coming soon)

Hard-/software minimum
requirements

Microsoft Windows 2000 or higher, 2 GHz Processor with 2 GB RAM,


screen resolution 1024 x 768 pixels

Supplied with

LPKF ProtoMat S 43, E33

Routing path generator with breakout tabs, joining/


separating objects, step & repeat (multiple PCB),
polygon cut-out, ground plane generation with
defined clearance

Measuring, design rule check

all

LPKF ProtoMat S 63, S103, D104

All specifications are subject to technical modifications.

LPKF CircuitPro 3D
LPKF CircuitPro is the software foundation for many LPKF systems
and CircuitPro 3D is the version that was developed for control of threedimensional structuring. It is an elementary component for activation of
LDS systems (Laser Direct Structuring see TechInfo, page 120) and the LPKF ProtoLaser 3D.
LPKF CircuitPro 3D relies on an operating concept with a clear user interface and genuine 3D display.
Depending on the connected laser system, the software also presents several laser sources, workpieces
and workpiece holders. Sophisticated functions for data preparation help the user prepare even complex
workpieces within the shortest time for structuring with the laser. Intelligent algorithms calculate the filling
structures that later emerge as circuit tracks on the workpiece. In addition, continuous maintenance and
further development ensures the technological edge of LPKF systems.
Along with the highest precision in series production, LDS prototypes can also be produced easily and quickly
in series quality. The structuring process is broken down into individual processes by CircuitPro 3D so that the
components can be manually positioned in different angular positions. Prototyping thus becomes a qualifying
process; subsequently, all parameters required for serial production are available.

34

Software LPKF CircuitPro

Circuit Board Plotters

Innovative laser technology


Broad machining spectrum
Compact and affordable

SMT/Finishing

Multilayer

Through-Hole Plating

Laser Circuit Structuring

Includes powerful CAM software

LDS Prototyping

Innovative Laser Technology


for Rapid PCB Prototyping
The natural transition from traditional PCB Prototyping to small batch production and special

LPKF is expanding its micromaterial processing range with contactless laser


processes from structuring and printed circuit board machining to machining
of internal traces or ceramic materials.

TechInfo

requirements.
Table of contents
LPKF ProtoLaser S

36

LPKF ProtoLaser U3

38

For additional information see TechInfo starting on page 94.

Innovative Laser Technology for Rapid PCB Prototyping

Index

Two laser systems are available: The ProtoLaser S is ideal for structuring
printed circuit boards. The ProtoLaser U3 can structure laminated
substrates as well as a large number of other materials. It is one of the most
competitively priced UV laser systems on the market and can be used in a
wide range of applications. Both systems are delivered with powerful CAM
software.

35

LPKF ProtoLaser S
Laser Structuring Circuit Boards
Product:
LPKF ProtoLaser S
Part no.:
124102
Ordering info: See front sleeve

IR laser for laser structuring


Material size up to 229 mm x 305 mm x 7 mm
(9 x 12 x 0.28)
Structuring speed: 6 cm2/min
Minimum cutting channel width: 25 m
Minimum corner radius: 12.5 m
Minimum PCB track width/distance: 50/25 m*
* on ceramic substrate with 5 m (0.2 mil) CU electro-plating

When do you need the finished PCB prototype?


How quickly do you need a small batch set up?
All too often the answer is: Now!
The compact LPKF ProtoLaser S allows PCB
designers to take great strides toward their
goal. Using the patented LPKF laser method the
ProtoLaser S structures PCBs in minutes with
accurate geometries on virtually any substrate.
Yet the ProtoLaser S is compact and fit for any
lab environment. It can be rolled through any
standard lab door and requires only an outlet and
compressed air supply connection to operate.

Highest mechanical resolution, precise


geometries, optimal repeatability
Compact and reliable: Fit for labs
For virtually all popular circuit board
materials
Prototyping and on-demand production
of custom small batches
229 x 305 millimeters (9 x 12) structured in 20 minutes

36

LPKF ProtoLaser S

Ceramics

PTFE

Circuit Board Plotters

FR4

25 m

Options

The LPKF ProtoLaser S selectively ablates the


conductive layer typically copper from the
substrate. This cuts the insulation channels through
out the planned PCB tracks and pad surfaces. The
ProtoLaser S is the solution for efficiently prototyping
complex digital and analog circuits, RF and microwave
PCBs up to a size of 229 mm x 305 mm (9 x 12). It
achieves unmatched geometric accuracy on virtually
any material and represents the ideal system for
manufacturing antennas, filters and many other
applications where precise, steep edges are essential.

Compressor system for supplying compressed


air (Part no. 122805)
Dust extraction (Part no. 124391)
Adjustment tool (Part no. 118005)

Through-Hole Plating

Laser structured circuit layouts

Laser Circuit Structuring

50 m

Accessories and materials start on page 19.

Multilayer

For additional info see TechInfo page 94.

124102

Max. material size and layout area (X/Y/Z)

229 mm x 305 mm x 7 mm (9 x 12 x 0.28)

Structuring speed

12 cm2/min ( 1.86 in2/min) a, on laminated substrate

Diameter of focused laser beam

25 m (1 mil)

Minimum line/space

50 m/25 m (2 mil /1 mil) a

Accuracy*

1.98 m ( 0.08 mil)

Repeatability

2 m ( 0.08 mil) b

Focus accuracy

20 m (0.8 mil)

Laser pulse frequency

15200 kHz

Z-axis

Stepper motor, software-controlled

Dimensions (W x H x D)

875 mm x 1430 mm x 750 mm (34.4 x 56.3 x 29.5) c

Weight

260 kg (573 lbs)

LDS Prototyping

Part no.

SMT/Finishing

Technical Specifications: LPKF ProtoLaser S

Power supply

110/230 V, 5060 Hz, 1.4 kW

Compressed air supply

8 bar (116 psi), 160 l/min (5.66 cfm)

Cooling

Air-cooled (internal cooling cycle)

Ambient temperature

22 C 2 C (71.6 F 4 F)
TechInfo

Operating conditions

Power supply

230 V, 50/60 Hz, 1.2 kW

Air flow rate

320 m3/h, max. vacuum pressure 21000 Pa

Filter

Active carbon filter and HEPA filter

Dimensions (W x H x D)

365 mm x 1245 mm x 501 mm (14.4 x 49 x 19.7)

Weight

80 kg (176.4 lbs)

Required accessories

Exhaust, compressor, standard PC

Hardware and software requirements

Microsoft Windows 2000 or higher, 2 GHz Processor with 2 GB RAM,


screen resolution 1024 x 768 pixels, USB 2.0

Depending on material and laser beam parameters

Direct repeat of laser beam movement

Index

Exhaust

Height with open door 1730 mm (68.1)

Technical specifications subject to change.

* Mechanical resolution scanfield


LPKF ProtoLaser S

37

LPKF ProtoLaser U3
The Multi-Purpose Tool for the Electronics Lab
Product:
LPKF ProtoLaser U3
Part no.:
10011576
Ordering info: See front sleeve

UV laser for innovative micromachining of materials


Compact and suitable for labs
Material size up to 229 mm x 305 mm x 7 mm
(9 x 12 x 0.28)

One system, many applications its all possible with


a laser. The LPKF ProtoLaser U3 provides a compact
system that can handle tasks previously requiring
large industrial systems. The integrated UV laser can
machine nearly all materials, is easy to install and is
even easier to use.
The ProtoLaser U3 shows how quickly applications
can be processed. The high pulse energy of the UV
laser leads to residue-free ablation, resulting in precise
contour geometries. Conversion to other products is
easy and flexible: Just load the new project file, and
start using the ProtoLaser U3.
The LPKF ProtoLaser U3 can quickly, cleanly and
precisely depanel or structure a wide range of
materials. A UV laser beam can easily and accurately
cut individual boards out of large boards, cut LTCCs
and prepregs, drill holes and microvias, and cut through
solder masks. An extensive material library supplies the
laser parameters for the most important materials.
Tool costs are no longer an issue, as the ProtoLaser U3
is a contactless system.

38

LPKF ProtoLaser U3

Contactless depaneling of rigid, rigid-flex,


and flexible printed circuit boards
Structuring of laminated substrates
Drilling and depaneling of ceramics
Laser focus of less than 20 m
Machining with no material stressing
or residues

The wavelength used by the laser makes the UV laser a truly multifunctional tool. It can be used to separate or
structure materials, or for direct exposure. And in the process, the micromachining of materials benefits from the fine
diameter of the laser beam, the ultra precise Z-axis focus and the precise selection of machining positions.

Through-Hole Plating

Laser Circuit Structuring

An overview of applications:

Circuit Board Plotters

The multifunction tool for laser materials processing

The ProtoLaser U3 can also structure FR4 materials with negligible

unpopulated, without thermal or mechanical strain on materials, in

impact on the substrate


Multilayer

Depaneling and cutting thin and flexible PCB materials: populated or

Structuring and cutting fired and unfired ceramic material,

or ceramic-filled PCB substrates with perfect drill hole geometry

e.g., LTCC

Ablating solder resist and cover layers ultra precise, with a diameter

Structuring transparent conductive oxides (TCO) without visible

of 30 m and larger

marks on the substrate

Index

TechInfo

Drilling holes and blind holes (microvias) in conventional and PTFE-

LDS Prototyping

SMT/Finishing

any shape

LPKF ProtoLaser U3

39

Prepared for anything

Easy machine control

The new laminated substrate structuring capability


is based on the use of compressed air to remove
detached metal strips from the machining area. A
special hood for the machining head supports the
removal process, perfectly guiding the airstream
directly to the extraction unit. Changing between hoods
requires no tools and takes just a few minutes.

The LPKF CAM software can handle all standard


layout data formats and converts them into production
data. In most cases, it just takes a push of a button to
operate the LPKF ProtoLaser U3 process parameters
are supplied for a large number of applications.
Administrator mode allows full control over all system
settings.

Small batches and prototypes


High repeatability: The optimum focal point position
for the laser is set automatically; a camera localizes
the workpiece position using registration marks. The
integrated vacuum table reliably keeps flexible and
thin substrates in place.

Options

structure laminated substrates

Dust extraction (item no. 124391)


Adjustment tool (item no. 118005)
Compressor system compressed air supply
(item no. 122805)

For additional info see TechInfo page 94.

Accessories and materials starting on page 19.

With the new hood (right), the LPKF ProtoLaser U3 can also

Technical Specifications: LPKF ProtoLaser U3


Part no.

10011576

Max. material size and layout area (X/Y/Z)

229 mm x 305 mm x 7 mm (9 x 12 x 0.28)

Structuring speed

8 cm2/min ( 1.24 in2/min)a, on laminated substrate

Laser wavelength

355 nm

Output

5W

Diameter of focused laser beam

20 m (0.8 mil)

Accuracy*

1.22 m (0.05 mil)

Repeatability

2 m ( 0.08 mil)b

Focus accuracy

50 m (1.97 mil)

Laser pulse frequency

25200 kHz

Z-axis

Stepper motor, software-controlled

Dimensions (W x H x D)

875 mm x 1430 mm x 750 mm (34.5 x 56.3 x 29.5)c

Weight

300 kg (661 lbs)

Operating conditions
Power supply

110/230 V, 5060 Hz, 1.4 kW

Compressed air supply

8 bar (116 psi), 160 l/min (5.66 cfm)

Cooling

Air cooled (internal cooling cycle)

Ambient temperature

22 C 2 C (71.6 F 4 F)

Exhaust
Power supply

230 V, 50/60 Hz, 1.2 kW

Air flow rate

320 m3/h, max. vacuum pressure 21000 Pa

Filter

Active carbon filter and HEPA filter

Dimensions (W x H x D)

365 mm x 1245 mm x 501 mm (14.4 x 49.8 x 19.7)

Weight

60 kg (132.3 lbs)

Required accessories

Exhaust, standard PC

Hardware and software requirements

Microsoft Windows 2000 or higher, 2 GHz Processor with 2 GB RAM,


screen resolution 1024 x 768 pixels, USB 2.0

Depending on material and laser beam parameters

Direct repeat of laser beam movement

Height with open door 1730 mm (68.1)

40

LPKF ProtoLaser U3

* Mechanical resolution scanfield


Technical specifications subject to change.

Circuit Board Plotters


Laser Circuit Structuring
Through-Hole Plating
Multilayer
SMT/Finishing
LDS Prototyping

Through-Hole Plating
Producing high-quality through-hole platings is critical in the production of modern
multilayer PCBs. LPKF offers several processes to complement the range of products for

LPKF through-hole plating drastically reduces production time.


New products can be developed and introduced to the market quicker.
LPKF offers a total of three powerful processes to cover almost any
application area imaginable.

TechInfo

in-house PCB prototype production.


Table of contents
LPKF ProConduct

42

LPKF Contac RS/LPKF MiniContac RS

44

LPKF EasyContac

46

LPKF ViaCleaner

47
Index

For additional information on the through-hole plating methods please


refer to the TechInfo starting on page 107.

Through-Hole Plating

41

LPKF ProConduct
Through-Hole Plating without Chemicals
Product:
LPKF ProConduct
Part no.:
115790
Ordering info: See front sleeve

LPKF ProConduct is an innovative system for costeffective through-hole plating without wet chemistry.
No electroplating baths required. The parallel process
will quickly, easily and reliably connect even PCBs with
a large number of drillings.

No plating tanks or chemicals required

ProConduct is perfect for small batches as well as labs


and companies where chemical electroplating is not
viable.

Quick and easy operation

When combined with an LPKF circuit board plotter or


ProtoLaser S the LPKF ProConduct system is a key
component of in-house PCB prototyping. It facilitates
reliable, flexible and quick production of prototypes.

42

LPKF ProConduct

Reliable, thermally stable platings


Compact

Also suitable for PTFE and other


sophisticated substrates

Circuit Board Plotters

The LPKF ProConduct system metalizes vias as


small as 0.4 mm (15 mil) and up to an aspect ratio
of 1:4. Smaller sizes can be drilled under special
conditions. The basic process takes only a few minutes
for double-sided as well as multilayer PCBs. At only
about 20 m with the LPKF ProConduct the electric
resistance of vias is extremely low.

For additional information and a process


description please refer to the technical
specifications starting on page 108.

Multilayer

Accessories

Laser Circuit Structuring

Reliable contacts

A special conductive paste is the heart of the LPKF


ProConduct. A vacuum draws the paste through the
drill holes this simple process for smooth coating
yields perfect results in mere minutes.

Through-Hole Plating

Easy to use

Hot air oven (Part no. 115877)


Vacuum table (Part no. 115878)
Dust extraction (Part no. 10033243)

SMT/Finishing

For further information about options see page 66.

Drilled hole diameter: 1 mm. Aspect ratio: min. 4:1 (0.4 mm x


1.6 mm (15 mil x 62 mil) substrate thickness). Copper layer: 35 m

LDS Prototyping

(1.4 mil). Through-hole plating: 20 m70 m (0.8 mil2.8 mil)

Part no.

115790

Max. material size

229 mm x 305 mm (9 x 12)

Min. hole diameter

0.4 mm (15 mil) up to an aspect ratio of 1:4a

Number of plated holes

No limit

Number of layers

Solderability

Reflow soldering 250 C (482 F), manual soldering 380 C (716 F)b

Base material types

FR4, RF and microwave materials (incl. PTFE-based materials)

Processing time

Approx. 35 min

Electric resistance
(Hole diameter 0.4 1.0 mm at 1.6 mm/63 mil
material thickness)

Average 19.2 m with standard deviation of 7.7 m

TechInfo

Technical Specifications: LPKF ProConduct

Smaller hole diameters upon request

Index

Soldering agent recommendation upon request

Technical specifications subject to change.

LPKF ProConduct

43

LPKF Contac RS/LPKF MiniContac RS


Electroplating of Through-Holes
Product:
LPKF Contac RS
Part no.:
120742
Ordering info: See front sleeve

LPKF MiniContac RS
119987

LPKF MiniContac RS

LPKF Contac RS

The LPKF Contac RS and the LPKF MiniContac RS


are electroplating systems for professional throughhole platings in PCB prototypes and small batches.
The compact desktop design allows it to also be used
in labs with limited space. The optional LPKF Reverse
Pulse Plating function and formaldehyde-free blackhole technology employed in both systems ensure
consistent metallization of through-holes, even with
small hole diameters.

High-quality through-hole plating in


your own lab

The LPKF Contac RS can handle PCBs up to 460 mm


x 330 mm (18 x 13). The system is also equipped for
chemical tin-coating. A spray basin with external water
supply assists in the PCB cleaning process.

Through-hole plating even with small


diameters of >0.2 mm (8 mil)

The LPKF MiniContac RS can handle PCBs up to


230 mm x 330 mm (9 x 13). The system does not
require external connections.

44

LPKF Contac RS/LPKF MiniContac RS

Even copper deposit through reverse


pulse plating (RPP)
No special chemical knowledge required
Chemical tinning with LPKF Contac RS

Ideal for through-hole plating


multilayer-PCBs

The through-hole plating process starts by cleaning


and degreasing the PCB in two baths. This is followed
by activation and copper buildup in additional baths.
After the final cleaning the PCB is ready for further
processing.

Advantages of Reverse Pulse Plating

The LPKF MiniContac RS only needs four baths. The


LPKF Contac RS also features a spray basin and a bath
for chemical tin-plating. All baths are easy to change.
No special chemical knowledge is required.

In the course of product maintenance, the anode plates


were optimized. The aim is an even more homogeneous
build-up of the copper layers. Systems that have
already been delivered can be inexpensively retrofitted.

Both systems offer a process for consistently coating


the annular rings with brief current reversals. Please
refer to page 109 for additional information.

Optimized copper build-up

Consumable

Part no.

Description

Electroplating chemicals MiniContac RS

119986

Covers the complete fill of electroplating chemicals for MiniContac RS.


Includes 6 l Cleaner 110, 5 l Cleaner 210, 4 l Activator 310, 16 l Copper Plater
400 and 0.25 l Shine 400.

Electroplating chemicals Contac RS

120743

Covers the annual supply of electroplating chemicals for Contac RS.


Includes 30 l Cleaner 110, 30 l Cleaner 210, 10 l Activator 310, 35 l Copper
Plater 400, 0.5 l Shine 400.

Anode plates

10032691

The anode plates were optimized.


The goal was to achieve an even more homogeneous copper layer structure.

Part no.

120742

119987

Activator

Carbon

Carbon

Max. material size

460 mm x 330 mm (18.1 x 13)

230 mm x 330 mm (9 x 13)

Max. layout size

430 mm x 290 mm (16.9 x 11.4)

200 mm x 290 mm (7.8 x 11.4)

Hole diameter

> 0.2 mm (> 8 mil)

> 0.2 mm (> 8 mil)

Number of through-plated holes

No limit

No limit

Max. number of layers

Max. contact resistance

<10 m

<10 m

Environmental compatibility

Good

Good

Processing reliability

Very good

Very good

Processing time

Approx. 90 120 min

Approx. 90 120 min

Base material types

FR4, RO3000, RO4000, TMM*

FR4, RO3000, RO4000, TMM*

Power supply

115/230 V, 50 60 Hz, max. 1.5 kW

115/230 V, 50 60 Hz, 0.6 kW

Ambient temperature

18 25 C (64 77 F)

18 25 C (64 77 F)

Dimensions (W x H x D)

900 mm x 540 mm x 800 mm


(35.4 x 21.2 x 31.5)

750 mm x 525 mm x 500 mm


(29.5 x 20.4 x 19.7)

Chemical tinning

Yes

No

Reverse Pulse Plating

Yes

Yes

Weight

85 kg (187.4 lbs) unfilled; 150 kg (330.7 lbs) filled

42 kg (92.5 lbs) unfilled; 71 kg (156.5 lbs) filled

LDS Prototyping

LPKF MiniContac RS

TechInfo

LPKF Contac RS

Index

Technical Specifications

SMT/Finishing

All materials can be ordered separately. Please contact your local LPKF representative.

* Additional materials available upon request.


Technical specifications subject to change.
LPKF Contac RS/LPKF MiniContac RS

Circuit Board Plotters

Simple process

Laser Circuit Structuring

The LPKF Contac RS features a bath for chemical


tin-plating. Tin-plating protects the through-plated PCB
from oxidation and is the ideal primer for the soldering
process.

Through-Hole Plating

Chemical tin-plating

The microprocessor-controlled systems feature easy


menu-guided operation. An acoustic signal indicates
that the process is complete.

Multilayer

Easy to operate

45

LPKF EasyContac
Manual Through-Hole Plating for Double-Sided PCBs
Product:
LPKF EasyContac
Part no.:
110914
Ordering info: See front sleeve

LPKF EasyContac is a manual system for through-hole


plating double-sided PCBs with copper-alloy rivets.
Perfect for applications where double-sided soldering is
impractical. LPKF EasyContac requires no special tools
or chemical baths. The portable tool set includes all the
required tools. For additional information on throughhole plating refer to the TechInfo starting on page 107.

Portable tool set


All the required utensils are packed in a handy tool box,
perfect for service technicians.

Fast and cost-effective for small projects


Complete with tools
Easy to learn

Technical Specifications: LPKF EasyContac


Part no.

Quantity Description

110914
1

Automated punch tool with stamp tip A for 0.6


mm (24 mil) and 0.8 mm (32 mil) rivets (inside
diameter*)

Max. material size

Unlimited

Number of layers

Max. contact resistance

10 m

Stamp tip B for 1.0 mm (40 mil) and 1.2 mm


(48 mil) rivets (inside diameter*)

Environmental compatibility

Excellent

Tweezers

Through-plated holes/min

2 or 3

Anvil

Process reliability

Good

Copper alloy rivets

Base material types

FR4, 1.5 mm (59 mil) thickness

1000

0.8 mm (32 mil)

1000

1.0 mm (40 mil)

1000

1.2 mm (48 mil)

1000

1.4 mm (56 mil)

Technical specifications subject to change.


