First input or out put pin burn

IC input protection: A diode clamping

circuit consists of a combination of one or
more diodes and series resistors. It is
used to control the amount of input
voltage to a sensitive circuit.
Input Pin burn can be board issue
how much IC can take solely depend on the
out put pine burn: IC issue

When process not stable : width not enough: burn

Location Mapping

to see the concentration

Problem Identify
Number one cause of damage IC
In many cases, it is not difficult to
distinguish between an electrical
overstress (EOS) and an electrostatic
discharge (ESD) damage. For instance,
we're all quite comfortable assigning
gross failure attributes such as extensive
metal line burn-out and migration to EOS.
When we see that the package is
discolored and carbonized, as well as
difficult to decapsulate, then we also know
that it was exposed to a large amount of
heat characteristic of an EOS rather than
an ESD event.

Factors

magnitude
duration
Junction spiking failure

Damage is caused by thermal overstress

symptom

Melted metallization failure

open bond wire failure

How to tell

Cause

EOS

Prevention
Common parameters that might be tested
include, but are not limited to:
Input Voltage
Input Current

The various models used for testing a

device's ESD sensitivity (ESDS) level,
i.e., HBM, CDM, and MM, apply standard
waveforms to electrically stress the device
under ESD testing. These waveforms are
usually defined by their peak current
level, rise and fall times, and duration.
Figures 1 to 3 below show the various
waveforms used in HBM, CDM, and MM
testing, respectively.

Electrical overstress

Input Frequency

EOS ESD knowledge

Input Duty Cycle

Input Waveform Characteristics (such as shape)

ESD test mode

Why no standard testing

Safety testing to explore the effects of

intentionally failing a particular component
of the design while varying an input
parameter to further stress the device.
Note that it is not just the maximum value
that equates to stress. Minimizing an
input may result in a different stress type
and potentially different failure modes.

Electrostatic discharge

Also of importance is the operating state

of the device under test. In one mode the
device may be insensitive to a particular
stress while in another mode this same
stress may cause the device to fail.

Main Topic

Electrical Overstress, or EOS, is a failure mechanism wherein the device is

subjected to excessive voltage, current, or power. Electrostatic Discharge, or
ESD, is a special type of EOS mechanism in the form of a single-event, rapid
transfer of electrostatic charge between two objects. Many people distinguish
ESD from other EOS-related but non-ESD mechanisms, so this discussion will
do the same and refer to ESD as a separate mechanism from conventional
EOS.

Input: LVDS 5V ( 4.5-5.5)

Out put: VGH, VGL, VCOM:

Power IC

function

Boost circuit
Panel Vcom use around 5mA

EOS ESD knowledge.mmap - 2016/2/17 - Mindjet

Design usually can stand 150mA