* The inside diameter is 0.2 mm (8 mil) or 0.4 mm (16 mil) smaller than the desired outside diameter.
46

LPKF EasyContac

Supplements galvanic through-hole plating

After the activator has been applied and dried, the


printed circuit board is moved around in the ViaCleaner
solution for 120 to 300 seconds. It is then rinsed and
can be copper-plated in the next step.

Technical Specifications: LPKF ViaCleaner


Part no.

10012137

Filling volume

4l

Dimensions (W x H x D)

530 mm x 150 mm x 380 mm


(20.8 x 5.9 x 14.9)

Process temperature

18 C25 C (64 F77 F)

Max. base material size

305 mm x 230 mm (12 x 9)

Consumables
(included in set)

Chemical set, Part no. 10013451


(ViaCleaner Part I and Part II)

LPKF ViaCleaner

Through-Hole Plating
TechInfo

Short process time

Index

Reliably removes activator layer in microvias

The basin is transparent and is mounted in a tank in


the existing LPKF Contac RC/MiniContac RS galvanic
via plating units. To avoid additional steps, the board
holders on the Contac RS and the MiniContac RS both
fit on the ViaCleaner. If there are no existing LPKF
galvanic via plating units, the board holders can be
ordered separately. A thermometer and a temperature
table are available to determine the perfect residence
time.

Multilayer

The individual layers are electrically connected by


means of via plating. Multilayer boards are connected
galvanically through liquid media after activator coating.
What functions reliably for vias is challenging for blind
vias: The activator accumulates at the bottom of the via
and forms a contact resistance to the insulation. The
LPKF ViaCleaner removes the activator from the copper
layer, whereas the activator layers on the via walls are
not removed.

SMT/Finishing

Multilayers offer additional circuit paths and are a


prerequisite for reliable connections in complex circuit
layouts on PCBs with high integration densities.

LDS Prototyping

Product:
LPKF ViaCleaner
Part no.:
10012137
Ordering info: See front sleeve

Laser Circuit Structuring

Circuit Board Plotters

LPKF ViaCleaner
Reliable Contacting with Microvias

47

Multilayer PCBs Produced In-House


Shorter and shorter product cycles: Rapid PCB Prototyping is a key factor in developing new
products and in their market introduction. Fast and easy prototyping methods determine the
success or failure of a new development.

Yet the number of functions to be accommodated on a PCB keeps growing.


The high circuit density and the associated high number of circuitries require
complex PCB prototypes to be laid out as multilayers, allowing circuits to be
arranged over several layers.

Table of contents
LPKF MultiPress S

50

A typical PCB multilayer with any number of layers includes:


PCBs, typically FR4, with the circuits.
Prepregs, as insulative compound material inserted between the layers.
The different layers must be bonded properly to eliminate pockets of air or impurities. For additional information on
the method please refer to the TechInfo starting on page 104.
In multilayer production the electrical connections are created between the individual layers. This requires a throughhole plating method suitable for multilayers, such as LPKF ProConduct more information starting on page 108.

48

Multilayer Overview

Circuit Board Plotters


Laser Circuit Structuring
Through-Hole Plating
Multilayer

Typical applications

RF multilayer
RF multilayers are created on special substrate
materials and prepregs. RF bonding films and RF
prepregs require a higher laminating temperature and
pressure compared to FR4-based multilayers.

Index

Rigid-flex
Rigid-flex PCBs are a combination of flexible and rigid
PCB sections. In principle they can be processed
similarly to multilayers. Achieving professional
bonding results in rigid-flex PCBs, unlike bonding rigid
multilayers, merely requires an increase in the bonding
temperature and pressure.

TechInfo

LDS Prototyping

SMT/Finishing

The classic case is a design with FR4 substrate material and two prepregs.

Multilayer Overview

49

LPKF MultiPress S
Press for Producing Multilayers
Product:
LPKF MultiPress S
Part no.:
1207341/1207362
Ordering info: See front sleeve
1

Incl. manual pump

Incl. automatic hydraulics

The LPKF MultiPress S is a desktop system for


laminating multilayers in your own lab. The short cycle
time of only approx. 90 minutes and simple operation
make this system the perfect tool for the reliable
production of multilayer prototypes and small batches.
The LPKF MultiPress S bonds complex PCBs with
up to eight layers in one pass. Different pressure,
temperature and time profiles provide the greatest
possible flexibility in material selection and the number
of layers.
The prototype quality is no different from those
produced by PCB manufacturers but it only takes a
fraction of the time required for an external supplier.
The entire process from design and structuring the
PCBs all the way to the final bonded and populated
product sample can be completed within one business
day.

50

LPKF MultiPress S

In-house production of multilayer


prototypes and small batches
Very fast process
Easy menu navigation via LCD display
Preset and custom process profiles
Bonds rigid and flexible materials,
RF materials
Upgradeable to automatic hydraulics

The microprocessor control


stores up to nine profiles.
Upon request it can also be
equipped with a hand pump
instead of an automatic
press.

Circuit Board Plotters

Options

Laser Circuit Structuring

The LPKF MultiPress S bonds multilayer circuits of


rigid, rigid-flex and flexible circuit board materials.
Even distribution of pressure and up to nine different
pressure, temperature and time profiles provide a
uniform material bond. Special process profiles can
even bond RF materials. Temperatures up to 250 C
are reached within a short period. Efficient heat trans
mission ensures short cool-down phases, resulting in
optimal processing times.

Through-Hole Plating

The key in multilayer prototyping

Mobile table (Part no. 107050)

Low space requirement

Multilayer

The LPKF MultiPress S with a laminating pressure of


up to 286 N/cm2 requires a mere 600 mm x 530 mm
(23.6 x 20.9) to fit any lab. The system can
be placed on any surface rated for at least 170 kg
(375 lbs). LPKF also offers an optional mobile table
for the MultiPress S.

SMT/Finishing

More information about options on page 66.

Automatic hydraulics (Part no. 120744)

Max. layout size

200 mm x 275 mm (7.8 x 10.8)

Max. laminating area

229 mm x 305 mm (9.0 x 12.0)

Max. laminating pressure

286 N/cm2 at 229 x 305 mm (9.0 x 12.0)

Max. temperature

250 C (480 F)

Max. number of layers

8 (depending on material and layout)

Pressing time

Approx. 90 mina

Dimensions (W x H x D)

600 mm x 620 mm x 530 mm (23.6 x 24.4 x 20.9)

Weight

170 kg (375 lbs)b

Power supply

230 V, 50/60 Hz, 2.3 kW/2.8 kW1

Microprocessor controlled

9 pressure/temperature/time profiles

Hydraulic unit dimensions (W x H x D)

260 mm x 410 mm x 280 mm (10.4 x 16.2 x 11.0)


100 mm x 150 mm x 700 mm (3.9 x 5.9 x 27.6)1

Hydraulic unit weight

15 kg (33 lbs), 5 kg (11 lbs)1

Base materials

FR4, others upon request, multilayer starter-sets on page 29

Depending on material compound

Technical specifications subject to change.

TechInfo

120734/1207361

Index

Part no.

LDS Prototyping

Technical Specifications: LPKF MultiPress S (1 with automatic hydraulics)

Plus weight of hand pump or automatic hydraulics

with automatic hydraulics

LPKF MultiPress S

51

SMT Rapid PCB Prototyping


Once the unassembled PCB is finished there are only a few

Table of contents

steps left to an electrically functional, populated product.

LPKF ProMask and LPKF ProLegend


Solder Resist Masks and Assembly Print 54

For these production steps LPKF again offers a powerful,


cost-effective and easy-to-implement method.

LPKF ProtoPrint S and ProtoPrint S RP


Solder Paste Printers
56
LPKF ProtoPlace S
Pick & Place Assembly

58

LPKF ProtoPlace BGA


BGA Circuit Board Assembly

60

LPKF ProtoFlow S and ProtoFlow S/N2


Reflow Ovens for Lead-Free Soldering 62
Economical Solutions for
SMT Prototyping The LPKF E series

64

Additional Options for SMT Prototyping 66

52

SMT Rapid Prototyping

Through-Hole Plating

Laser Circuit Structuring

Circuit Board Plotters

An Overview

LPKF ProtoPrint S

Simple application of a green solder resist mask


to protect the conductor paths during production.
ProLegend can be used to apply professional legend
print.

Manual fine-pitch stencil printer for accurately


positioning and dispensing solder paste onto PCBs.

LPKF ProtoPlace S

LPKF ProtoFlow S

Pick&Place system for accurately positioning SMT


components on PCBs from small chips to large QFPs.

Reflow oven also suitable for lead-free soldering


features a large material size and precisely controlled
temperature profile.

TechInfo

LDS Prototyping

SMT/Finishing

Multilayer

LPKF ProMask and LPKF ProLegend

SMT Rapid Prototyping

Index

LPKF reduces the production time of PCB prototypes to a fraction of the time required when using
external suppliers. The finely tuned LPKF tool spectrum allows several full product cycles to be
completed in one day resulting in quicker product introduction.

53

LPKF ProMask and LPKF ProLegend


Solder Resist Masks and Assembly Print
Product:
LPKF ProMask
Part no.:
117072
Ordering info: See front sleeve

LPKF ProLegend
117584

LPKF ProMask is an easy-to-apply green solder resist


mask: easy to use and cost-effective for a professional
solder resist application during in-house production.
The structured PCB prototypes receive a perfect
surface finish for safely soldering SMD or conventional
components. The professional surface finish is
especially ideal for SMT prototypes with minimal
track spacing.
LPKF ProLegend is the easiest method of legend
printing, adding logos and labeling PCB prototypes.

54

LPKF ProMask and LPKF ProLegend

Compact, quick and easy to use


Protective surface finish and perfect
soldering
Only four simple steps, meaning less
training is required
Professional legend print
No environmental impact

LPKF ProMask protects the conductor paths with a


special lacquer and prevents short circuits in PCBs
populated with SMD or conventional components.

Circuit Board Plotters


Laser Circuit Structuring

Perfect results for in-house prototyping

Options

UV exposure. With use of the artwork the


pattern is transferred to the surface of the
circuit board.
230/240 V: Part no. 117050
110/120 V: Part no. 117192

Through-Hole Plating

A special lacquer, initially


applied to the entire PCB,
is the key component in
the LPKF ProMask and
LPKF ProLegend. A laser
printer prints the layout
to be transferred onto a
transparency, and a photochemical production process transfers it onto the
lacquer. See page 112 for an illustration of the process.

LPKF ProMask includes all instructions, tools and


process materials. All process materials are sealed in
sections. No waste requiring special disposal.

Reliability and quick time-to-market

Multilayer

In-house Rapid PCB Prototyping speeds up


development of electronic circuits from design to
prototype, reducing the time-to-market. This avoids
delays or high costs associated with external suppliers.
All CAD data safely remain in house.

SMT/Finishing

Reflow oven. For pre-drying the PCB and


hardening the resist.
230/240 V: Part no. 115877

LPKF ProMask

LPKF ProLegend

Part no.

117072

117584

Max. material size

229 mm x 305 mm (9 x 12)

Max. layout area of image exposer

240 mm x 340 mm (9.5 x 13)

Processing time

Approx. 60 min/cycle

Pad separation

0.5 mm (20 mil) fine pitch

Adhesive strength

Class H and T, test method: IPC-SM-840 C, item 3.5.2.1

Solder bath resistance

20 s at 265 C (509 F), test method: IPC-SM-840 C, item 3.7.2


10 s at 288 C (550 F), test method: MIL-P 55 110 D
20 s at 288 C (550 F), test method: UL 94 (lead-free)

Surface resistance

2 x10 exp14 , test method: VDE 0303, Part 30, DIN IEC 93

Moisture resistance and isolation resistance

Class H and T, test method: IPC-SM-840 C, item 3.9.1

Solving/cleaning agent resistance

IPC-SM-840 C, item 3.9.1 (10 percent alkaline cleaner, isopropanol, monoethanolamine)

Minimum capital height

2.0 mm (with 1200 dpi laser printer)

Minimum capital strength

0.1 mm (with 1200 dpi laser printer)

Hardware requirements

Min. 600 dpi laser printer

Software requirements

LPKF CircuitPro

Index

TechInfo

LDS Prototyping

Technical Specifications:

Technical specifications subject to change.

LPKF ProMask and LPKF ProLegend

55

LPKF ProtoPrint S and ProtoPrint S RP


Solder Paste Printers
Product:
LPKF ProtoPrint S
Part no.:
127067
Ordering info: See front sleeve

LPKF ProtoPrint S RP
127066

The LPKF ProtoPrint S is available in two versions:


ProtoPrint S for printing with stainless steel stencils,
ProtoPrint S RP for polyimide stencils.

When populating PCBs with tiny SMD components


the developer relies on an accurate solder paste
application. Large numbers of solder deposits are
most easily and quickly applied by stencil print. The
ProtoPrint S LPKF provides an accurate manual
stencil print for SMT prototypes and small batches.
The superior positioning accuracy, ease of use and
usability of milled polyimide stencils are impressive.
The SMD fine-pitch print, accurate parallel separation
of stencil and PCB and simple stencil frame clamping
guarantee a state-of-the-art stencil print. Before the
PCBs are produced a test film is printed to easily
verify the expected print result and allow fine-tuning.
The LPKF ProtoPrint S features an LPKF ZelFlex frame
but is also compatible with many other stencil frames.
The LPKF ProtoPrint S RP features an LPKF ZelFlex
frame with adapter for directly inserting size DIN A4
polyimide stencils. The polyimide stencils can be
produced on an LPKF ProtoMat.

56

LPKF ProtoPrint S and ProtoPrint S RP

SMD fine-pitch print to 0.3 mm


Parallel stencil separation
Prints assembled double-sided PCBs
Compatible with many stencil frames
Test film print
Screen printing, applying adhesives
Optional vacuum table for securing rigid
and flexible PCBs

Intelligent nesting pins


The LPKF ProtoPrint S
features freely adjustable
PCB nesting pins, allowing
the backside of assembled
PCBs to be printed.
Stencil frames such as the
LPKF ZelFlex can easily be set with height- and lengthadjustable fixing clamps. Test film printing makes it
easy to set up new print jobs.

Through-Hole Plating

The LPKF ProtoPrint S RP,


unlike the ProtoPrint S,
includes a ZelFlex frame
with adapter for use with
polyimide stencils up to a
size of 210 mm x 297 mm
(A4).

Circuit Board Plotters

The precision multi-dimensional settings (X, Y,


Z, distance and rotation of PCB and stencil) via
micrometer screws are the basis for outstanding print
results. The mechanical resolution up to a grid size of
0.3 mm/12 mil (polyimide stencils 0.65 mm/25 mil) fits
in the ultra-fine pitch range. The lever arm developed
specifically for speed-controlled parallel separation of
PCB and stencil allows the ultra-fine pitch print. The
print height can be precisely adjusted with micrometer
screws.

Laser Circuit Structuring

SMD fine-pitch print

Multilayer

Accessories

Technical Specifications:

LPKF ProtoPrint S

ProtoPrint S RP

Part no.

127067

127066

Frame dimensions

Width to 430 mm (16.9)


Length adjustable from 420 mm to 520 mm (16.5 to 20.5)
Height adjustable from 20 mm to 40 mm (0.8 to 1.6)

Max. print area

260 mm x 330 mm (10.2 x 13)

Print type

Manual

Print table adjustment

X and Y 10 mm (0.4/400 mil), 5

Max. PCB thickness

5 mm (0.2), optionally thicker

Frame type

Zelflex QR 362 mm x 480 mm


(14.3 x 18.9)

Zelflex QR 266 mm x 380 mm with


adapter (10.5 x 15)

Squeegee type

Hand squeegee, rubber, 260 mm (10.2)

Hand squeegee, metal, 180 mm (7)

Accuracy (machine)

0.025 mm (1 mil)

Double-sided print

Max. component height 15 mm (0.59)

Dimensions (W x H x D)

850 mm x 180 mm x 530 mm (33.4 x 7.1 x 20.9)

Weight

30 kg (66 lbs)

Operating conditions

Temperature: 1535 C (5995 F); humidity: 3080 %

LDS Prototyping

SMT/Finishing

The LPKF stencil printers can be upgraded with


additional squeegees, mechanical or pneumatic
stretching frame and special material feeders. These
and other options are shown starting on page 67.

Index

TechInfo

164 mm x 230 mm (6.5 x 9.1)

Technical specifications subject to change.

LPKF ProtoPrint S and ProtoPrint S RP

57

LPKF ProtoPlace S
Pick & Place Assembly System
Product:
LPKF ProtoPlace S
Part no.:
126979
Ordering info: See front sleeve

Populating PCBs with tiny components requires very


steady hands or the help of an assembly system.
The LPKF ProtoPlace S is a manual, ergonomic
Pick&Place system for professional SMT assembly.
The menu-guided navigation and LCD display virtually
eliminate the need for training.
The optional camera system with color screen supports
the operator in positioning components with precision.
For accurately placing complex SMD components,
the X, Y and Z direction can be locked in on the
manipulator. The PCB can then be fine-tuned using
micrometer screws. Pneumatics then securely and
accurately lower the component.

Accurate assembly of fine-pitch


components
Pneumatic component placement
Built-in adhesive and soldering paste
dispenser
Microprocessor control
Optional camera system to assist with
positioning components
Various feeders available
Optional vacuum table for flexible PCBs

58

LPKF ProtoPlace S

Circuit Board Plotters


Laser Circuit Structuring

Feeder carrier

Components

Accessories

Ensuring each contact on complex SMT components


meets its matching position on the PCB requires
precision. The LPKF ProtoPlace S picks electronic
components from a feeder or component tray via
vacuum. After the initial manual positioning fine
adjustments are made via the micrometer screws.
Finally, the vacuum needle places the component in
exactly the desired location.

The ProtoPlace S can be upgraded with optional


equipment. A vacuum table, a components turntable
with up to 90 component bins, stick and roller feeder
and a feeder carrier are available as upgrades. The
micro-camera and an LCD monitor are useful during
fine-pitch assembly, while a compressor and air
pressure regulator ensure the pressure required for
dispensing. A description of the various options and
accessories can be found starting on page 68.

Multilayer

Many contacts, many functions

Through-Hole Plating

turntable

SMT/Finishing

In addition to assembly the ProtoPlace S can also be


used as a dispenser for soldering paste, adhesive and
additives.

LDS Prototyping

Technical Specifications: LPKF ProtoPlace S


126979

Max. PCB size

297 mm x 420 mm (11.8 x 16.5)

Min. component size

0201 chip components

Pulse/pause duration

0.19 s/0.12 s

Dosing quantity

Min. 0.2 Liter

Component turntable position

Rear

Feeder position

Left

Adjustable air pressure

0.14 bar (1.458 psi)

Vacuum

Max. 0.8 bar (11.6 psi)

Weight

29 kg (64 lbs) depending on accessories

Dimensions (W x H x D) (with all feeders and turntable)

1000 mm x 500 mm x 900 mm (40 x 20 x 35)

Dimensions (W x H x D) (machine only)

760 mm x 250 mm x 760 mm (30 x 10 x 30)

Operating conditions

Temperature: 1535 C, (5995 F); humidity: 3080 %

Compressed air supply

8 bar (116 psi), min. 50 l/min (1.76 cfm), unlubricated, waterless

Power supply

115/230 V, 5060 Hz, 10 W

Index

TechInfo

Part no.

Technical specifications subject to change.

LPKF ProtoPlace S

59

LPKF ProtoPlace BGA


BGA Circuit Board Assembly
Product:
LPKF ProtoPlace BGA
Part no.:
111433
Ordering info: See front sleeve

Modern electronics layouts increasingly rely


on complex built-in components with many I/O
connections such as microprocessors, DSPs and
FPGAs. With these components the number of external
contacts can reach four digits. These connections are
typically in form of BGAs, combining high connection
density with excellent manageability.

Semi-automated BGA, uBGA, PLCC


and QFP component placement sized
5 x 5 mm to 45 x 45 mm

A visual inspection of the contact areas is hardly


realistic and x-ray inspection costly: accurate
placement gains importance.

Optical position monitoring

The LPKF ProtoPlace BGA will accurately assemble


BGA components, CSPs or flip-chip components. The
system can be used in development labs just as well as
for producing custom layouts or small batches.

60

LPKF ProtoPlace BGA

Granite-based
Air cushioned work table

Circuit Board Plotters


Laser Circuit Structuring

Options

Special optics and adjustable, two-colored lighting


allow the PCB pads and pins to simultaneously be
viewed and positioned on the component.

Vacuum table
Vacuum table for securing flexible or rigid PCBs with
ease. The vacuum table is compatible with the LPKF
ProtoPrint S and LPKF ProtoPlace S. See also page 67
for details.
MicroBGA
This retrofit option assists in placing the smallest
components with a pitch of 0.25 mm/0.50 mm and
a size of approx. 2 x 2 mm (0.08 x 0.08). The set
includes a micro pipette and optical converters

Multilayer

The rough and fine adjustments


are made on an air cushioned
table with micrometer screws.

Through-Hole Plating

Assembling components with


concealed pins

LDS Prototyping

SMT/Finishing

Once the component is aligned


it is automatically placed with
just a single push of a button.

126979

Max. PCB size

229 mm x 305 mm (9.0 x 12.0)

Max. size of view area

50 mm x 50 mm (2 x 2)

Min. size of view area

8 mm x 8 mm (0.3 x 0.3)

Max. size of view area MicroBGA option

22 mm x 22 mm (0.9 x 0.9)

Min. size of view area MicroBGA option

4 x 4 mm (0.2 x 0.2)

Pitch (QFP)

0.3 mm (12 mil)

Placement accuracy

50 m ( 2 mil)

Power supply

90250 V, 5060 Hz, 25 W

Compressed air supply

6 bar (87 psi), min. 5 l/min (0.18 cfm), oil-free

Dimensions (W x H x D)

600 mm x 550 mm x 435 mm (23.6 x 21.7 x 17.1)

Weight

60 kg (132 lbs)

Index

Part no.

TechInfo

Technical Specifications: LPKF ProtoPlace BGA

Technical specifications subject to change.

LPKF ProtoPlace BGA

61

LPKF ProtoFlow S and ProtoFlow S/N2


Reflow Ovens for Lead-Free Soldering
Product:
LPKF ProtoFlow S
Part no.:
126978
Ordering info: See front sleeve

LPKF ProtoFlow S/N2


126977

The compact convection oven LPKF ProtoFlow S is


perfect for lead-free, RoHS compliant reflow soldering.
The large motorized drawer automatically opens for
cooling the PCB. The special MultiZone function allows
the soldering process to be broken down into five
separate phases, each featuring its own temperature
profile. Three internal temperature sensors ensure even
and precisely controlled heat distribution across the
entire PCB surface. The LPKF ProtoFlow S also cures
adhesives and conductive polymers.
The LPKF ProtoFlow convinces in SMD reflow soldering,
curing conductive through-plating paste and other
thermal processes requiring accurate control. The
LPKF ProtoFlow S/N2 with controlled inert gas function
(nitrogen) significantly reduces oxidation during the
soldering process, optimizing the soldered connections.

62

LPKF ProtoFlow S and ProtoFlow S/N2

RoHS compliant lead-free reflow soldering


Simple menu navigation via LCD display
and arrow keys
Preprogrammed and custom reflow profiles
Process control and analysis via USB port
Motorized drawer for automatic cool-off
after soldering
Model with program-controlled inert gas
supply to reduce oxidation
Additional temperature sensors optional

Circuit Board Plotters

Ease of use
and powerful

Options

Through-Hole Plating

Temperature indicating device


(Part no. 117850)

Multilayer

The lighted process chamber


and a front window allow
a visual inspection of
the reflow process. USB
connectivity and included
system software LPKF
FlowShow allow it to be
controlled via PC. It can save
profiles and record temperature profiles in real time
even data from the four (optional) temperature sensors
which can be placed anywhere.

Laser Circuit Structuring

All parameters such as


temperature, processing
time and cool-off can easily
be set with the arrow keys
and LCD display. The attuned
parameters can be stored as
custom profiles.

LPKF ProtoFlow S

LPKF ProtoFlow S/N2

Part no.

126978

126977

Max. PCB size

230 mm x 305 mm (9 x 12)

Max. preheat temperature/time

220 C (428 F), 999 s

Max. reflow temperature/time

320 C (608 F), 600 s

Long thermal treatment: temperature/time

220 C (428 F), 64 h

Temperature stabilizing time

<5 min

PCB cooling

Two fans, adjustable speed, mounted on base

Power supply

230 V, 5060 Hz, single-phase

Max. power consumption

3.2 kW

Dimensions (W x H x D)

647 mm x 315 mm x 450 mm (25.5 x 12.4 x 17.7)

Weight

22 kg (48.5 lbs)

Operating conditions

Temperature: 1530 C (5995 F)


Humidity: 3080 %

Nitrogen pressure

28 bar (29116 psi)

Nitrogen flow rate

0730 l/h (026 cfm)

Software requirements

Windows 7 or higher, USB 2.0

Index

TechInfo

Technical Specifications:

LDS Prototyping

SMT/Finishing

LPKF FlowShow

Technical specifications subject to change.

LPKF ProtoFlow S and ProtoFlow S/N2

63

Economical Solutions for SMT Prototyping


The LPKF E Series
Product:
LPKF ProtoPrint E
Part no.:
127056
Ordering info: See front sleeve

LPKF ProtoPlace E
127055

LPKF ProtoFlow E
127065

LPKF ProtoPrint E

LPKF ProtoPlace E
LPKF ProtoFlow E

Quality at an affordable price. The LPKF E series


provides three options for efficient prototyping and
small batch production: the stencil printer LPKF
ProtoPrint E, LPKF ProtoPlace E for manual PCB
assembly, and the LPKF ProtoFlow E convection oven.
The three systems feature all the key functions and a
maximum material size of up to 160 mm x 200 mm.
Along with the LPKF ProtoMat E33 these three systems
are an especially economic solution for professional
Rapid PCB Prototyping in LPKF quality.

64

LPKF E Series

Compact and ergonomic


Super economical
For prototypes and small batches
Great for education

The LPKF ProtoFlow E convection oven offers reliable


reflow soldering across the entire PCB, including
lead-free solder materials. Its temperature limit isnt
reached until 320 C (608 F). The reflow oven with a
max. material size of 160 x 200 millimeters (6.3 x 8)
is perfectly matched to the LPKF ProtoPrint E. A drawer
window offers a view of the lighted process chamber,
and the USB connection allows the LPKF ProtoFlow E
to also be programmed from a PC for faster and easier
process analysis.

LPKF ProtoPlace E
This manual, vacuum-assisted Pick&Place system is
designed for components up to 0603 format, SO-ICs
or smaller QFPs. The LPKF ProtoPlace E features 14
antistatic component bins.

Max. PCB size

160 mm x 200 mm (6.3 x 8)

PCB thickness

0.5 mm3 mm (1280 mil)

Operating conditions

Temperature: 1530 C (5986 F), humidity: 3080 %

Through-Hole Plating

Technical Specifications: LPKF E Series

Circuit Board Plotters

LPKF ProtoFlow E

The LPKF ProtoPrint E is an inexpensive SMT stencil


printer for metal and polyimide stencils. A double-sided
quick-clamp frame for frameless stencils (Zelflex QR) is
included.

Laser Circuit Structuring

LPKF ProtoPrint E

127056

Frame type

ZelFlex QR 266 mm x 380 mm (10.5 x 15) (part of the system)

Film size (max.)

214 mm x 310 mm (8.4 x 12.2)

Print type

Manual, 220 mm (8.7)

Squeegee type

Metall, 180 mm (7.1), (included)

Printer table adjustment

X and Y 5 mm (0.2), 5

Min. grid size

0.625 mm (25 mils)

Dimensions (W x H x D)

270 mm x 115 mm x 470 mm (10.6 x 4.5 x 18.5)

Weight

8 kg (17.6 lbs)

SMT/Finishing

Part no.

Multilayer

Technical Specifications: LPKF ProtoPrint E

Part no.

127055

Min. component size

0603, mini-melf, SOIC, SOT, QFP44 (0.8 mm pitch)

Power supply (vacuum pump)

230 V, 5060 Hz, 6 VA

Dimensions (W x H x D)

485 mm x 80 mm x 280 mm (19.1 x 3.1 x 11)

Weight

5.8 kg (12.8 lbs)

LDS Prototyping

Technical Specifications: LPKF ProtoPlace E

10023178

Max. preheat temperature/time

220 C (428 F), 999 s

Max. reflow temperature/time

320 C (608 F), 600 s

Long thermal treatment: temperature/time

220 C (428 F), 64 h

Temperature stabilizing time

<5 min

Power supply

Single-phase 220240 V, 5060 Hz, 1650 W (max.)

Dimensions (W x H x D)

400 mm x 280 mm x 380 mm (15.7 x 11 x 14.7)

Weight

18 kg (40 lbs)

Index

Part no.

TechInfo

Technical Specifications: LPKF ProtoFlow E

Technical specifications subject to change.

LPKF E Series

65

Additional Options for Through-Hole Plating,


Multilayer Production and SMT Prototyping
All systems and methods are delivered to the customer complete with sufficient basic supplies.
Additional options open the door to special application areas. Here is a selection:

Accessories for through-hole plating with LPKF ProConduct


Convection oven (Part no. 115877)
The convection oven is used for curing the ProConduct paste, pre-drying
the PCB for solder resist and curing the solder resist/labeling, in about
30 minutes. With timer and precise temperature control.

Vacuum table (Part no. 115878)


Vacuum table developed specifically for the ProConduct system
for extracting excess paste prior to the curing process.

Dust extractor (Part no. 10033243)


The dust extractor ensures a consistent vacuum across the
entire vacuum table.

Accessories for bonding multilayers with the LPKF MultiPress S


Rolling table (Part no. 107050)
A rolling table with sturdy casters specifically for the MultiPress S.

Automatic hydraulics upgrade (Part no. 120744)


The automatic hydraulic unit is an extension of the MultiPress S.

66

Accessories for SMT Prototyping

Circuit Board Plotters

Accessories for the LPKF ProMask and LPKF ProLegend

Laser Circuit Structuring

UV exposer
230/240 V: Part no. 117050
110/120 V: Part no. 117192
Transfers the transparency master onto the PCB in about 30 seconds.

LPKF ProMask consumables set (Part no. 117108)


Includes ProMask solder resist, developer, conditioner, laser printer film.

Through-Hole Plating

LPKF ProLegend consumables set (Part no. 117564)


Includes ProLegend labeling paint, developer, conditioner,
laser printer film.

Multilayer

Convection oven (Part no. 115877)


See page 66.

Accessories for LPKF ProtoPrint S/ProtoPrint S RP

229 mm x 279 mm (9 x 11)

Max. compressed air

7 bar (102 psi)

Compressed air supply

1.76 bar (24.787 psi), 0.30.79 l/s

LDS Prototyping

Max. material size

SMT/Finishing

Vacuum table (Part no. 119684)


The vacuum table secures any PCB type from rigid to flexible, regardless
of their thickness. It can be transferred between systems without
breaking the vacuum. An optional ceramic slab (Part no. 125021) allows
the vacuum table to also be used for the subsequent reflow process.

Technical specifications subject to change.

TechInfo

Magnetic edge support


Magnetic edge support (4 pieces) Part no. 126507
Magnetic support pin (4 pieces) Part no. 128946
Positioning pin (4 pieces) Part no. 128947

Mechanical stretching frame


ZelFlex QR 362x480, double-sided
(included with ProtoPrint S).

Index

ZelFlex QR 266x380, double-sided


(included with ProtoPrint S RP).

Accessories for SMT Prototyping

67

Continued: Accessories for LPKF ProtoPrint S/ProtoPrint S RP


Pneumatic stretching frame (Part no. 127094)
ZelFlex Z4P 406 x 508 x 25 mm slim, four-sided
(print area 306 x 408 mm [12x16.1])

Squeegee
Various squeegees for applying solder paste.
Hand-held squeegee, rubber, 180 mm (7):
Hand-held squeegee, rubber*, 260 mm (10.2):
Hand-held squeegee, metal**, 180 mm (7):
Hand-held squeegee, metal, 260 mm (10.2):
Hand-held squeegee, Permalex, 180 mm (7):
Hand-held squeegee, Permalex, 260 mm (10.2):

Part no. 10023549


Part no. 108140
Part no. 10023958
Part no. 124870
Part no. 10023550
Part no. 122257

* included with LPKF ProtoPrint S.


** included with LPKF ProtoPrint S RP.

Test print film (Part no. 115632)


Test print film makes setting up new print jobs easier and quicker.

Polyimide film (Part no. 108321)


Set (10 sheets, 210 x 297 mm (8.3 x 11.7), 0.125 mm (5 mil) thick)

Accessories for SMT assembly with the LPKF ProtoPlace S


Micro-camera (Part no. 115040)
The micro-camera is mounted directly to the manipulator. The optional
color monitor shows an enlarged view of the component placement.
The vision system effectively supports users in placing fine-pitch
components.

LCD color monitor (Part no. 119777)


The LCD monitor displays the image transmitted by the optional
camera with detailed accuracy, allowing the smallest of components
to be positioned accurately.

Compressor (Part no. 10032687)


The compressor with 24-liter pressure tank is very quiet (40 dB) and
provides a air pressure of 8 bar (116 psi) and a volume of 50 l/min
(1.8 cfm).

68

Accessories for SMT Prototyping

Circuit Board Plotters

Continued: Accessories for SMT assembly with the LPKF ProtoPlace S

Laser Circuit Structuring

Air pressure regulator (Part no. 124919)


Air pressure regulator with water trap and 5 m particle filter mounts
to the side of the ProtoPlace S.

Through-Hole Plating

Motorized components turntable


The motorized carousel significantly accelerates components intake.
The components are stored in inscribable bins.
45 component trays: Part no. 114460
75 component trays: Part no. 114461
90 component trays: Part no. 114462

Multilayer

Feeder carrier (Part no. 115590)


The feeder carrier holds up to 12 feeders at a time.
Required for optional roller or stick feeders.

SMT/Finishing

Roller feeder
Roller feeders for components of various widths are available
for the LPKF ProtoPlace.
Roller feeder 8 mm: Part no. 116004
Roller feeder 12 mm: Part no. 116008
Roller feeder 16 mm: Part no. 116009

LDS Prototyping

Stick feeder
The LPKF ProtoPlace can be used with stick feeders for various components.
S08S028:
Part no. 101356
S08LS028L:
Part no. 101356
PLCC28PLCC44:
Part no. 101357
PLCC52PLCC84:
Part no. 103897

Vacuum table (Part no. 119684)

TechInfo

Reflow soldering accessories for the LPKF ProtoFlow S/ProtoFlow S N2

Accessories for SMT Prototyping

Index

Temperature indicating device (Part no. 117850)


A freely positionable auxiliary module with four temperature sensors
completes the LPKF ProtoFlow S. The temperature sensors detect the
precise temperatures of critical components or the PCB in real time.
The temperature curves for all four sensors are displayed on the monitor
in a temperature/time view and stored for future analysis. The profile
recorder requires a PC with USB port as well as standard software
(spreadsheet).

69

Accessories for ProtoPlace E/ProtoPrint E


Magnetic fixing pins
Set of magnetic fixing pins (Part no. 10015381)
Allows double-sided printing. Set includes:
Magnetic edge supports (4 pieces), Magnetic support pins (4 pieces),
Magnetic positioning pins (2 pieces)

Magnetic edge supports (4 pieces)


(Part no. 126507)

Magnetic support pins (4 pieces)


(Part no. 10015383)

Magnetic positioning pins (2 pieces)


(Part no. 10015385)

70

Accessories for SMT Prototyping

Circuit Board Plotters


Laser Circuit Structuring
Through-Hole Plating
Multilayer
SMT/Finishing
Table of contents

weight and costs. LPKF has developed a simple prototyping

The LDS process

72

LPKF ProtoPaint LDS

74

LPKF ProtoLaser 3D

76

LPKF ProtoPlate LDS

78

Information on the LDS Process


and Components

80

process with which 3D molded interconnect devices can be


produced in-house.

Index

Three-dimensional molded interconnect devices save space,

TechInfo

LDS Prototyping

LDS Prototyping Circuit Tracks


in the Third Dimension

LDS Prototyping

71

The LDS Process


Three-dimensional molded interconnect devices
are ideal for combining mechanical and electronic
functions. The space requirement and weight of these
parts are clearly reduced. Injection-molded plastic
parts serve as the foundation surface for mounting the
circuit tracks. That is also why they are called molded
interconnect devices (MIDs).
With MIDs, laser direct structuring (LDS) plays a leading
role. Parts that are produced from an additivized plastic
are the foundation. The part is inscribed by a laser.
The laser process exposes the additive and creates a
perfect surface for adhesion of the circuit tracks.

Laser direct-structured smartphone antennas:


LDS parts such as these are common practice
for smartphone technology

72

LDS Prototyping

Then a electroless metallization bath builds up the


circuit tracks on the structured areas. In this process,
circuit track thicknesses of ca. 10 m are possible;
a finish with nickel and gold can follow in the serial
process.
LDS technology is already established in automotive,
electronic and medical technology.

Circuit Board Plotters

Production of only one or very few parts in the injection


molding process is uneconomical and leads to high unit
costs. However, the LPKF ProtoPaint LDS spray paint
and ProtoLaser 3D system allows for circuitry to be
generated on a wider range of materials for a fraction
of the development cost.

Finally, no chemical knowledge is required for


metallization. The LPKF ProtoPlate LDS system
is specifically equipped for this task allowing for
metallization solutions to be applied to the laser
activated material.

Laser Circuit Structuring

LDS Prototyping

Multilayer

Through-Hole Plating

The ProtoLaser 3D, a compact laboratory system


specifically developed for prototyping and ultra-small
series production, is now available for laser structuring.

LDS Prototyping

SMT/Finishing

The LDS Prototyping process at a glance

2. Painting the part with LPKF ProtoPaint LDS

3. Structuring the circuit tracks with the LPKF ProtoLaser 3D

4. Selective metallization with LPKF ProtoPlate LDS

LDS Prototyping

Index

TechInfo

1. Creating the three-dimensional part

73

LPKF ProtoPaint LDS


Spray Coating of 3D Interconnect Devices
Product:
LPKF ProtoPaint LDS
Part no.:
10029743
Ordering info: See front sleeve

The basic idea of the new LDS Prototyping is in


coating any part with an activatable surface. Parts can
be, for example, plastic parts from 3D printers. After
painting, a sufficiently smooth surface is created which
allows for continuous metallization.

LDS painting from a spray can


Easy application
High covering and filling power

74

LPKF ProtoPaint LDS

The LPKF ProtoPaint LDS contains the LDS additives


on which the copper layer forms after laser structuring.
With the new LPKF ProtoPaint LDS paint, a single coat
is sufficient. The paint comes in a spray can and can be
applied quickly and easily.

Coating 3D parts with LPKF ProtoPaint LDS

Along with the ProtoPaint spray can, the set also includes test

Circuit Board Plotters

Usually one thorough cross-coat is sufficient for


coating. Then the part should be dried for at least 180
minutes at a maximum of 70 C (160 F) in a circulating
air oven. Good cross-linkage of the paint surface and
good hardening are the preconditions for reliable
metallization.

Multilayer

Through-Hole Plating

Laser Circuit Structuring

To activate the paint, the lower cap is removed and


the key ring is attached and turned a few times. After
thorough shaking, the paint is ready to use. LPKF
ProtoPaint LDS remains ready to use for approximately
four hours after activation.

parts and instructions on a DVD

LDS Prototyping

SMT/Finishing

For additional information see TechInfo


starting on page 120.

10029743

Color of the paint

Black

Shelf life or storage

Unopened, up to one year

Storage conditions

At 5 C to 25 C (41 F to 77 F), in dry storage

Processing temperature

20 C to 24 C (68 F to 75 F), room temperature

Time for becoming touch-dry

Approx. 30 minutes

Drying time

3 hours at 70 C (160 F)

Spraying distance

15 to 20 cm (6 to 8)

Relative air humidity when drying

15 % at 50 C (122 F)

Wet layer thickness

Approx. 60 m (2.4 mil) in 2 to 3 layers

Dry layer thickness

Approx. 2025 m (0.81 mil) in 2 to 3 layers

Index

Part no.

TechInfo

Technical Specifications: LPKF ProtoPaint LDS

Technical specifications subject to change.

LPKF ProtoPaint LDS

75

LPKF ProtoLaser 3D
Structuring 3D Interconnect Devices
Product:
LPKF ProtoLaser 3D
Part no.:
10032807
Ordering info: See front sleeve

Compact LDS laboratory system


Simple part fixturing
Included vision system and pilot laser

LPKF is presenting a completely new laser system


for 3D laser structuring. It is based on the proven
ProtoLaser product line and is equipped with a laser
optic system which is also used with LDS production
systems. The LPKF ProtoLaser 3D requires standard
outlet power and a laser rated vaccum/exhaust unit.
It has a height-adjustable work platform for structuring
parts of different dimensions. The working range is
300 mm x 300 mm x 200 mm (11.8 x 11.8 x 7.9)
and the scanning field is 100 mm x 100 mm x 40 mm
(3.9 x 3.9 x 1.6).

76

LPKF ProtoLaser 3D

Compact, flexible and economical


Vision system supports placement
of parts
Large movable work platform

Circuit Board Plotters

A pilot laser and an advanced vision system help with


material set-up. The laser optics of the ProtoLaser 3D
correspond to those of the LDS production systems.

For laser activation, simple inexpensive mounting of


parts is sufficient, as there are no mechanical stresses.
The vision system detects fiducials or contours of the
parts which facilitates alignment and structuring in
different positions.
For additional information see TechInfo
starting on page 120.

SMT/Finishing

Technical Specifications: LPKF ProtoLaser 3D


10032807

Structuring area (X x Y x Z)

100 mm x 100 mm x 40 mm (3.9 x 3.9 x 1.6)

Max. material size (X x Y x Z)

300 mm x 300 mm x 130 mm (11.8 x 11.8 x 5.1)

Fixturing base plate (X x Y)

500 mm x 500 mm (19.7 x 19.7)

Z travel of the base plate

200 mm (7.8), software controlled

Accuracy*

25 m (1 mil)

Laser wave length

IR range

Laser pulse frequency

10100 kHz

3D structuring speed

1000 mm/s (39.4/s)a

Diameter of focused laser beam

50 m 5 m (1.7 mil 0.2 mil)

Software

LPKF CircuitPro 3D (included)

Features

Vision system in the optical axis of the laser beam with LED illumination,
automatic suction control, controlled filter

System dimensions (W x H x D) incl. open hood

880 mm x 1820 mm x 720 mm (34.6 x 71.7 x 28.3), height with open hood

Weight

300 kg (661.4 lbs), without exhaust unit

TechInfo

LDS Prototyping

Part no.

110/230 V, 50/60 Hz, 1.25 kW

Ambient temperature

22 C 2 C (71.6 F 4 F)

Humidity

<60 % non-condensing

Cooling

Air-cooled (internal cooling cycle)

Hardware and software requirements

Internal PC, Windows 7, 1 x external USB, 1 x internal USB, 1 x DVI (included)

Required accessories

Laser rated vacuum/exhaust unit

* Calibrated scanfield

Index

Operating conditions
Power supply

Through-Hole Plating

Laser Circuit Structuring

Simple part set-up

The ProtoLaser 3D imports data from the common


layout programs and calculates the required laser paths
within the included LPKF CircuitPro 3D CAM software.

Multilayer

The ProtoLaser 3D is designed for prototyping and


ultra-small series production of LDS-painted plastic
parts or plastic parts produced with LDS plastics.
Utilizing the sturdy construction and form of previous
ProtoLaser models, manufacturing is simplified and
laser performance is highly reliable. The 500 mm x
500 mm (19.7 x 19.7) work table can be moved
200 mm along the Z-axis.

Technical specifications subject to change.

Depending on material and laser beam parameters

LPKF ProtoLaser 3D

77

LPKF ProtoPlate LDS


Electroless Metallization of 3D Interconnect Devices
Product:
LPKF ProtoPlate LDS
Part no.:
10029183 (230 V), 10029184 (110 V)
Ordering info: See front sleeve

For metallization, LPKF is introducing a ready-to-use


solution for which no chemical knowledge is required.
LPKF ProtoPlate LDS achieves electroless metallization
of structured LDS parts.

Closed system
The foundation for the metallization process is the
ProtoPlate LDS system for process control (system
enclosure, heating, beaker and magnetic stirrer) and a
combination of bath chemicals, LPKF ProtoPlate CU.
The bath chemicals are already portioned and
consecutively numbered according to the order in
which they are to be dosed.

No chemical knowledge required


Metallization in four easy steps
Production-level layer thicknesses

Layer thickness [m]

Process time at 44 C

low foam depth


low selectivity

high foam depth


high selectivity

Time [min]

Layer thickness depends on exposure time

78

LPKF ProtoPlate LDS

After metallization, the consumed bath chemicals are


put back into the canister, marked with the included
label and can then be easily disposed.

For additional information see TechInfo


starting on page 120.

1. Pour the copper solution into the beaker

2. Pour in the activator to start the metallization bath

3. Immerse the part in the bath

4. Rinse the part and the part is ready

LDS Prototyping

SMT/Finishing

Multilayer

Through-Hole Plating

The parts are then immersed in the bath. The thickness


of the copper layer, in the practically relevant range of
3 m to 10 m, primarily depends on the dwell time.

Circuit Board Plotters

The base metallization is poured from the canister into


a beaker and then heated to the working temperature
of ca. 44 C (110 F). An activator solution that is also
portioned in advance starts the process.

Laser Circuit Structuring

Four easy steps to metallization

Part no.

10029183 (230 V), 10029184 (110 V)

Enclosure size (W/H/D)

413 mm x 706 mm x 479 mm (16 x 28 x 19)

Weight

23 kg

Power supply

230 V AC, 50 Hz / 110 V AC, 60 Hz

Power input

600 VA

Ambient temperature

20 C to 24 C (68 F to 75 F), room temperature

TechInfo

Technical specifications: LPKF ProtoPlate LDS

Shelf life or storage of chemicals

Can be stored unopened for one year

Storage temperature of chemicals

5 C to 25 C (41 F to 77 F), dry

Index

Chemical set CU*

*For further details, see chemical safety data sheets and user manual
Technical specifications subject to change.
LPKF ProtoPlate LDS

79

Information on the LDS Process and Parts


LDS prototyping with the LPKF ProtoLaser 3D, ProtoPaint and ProtoPlate processes were designed to improve
development capabilities within your lab. Allowing engineers to work with materials and in volumes needed for
R&D and verify designs which are easily repeated in a high volume production capacity. LPKF supports prospective
customers with extensive LDS design guidelines and comprehensive technical papers. The complete process,
available systems, tested plastics, latest developments and practical examples are all available for review.
Support documents can be downloaded from the LPKF website and can be provided by your LPKF representative.

80

Information on the LDS Process and Components

Customer Testimonials
The LPKF ProtoMat is small and easy to use. It is very useful to make all kinds of small-series PCBs.
And it corresponds fast to design changes!
Tomokazu Watanabe
DENSO CORPORATION
Japan

Enercon has been using a ProtoMat S62 for years: as a leading manufacturer of innovative wind
power plants, the ProtoMat hardly ever gets a break: we use it to produce various test equipment,
but also measuring adapters, receiving devices and signs for wind power plants throughout the world.
The materials we use are e.g. plastic, hard paper, aluminum or GRP. The LPKF ProtoMat yields perfect
results within short periods.
Holger Lbben
Enercon GmbH
Aurich, Germany

When it comes to implementing precision RF designs on ceramic materials, the ProtoLaser S is


clearly more advanced than conventional methods. Instead of four weeks we now only need a few
hours for our high frequency boards. The outstanding geometric accuracy and clearly laid out
controls of the laser system allow us to also produce sophisticated PCBs in small batches or on
demand.
Michael Kuri
Fraunhofer Institute for Applied Solid State Physics
Freiburg, Germany

Qualified training is the best recipe for a successful start to a career. SICK AG has recognized this and
also relies on professional equipment for training. Our training departments feature an LPKF ProtoMat
S62. The S62 is constantly in use and has proven to be extremely reliable.
Our trainees transform theoretic knowledge into functional printed circuit boards in the process
learning all about prototyping methods.
Nico Zimmermann
SICK AG
Waldkirch, Germany

Customer Testimonials

81

LPKF StencilLaser G 6080

LPKF Fusion3D 6300

LPKF Fusion3D 1500

Specialist in Micromaterial
Processing
Our high-precision milling technology goes all the way back to the companys beginnings.
LPKF developed additional business segments and markets such as automotive, consumer
electronics, and medical and solar technology based on precision drives and controls, and the
laser as a tool. In addition to sophisticated methods for producing circuit board prototypes and
small batches, the company also offers laser systems for micromaterial processing.

Building powerful milling plotters requires a great range of skills.


Control systems and precision drive technology laid the foundation,
experience and continued enhancements to products and methods
account for the rest. LPKF has been dedicated to circuit board
prototyping for more than 35 years, and this expertise is built into
each milling plotter.
At the end of the 1980s, the laser became an item of interest for
industrial production: the laser promised new production forms and
technologies. LPKF has delivered on this promise and in 1993 already
provided the first laser systems for manufacturing electronics. Ever
since, laser technology at LPKF in the micromachining of materials
has been playing an ever increasing role.

82

LPKF Product Lines

Laser
technology
& optics

Materials
technology

Micromaterial
processing
with lasers
Precision
drive
engineering

Control
technology
& software

LPKF MicroLine 2000 Si

LPKF MicroLine 6000 S

LPKF MicroLine 1000 S

Soldering paste stencils


with LPKF StencilLasers

LPKF MicroLine UV laser systems for


cutting PCBs and cover-layers

LPKF is a worldwide leading


supplier of StencilLasers
featuring groundbreaking
technology for producing
SMT soldering paste stencils
and micro-cutting parts. LPKF StencilLasers are
characterized by accuracy, reliability and high capacity.
LPKF offers a wide range of machines for any cutting
application imaginable, with material thicknesses up to
1000 m.

LPKF MicroLine UV laser systems are production


machines for non-contact contour cutting/depaneling
flexible and flex-rigid interconnect devices without any
burrs, and for making apertures in cover-layers
with utmost precision and
flexibility. Changeover times
when switching products are
reduced and reworking costs
are eliminated.

Laser direct structuring (LDS) threedimensional interconnect devices


LPKF 3D laser systems are designed specifically for
producing three-dimensional interconnect devices
(MID). Components combine mechanical and electrical
functions in confined spaces. Previous methods for
producing MIDs required expensive product-specific
tools to create the circuitry on
the component. The patented
LDS method allows ultrafine conductive patterns to
be transferred right from the
layout to the component, using
LPKF 3D laser systems.

LPKF MicroLine laser systems


are designed for cutting
assembled and unassembled
circuit boards. User-defined
panels can quickly be cut from
larger circuit boards without
mechanical stress. Electronic
components can be positioned
closer to the edge and the
electronic design engineers benefit from maximum
design freedom.

LPKF Product Lines

83

LPKF TwinWeld3D

LPKF Allegro

LPKF PrecisionWeld 3000

Laser Plastic Welding


Laser plastics welding offers
technological and economic
advantages compared to
conventional plastics welding.
The plastics welding division
is focused on this innovative
technology, supporting users during implementation,
and offers systems for stand-alone and in-line
manufacturing.

Laser systems for


structuring thin film
solar modules
Thin film solar modules feature
lower production costs and
enhanced low-light properties
compared to crystalline
modules, which is why its market share keeps growing.
The Allegro series laser scribing systems with their
precision, high output and innovative technological
details contribute to the production of increasingly
more powerful modules with sinking production costs.

84

LPKF Product Lines

LPKF PowerWeld 2600

Service for industrial micromaterial


processing with the laser
LaserMicronics GmbH offers an extensive service in
industrial laser micromaterial processing and process
development. The range includes all current LPKF
technologies from process development and process
optimization to small or large series production.
LaserMicronics GmbH manufactures at the Garbsen
and Frth locations under strict observation of the ISO
9001 quality guidelines.
LaserMicronics provides
support in the development
of production processes and
also uses LDS Prototyping
in collaboration with the
customers developers.
Then small and large series
production of LDS components can also be done there.

Circuit Board Plotters


Laser Circuit Structuring
Through-Hole Plating
Multilayer

Process Steps of PCB Prototyping

86

Basic Knowledge of PCBs

88

LPKF Software Intelligent Helper


for Prototyping

90

Structuring and Machining PCBs

92

This technical information provides an introduction to the innovative

Laser Micromachining Materials

94

prototyping solutions offered by LPKF. One comprehensive system

PCB Structuring with the ProtoLaser S

96

It takes only a few hours from the design to the finished prototype, without
the design data leaving the company. In addition, the LPKF processes
are suitable for in-house production of small series on demand. LDS
Prototyping is an economical and reliable way to produce new products;
there is more on the process and the systems starting on page 120.

Structuring Printed Circuit Boards


with the LPKF ProtoMat D104

100

Selecting the Mechanical Systems


for PCB Structuring

102

Multilayer: Fabricating and Laminating 104


Center-Punching, Drilling and
Cutting-Out

106

Systems for Through-Hole Plating

107

LPKF ViaCleaner A Pinpoint Solution 110

LPKF prototyping that means: reliable results and close-to-production


product samples in a short time and in an environmentally friendly fashion.

This catalog does not replace the manuals for the individual products.
Always observe the safety precautions and particularly the statutory
regulations.

Comparison of Through-Hole Plating


Methods

111

Solder Resist and Screen Printing

112

Solder Paste Printing

113

SMD Assembly

114

Reflow Soldering

115

Applications

116

Upgrades for the ProtoMats

119

3D Molded Interconnect Devices

120

Technical Information

85

LDS Prototyping

(PCBs) in house.

The All-Purpose Tool: The ProtoLaser U3 98

TechInfo

allows you to manufacture production quality printed circuit boards

Index

Technical Information

SMT/Finishing

Table of contents

Process Steps of PCB Prototyping


From concept to finished product after being designed with the design software the PCB must
physically be manufactured. During the first step a circuit board plotter or a laser system creates
the circuit tracks on a substrate. Additional process steps quickly result in a functional PCB.

Structuring PCBs
The LPKF ProtoMat series circuit board plotters set
worldwide standards in precision, flexibility and ease
of operation. The equipment mills the structure of
the printed circuit board on a fully coated substrate.
The LPKF circuit board plotters significantly reduce
production times of PCB prototypes and therefore
the development time of new products. High-speed
spindles with speeds ranging from 33000100000
rpm, a mechanical resolution of up to 0.25 m
(0.01 mil) as well as a very high repeatability ensure
the finest structures are produced even in RF and
microwave applications. Multilayer PCBs and the
plug-in assembly of electronic components require
drill holes.

86

Technical Information

Even these drill holes are produced by the LPKF


ProtoMat systems.
When it comes to extreme precision two laser
systems set new standards: the LPKF ProtoLaser S
and U3 offer tool-less and non-contact structuring
and are already preconfigured for many substrates
and conductive coatings. With their special
capabilities regarding RF boards and ceramic
materials, these systems are unique worldwide.
Both worlds come together in the new ProtoMat
D104: mechanical structuring is supplemented by
an additional laser tool if individual areas require
especially high precision.

Circuit Board Plotters

Fast structuring with LPKF


circuit board plotters
Easy and reliable: multilayer
with up to eight layers

Surface Mounted Technology (SMT)

Separating PCBs
Separating the PCBs from a larger panel is another
task performed by the LPKF ProtoMat. One or more
boards are arranged on a substrate and singularized
with a milling machine or the LPKF ProtoLaser U3.
Solder resist
The use of solder resist is often essential in SMD
assemblies. Applying a solder resist mask to
the PCB prevents subsequent short-circuits and
corrosion.

Multilayer
SMT/Finishing

Solder paste stencils


An SMD solder paste is applied onto all pads to be
assembled using a solder paste stencil. Prototyping
stencils can be produced with an LPKF ProtoMat or
laser system. They are then printed using a special
stencil printer such as the LPKF ProtoPrint S.

LDS Prototyping

Multilayer
Even complete multilayer circuits can be produced
within a short period with professional results. The
LPKF MultiPress S provides developers with a stateof-the-art multilayer lamination press for in-house
production.

Legend printing
LPKF also offers an ecological and easy-to-use
solution for labeling the PCB with the components
or the manufacturers logo the ProLegend.

SMD assembly
Assembling SMD components onto the PCB
requires high accuracy. Therefore a semi-automatic
assembly system such as the LPKF ProtoPlace S
is used for PCB prototyping, where the exact
placement of the elements is monitored via a
camera system.

TechInfo

Drilling and through-hole plating


Another process step is the through-hole plating
of PCBs. Through-hole plating can be voltaic, with
a paste or a riveting technology, depending on
the application field of the PCBs and the technical
requirements. LPKF offers professional systems
for all methods.

In-house SMT prototyping saves time and contributes


to ensuring sensitive data is not needlessly made
accessible to third parties. SMT prototyping requires an
accurately coordinated production system.

Reflow soldering
The last production step in SMT prototyping is
reflow soldering. The lead on the PCB is carefully
heated in a reflow oven at a predefined temperature
profile. This melts the solder paste and connects
the PCB and components.

Index

SMT is a design principle where tiny electronic


components are applied directly onto a PCB. These
components are SMDs (surface mounted devices).
SMT prototyping includes solder paste printing as
well as SMD assembly.

Through-Hole Plating

Laser Circuit Structuring

Complete in-house finishing

Technical Information

87

Basic Knowledge of Printed Circuit Boards


The PCB not only holds electronic components but also provides their electronic connection
through PCB tracks, shielding against electronic fields or thermal conduction. With increasing
complexity, more tracks and components must fit into the same space and prototyping offers
various technical solutions.

Single-sided PCBs

Double-sided PCBs

The substrate of a single-sided PCB consists of an


electrically isolating substrate coated with a conductive
material. Primarily FR4 substrates are used, a fiberglass reinforced epoxy resin with the conductive layer
typically made from copper. The copper application is
indicated in copper thickness (micrometers or m) or
copper weight (oz ounces per square foot). Typically
lamination thicknesses of 35 m (1 oz) are used. For
some applications the copper is also coated with an
additional metal such as nickel, tin or gold (surface
finish). The FR4 substrate varies in thicknesses ranging
from 0.25 mm (10 mil) to 3.125 mm (125 mil). The most
common substrate thicknesses used are 0.74 mm
(29 mil) or 1.5 mm (59 mil).

On double-sided PCBs the bottom face of the board


is also coated with conductive material generally
copper in addition to the top face. The LPKF circuit
board plotters feature a mechanical passer system or a
camera which automatically captures the position when
drilling and milling double-sided PCBs. This ensures the
structures on the top and bottom of the double-sided
PCB are identical. The two ProtoLaser systems each
come with a vacuum table and a vision system.

88

Technical Information

TMM substrate and PTFE substrate

Flexible and rigid-flex PCBs


Flexible PCBs typically consist of polyimide films with
copper tracks. Rigid-flex PCBs are formed by combining
flexible substrates with rigid PCBs. Producing rigid-flex
PCBs is similar to multilayer boards.

Circuit Board Plotters


Laser Circuit Structuring
Through-Hole Plating

RF or microwave PCBs are made from materials


with special electrical and mechanical properties, for
example fiberglass-reinforced polymer resin with the
addition of RO4000 ceramic particles and many more.
Machining these sometimes highly sensitive surfaces
and the exact geometries requires maximum precision
circuit board plotters with high spindle speeds or the
LPKF ProtoLaser S ensure a precise match between
design/simulation and structuring result.

Multilayer

RF and microwave circuits

SMT/Finishing

Multilayer

LDS Prototyping

Multilayer
Multilayer refers to PCBs with multiple layers. They are
laminated from multiple layers of PCBs and insulating
material. In theory the number of conductive layers
insulated from each other is infinite. Multilayers can be
assembled with double-sided structured PCBs in the
inner layers and single-sided PCBs in the outer layers.
A through-hole plating process adapted to multilayers
is required in order to create the electrical connections
between the individual layers.

Index

TechInfo

Flexible and rigid-flex substrates

Technical Information

89

LPKF Software Intelligent Helper for Prototyping


Precision counts which makes controlling modern prototyping systems unthinkable without
sophisticated software. LPKF CircuitPro is the latest generation powerful CAM and machine
software. It combines data preparation and system control in one program.

Already during the installation process LPKF


CircuitPro checks which prototyping units will be
used and includes them in the production process.
LPKF CircuitPro transfers design data from CAD/EDA
systems. The process planning assistant prompts on
important points such as the number of layers, the
material used and the type of finishing. Step by step,
the project parameters are created.

Then it comes down to optimizing the data for


prototyping. After that the Design Rule Check is
initiated: it determines whether the design can actually
be physically machined with the existing tools, such as
indicating if the conductor path spacing is too small.

90

Technical Information

Circuit Board Plotters


Laser Circuit Structuring
Through-Hole Plating
Index

TechInfo

The assistant indicates user interaction required during


the machining process of the blank. This can be actions
such as turning the machined board, throughplating
or a tool change. If in the end the project is saved, all
production data will be immediately available for the
next run.

Multilayer

The project is then placed on the previously empty


virtual work surface and production could technically
start now. At this point multiple PCBs for a project can
be positioned on one board. This allows multiple PCBs
to be manufactured from a base material.

SMT/Finishing

Additional production controls are handled by the


Production Assistant, which guides the user through
the production process. After switching from CAM to
machine view the LPKF CircuitPro prompts for material
properties and defines the position on the working
table.

LDS Prototyping

In the next step the LPKF CircuitPro produces milling


lines for isolating conductor paths and the contours
for cutting out the PCB both with the Technology
Dialogue. One action combines all tasks specific to the
PCB.

Technical Information

91

Structuring and Machining PCBs


After designing the circuit, the planned layout must be transferred onto a board. In PCB
prototyping the negative method prevails: insulating areas are milled into a fully coated PCB.
The insulating channels form the contours of the tracks and pads. Depending on the requirements,
two finishing options are available: mechanical structuring through milling and laser structuring.

Creating circuitry through contour milling


During the milling process the PCB layout of the outer
and inner layers is transferred onto the substrate.
During this process the conductive material is removed
from the insulating substrate using a high-speed milling
machine.

Single and double-sided PCBs and multilayer

The higher the speed, the finer the tools that can
be used for milling. This is particularly beneficial in
substrates for RF applications. The maximum speed of
the milling spindle determines how fine the structures
can be and the smallest possible drill diameter.
All PCB tracks and soldering areas are first edged
with the standard milling cutter. This ensures clean
and identical edge geometries, which has a positive
impact on the electrical properties of a PCB. A small
milling cutter is only used in areas with small insulating
spacing. Larger insulated areas are automatically milled
out with the largest possible milling tool to save time
and money.

Wiring systems are created by milling contours

Some milling tools for structuring PCBs have a conical


point. At the beginning of the milling process the
milling width and along with it the minimal insulating
distance is determined based on the milling depth in
the substrate (immersion depth).
There are various methods for adjusting the milling
depth: if an automatic tool change is installed, the
drilling and milling tools are automatically changed
during the milling process. The tool change is combined
with an automatic milling width adjustment. This
facilitates unattended machining. In manual tool
changes the milling depth is adjusted with a
micrometer screw.

Interconnect device for RF and microwave technology

92

Technical Information

Since the layers in composite materials have different


ablation thresholds the patented process of targeted
etching is used in laser structuring. Here the laser beam
first creates the PCB track structure on the surface of
the PCB with a precisely metered energy input, then
systematically removes the conductive layer typically
copper using less energy, without compromising the
substrate of the PCB. This patented process allows the
laser to be used for direct structuring PCBs made from
laminated materials at an etching rate of up to 6 cm2/
min. Since this has minimal impact on the substrate
the measured insulating resistances comply with the
requirements of IPC standard TM 650.

Powerful machine software

LPKF ProtoLaser S

FR4 PCB structured with ProtoLaser S

Circuit Board Plotters


Index

TechInfo

LDS Prototyping

The CAM software LPKF CircuitPro is the basis for


easy operation of the LPKF ProtoMats. It converts the
designs from common design programs into control
data for the structuring systems, allows optimizations
to the layout elements and offers check routines.
This enables any user to create individual pieces and
small batches with ease. LPKF systems are ideal for
high-performance, analog, digital, RF and microwave
applications. Options such as a vacuum table or the
vision system further simplify handling and reduce the
required user interventions to a minimum.

Laser Circuit Structuring

The LPKF ProtoMat D104 is a combination of a


mechanical processing system and a laser. The
laser works only by vaporization and is used only in
especially fine areas. It can drill, engrave and cut circuit
boards an ideal combination of both machine types.

Through-Hole Plating

Laser offers the best conditions for direct structuring


copper-plated PCBs. High precision and edging
accuracy qualify the laser process particularly for
RF layouts. Laser micromachining convinces with
high energy densities in the smallest areas, excellent
focusing capabilities and free control of the laser spot.

Multilayer

Laser structuring

When structuring purely ceramic interconnect devices


the conductive metal layers are vaporized with high
laser energy, not etched. Here the laser implements
an isolation gap of 25 m. With this material class the
LPKF ProtoLaser S can also be used for separating the
material. For drilling and cutting laminated PCBs we
recommend combining it with an LPKF ProtoMat. The
new ProtoLaser U3 can do both: It structures laminated
substrates and then cuts them out of larger boards.

SMT/Finishing

The change is controlled via the system software,


LPKF CircuitPro. The service life of the various tools
is stored in the control software. A warning message
indicates the pending tool change. The acoustic cabinet
on the LPKF circuit board plotters minimize noise
emissions. They further ensure optimal occupational
safety in any working environment.

Technical Information

93

Laser Micromaterial Processing


There is a fundamental difference between laser light and conventional light, in several aspects in fact.
Laser light is monochrome; it only has a marginal spread spectrum. At the same time laser beams can
easily be bundled the high amounts of energy are concentrated on an area closely limited to the
diameter of the beam. The focus of the laser has a higher energy density than the surface of the sun.

The wavelength of the laser changes depending on


the source emitting the laser a crucial aspect of a
wide range of applications. The different materials
have different absorption properties. The higher the
absorption of a material the more energy is transmitted
by the laser.
The laser energy brought to the material is split into the
effects:
Transmission the part of the laser light which
goes through the material.
Reflection the part of the laser energy reflected
by the material.
Absorption the energy effective in the material.
The laser applies energy onto the material without
touching it. The absorbed energy activates electrons
in the target material. This results in three kinds of
effects:

In addition, photochemical reactions can be evoked


in suitable materials. Laser processes are tool-less
processes, meaning they require no tools. This makes
the process cost-effective, quick and sturdy.
Laser micromachining is one of the core competences
of LPKF. Lasers cut, drill and structure. Lasers machine
thin multilayers, rigid, rigid-flex and flexible PCBs.
They are ultra precise, gentle and quick. Engraving,
scoring and marking were typical applications for
first-generation laser systems. Over the years the
application spectrum has broadened, for example
invisible, micro-structured layouts on films and
glass mediums for touch screens.
Micromachining of ceramics is gaining importance.
Lasers can be used for direct structuring by vaporizing
a conductive coating as well as for precision cuts in
material.

The applied energy breaks up chemical bonds


The material fuses from the applied energy
High pulse energies vaporize the material

Laser beam

Reflection

Absorption

Transmission

Only the absorbed energy is effective in the component

94

Technical Information

Absorption values vary depending on laser wavelength and materials

Index

TechInfo

LDS Prototyping

SMT/Finishing

Multilayer

The specific wavelength of the UV laser enables gentle


ablation and precise contours. Because the depth of
laser machining can be controlled, the ProtoLaser U3
can perform structuring, engraving, and depaneling in
one pass.

Circuit Board Plotters

The LPKF ProtoLaser U3 is equipped with a UV laser,


which can be used to perform a multitude of tasks due
to its high beam quality and absorption properties. The
system can cut and drill or depanel boards made of
nearly any material even delicate ceramics without
stressing the material. With expert control of the overall
system, the ProtoLaser U3 can now also precisely
structure and machine laminated substrates such as
FR4.

Laser Circuit Structuring

LPKF ProtoLaser U3

The LPKF ProtoLaser S stands for efficient prototyping


of complex digital and analog circuits, RF and
microwave PCBs up to a size of 229 mm x 305 mm (9
x 12). The system can be used for non-laminated and
laminated PCBs. The ProtoLaser S structures an A4
size layout in about 20 minutes. Track thicknesses of
50 m and gaps of 25 m with exact geometries can
be produced on ceramics. The precise process control
also allows circuits to be produced based on aluminumcoated PET films, copper-coated FR4, ceramic and
RF substrates.

Through-Hole Plating

LPKF ProtoLaser S

Technical Information

95

PCB Structuring with the LPKF ProtoLaser S


The ProtoLaser S transfers circuit layouts onto the PCBs with previously unseen speeds and precision.
Its the only laser system also suitable for direct structuring laminated substrates. The compact system
can structure PCBs up to a maximum layout area of 229 mm x 305 mm (9 x 12). The LPKF ProtoLaser
S works in the near infrared range. With this it creates complete layouts on PCBs without chemicals.

Another dimension of prototyping

Laser structuring of laminated PCBs

The ProtoLaser S masters both the delaminating and


vaporizing methods of structuring and is therefore
nearly independent from the substrate material. The
process control allows copper-coated FR4 material
to be structured just as easily as aluminum-coated
PET film. Even thermoplastics such as PTFE as well as
ceramic filled and purely ceramic substrates from RF
technology are suitable as substrates. On ceramics a
track width of 50 m and 25 m gaps can be produced
with exact geometries. Its high precision and edge
accuracy make the ProtoLaser S recommended for
use wherever precise, steep edges are required. The
reproducibility of the results surpasses mechanical,
tool-bound or chemical processes. The non-contact
laser process particularly shows its strengths on
flexible and delicate materials.

The LPKF ProtoLaser S applies a patented process on


laminated PCBs. First, the laser structures the outlines
of the circuit and then delaminates the copper layer.
Superfluous copper comes off in chunks. With this
setting the ProtoLaser S will structure a complex design
layout at A4 size in a mere 20 minutes.

Laser structuring ceramic interconnect


devices
In purely ceramic interconnect devices without an
adhesive layer between the conductive material and the
substrate the ProtoLaser S utilizes an alternate method.
An ultrahigh-energy laser beam fuses the affected
material within fractions of a second. Due to its
temperature resistance the ceramic substrate remains
intact. Insulation spaces of 25 m and track widths of
50 m can be realized on these materials.
Even when it comes to power electronics applications
the ProtoLaser S is a great fit. Vaporization will also
structure thick-film boards: the laser beam is guided
over a position multiple times until the conductive layer
has been removed.

96

Technical Information

Circuit Board Plotters

Mass-production quality in-house

Cu (18 m) on FR4

Multilayer

Through-Hole Plating

Laser Circuit Structuring

Sophisticated applications fabricated from substrates in mere minutes with the LPKF ProtoLaser S.

PTFE

25 m

LDS Prototyping

SMT/Finishing

50 m

Ceramic

RF structure, Au on Al203 ceramic

Semi-flex material, Cu layer thickness 18 m

Technical Information

Index

TechInfo

Al (15m) on PET film

97

An All-Purpose Tool: The LPKF ProtoLaser U3


The ProtoLaser U3 is a universal tool for material micromachining. The UV laser system can cut,
drill, or structure nearly any material. Prototyping tasks that were previously prohibitively complex
and expensive or had to be done by external service providers can now be performed with the
LPKF ProtoLaser U3.

The LPKF ProtoLaser U3 is also capable of structuring


uncommon materials such as TCO/ITO layers. With a
precisely controlled energy density, the laser beam
can generate the finest structures with an extremely
high accuracy. The UV laser can also cut through solder
masks and protective films.
The high pulse energy of the UV laser leads to nearly
residue-free ablation. The targeted material evaporates
quickly. For drilling and cutting, the laser beam can
achieve clean edges and precise contour geometries.
The ProtoLaser U3 guarantees high repeatability.
The perfect focal point position for the laser is set
automatically; a camera localizes the workpiece
position using registration marks. The integrated
vacuum table reliably keeps even flexible and thin
substrates in place, enabling complex contours to
be cut without mechanically stressing the material.

ProtoLaser U3 for prototyping


and small batches
The LPKF ProtoLaser U3 is ideal for prototyping and
small batch production on demand. It can be used
to machine various materials quickly, cleanly, and
precisely. The UV laser beam can be used for many
applications, including accurate contactless depaneling
and cutting of LTCCs and prepregs. The ProtoLaser U3
can depanel boards made of all types of materials
without creating stresses, with flexible contours,
and with or without components mounted.

Drilling, cutting and structuring


The ProtoLaser U3 can cut holes and microvias to a
minimum diameter of just 100 m in HDI boards. The
laser beam pierces through the copper layer and then
the epoxy resin and glass fiber substrate.

98

Technical Information

Parameter library for easy operation


and flexibility
The efficient CAM software imports existing
CAD data and converts them to laser processes.
Changes to the circuit layout can be made in
mere minutes as pre-configured parameters
are available for the numerous applications. A
large parameter library provides the settings
for the main materials the user mode
makes processing saved projects easy. The
administrator mode provides full control of all
system settings.

Circuit Board Plotters

Peak performance in laser machining

Structuring micro-tracks in etch resists

Structuring, engraving, drilling, and

TCO/ITO: Invisible conductive lines on

(e.g. electroless tin)

depaneling in a single pass: the ProtoLaser

transparent materials

Through-Hole Plating

Laser Circuit Structuring

The UV laser cuts, drills and structures a wide range of materials.

U3 can also handle delicate LTCC

Laser-structured FR-4 boards feature

Accurate cuts in populated and

and cut out on RO 5880 material

high agreement between layout and actual

unpopulated materials even complex

geometry

shapes: ceramics, polyimide and FR4

Index

TechInfo

LDS Prototyping

Microwave filter circuit sample structured

SMT/Finishing

Multilayer

ceramics.

Top results on delicate ceramic materials

Technical Information

99

Structuring Printed Circuit Boards with the LPKF ProtoMat D104


The ProtoMat D104 is primarily a ProtoMat for mechanical processing of circuit board materials
but it has a unique additional tool; a compact UV laser is included for surface metal etching.
The ProtoMat D104 is thus a hybrid of a laser etching and circuit board plotter combining these
possibilities in an inexpensive system.
Just to be clear, the lower power UV laser in the D104
system cannot keep up with the higher power LPKF
laser models as more expensive scanner optics are
not included. The lower power limits this laser to
precision surface laser etching to create especially
fine structures. In addition, it increases the precision
substantially and creates geometrically optimal
conductor tracks. That is important for ultra-fine
conductor applications as well as digital and RF circuits.
The ProtoLaser systems can guide the laser beam
at lightning speeds over the material, thanks to the
scanner optics. In the case of the ProtoMat D104, the
laser trace is obtained by means of head and table
movements, without impairing precision.

The D104 laser achieves a mechanical resolution of


50 m lines and 15 m space (65 m pitch) on FR4
material.
In practice this means that the ProtoMat D104
automatically chooses the required tools. Each
structuring task that requires a finer mechanical
resolution than the installed milling tool provided is
done automatically with the laser. Structures smaller
than 100 m are completed with the D104 laser as
tooling this small is either not available or the costs and
very short tool life is undesirable. Also, if only a 200 m
milling tool is available in the tool magazine, 150 m
structures are also created by the laser. An integrated
vision system ensures that laser lines and conventional
structures seamlessly merge.

Reworking RF structures
With a special processing routine, the throughput of the LPKF ProtoMat D104 is increased with large, highly
precise circuit elements. The contours of the circuit are initially exposed with the UV laser. Then the larger
insulation structures can be carved out with conventional milling tools. If necessary, further insulation can be
done with the UV laser in the case of tight layouts.
This also applies to sharp angles in the layout. Whereas the radius capability of a milling tool is limited to half
the diameter, the 15 m laser beam generates an even smaller radius in all corners.

100

First step: forming fine geometry with the

Then processing larger surfaces with

UV laser

milling technology (removing copper)

Technical Information

An RF filter produced in prototyping

Circuit Board Plotters


Laser Circuit Structuring
Multilayer

Overview of applications

Through-Hole Plating

Design and result: The red lines show the router path; the green lines represent the laser machining. Tool changeover is done by the system software

RF filters on different materials, exact geometry

TechInfo

LDS Prototyping

SMT/Finishing

due to laser processing on the Cu edge

HDI board with ultra-fine structures, processing


with UV laser and milling/drilling technology in
one system

Index

Fine-pitch stencil for applying soldering paste,


created with UV laser

Technical Information

101

Selecting the Mechanical Systems for PCB Structuring


LPKF offers a complete line for manufacturing fully equipped PCBs. The first step is structuring
the PCB tracks. Depending on the application requirements there are generally two processes:
mechanical or laser-based.
LPKF circuit board plotters

Milling and drilling RF and microwave substrates

A spectrum of mechanical PCB structuring covers the LPKF

RF and microwave prototypes use special substrates

ProtoMat series circuit board plotters. LPKF circuit board plotters

such as ceramic-filled (RO4000) substrates, and require extremely

differ in the size of work space, spindle speed and features. They

precise structuring. LPKF circuit board plotters with high-speed

can be categorized by the maximum PCB size:

spindles produce just these fine structures with high accuracy.


Custom hard metal tools produce straight edges and reduce the

S series up to 229 mm x 305 mm (9 x 12)

substrate penetrating depth.

X 60 up to 650 mm x 530 mm (25.6 x 20.8)


E 33 up to 229 mm x 305 mm (9 x 12)

Milling and drilling multilayers with

D104 up to 229 mm x 305 mm (9 x 12)

up to 8 layers
LPKF circuit board plotters are key components in manufacturing

The spindles on the LPKF circuit board plotters S63, S103, D104 and

multilayer prototypes. Prototypes with up to eight layers can quickly

X60 with maximum speeds of 60000 or 100000 rpm respectively

and easily be produced using an LPKF ProtoMat in connection with a

can easily produce structures down to a size of 100 m and drill

through-hole plating system such as the Contac RS and a multilayer

holes smaller than 0.4 mm. Another unique feature is the Z-drive,

press such as the MultiPress S. The use of a fiducial camera is

which allows the setting of limits on the spatial processing of

recommended for accurate positioning when producing multilayers.

components such has mounts or housing components.


Flexible and rigid-flex circuit milling
Milling and drilling single- and double-sided PCBs
The main application of the LPKF circuit board plotters

Some ProtoMats feature a vacuum table which ensures


the PCB materials are firmly secured to the work surface. A high

is the production of sophisticated PCB prototypes. They mill PCB

spindle speed helps to safely structure and separate these delicate

tracks and gaps to 100 m (4 mil) and drill holes to 200 m

boards.

(8 mil). Prototypes are produced right from the original CAD data,
including precise geometries for BGAs, fine-pitch SMT, RF and
other applications.

Application

ProtoMat
S103

S63

S43

E33

D104

X60

Milling and drilling single- and double-sided PCBs

Milling/drilling RF & microwave substrates

Milling/drilling multilayers with up to 8 layers

Contour routing of PCBs

Milling flexible, rigid-flex PCBs

Engraving front panels/labels

Machining cut outs in front panels

Milling/Laser structuring* of SMT soldering paste stencils

Housing production

Wave solder pallets

Reworking PCBs

Test adapter drilling

Inspection templates

Depanelization of populated boards

Ultrafine conductor structuring <200 m pitch

Metal layers on ceramics

Reworking of RF structures

* Only applies to the ProtoMat D104


102

Technical Information

LPKF circuit board plotters are always well suited for

LPKF circuit board plotters engrave plastic,

accurately structuring soldering jigs and inspection templates.

extraordinary precision.
Ultrafine conductor structuring
Machining cut-outs in front panels
easily mill cut-outs, even in aluminum front panels.

In high-resolution, high-density electronics


components, the connector contact pin spacing is tight, while
at the same time the number of contacts required is large.
This necessitates very fine conductor structures.

Milling SMT solder paste stencils


Metal layers on ceramics

Polyimide stencils are especially important in the

Metal layers on fired ceramics are used in harsh

production of SMT PCBs, as theyre required for solder paste

environments. This material combination is sensitive to mechanical

printing.

stresses, but at the same time places high requirements on the


Housing production

mechanical qualities of the tools. The laser has clear advantages

The LPKF circuit board plotter can not only machine

here, because the processing is done without mechanical stresses.

flat housing fronts and labels. Using a Z-axis (up to 50 mm) housing
Reworking of RF structures

parts can be produced at the prototype lab.

RF structures are dependent on steep circuit track


Wave solder pallets

flanks so as to exclude perturbations. The LPKF ProtoMat D104 can

Soldering jigs secure the PCBs during soldering. LPKF

quickly carve out the rough structures with mechanical tools and

circuit board plotters with multiphase-motor driven Z-axis are ideal

Laser Circuit Structuring

LPKF ProtoMats with high milling speeds quickly and

Through-Hole Plating

Plexiglas, aluminum, brass and other front panels and labels with

Circuit Board Plotters

Inspection templates

Engraving front panels/labels

perform the last finishing with the laser tool.


Multilayer

for milling the designs into thick heat-resistant materials such as


Dispensing

aluminum or durostone.

The dispenser accurately applies solder paste to the


Depanelization and rework

PCB using compressed air supply.

An LPKF ProtoMat can effectively be applied for


separating units of populated and unpopulated PCBs. LPKF circuit
board plotters are also suitable for rework.

A chart containing technical specifications and system features


SMT/Finishing

of the individual ProtoMats can be found on page 18. It is


Test adapter drilling

followed by other system options and tools.

LPKF ProtoMats with high spindle speed and Z-axis


controlled by a multiphase-motor are perfect for drilling individual
adapter plates on needle bed test adapters.

LDS Prototyping

Application notes

LPKF recommends the S103 or D104 for primarily RF/microwave products.


LPKF recommends the optical fiducial recognition for increased accuracy and ease-of-use (the camera system is standard on the S63, S103 and D104).

TechInfo

A vacuum table is required for flexible substrates, sold separately for the S63, standard on the D104 and S103.

LPKF recommends the D104, S103 or S63 for routing aluminum front plates.
A vacuum table is required for flexible substrates, optionally for the S63, standard on the D104 and S103.
LPKF recommends the S103 and S63 with Z-axis control for machining plastic and aluminum housings.
LPKF recommends the S103 and S63 for its stepper motor controlled milling depth adjustment.
LPKF recommends the D104, S103 and S63 because of the optical fiducial recognition.

Index

LPKF recommends the S103 or S63 because of the stepper controlled Z-axis.

LPKF recommends the S103, S63 or X60 because of the Z-axis control.

Technical Information

103

Multilayer: Fabricating and Laminating


Multilayers are PCBs with more layers, each featuring conductive structures.
They are manufactured in three steps: structuring of the individual layers, laminating
and through-hole plating.

A PCB with several layers


A multilayer board consists of multiple layers which
are bonded to form one PCB. The outer layers of a
multilayer often consist of PCBs structured on one
side, the inner layers from material coated on both
sides. Insulating layers, so-called prepregs, are inserted
between the conductive layers.

The outer layers of the PCB, top layer and bottom


layer, are bonded with the inner layers using heat and
pressure. Pressing plates and pads ensure the optimal
distribution of the pressure inside the pressing mold.
During lamination the resin from the prepregs liquefies
due to the high temperature, ensuring an optimal bond.

pressure plate
layer 1
2x prepreg
layer 2 & 3
2x prepreg
layer 4
pressure plate

registration pins

4-layer multilayer
6-layer multilayer
104

Technical Information

Circuit Board Plotters


Laser Circuit Structuring
LPKF MultiPress S

Through-Hole Plating

Up to 8 layers in-house: LPKF Prototyping

Index

TechInfo

LDS Prototyping

The type of through-hole plating used impacts the


structuring sequence. The outer layers are structured
during chemical-free through-hole plating prior to
laminating, in electroplating afterwards. The inner
layers of a multilayer must always be structured before
laminating.

The LPKF MultiPress S laminates up to eight-layers


from rigid, rigid-flex or flexible substrates. Distributing
pressure evenly across the entire pressing surface of
229 mm x 305 mm (9 x 12) ensures a harmonious
material bond. The LPKF MultiPress S stores up to
nine different time, temperature and pressure profiles;
which can be accessed via the menu-guided LCD
screen. Standard profiles for common PCB materials
are stored directly from the factory. Special process
profiles also ensure laminating RF materials, which
require a laminating temperature of about 230 C
(445 F). The LPKF MultiPress S achieves optimal
results with brief warm-up periods (temperature can
reach up to 250 C [490 F]) and short cooling phases.

Multilayer

Eight-layer multilayer with the


LPKF MultiPress S

SMT/Finishing

Air pockets must be eliminated during laminating.


This requires working with the right laminating pressure
and the proper temperature profile, suitable for
the materials and number of layers. The laminating
temperature of a standard multilayer is approx. 180 C
(355 F). On the LPKF MultiPress S with automatic
hydraulics the multilayers automatically pass through
the different heating and laminating phases of a
process profile.

Technical Information

105

Center-Punching, Drilling and Cutting-Out


A functional double-sided or multilayer PCB requires the drilling of vias. The drill holes are
required for through-hole plating of the individual layers and also serve as holes for registration
pins in double-sided structuring or for later attaching the PCB.

The inner disruptions or contours can be produced with


various shapes, including complex shapes. LPKF circuit
board plotters can also be used for separating units
for separating strips of different sizes and variations.

An assortment of tools

Drilling and center-punching PCBs

The selection of the respective milling tool for one


depends on the desired milled width, and also on the
material being machined. Milling tools with larger
diameters are sturdier and can therefore operate at a
higher feed rate. FR4 material is machined with a router
milling cutter. For soft RF substrates or aluminum a
double-edged end mill is used for cutting.

All drill holes on a PCB can be made with LPKF circuit


board plotters. Drilling tools with diameters from 0.2 to
3 mm are available for this purpose. Drill holes with a
diameter larger than 2.4 mm (94 mil) are milled.
The system software LPKF CircuitPro automatically
converts these drill holes into milling circles. The
drilling parameters such as spindle speed and sinking
time, and for spindles with motor-controlled Z-axis also
the feed rate, are stored in the software. Additional
user intervention is not required.

Router milling and rub-out areas

Very thin or dull drilling tools bring with them the risk
of the drill giving way and incorrectly positioned drill
holes. When center-punching with a milling tool, brief
spot drilling with a small penetration depth prevents
the drill from giving way. The 90 polished tip of the
1/8 universal milling cutter, typically used for 200 m
wide milling grooves, features the optimal geometry for
center-punching.
Multiple printed panels

LPKF CircuitPro automatically produces the


corresponding production data.

Cutting the PCB/router milling


With the right milling tools all LPKF circuit board
plotters can also be used for router milling. The PCB is
then milled in its entire material thickness.

106

Technical Information

Front panel

Circuit Board Plotters

Systems for Through-Hole Plating


When the circuits of a PCB are spread across several layers, these layers must be connected.

Laser Circuit Structuring

This is done with drill holes which are then plated with conductive material.

Manual: LPKF EasyContac

Chemical-free: LPKF ProConduct

Multilayer

Through-Hole Plating

LPKF offers three different through-hole plating systems to suit the respective application:

Electroplating: LPKF Contac RS and

SMT/Finishing

LPKF MiniContac RS

Through-hole plating with rivets

LDS Prototyping

LPKF EasyContac is an easy to use system for through-hole plating


double-sided standard FR4 based PCBs. The diameter of the rivets ranges
from 0.6 to 1.2 mm (+0.2 mm outside diameter). The system is ideal for PCB
prototypes with up to 50 through-holes and for repairing PCBs.

TechInfo

Easy to learn
The rivets are simply placed into the drill holes by hand and inserted with a pressing tool. The rivet is then
soldered to the copper layer.
Pressing tool
Copper

Rivet

Base
material

inserting

before pressing

Index

Anvil

Copper

after pressing

soldered

with component

Technical Information

107

Chemical-free through-hole plating


LPKF ProConduct is a professional process for
prototyping numerous through-holes without the need
for chemicals. It is suitable for up to four layers with a
minimum hold diameter of 0.4 mm at an aspect ratio of
up to 1:4.
The maximum size of the PCBs is merely limited by the
required hot air oven. For a hole diameter of 0.4 mm the
contact resistance is about 25 m.

Since LPKF ProConduct doesnt apply additional copper


to the structured surfaces, they do not impact the
calculations in RF applications.
Based on the more favorable production flow, in
chemical-free through-hole plating the outer layers of
the multilayer are already milled before through-hole
plating occurs.

LPKF ProConduct: Simple steps for through-hole plating


1. Protection foil:
Apply self-adhesive
custom-designed film to
the surfaces.

3. Apply contact paste:


Spread paste onto the PCB
with squeegee. The vacuum
table will draw the paste
through the holes. Also apply
paste onto the rear side and vacuum.

2. Drill:
Drill all through-holes with
an LPKF circuit board plotter
through the film.

4. Curing:
Carefully remove protection
foil, cure PCBs in the hot
air oven, then clean with
ProConduct cleaner under
running water.

Quick temperature change cycles


-40 C/125 C (-40 F/250 F) @ 1.6 mm (64 mil) FR4 PCB
Starting value

The electric resistance of a


finished plated through-hole
ranges from 1025 m. Even
after 250 temperature change
cycles the resistance increases
only minimally (max. 28 m).

250 cycles

100 cycles

35
30
R (m)

25
20
15
10
5
Hole

mm

0.4

0.5

0.6

0.7

0.8

0.9

1.0

diameter

mil

16

20

24

28

32

36

40

Basis: Double-sided FR4 PCB with 35 m (1 oz/ft2) copper

108

Technical Information

Circuit Board Plotters

One difference between the two LPKF systems is


the maximum PCB size. The LPKF MiniContac RS has
a maximum size of 230 mm x 330 mm (9 x 13),
while for the LPKF Contac RS it is 460 mm x 330 mm
(18 x 13).
Another difference is the feature set. The MiniContac
RS features four chemical baths: two cleaning baths,
one activator bath and the galvanic bath. The Contac
RS also features a bath for chemical tinning plus a sink
bath to assist with the cleaning process.

In multilayers the outer layers are not milled until after


through-hole plating, as the entire copper surface on
the outer layer is used as a cathode. Since all inner
layers are structured, the drill holes must be made
before through-hole plating.

Multilayer

The through-hole plating systems are easy-to-use,


no special chemical expertise required for operation
or maintenance. The operating process is largely
automated. The menu guides the user through all
phases, step by step.

Laser Circuit Structuring

Electroplating is suitable for professionally fabricated


PCB prototypes and small batches. In principle the
chemical process is equivalent to the process used
in mass production. Both LPKF systems can machine
multilayers with up to eight layers and a minimum hole
diameter of 0.2 mm (7.9 mil) at an aspect ratio of up
to 1:10. The reverse-pulse plating process ensures an
even structure without excess copper deposits at the
drill hole inlets.

Through-Hole Plating

Electroplating

SMT/Finishing

LPKF Contac RS and LPKF MiniContac RS: Four steps in through-hole plating
1. Clean and degrease: The PCB is cleaned and
degreased in two baths.

LDS Prototyping

2. Apply activator: Following the blackhole process


a carbon activator is applied to the surfaces of the
drill holes to be coated.
3. Electroplating: The entire LPKF electroplating
process is controlled by the system. The user only
needs to add the PCB and enter base parameters.
4. Clean: As the last step the PCB is cleaned.

+
0
-

of process

process

of process

TechInfo

Reverse pulse plating


Reverse pulse plating interrupts the
electroplating process with reverse
currents. This
prevents excess
+
copper deposits
0
on the process
and holeEndinlets.
End of
Beginning
of
Beginning

Index

The entire process takes approx. 90 to 120 minutes


depending on the thickness of the copper coat.
After through-hole plating the double-sided PCB or
the outer layers are structured.

process

Technical Information

109

LPKF ViaCleaner A Pinpoint Solution


Successful galvanic coating requires a current flow.
For the substrate material for a PCB, which is normally
based on synthetic resins, this is not the case. Before
galvanic via plating, an activator, usually carbon-based,
is flushed through the vias. It coats the non-conducting
wall and forms the basis for the metal layer in the
drilled hole. However, it is also deposited on the copper
layers and generates a contact resistance.
With the LPKF ViaCleaner, the activator can be
selectively removed from the copper layer. The
ViaCleaner reacts with extremely small amounts of
copper in the copper layer and spalls off the activator
layer. Because the LPKF ViaCleaner is activated in a
warm condition, a thermometer and a temperature
table are helpful for estimation of the required bath
dwell time. Three to five minutes are generally sufficient
for reliable cleaning.

multilayer boards

For the process to be carried out in the fine throughholes, there must be no air bubbles in the microvias.
Air bubbles may be removed easily through continuous
agitation of the board during cleaning.

Without cleaning, the activator required for metallization forms

The result: perfect, reliable via plating

The additional LPKF ViaCleaner bath system cleans microvias in

a barrier

110

Technical Information

The methods at a glance:

LPKF EasyContac
An easy to use manual through-hole plating method
for small quantities. EasyContac is easy, compact and
portable, making it the ideal entry into through-hole
plating prototypes.

LPKF ProConduct
A versatile manual through-hole conductivity option
without chemical baths. The LPKF ProConduct uses a
special conductive polymer to quickly and easily plate
drill holes within minutes.
Contac RS/
MiniContac RS

ProConduct

Small production runs, high hole count


Small production quantities and an infinite number of drill holes are quickly and easily
through-plated with ProConduct, Contac RS and MiniContac RS.

Average production quantities


The chemical electroplating systems Contac RS and MiniContac RS are the right choice for
average production quantities. PCBs of various shapes and sizes can be through-plated nonstop.

Complex surfaces
Substrates with special requirements, such as pure PTFE.

RF/microwave PCBs
The LPKF ProConduct is the best match for the strict geometric requirements of
RF/microwave PCBs.

Tin-plating
Voltaic through-hole platings with the LPKF Contac RS include a chemical tin-plating option.

Chemical restrictions
The LPKF EasyContac and the ProConduct are suitable where the use of chemicals is
a concern. Both methods do without a single chemical bath.

Circuit Board Plotters


LDS Prototyping

SMT/Finishing

TechInfo

Small production run, low hole count


Although the Contac RS/MiniContac RS and ProConduct systems are also perfectly suited for
small production quantities and low drill hole counts (less than 50), the EasyContac is
a system developed specifically for these applications.

EasyContac

High-power circuitry
High-power circuitry requires larger drill holes and heavier platings. For these applications
LPKF recommends the Contac RS.

Reverse pulse plating


The reverse pulse plating on the LPKF Contac RS and MiniContac RS provides substantially
cleaner through-hole plating. Reverse pulse plating ensures the copper is applied evenly and
eliminates build-up or even clogging at the mouth of the through-hole.

Index

Application

Laser Circuit Structuring

The application determines the most suitable throughhole plating. Basic information such as the materialand layout size are quite instrumental, but also special
factors such as specific substrates, PCB types, etc. play
a role.

LPKF Contac RS/MiniContac RS


Professional chemical electroplating method with
reverse pulse plating. The Contac RS and MiniContac
RS systems are self-contained and require no chemical
expertise for use.

Through-Hole Plating

LPKF offers three different through-hole conductivity


methods. Each of these methods has its certain
advantages.

Multilayer

Comparison of Through-Hole Plating Methods

* Material options upon request.

Technical Information

111

Solder Resist and Screen Printing


The solder resist LPKF ProMask protects surfaces and
tracks on a PCB. A professional surface finish protects
pads with minimal spacing from short-circuits during
the soldering process.

LPKF ProMask is an easy-to-apply green solder resist


mask. The professional surface finish is particularly
ideal for SMT prototypes with small track spacing.
LPKF ProLegend adds any marking to the PCB without
the use of environmentally hazardous wet chemistry.

Applying solder resist:


Four steps to a solder resist mask
1. Create film template:
Each PCB side requires one
film template. It is printed
onto a transparency from
LPKF CircuitPro using a
standard laser printer.

2. Apply solder resist:


The solder resist is mixed
from the portioned
components of enamel and
curing agent and applied
onto the entire PCB side with a foam roller. The PCB
is then pre-dried in a hot air oven at 80 C for ten
minutes.

3. Expose PCB with film


template: The film template
is accurately positioned over
the pads. The PCB is then
placed in the UV exposer
unit for 30 seconds. This sets the unprinted
sections of the film template on to the PCB. After
the PCB is removed from the laser setter the film
template is removed.

4. Develop and cure


solder resist mask:
The development bath is
prepared by dissolving
the developing powder in
warm water. The development bath releases the
unexposed sections from the solder resist. Paint
residue is rinsed off with a brush and water. The
solder resist then cures in the hot air oven for 30
minutes. Finally, oxidation residue is removed from
the PCB and the PCB is cleaned.

The component legends are printed in white paint with LPKF ProLegend using exactly the same method. As
the areas which are to remain unpainted must also be exposed, the film template must be negative-printed.

112

Technical Information

The LPKF ProtoPrint S is a manual stencil printer for creating SMT prototypes and small batches.

The mechanical resolution up to a grid dimension of


0.3 mm (12 mil) ensures ultra-fine pitch range stencil
printing. The thickness of the template (between 100
m and 250 m) is determined by the solder paste
application.

The LPKF solder paste printer is suitable for polyimide


templates limited to a grid-dimension of 0.625 mm
(25 mil) at a thickness of 125 m. Polyimide templates
can be produced with an LPKF circuit board plotter,
saving time and cost compared to steel stencils.

Multilayer

The stencil frames can easily be secured with adjustable


retaining clips. The freely adjustable nesting pins allow
the unpopulated side of populated PCBs to be printed.
The PCB is accurately aligned in the X and Y position as
well as height using micrometer screws. A lever allows
the PCB to be separated parallel from the template at
a controlled speed. The simple securing of the PCB
on a slide allows quick and easy replacement when
producing small batches.

Through-Hole Plating

Applying solder paste to all pads to be populated with components requires maximum precision.

Laser Circuit Structuring

Circuit Board Plotters

Solder Paste Printing

SMT/Finishing

LPKF ProtoPrint S

Applying solder paste: The solder paste is applied to the PCB in six steps

3. Test film print:


The lever presses the test film on the stencil. Solder
paste is then evenly spread onto the film with a
squeegee and the pad image printed onto the film.

LDS Prototyping

5. Apply solder paste:


The slide is moved to printing position and the PCB
pressed on the stencil with the lever. Then solder
paste is evenly applied to the PCB with a squeegee.

TechInfo

2. Clamp stencil:
Move the slide into printing position and secure
the stencil frame in its rough position with the
adjustable PCB nesting pins.

4. Fine adjustment:
The test film is released from the stencil using the
lever and the slide is moved into loading position.
The PCB is now accurately aligned with the
micrometer screws for test film printing. Afterwards
the test film is cleaned and removed.

6. Release PCB:
The PCB is released from
the template using the lever.
During this process the applied
solder paste must remain on
the PCB and may not stick to the template. The slide
is then moved to loading position.

Technical Information

Index

1. Secure PCB:
The PCB nesting pins are mounted onto the slide
and the PCB is inserted. Then the film for the test
film print is clamped onto the PCB.

113

SMD Assembly
Accommodating many functions in a small space requires tiny components. The small size of
modern electronic components makes it difficult to manually populate PCBs. With the ProtoPlace S
LPKF offers users a semi-automatic, ergonomic pick&place system for complex SMD populating.

Semi-automatic populating of PCBs with


SMD components
SMD PCBs are populated in as little as three steps.
First a vacuum needle takes the SMD component from
an anti-static bin or from a feeder. Two different types of
feeders are common here: tape feeder, stick feeder or
motorized turntables. All types can be connected to the
LPKF ProtoPlace S.
The vacuum needle is mounted to a manipulator which
helps with accurate positioning. The SMD component is
manually moved or turned in X and Y axes. The optional
camera and an LCD color monitor help with correct
positioning.
Finally the component is accurately lowered onto the
PCB. The bond from the solder paste prevents the
component from shifting.
For more complex SMD components such as QFPs and
PLCCs the component is first roughly positioned before
the manipulator is locked in the X-, Y- and Z-axes. The
PCB can be micro-adjusted under the SMD component
with the help of a camera and micrometer screws.
A 4-line LCD screen on the LPKF ProtoPlace S guides
the user through the individual adjustment and work
phases. Virtually all user functions are executed via the
four ergonomically arranged directional keys. The
optional camera system with color monitor assists
the user in accurately positioning components
even on complex PCBs.

114

Technical Information

Populating the PCB

Solder paste, adhesive or low-viscosity auxiliary


materials are applied to the built-in standard solder
paste dispenser by adjusting the transfer pressure
accordingly.
The LPKF ProtoPlace S is optimized for precision
assembly with fine-pitch components. The maximum
configuration features several feeders, a camera system
and a dispenser.

LPKF ProtoPlace S

Circuit Board Plotters

Reflow Soldering
Once the PCB is structured and populated only one step remains before its functional:
Soldering the components to the lead structure. In modern SMT boards the soldering iron stays

Laser Circuit Structuring

cold; a reflow oven connects all soldering points in one step.

Multilayer

The compact LPKF ProtoFlow is the ideal reflow oven


for leaded as well as for lead-free, RoHS compliant
reflow soldering, curing through-hole plating pastes
and other thermal processes requiring precise control.
The special function MultiZone allows the soldering
process to be broken down into five separate phases,
each with its own temperature sequence. Four internal
temperature sensors accurately control the temperature
spread across the entire PCB. The temperature curve of
the sensors is displayed on a monitor in a temperature/
time-diagram. They can be stored for later analysis.
The LPKF ProtoFlow S processes PCBs up to a size
of 229 mm x 305 mm (9 x 12) at a maximum
temperature of 320 C.

Through-Hole Plating

Lead-free and leaded

A lighted process chamber allows visual inspection during


reflow soldering

The LPKF ProtoFlow S can be equipped with a sensor


module which records temperature sequences in up to
four freely selectable locations including components.

LDS Prototyping

Preprogrammed standard reflow profiles are stored


from the factory; additional profiles can be individually
programmed and stored.

The LPKF ProtoFlow S can be connected to a computer


via USB interface. The included intuitive PC software
is used for recording temperature in real-time, and
programming and storing profiles.

TechInfo

The LPKF Protoflow S/N2 can be externally connected


to inert gas with a digital flow regulator. The nitrogen
atmosphere significantly reduces oxidation during
the soldering process, thus optimizing the solder
connections.

SMT/Finishing

Inert gas option

LPKF ProtoFlow S

PCB produced and populated

Index

with LPKF technology

Technical Information

115

Applications
From design to completed board: the modular prototyping systems by LPKF implement complex
designs in no time; from structuring to functional PCB.

Flexible and rigid-flex PCBs

Engraving plastic and aluminum (2.5D)

Flexible or rigid-flex PCBs often cause problems with


handling as they are quite difficult to secure to a work
surface. Almost all LPKF structuring systems can be
equipped with a vacuum table to securely position the
PCB; making setup easier, quicker and more accurate.

All LPKF circuit board plotters can engrave, drill


mounting holes, and mill front plates and almost any
type of shapes and lines. Many LPKF circuit board
plotters can also be used to drill and mill plastic and
soft metals in 2.5 dimensions.

Since the substrate of flexible PCBs is comparatively


soft, primarily RF tools are used for machining. RF tools
have the added benefit of not penetrating the material
as deeply. Structuring a flexible PCB is similar to the
milling process in rigid substrates.

The machining result essentially depends on the spindle


speed. LPKF circuit board plotters with a minimum of
60000 rpm produce very clean surfaces when milling
or cutting.

Rigid-flex PCBs combine flexible PCBs with rigid ones.


The method used for producing rigid-flex PCBs is
similar to producing multilayers. The rigid component(s)
are structured on one unit.

The surface in which the flexible part is to be inserted


remains unstructured in the unit and is covered with
a barrier sheet. The flexible section is then laminated
onto the structured rigid sections. Afterwards the
unstructured section below the flexible PCB is milled
off. The same LPKF systems also used for producing
multilayers can be used here.

116

Technical Information

Multiple passes may be required depending on the


milling depth. As a rule of thumb, the milling depth
should not be more than half the tool diameter.

The parameter library of the LPKF CircuitPro software


supports machining aluminum and other soft metals.
The optimal feed and spindle speed for a long tool life
are already stored in LPKF CircuitPro by default.

Milling polyimide stencils with LPKF circuit board


plotters is a very appealing alternative to steel stencils,
particularly from a cost perspective. The solder paste
stencils can be milled in-house in less than ten minutes.
Generating the milling data by LPKF CircuitPro through
inverse isolation is easy. The pad surfaces are then not
circumscribed for insulating, but instead milled out.

Index

This combined with RF tools and precisely adjustable


milling depth ensures a clean vertical geometry; even in
soft RF substrates. The pneumatic, non-contact depth
limiter, which allows the milling head to glide on an air
cushion above the substrate without physical contact,
ensures scratch-free milling.

Milling polyimide templates brings with it the benefits


of speed and accuracy when applying solder pastes.
When combined with the SMT stencil printer LPKF
ProtoPrint S, stencil printing becomes a cost-effective
solution when creating the prototype, especially
compared to the amount of work involved in manual
dispensing or soldering.

TechInfo

LDS Prototyping

SMT/Finishing

by an end mill RF tool

Milling stencils

Laser Circuit Structuring

Circuit Board Plotters


Precise geometries produced

All of these requirements


are fulfilled by LPKF
systems and LPKF tools.
The LPKF ProtoMat S103
and D104 circuit board
plotters feature a highspeed spindle with
100000 rpm. The ProtoMat
D104 also features a highprecision laser tool.

The LPKF ProtoLaser laser systems are unsurpassed


in speed and precision. Super fine structures and even
large insulating rub-out areas are produced quickly
on soft as well as particularly hard substrate materials.

Through-Hole Plating

Producing PCBs for RF and microwave applications


is quite challenging. Materials with special electrical
properties are used which also require the corres
ponding machining. Further, extremely delicate
surfaces are to be structured. And last but not least,
it often requires very precise geometries.

Multilayer

RF and microwave applications

Technical Information

117

Depaneling
LPKF ProtoMats mills through the break-out tabs
connecting an individual PCB in one panel. This process
is only indirectly connected to the actual process of
manufacturing a PCB and its later function. Therefore
the required milling time is only granted on highvolume drilling/milling equipment; which can result
in bottlenecks in production. The LPKF circuit board
plotters are a great alternative to laser use. Combining
a vacuum table and fiducial camera turns inserting and
aligning a panel into a quick and easy task. The breakout tabs are cut clean, providing the user has a PCB
with an exact contour.
One particularly interesting system is the LPKF
ProtoLaser U3. This laser system cuts any contour in
thin rigid, rigid-flex or flexible PCB materials without
mechanical stress on the substrate material and the
components.

Structuring super fine conductive tracks


One special application relies on the LPKF
ProtoLaser U3 a combination of laser structuring
and etching the PCB. The completely copper-plated
substrate is first chemically coated with a homogenous
tin surface. The UV laser beam then removes the tin
resist in the area to be etched. This technique allows
super fine lead ranges of < 50 m (width/gaps) to be
produced in the circuit track.

Dispensing
The dispenser introduced with the new S series
accurately applies low-viscosity auxiliary materials such
as solder paste onto the PCB.

118

Technical Information

The new generation of S series ProtoMats is designed for growth. Easy to install upgrade kits turn
the entry-level system LPKF ProtoMat S43 into the all-rounder LPKF ProtoMat S63 or even the
top-of-the-line system LPKF ProtoMat S103. The new features come in a compact upgrade box
containing all the required parts and components. A utility film shows the steps required to give the
ProtoMat its new abilities. With a little mechanical skill the upgrade is installed in no time without

Through-Hole Plating

the ProtoMat leaving the building.

Laser Circuit Structuring

Circuit Board Plotters

Growing with the Job: ProtoMat Upgrades

Multilayer

The S43 and S63 ProtoMats can be upgraded all the way to the top-of-the-line S103:

SMT/Finishing

An upgrade kit will turn a ProtoMat S43 or S63 into a ProtoMat S103 in no time!

Upgrade

S43 to S63

S43 to S103

S63 to S103

Part no.

127700

127701

127702

Milling spindle (rpm)

60000

100000

100000

LDS Prototyping

The upgrade kits at a glance (see also page 20):

2D milling
Fiducial recognition camera
Automatic tool change

TechInfo

Vacuum table
Solder paste dispenser*
Pneumatic non-contact working depth limiter*

Software LPKF CircuitPro Full


Included in upgrade kit

Index

Included/with upgrade possible

* For the use of the dispenser and the pneumatic non-contact working depth limiter compressed air is required.
All other functions are available without compressed air.

Technical Information

119

Three-Dimensional Interconnect Devices


Each new generation of electronics features more functionality, a greater degree of integration,
miniaturization and reliability, but often with rising costs as well. Here 3D molded interconnect
devices are ideal; they combine mechanical functions with electric ones.

Laser direct structuring of a smartphone antenna using the LPKF Fusion3D 1100

With MIDs (molded interconnect devices), injectionmolded plastic parts are provided with circuit
tracks and can then even be assembled. Laser
direct structuring (LDS), which is more extensively
described in what follows, dominates this technology.

parts that at the same time serve as enclosure


components and three-dimensional molded
interconnect devices. These plastic parts are provided
with circuit tracks and combine mechanical and
electronic characteristics.

Along with the production systems, LPKF has also


developed a simple and inexpensive method for
LDS Prototyping.

In the case of MIDs, function follows form, which not


only generates new functionality but also, outwardly,
new products. In using defined plastics, the RoHS
specifications are met and recycling is easier than with
conventional circuit boards, for example.

Function follows form


With electronic and mechatronic products, parts
continue to shrink, but can be used for a wider
variety of applications. This is what drives innovative
technologies such as MIDs: injection-molded plastic

120

Technical Information

The LDS (laser direct structuring) process stands out


in this technological environment: the circuit tracks
arise along laser structures. The process thus becomes
especially efficient, exact and flexible.

Circuit Board Plotters

Economization of space and weight


Reduced assembly outlay
New product layouts

Laser Circuit Structuring

Easy LDS Prototyping

Multilayer

Through-Hole Plating

Some LDS applications

LED-retrofitted lamps

Steering wheel components

Laser-structured finger tips for robotic hands

(manufacturer: TRW Automotive for BMW)

(manufacturer: Citec, University Bielefeld, Germany)

MID parts for hearing devices

Parts for dental tool holders

(manufacturer: Siemens Audiologische Technik GmbH)

(manufacturer: KaVo Dental GmbH)

Index

TechInfo

LDS Prototyping

SMT/Finishing

Smartphone antennas

Technical Information

121

Potentials of three-dimensional Molded


Interconnect Devices (MIDs)
Each new generation of electronics includes more
functionality, a greater degree of integration,
miniaturization and reliability, but these innovations
come with increased costs. With the freedom of 3D
design, three-dimensional molded interconnect devices
offer the best preconditions for producing products
with a unique functionality in a cost-efficient fashion
with a moderate manufacturing outlay.
The basis for this is an injection-molded plastic part
of nearly any shape. Fastening elements, reinforcers
and cooling fins can now be integrated in the
enclosure. This allows for chips to be elegantly stacked
in assemblies or antennas can be created on the
enclosures of smartphones and ultrabooks in order to
save space.
Heating units, additional plug connections, partial
shielding and touch panels are simple to integrate;
in some circumstances entire enclosure parts, circuit
boards and cables become superfluous. This intelligent
packing of components combined with optimal housing
allows a high level of cost-efficiency with a minimal
process chain.

LDS antennas for ultrabooks

The LDS process


The LDS process uses thermoplastic plastics that are
doped with a laser-activatable additive. The additive
is activated where the infrared laser beam strikes the
doped plastic and it forms a trace, with metal particles
and micro-cavities. The metal particles are the seeds
for the subsequent metallization; the roughness
guarantees optimal adhesion of the circuit tracks. The
laser does not require masks and can thus inscribe any
structures on the component.
The circuit track layers come about exactly on these
traces in a electroless metallization bath. Thus copper,
nickel, a gold finish and other bond-capable metal
layers can be applied consecutively.

122

Technical Information

Activated additive
by laser ablation

Laser

Modified polymer

Circuit Board Plotters

2. The laser roughens the surface and activates


the additive

3. Metal layers on the activated paths are built up


in metallization

4. The metallized structures can then be assembled


with components
LDS Prototyping

SMT/Finishing

Multilayer

1. The injection-molded part consists of an LDSadditivized thermoplast

Through-Hole Plating

Laser Circuit Structuring

The LDS process

Laser systems for the LDS process


The production of parts in large quantities requires a
high level of performance.

Index

Together with well-designed handling, nonproductive times are reduced and the processing
times drop to a minimum.

TechInfo

The modern LDS production systems of the LPKF


1000 and 6000 series are designed for 24/7
production and can be equipped with three or four
laser units if necessary. Structuring thus takes place
from several angles simultaneously.

Laser direct structuring with the LPKF Fusion 1500

Technical Information

123

LDS Prototyping in practice


Prototyping for three-dimensional molded interconnect
devices was until now elaborate or couldnt maintain
the desired readiness for production. Production of
special injection molding tools is time-intensive and
usually uneconomical. When milling components made
of plastic blocks or when casting in silicone molds,
not all structural approaches allow for the required
precision.
LDS Prototyping from LPKF takes another route. The
basis for the LDS part is a 3D body, usually produced
by a 3D printer. The decisive factor is the surface
roughness.
Instead of producing the part on an LDS plastic, LPKF
ProtoPaint LDS creates the capacity for metallization on
alternative materials. LPKF ProtoPaint LDS is supplied
in a spray can and is easy to use. The paint complex
is activated before painting. Usually one thorough
cross-coat is enough for a sufficient layer thickness.
In practice, several parts are coated together so as to
create a sufficient number of prototypes for testing and
optimization.
After drying, the part can be structured with an LDS
laser system. The LPKF ProtoLaser 3D is outstandingly
suited for prototyping and small batch production
requirements. Additional LPKF LDS laser systems are
available for high volume production requirements.

The parts can be flexibly fixed with a paste

The ProtoLaser 3D offers a large height-adjustable


working surface and a vision system. The vision system
can be oriented to component geometries. Since
no mechanical stresses have to be accommodated,
simple part mountings are sufficient in many cases. In
practice, even retainers made of non-shrinking pastes
have proven adequate. The same design rules apply to
prototyping as to serial production. Thus several laser
processes with different angular positions are required,
if applicable.

The entire LDS Prototyping solution from


a single source LPKF ProtoLaser 3D,
ProtoPaint LDS and ProtoPlate LDS

124

Technical Information

Circuit Board Plotters


Laser Circuit Structuring
Through-Hole Plating

After structuring, the parts are cleaned and then


metallized. Cleaning removes residual particles from
the laser structuring and prevents faulty metallization
at undesirable positions. Then the metallization begins.
After the metallization bath has been poured into the
beaker and heated to just below 44 C (110 F), the
pre-portioned activator is added. Parts can be fastened
with isolated copper wires on the beaker cover which
are then immersed in the bath. The thickness of the
metallized structure depends on the dwell time of the
parts in the bath. After two hours, layer thicknesses of
ca. 10 m (0.4 mil) can be built up.

The finished LDS parts can be used for installation


tests or functional tests. The quick prototyping process
speeds up process development considerably and will
contribute to the further success of LDS technology.

Multilayer

After assembly the prototype is ready for functional testing

Index

TechInfo

LDS Prototyping

SMT/Finishing

Easy process metallization with LPKF ProtoPlate LDS

Technical Information

125

Technical Terms
Bridging
A buildup of solder between tracks or pads causing a short circuit.

A
Activation
Treatment that enables electroless deposition on a nonconductive
material. Also: activation of embedded additives in plastic or paint in
the laser direct structuring process.
Annular Ring
The conductive foil and plating surrounding a hole.
Aperture
A description of the shape and size of the tool used to create a pad
or track. The term comes from the days of vector photoplotters,
where film was exposed by shining light through apertures (shaped
holes) arrayed around the edge of a disk (or aperture wheel). Each
aperture corresponded to a different D code in the Gerber data.
Today, photoplotters use lasers to expose the film but the term
aperture persists.
Aperture List
A list of the shapes and sizes for describing the pads and tracks
used to create a layer of a circuit board.
Artwork
A phototool used to create the different layers during printed circuit
board manufacture.
Artwork Master
An accurately scaled (usually 1:1) pattern which is used to produce
the production master.
Aspect Ratio
The ratio of the circuit board thickness to the smallest hole
diameter.

Buried Via
A mechanically or laser drilled hole which interconnects internal
layers only. It is not electrically connected to any external layer.
C
C-Stage
The condition of a resin polymer while in a solid state, with high
molecular weight, being insoluble and infusible.
Center-To-Center Spacing
The nominal distance between the centers of adjacent features or
traces on any layer of a printed circuit board.
Chamfer
A corner which has been rounded or angled to eliminate an
otherwise sharp edge.
Circuit
The interconnection of a number of devices in one or more closed
paths to perform a desired electrical or electronic function.
Circuit Layer
A layer of a printed board containing conductors, including ground
and voltage planes.
Clad or Cladding
A relatively thin layer or sheet of metal foil which is bonded to a
laminate core to form the base material for printed circuits.

Clearance Hole
A hole in the conductive pattern larger than, but concentric with,
a hole in the base material of the PCB.

B-Stage Material
Sheet material impregnated with a resin cured to an intermediate
stage (B- stage resin). The preferred term is prepreg.

Coefficient of Expansion, Thermal


A materials fractional change in dimension for a unit of temperature
fluctuation.

Backplanes and Panels


Interconnection panels into or onto which printed circuits, other
panels, or integrated circuit packages can be plugged or mounted.

Component Hole
A hole used for attachment and electrical connection of component
terminations, including pins and wires, to the printed circuit board.

Bare Board
A finished PCB without added components.

Component Side
The side of the printed circuit board on which most of the
components are mounted.

Barrel
The cylinder formed by plating through a drilled hole.
Base Laminate or Base Material
The substrate material upon which the conductive pattern is formed.
The base material can be rigid or flexible.
Bed-of-Nails
A method of testing printed circuit boards that employs a test fixture
mounting an array of contact pins configured so as to engage platedthrough holes on the board.
Blind Via
A via hole that does not pass completely through the printed circuit
board. A blind via starts from one side or another.
Bond Strength
The force per unit area required to separate two adjacent layers of a
board by a force perpendicular to the board surface.

126

Technical Terms

Conductive Pattern
The configuration or design of the conductive material on the base
laminate. Includes conductors, lands, and through-hole plating.
Conductor Base Width
The conductor width at the base materials surface plane. See also:
Conductor Width
Conductor-To-Hole Spacing
The distance between the edge of a conductor and the edge of a
supported or unsupported hole.
Conductor Spacing
The distance between tracks on a printed circuit board.
Conductor Width
The perceivable width of the respective conductor in any random
PCB location.

D
Datum Reference
A defined point, line, or plane used to locate the pattern or layer for
manufacturing, inspection, or for both purposes.
Deburring
Process of removing a burr after drilling the board. There are two
types of deburring: producing a clean, sharp edge when removing
heavy burr; and rounding the edges of holes to prevent build-up
during plating.
Design Rules Check
A computer aided program used to check the manufacturability of
the circuit board. The checks include track to track gaps, track to
pad gaps, annular ring sizes, track to board edge gaps, acid trap
detection, unterminated track checks.
DFM
Design For Manufacture.
Dielectric
An insulating medium which occupies the region between two
conductors.

Fiducial
A feature of the printed circuit board used to provide a common
measurement point for all steps in the assembly process.
Flash
A pad. Another term dating from the days of vector photoplotters
tracks were drawn, pads were flashed. See also pad. Flash is
also a term used to describe excess material squeezed out between
mold pieces during a casting.
Flux
A substance used to promote or facilitate fusion, such as a material
used to remove oxides from surfaces to be joined by soldering or
welding.
Foil
A thin sheet of metal, usually copper or aluminum, used as the
conductor for printed circuits. The thinner the foil, the lower the
required etching time. Thinner foils also permit finer definition and
spacing. See Copper Foil.
FR4
The standard glass epoxy substrate.
Fused Coating
A metallic coating (usually tin or solder alloy) which has been melted
and solidified forming a metallurgical bond to the base material.

Circuit Board Plotters


Laser Circuit Structuring

F
Current-Carrying Capacity
The maximum current which can be carried continuously, under
specified conditions, by a conductor without degrading the electrical
or mechanical properties of the printed circuit board.

Through-Hole Plating

Etching
The process of removing unwanted metallic substance (bonded to a
base) using chemicals, or chemicals and electrolytes.

Multilayer

Copper Foil
A cathode-quality electrolytic copper used as a conductor for
printed circuits. Available in a number of weights (thicknesses); the
traditional weights are 1 and 2 ounces per square foot (0.0014 and
0.0028 inches thick).

Electroplating
The electrodeposition of a metal coating onto a conductive object.
The object to be plated is placed in an electrolyte and connected to
one terminal of a D/C voltage source. The metal to be deposited is
similarly immersed and connected to the other terminal. Ions from
the metal provide transfer to metal as they make up the current flow
between the electrodes.

SMT/Finishing

Controlled Impedance
The process that gives a circuit the correct impedance value. The
design engineer will specify the track impedance required. From
this, a suitable manufacturing build will be chosen for the track
widths and layer spacings on the design to meet the required
impedance.

Double-Sided Board
A printed board with a conductive pattern on both sides, but no
inner layers.

Ground Plane
A conductor layer, or portion of a conductor layer, used as a common
reference point for circuit returns, shielding, or heat sinking.
H
HP-GL
Hewlett Packard Graphics Language.

Drill Table
A description of the drill sizes used to create the circuit board. The
drill equivalent of an aperture list.

Internal Layer or Inner Layer


A conductive pattern which is contained entirely within a multilayer
printed board.

Edge Connector
The portion of the PCB used to provide external electrical
connection, normally gold plated.

TechInfo

Dimensional Stability
A measure of dimensional change caused by factors such as
temperature, humidity, chemical treatment, age, or stress; usually
expressed as units/unit.

IR laser
Laser system working in the infrared range. The LPKF ProtoLaser S
uses a laser source with a wavelength of 1064 nm.

Technical Terms

127

Index

Digitizing
Any method of reducing feature locations on a flat plane to digital
representation in X-Y coordinates.

Gerber Data
A type of data consisting of graphics commands, usually describing
how to draw a picture of a circuit. Intended for directing a
photoplotter, it is the most common format for data transfer from
PCB CAD systems to the manufacturing process. Gerber data is
officially designated as RS-274-D (without embedded aperture
codes) and RS-274-X (with embedded aperture codes).

LDS Prototyping

G
Dielectric Constant
That property of a dielectric that determines the electrostatic
energy per unit volume for unit potential grade.

L
Laminate
A product made by bonding together two or more layers of material.
Lamination
The process of preparing a laminate; or a multilayer PWB.

Multilayer Printed Circuit Boards


Printed circuit boards consisting of three or more conducting circuit
planes separated by insulating material and bonded together with
internal and external connections to each level of the circuitry as
required.
N

Land
A portion of a conductive pattern usually, but not exclusively, used
for the connection and/or attachment of components. Also called
Pad, Boss, Terminal area, Blivet, Tab, Spot, or Donut.

Nick
A cut or notch in a track or pad.

Layer-To-Layer Spacing
The thickness of dielectric material between adjacent layers of
conductive circuitry in a multilayer printed circuit board.

Open
A loss of electrical continuity caused by a break in a track.

P
Legend
A format of lettering or symbols on the printed board; e.g. part
number, component locations, and patterns.
LDS
Laser Direct Structuring. The laser beam writes conductor
structures on an additive-containing plastic component. It activates
the additive in the plastic, leaving a microrough surface for
metallization.
M
Mask
A material applied to enable selective etching, plating, or the
application of solder to a printed circuit board.
Metallization
Buildup of traces in the LDS process: In a chemical metallization
bath, copper and other metals accumulate on a seed layer on a
structured plastic component. The conductor layer is formed out of
this. In contrast to galvanic metallization, no voltage is applied.
Microsectioning
The preparation of a specimen for the microscopic examination of
the material to be examined, usually by cutting out a cross-section,
followed by encapsulation, polishing, etching, staining, etc.
Mil
1/1,000th of one inch, or 0.001.
Minimum Annular Ring
The minimum metal width, at the narrowest point, between the
circumference of the hole and the outer circumference of the land.
This measurement is made to the drilled hole on internal layers of
multilayer printed circuit boards and to the edge of the plating on
outside layers of multilayer boards and double-sided boards.
Minimum Electrical Spacing
The minimum allowable distance between adjacent conductors
sufficient to prevent dielectric breakdown, corona, or both, between
the conductors at any given voltage and altitude.
Misregistration
The lack of conformity between two or more patterns or features.
Mixed Technology
Describes the assembly process of using pin through-hole, surface
mount, and other mounting technologies on the same printed circuit
board.

128

Technical Terms

Pad
The portion of the conductive pattern on printed circuits designated
for mounting or attaching components. Also called Land.
Panel
The base material containing one or more circuit patterns that
passes successively through the production sequence and from
which printed circuit boards are extracted. See Backplanes and
Panels.
Panel Plating
The plating of the entire surface of a panel (including holes).
Pattern Plating
Selective plating of a conductive pattern (including holes).
PCB
Printed Circuit Board
Photo Plot
A high accuracy laser plotting system. It is used to produce
actual size master patterns for printed circuit artwork directly on
dimensionally-stable, high contrast silver halide photographic film.
Photoplotter
A device for generating photographic images by directing a
controlled-light beam that directly exposes a light-sensitive material.
Photoresist
A light sensitive liquid or a film which, when selectively exposed to
light, masks off areas of the design that can then be etched away.
Plated-Through Hole (PTH)
A hole used to form the electrical connections between layers. This
is achieved by metalizing the walls of the hole.
Plating, Electroless
See Plating.
Plating, Electrolytic
See Plating.
Plating Resists
Materials which, when deposited on conductive areas, prevent
the plating of the covered areas. Resists are available both as
screened-on materials and as dry-film photopolymer resists.
Plotting
The mechanical conversion of X-Y positional information into a visual
pattern, such as artwork.

Circuit Board Plotters

T
Tester
A device that checks a PCB for the connectivity of its circuits from
the design netlist.

PWT
Printed Wiring Technologies

Thin Foil
A metal sheet less than 0.0007 inches (1/2 oz) thick or less.

Tooling Holes
The general term for non-plated holes placed on a printed circuit
board or a panel used for registration and tooling during
manufacturing, testing and assembly.

Router
A machine that cuts away portions of the laminate to leave the
desired shape and size of a printed circuit board.
S
Schematic Diagram
A drawing which shows, by means of graphic symbols, the electrical
connections, components and functions of an electronic circuit.
Scoring (V-Scoring)
The panels are precision cut through both sides of the panel to a
preset depth. The panels remain rigid for assembly but are ready for
breaking into individual circuits.
Screen Printing
A process for transferring an image to a surface by forcing suitable
media through a stencil screen with a squeegee. Also called Silk
Screening.
Single Sided Board
A printed circuit board that contains tracks and pads on one side of
the board and no plating in the through holes.
SMT
Surface Mount Technology

UL (Underwriters Laboratory)
A U.S. safety standard certification organization.
UV (Ultraviolet)
Ultraviolet radiation is electromagnetic waves with short wave
length which can be used for curing polymers. Ultrasonic waves can
also be used to clean PCBs in special cleaning equipment.

Multilayer

Resist
Coating material used to mask or to protect selected areas of a
pattern from the action of an etchant, solder, or plating. Also see:
Dry-Film Resists, Plating Resists and Solder Resists.

UV laser
Laser system working in the ultraviolet range. These wavelengths
are easily absorbed by numerous materials.
V
Via or Via Hole
A plated-through hole used to connect individual layers of a circuit
board. These holes are generally the smallest as no components are
inserted in them.
ViaCleaner
A special bath that removes activator coatings from copper surfaces
in microvias prior to galvanic via plating.
W
WYSIWYG
What You See Is What You Get. This term describes a computer
interface that reflects an actual physical object, as opposed to a
more symbolic representation. For example, early word processing
programs produced a final printed output that was very different to
what appeared on the editing screen, but later programs appeared
on the editing screen exactly as they were expected to print

Solder Leveling
The process of dipping printed circuit boards into molten solder and
leveling the surface with hot air.

SMT/Finishing

Registration
The degree of conformity of the position of a pattern, or a portion
thereof, with its intended position or with that of any other
conductor layer of a board.

Track
An electrical connection between two or more points on a PCB.

LDS Prototyping

Reflowing
The melting of an electro-deposit followed by solidification. The
surface has the appearance and physical characteristics of being
hot-dipped.

Through-Hole Plating

Prepreg
Sheet material consisting of the base material impregnated with a
synthetic resin, such as epoxy or polyimide, partially cured to the
B-stage.

Laser Circuit Structuring

Surface Mounted Technology (SMT)


The components are mounted on the surface of a circuit board
rather than inserting components into plated through-holes.

TechInfo

Polyimide Resins
High temperature thermoplastics used with glass to produce
printed circuit laminates for Multilayer and other circuit applications
requiring high temperature performance.

Index

Solder Mask or Resist


Coatings which mask and insulate portions of a circuit pattern where
solder is not desired.
Solder Side
On printed circuit boards with components on only one side, the side
of the PCB that is opposite to the component side.

Technical Terms

129

Index
2.5-dimensional . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Circuit board plotters

3D body. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124

Configuration matrix. . . . . . . . . . . . . . . . . . . . . . . . . 18

3D circuitry. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71, 120

Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4, 18

3D laser systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

Cleaning pads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

3D printer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124

Comparison of methods . . . . . . . . . . . . . . . . . . . . . . . . 47

3D software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Competence spectrum . . . . . . . . . . . . . . . . . . . . . . . . . 82
Components carousel. . . . . . . . . . . . . . . . . . . . . . . . . . 69

Components placement . . . . . . . . . . . . . . . . . . . . . . . . 58

About LPKF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Compressor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22, 68

Absorption lines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94

Conducting path width . . . . . . . . . . . . . . . . . . . . . . . . . 118

Aluminum engravings . . . . . . . . . . . . . . . . . . . . . . . . . . 116

Consumables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27, 67

Accurate geometry . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Contac RS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Acoustics chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Contour cuts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

Activator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47, 109

Contour milling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92, 102, 106

Activator coating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Convection oven. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

Adhesive tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Copper cladding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

Adjustment tool. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Copper deposition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Air pressure regulator. . . . . . . . . . . . . . . . . . . . . . . . . . 69

Copper rivets. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Antennas. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Core competencies. . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

Application matrix. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

Corner radius. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

Cover layers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39, 98

Assembly, manual. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

Curing adhesives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

Assembly print. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54, 112

Curing conductive polymer paste . . . . . . . . . . . . . . . . . 62


Curing paste, hardening . . . . . . . . . . . . . . . . . . . . . . . . 62

Curing polymers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

Base material. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Currentless metallization . . . . . . . . . . . . . . . . . . . . . . . 78

Blind holes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39, 47

Customers say . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

Bonding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

Cutter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Brush head . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Cutting boards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Cutting channel width. . . . . . . . . . . . . . . . . . . . . . . . . . 36

Cutting lands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118

CAM-Software. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31, 90
Ceramic material. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Ceramics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3, 86

D104 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14, 100, 102

Chemical metallization . . . . . . . . . . . . . . . . . . . . . . . . . 78

Data import . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Chemical tinning. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Data preparation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32, 90

CircuitPro . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3, 31, 90

Degreasing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Circuit Boards

Delaminating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

Assembly. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

Depaneling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38, 83

Cutting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83, 106

Direct exposure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Depaneling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Direct structuring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

Double-sided circuit boards . . . . . . . . . . . . . . . . . . . 88

Dispenser . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

Drilling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

Distributors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134

Flexible . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

Drill holes for vias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

Microwave circuit boards . . . . . . . . . . . . . . . . . . . . . 15

Drilling backing plates. . . . . . . . . . . . . . . . . . . . . . . . . . 29

Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

Drilling tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Punch marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

Drilling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

RF circuit boards. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Dust extraction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21, 66

Rigid-flex. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49, 89
Single-sided circuit boards. . . . . . . . . . . . . . . . . . . . 88
Soldering paste. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Structuring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
130

Index

Entry-level systems . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 64

Laser welding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

Circuit Board Plotters

Laser technology. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Laser Circuit Structuring

Base material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97

Engraving. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103, 116

Laser micromachining materials. . . . . . . . . . . . . . . . . . 84, 94


F

LaserMicronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

Feeder support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

LCD color monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

Feeder. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

LDS

Fiducial camera. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

LDS design guide . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

Fiducial recognition. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

LDS laser systems . . . . . . . . . . . . . . . . . . . . . . . . . . 123

Film template. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

LDS method . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72, 83, 122

Fine-focus UV laser. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

LDS paint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

Fixture of components . . . . . . . . . . . . . . . . . . . . . . . . . 77

LDS process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123


LDS prototyping . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71, 73, 124

FlowShow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

LDS tech paper . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

Focus position . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Lead-free soldering. . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

FR4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

Legend printing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54, 112

Front panels. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103

LPKF CircuitPro. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3, 31

Function list. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

LPKF CircuitPro 3D. . . . . . . . . . . . . . . . . . . . . . . . . . 34

Fundamentals of circuit boards. . . . . . . . . . . . . . . . . . . 88

LPKF Contac RS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44, 107

Multilayer

Flanging radius . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

LPKF EasyContac . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46, 107

Galvanic chemicals. . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

LPKF MicroLine. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

Galvanics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

LPKF MiniContac RS. . . . . . . . . . . . . . . . . . . . . . . . . . . 44

General services. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

LPKF MultiPress . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

Geometry. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

LPKF MultiPress S. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126

LPKF ProConduct . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42, 107

SMT/Finishing

LPKF distributors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134


G

Through-Hole Plating

Laser structuring. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3, 36, 93

Edge steepness. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

LPKF ProLegend . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54, 112


H

LPKF ProMask. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54, 112

Heat management . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

LPKF ProtoFlow E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

Hot air oven . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

LPKF ProtoFlow S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

Housing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

LPKF ProtoLaser S. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36, 95, 96

Hydraulics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

LPKF ProtoLaser U3 . . . . . . . . . . . . . . . . . . . . . . . . . . . 38, 95, 98


LPKF ProtoMat D104. . . . . . . . . . . . . . . . . . . . . . . . . . . 14, 100, 102
LPKF ProtoMat S103. . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Inert gas option. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

LPKF ProtoMat S43. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10, 12

Inert gas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

LPKF ProtoMat S63. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

In-house production . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

LPKF ProtoMat X60. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Inspection templates . . . . . . . . . . . . . . . . . . . . . . . . . . 103

LPKF ProtoPaint LDS. . . . . . . . . . . . . . . . . . . . . . . . . . . 73, 74, 124

IPC TM 650 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

LPKF ProtoPlace BGA . . . . . . . . . . . . . . . . . . . . . . . . . . 60

IR laser. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

LPKF ProtoPlace E. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

Isolation channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

LPKF ProtoPlace S. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114

Isolation gaps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

LPKF ProtoPlace . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3, 58, 60

TechInfo

LDS Prototyping

LPKF ProtoPlate LDS. . . . . . . . . . . . . . . . . . . . . . . . . . . 78, 125

Laminated substrates. . . . . . . . . . . . . . . . . . . . . . . . . . 93

LPKF ProtoPrint E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

Laser Direct Structuring. . . . . . . . . . . . . . . . . . . . . . . . 72, 83, 120

LPKF ProtoPrint S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56, 113

Laser effects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94

LPKF ProtoPrint S-RP . . . . . . . . . . . . . . . . . . . . . . . . . . 57

Laser hoods. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

LPKF StencilLaser. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

Laser materials processing. . . . . . . . . . . . . . . . . . . . . . 38

LTCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

Index

LPKF ProtoPlate CU. . . . . . . . . . . . . . . . . . . . . . . . . . . . 78


L

Laser plastic welding. . . . . . . . . . . . . . . . . . . . . . . . . . . 84

Index

131

Populating, manually. . . . . . . . . . . . . . . . . . . . . . . . . . . 64

Manual through-hole plating. . . . . . . . . . . . . . . . . . . . . 46

Position measuring systems. . . . . . . . . . . . . . . . . . . . . 84

Manual tool holder. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Positioning SMD components. . . . . . . . . . . . . . . . . . . . 113

Market leader . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Precise geometries. . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Markings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

Precision drive technology . . . . . . . . . . . . . . . . . . . . . . 82

Measuring microscope . . . . . . . . . . . . . . . . . . . . . . . . . 21

Prepregs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48, 98

Metallization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78, 125

Pressure control, hydraulic . . . . . . . . . . . . . . . . . . . . . 51

MicroBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

Pressure distribution. . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Micro-camera . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

Process automation. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Micromachining of materials. . . . . . . . . . . . . . . . . . . . . 35, 38, 82

Process development . . . . . . . . . . . . . . . . . . . . . . . . . . 84

Microvias. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39, 47, 110

Processing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Microwave applications. . . . . . . . . . . . . . . . . . . . . . . . . 117

Process parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Microwave circuitry. . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

Process profiles. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

MID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71, 120

Process wizard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Milling depth . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

ProConduct. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Milling tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Product spectrum. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Minimum conducting path width. . . . . . . . . . . . . . . . . . 36

Production steps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108

Multilayer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3, 48

Production wizard. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91

Circuit boards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Profiles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104

Protective sheets. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39, 98

Multilayer sets. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

ProtoMat

MultiZone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
ProtoMat D104 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14, 100, 102

ProtoMat E33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Negative process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

ProtoMat S103. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
ProtoMat S43 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

ProtoMat S63 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

On-Demand production . . . . . . . . . . . . . . . . . . . . . . . . 36

ProtoMat X60 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Opening solder resists . . . . . . . . . . . . . . . . . . . . . . . . . 38

ProtoPaint LDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74, 124

Overview

ProtoPlate CU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

ProtoPlate LDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78, 125

Circuit boards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

Upgrade. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5, 119

Circuit board plotters . . . . . . . . . . . . . . . . . . . . . . . . 4, 18

Prototypes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Rapid PCB Prototyping . . . . . . . . . . . . . . . . . . . . . . . 3

Prototyping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

SMD machining. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
SMT production. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

SMT Rapid Prototyping. . . . . . . . . . . . . . . . . . . . . . . 52

Quick-release tool holder . . . . . . . . . . . . . . . . . . . . . . . 10

Structuring circuit boards. . . . . . . . . . . . . . . . . . . . . 85, 102


Through-hole plating. . . . . . . . . . . . . . . . . . . . . . . . . 107, 111

Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Rake. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Rapid PCB Prototyping . . . . . . . . . . . . . . . . . . . . . . . . . 3

Reflow oven. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

Parameters library. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

Reflow profiles. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

PET films . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62, 115

Pick&Place system . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

Registration marks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Pick&Place. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

Register pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

Photochemical reactions. . . . . . . . . . . . . . . . . . . . . . . . 94

Repeat accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Plastics engraving. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

Retrofit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5, 119

Plastics welding. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

Reverse pulse plating . . . . . . . . . . . . . . . . . . . . . . . . . . 44, 109

Pneumatic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6, 17

RF bonding. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

Polyimide stencils. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57, 113, 117

RF circuit boards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

132

Index

RF substrates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

Temperature sensors. . . . . . . . . . . . . . . . . . . . . . . . . . . 63

RF tools. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Test adapters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103

Ringset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Test print screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

Rivets. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46, 107

Test screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

Rod feeder. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

Thin-film solar modules. . . . . . . . . . . . . . . . . . . . . . . . . 84

RoHS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

Three-dimensional interconnect devices . . . . . . . . . . . 83

Roller feeder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

Through-hole plating. . . . . . . . . . . . . . . . . . . . . . . . . . . 41, 107

RPP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Comparison of methods . . . . . . . . . . . . . . . . . . . . . . 111

Circuit Board Plotters

Temperature measuring equipment . . . . . . . . . . . . . . . 69


Laser Circuit Structuring

Temperature curves. . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

RF multilayers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

Through-Hole Plating

Tech paper. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

RF filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Tin resist. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118


S

Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

S series. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

Tool sets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
U
Upgrade kits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Sinter plates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Upgrade ProtoMat. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119

Small batch production. . . . . . . . . . . . . . . . . . . . . . . . . 14, 36

Upgrade. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8, 10, 117

SMD assembly. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114

UV exposer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55, 67

SMD fine pitch printing. . . . . . . . . . . . . . . . . . . . . . . . . 56, 68

UV laser. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38, 83

Multilayer

Separating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39, 83
Series-production quality . . . . . . . . . . . . . . . . . . . . . . . 97

SMT assembly system. . . . . . . . . . . . . . . . . . . . . . . . . . 58


SMT production overview. . . . . . . . . . . . . . . . . . . . . . . 86

SMT prototyping accessories . . . . . . . . . . . . . . . . . . . . 66

Vacuum needle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114

SMT prototyping process steps. . . . . . . . . . . . . . . . . . . 86

Vacuum table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20, 29

SMT Rapid Prototyping. . . . . . . . . . . . . . . . . . . . . . . . . 52, 87

Vaporizing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94

SMT stencil printer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

ViaCleaner. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47, 85, 110

SMT E family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

Vision system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14, 88, 93, 124

Solder resist mask. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54, 112

Solder resist . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

Wizard. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Soldering paste dispenser. . . . . . . . . . . . . . . . . . . . . . . 114

Working area. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Soldering paste printing . . . . . . . . . . . . . . . . . . . . . . . . 56, 113

Working depth limiter . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Soldering paste stencils . . . . . . . . . . . . . . . . . . . . . . . . 73, 117

LDS Prototyping

Software interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

pneumatic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6, 14, 17

Spray basin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Starter set. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

StatusLight . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Z-axis control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Stencil frame. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56, 113

ZelFlex . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6, 68

SMT/Finishing

RF circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

Stencil printer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56, 64, 101


TechInfo

Stencils. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
Stretching frame. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56, 68
Structuring ultra-fine conductors. . . . . . . . . . . . . . . . . 118
Subsidiaries. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Surface finish . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54, 88
Surface Mounted Technology (SMT). . . . . . . . . . . . . . . 87
System software. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Index

T
TCO/ITO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39, 98
Technical information . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Technical terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126

Index

133

LPKF Worldwide
Australia
Embedded Logic Solutions Pty. Ltd.
Phone +61-2-96871880
Fax
+61-2-96871881
sales@emlogic.com.au
www.emlogic.com.au

Great Britain
TRACKS Laser & Electronics Ltd.
Phone +44-844-8157266
Fax
+44-844-5763855
s.curran@trackslaser.co.uk
www.trackslaser.co.uk

Poland
SE Spezial-Electronic Sp.z.o.o.
Phone +48-228409110
Fax
+48-228412010
marek@spezial.pl
www.spezial.pl

Sweden
SOLECTRO AB
Phone +46-40-536-600
Fax
+46-40-536-610
Solectro@Solectro.se
www.solectro.se

Austria
elsinger electronic handel gmbh
Phone +43-1-9794651-0
Fax
+43-1-9794651-24
office@elsinger.at
www.elsinger.at

Hungary
Pannoncad Technical Informatics &
Technology Systems House Ltd.
Phone +36-1-350-0214
Fax
+36-1-350-0214
gaborb@pannoncad.hu
www.pannoncad.hu

Romania
Interbusiness Promotion
& Consulting S.R.L.
Phone +40 31 4178390
Fax
+40 31 4178390
marian.lazurca@interbusiness.ro
www.interbusiness.ro

Switzerland
Lumatron AG
Phone +41-62-7977580
Fax
+41-62-7977581
h.kurth@lumatron.ch
www.lumatron.ch

India
Bergen Associates Pvt. Ltd.
Phone +91-11-2592-0283
Fax
+91-11-2592-0289; -0292
info@bergengroupindia.com
www.bergengroupindia.com

Russia
OOO All Impex 2001
Phone +7-495-9213012
Fax
+7-495-646-20-92
info@all-impex.ru
www.all-impex.ru

Israel
MTI SUMMIT Engineering Ltd.
Phone +972-3-9008900
Fax
+972-3-9008902
adip@mtisummit.co.il
www.mtisummit.co.il

SE Spezial-Electronic Moscow
Phone +7-095-438-7343
Fax
+7-499-737-5108
info@spezial.ru
www.spezial.ru

Brazil
ANACOM Eletronica Ltda.
Phone +55-11-3422-4200
Fax
+55-11-3422-4242
contato@anacom.com.br
www.anacom.com.br
China
LPKF Tianjin Co., Ltd.
Phone +86-22-2378-5318
Fax
+86-22-2378-5398
sales@lpkf.cn
www.lpkf.cn
Czech Republic
SE Spezial-Electronic AG, o.s.
Phone +420-233-326621
Fax
+420-233-326623
spezial@spezial.cz
www.spezial.cz
Egypt
Universal Advanced Systems (UAS)
Phone +20-2-24030660
Fax
+20-2-24027629
mahmoud.aladdin@uas-eg.com
www.uas.com.eg
Finland
IsoProto Oy
Phone +358 50 381 3344
janne.isopahkala@isoproto.fi
www.isoproto.fi
France
Inoveos S.A.R.L.
Phone +33-587498020
Fax
+33-587498021
oseguin@inoveos.com
www.inoveos.com
Germany
SE Spezial-Electronic AG
Phone +49-5722-203-0
Fax
+49-5722-203-77135
info@spezial.de
www.spezial.de
Greece
S.K.T. Testing Co.
Phone +30-210-6618414
Fax
+30-210-6618421
ktheodoridis@skt-testing.gr
www.skt-testing.gr

134

LPKF Worldwide

Italy
NITZ engineering GmbH
Phone +39-0472-833944
Fax
+39-0472-833943
info@nitz.it
www.nitz.it

Saudi Arabia
ARAB ENGINEERS for
Trading Co., Ltd.
Phone +966-1-4633117
Fax
+966-1-4652766
tdegwy@ae.com.sa
www.ae.com.sa

Japan
LPKF Laser & Electronics K.K.
Phone +81 45 650-1622
Fax
+81 45 650-1624
info.japan@lpkf.com
www.lpkf.jp

Singapore
HAKKO Products Pte. Ltd
Phone +65-67482277
Fax
+65-67440033
sales@hakko.com.sg
www.hakko.com.sg

Jordan
International Engineers for Trading
Phone +962-6-551-4648
Fax
+962-6-551-9211
ie-est@nol.com.jo
www.ie-est.com.jo

Slovenia
LPKF Laser & Elektronics d.o.o.
Phone +386-592088-00
Fax
+386-592088-20
sales@lpkf.si
www.lpkf.si

Netherlands
PrintTec Tools for Electronics
Phone +31-34457-0088
Fax
+31-34457-1077
info@printtec.nl
www.printtec.nl

South Africa
Cadshop Pty. Ltd.
Phone +27-823770052
Fax
+27-866188782
davidpower@vodamail.co.za
www.cadshop.co.za

Pakistan
Zeeshan Electronics
Phone +92-51-4449945
Fax
+92-51-4449948
zia.sheikh@zeeshanelectronics.com

South Korea
LPKF Korea Laser & Electronics Ltd.
Phone +82-31-689-3660
Fax
+82-31-478-5988
sales.korea@lpkf.com
www.lpkf.kr

Peru
MBC Representations S.A.C.
Phone +51-1-266-5448
Fax
+51-1-266-6439
mariaburgos@speedy.com.pe
www.mbc.pe

Spain
Laser Tecom Electrnica S.L.
Phone +34-91-8475505
Fax
+34-91-8475647
laser@lasertecom.com
www.lasertecom.com

Taiwan R.O.C.
Li Huey Co. Ltd.
Phone +886-2-22405585
Fax
+886-2-22405285
kevin@lihuey.com
www.lihuey.com
Turkey
TAMARA Elektronik Mh. Ltd. Sti.
Phone +90-2164189294
Fax
+90-2164189396
emin@tamara.com.tr
www.tamara.com.tr
Ukraine
SPF VD MAIS
Phone +380-44-2200101
Fax
+380-44-2200202
v.linskiy@vdmais.kiev.ua
www.vdmais.kiev.ua
United Arab Emirates
Laser & Electronics Middle East LLC
Phone +971 04 388-4800
Fax
+971 04 388-4900
sales@laserandelectronics.com
www.laserandelectronics.com
USA
LPKF Distribution Inc.
Phone +1-503-454-4200
Fax
+1-503-682-7151
info@lpkfusa.com
www.lpkfusa.com
Venezuela
Inversiones Makarelli, C.A.
Phone +58-212-985-4822
Fax
+58-212-256-1521
inversionesmakarelli@gmail.com
Vietnam
TECAPRO Co.
Phone +84-4-62637202
Fax
+84-4-38458032
hoanganhtec@hn.vnn.vn

Legal Details
Price lists
Any price lists inserted or attached to this catalog are not a part of this catalog. Prices subject to change.
Please contact your nearest distributor for current pricing.

Technology note
All specifications are subject to technical modifications. The information that LPKF presents to you in this catalog
has been compiled with the greatest of care. In spite of the most careful control, it is impossible to guarantee freedom
from all errors. For this reason, LPKF Laser & Electronics AG excludes all liability or warranty with regard to the
accuracy and completeness of the information provided. LPKF reserves the right to undertake alterations or additions
to the information or data provided at all times without further notice.

Imprint, trademarks, and patents


2014 LPKF Laser & Electronics AG, Garbsen, Germany. All rights reserved. The content including pictures and the
design of the catalog are subject to copyright protection and other laws for the protection of intellectual property.
Systems and products offered by LPKF and its subsidiaries are protected by issued and pending German and
international patents. Any non-LPKF products mentioned are for reference purposes only and may be trademarks
or registered trademarks of their respective companies. Product and brand names are trademarks of LPKF Laser
& Electronics AG, registered among others at the US Patent and Trademark Office: LPKF and the company logo,
# 2,385,062 and # 2,374,780; SolarQuipment, # 3,494,986; ProConduct, # 3,219,251; Allegro, # 3,514,950.
LPKF Laser & Electronics AG
Osteriede 7
30827 Garbsen
Germany

Legal Details

135

Notes

136

Notes

Notes

137

LPKF circuit board plotters have ensured high quality work in laboratories and development departments around
the world for many years. More than 50 subsidiaries and distributors provide customers with reliable services and
support.

www.jenko-sternberg.de

Service

Worldwide (LPKF Headquarters)


LPKF Laser & Electronics AG Osteriede 7 30827 Garbsen Germany
Phone +49 (5131) 7095-0 Fax +49 (5131) 7095-90 info@lpkf.com
www.lpkf.com

North / Central America


LPKF Laser & Electronics North America

LPKF Laser & Electronics AG sells and markets


products and provides support in more than
50 countries. Find your local representative
at www.lpkf.com.

Pictures may show optional equipment.

The global LPKF network for service and distribution:


Headquarters
LPKF Group
LPKF Distributors

Phone +1 (503) 454-4200 Fax +1 (503) 682-7151 sales@lpkfusa.com

China
LPKF Tianjin Co., Ltd.
Phone +86 (22) 2378-5318 Fax +86 (22) 2378-5398 sales@lpkf.cn
www.lpkf.cn

Hong Kong
LPKF Laser & Electronics (Hong Kong) Ltd.
Phone +852-2545-4005 Fax +852-2545-4006 hongkong@lpkf.com
www.lpkf.com

LPKF AG, 10005769-160714-EN

www.lpkfusa.com