Overview on Basic
Materials Properties
Materials Categories
Metallic Materials
---Inorganic and have crystalline structure.
---Good thermal and electric conductors.
Materials Categories
Ceramic Materials
Metallic and nonmetallic elements are chemically
bonded together.
Inorganic but can be either crystalline, noncrystalline
or mixture of both.
High hardness, strength and wear resistance.
Very good insulator. Hence used for furnace lining for
heat treating and melting metals.
Also used in space shuttle to insulate it during exit and
reentry into atmosphere.
Other applications : Abrasives, construction materials,
utensils etc.
Example:- Porcelain, Glass, Silicon nitride.
Materials Categories
Composite Materials
Mixture of two or more materials.
Consists of a filler material and a binding material.
Materials only bond, will not dissolve in each other.
Mainly two types :---Fibrous: Fibers in a matrix
---Particulate: Particles in a matrix
---Matrix can be metals, ceramic or polymer
Examples : Fiber Glass ( Reinforcing material in a polyester or
epoxy matrix)
Concrete ( Gravels or steel rods reinforced in cement
and sand)
Applications:- Aircraft wings and engine, construction.
Materials Categories
Electronic Materials
Not Major by volume but very important.
Silicon is a common electronic material.
Its electrical characteristics are changed by adding impurities.
Body Centered
Face Centered
Base Centered
Unit Cells
Simple
Body Centered
Face centered
Tetragonal
a =b c
= = = 90
Simple
Body Centered
Unit Cells
Orthorhombic
a b c
= = = 90
Simple
Face Centered
Base Centered
Body Centered
Rhombohedral
a =b = c
= = 90
Simple
Unit Cells
Hexagonal
a = b =a c
= = 900, = 1200
Simple
Monoclinic
a b c
Base
Centered
= = 900, 900
Simple
Triclinic
a b c
900
Simple
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Direction Indices
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Miller Indices
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Polymorphism or Allotropy
9120C
-2730C
Iron
BCC
13940C 15390C
Iron
FCC
Iron
BCC
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X-Ray Diffraction
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XRD
n = MP + PN
(n = 1,2)
n is order of diffraction
If dhkl is interplanar distance,
Then MP = PN = dhkl.Sin
Therefore,
= 2 dhkl.Sin
Ref: A.G. Guy and J.J. Hren, Elements of Physical Metallurgy, 3d ed., Addison-Wesley, 1974, p.201.)
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Example of XRD
= 2 dhkl.Sin
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Solvent atoms
Solute atoms
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Examples:System
ElectroSolid
Atomic
negativity Solubility
radius
Difference difference
Cu-Zn
3.9%
0.1
38.3%
Cu-Pb
36.7%
0.2
0.17%
Cu-Ni
2.3%
100%
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Crystalline Imperfections
No crystal is perfect.
Imperfections affect mechanical properties,
chemical properties and electrical properties.
Imperfections can be classified as
Zero dimension point defects.
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Dislocations
Line Defects (Dislocations)
Edge Dislocation--Screw Dislocation--Mixed Dislocation---
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3D view of
grains
Grain Boundaries
In 1018 steel
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Planar Defects
Grain boundaries, twins, low/high angle
boundaries, twists and stacking faults
Free surface is also a defect : Bonded to
atoms on only one side and hence has
higher state of energy Highly reactive
Nanomaterials have small clusters of
atoms and hence are highly reactive.
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Examples:
---Movement of smoke particles in air : Very fast.
---Movement of dye in water : Relatively slow.
---Solid state reactions : Very restricted movement due
to bonding.
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Diffusion mechanism
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Substitutional Diffusion
Example: If atom A
has sufficient activation
energy, it moves into the
vacancy self diffusion.
Activation
Energy of
Self diffusion
Activation
Energy to
form a
Vacancy
Activation
+ Energy to
move a
vacancy
Interstitial atoms
Matrix
atoms
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Concentration
Of diffusing C
2
atoms
Distance x
Diffusing
atoms
Unit
Area
J = D
dc
dx
dc
= Concentration Gradient.
dx
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Diffusivity
interstitial or substitutional.
Temperature: As the temperature increases
diffusivity increases.
Type of crystal structure: BCC crystal has lower
APF than FCC and hence has higher diffusivity.
Type of crystal imperfection: More open
structures (grain boundaries) increases diffusion.
The concentration of diffusing species: Higher
concentrations of diffusing solute atoms will affect
diffusivity.
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d dc x
D
=
dt
dx dx
dC x
Cs C x
Cs = Surface concentration of
element in gas diffusing
into the surface.
C0 = Initial uniform concentration
of element in solid.
Cx = Concentration of element at
distance x from surface at
time t1.
x = distance from surface
D = diffusivity of solute
t = time.
Cs
Time = t2
Time= t1
Cx
Time = t0
C0
Distance x
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Phase Diagrams
Phase: A region in a material that differs in structure
and function from other regions.
Phase diagrams:
Represents phases present in metal at different conditions
(Temperature, pressure and composition).
Indicates equilibrium solid solubility of one element in
another.
Indicates temperature range under which solidification
occurs.
Indicates temperature at which different phases start to
melt.
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Ref: W. G. Moffatt, et al., The Structure and Properties of Materials, vol I: Structure, Wiley, 1965, p.151
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Phase Rule
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Eutectic temperature
Liquid
Cooling
Terminal phases:
Phases occur at the end
of phase diagrams.
Intermediate phases:
Phases occur in a
composition range inside
phase diagram.
Examples: Cu-Zn
diagram has both
terminal and
intermediate phases.
Five invariant peritectic
points and one eutectic
point.
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Three components
Constructed by using a equilateral triangle ()
as base.
Pure components at each
end of triangle.
Binary alloy composition
represented on edges.
Temperature can be
represented as uniform
throughout the
Whole Diagram ----Isothermal section.
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Ceramics
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Silicate Structures
Silicate (SiO44-) is building block of silicates.
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Silicate Networks
Silica: All four corners of the SiO44- tetrahedra share
oxygen atoms.
Basic structures: Quartz, tridymite and cristobalite.
Important compound
of many ceramic and
glasses.
Feldspars: Infinite 3D
networks.
Some Al3+ Ions replace
Si4+ Ions
Net negative charge.
Alkaline and alkaline fit into interstitial sites.
.
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Traditional Ceramics
Made up of clay, silica and feldspar.
Quartz
grain
High-silica
glass
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Engineering Ceramics
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Electrical Properties
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Ceramic Semiconductors
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Zn + 2HCl
ZnCl2 + H2
or
Zn + 2H+
Zn2+ + H2
also
Zn
Zn 2+ + 2e- (oxidation half cell reaction)
2H+ + 2eH2 (Reduction half cell reaction)
Oxidation reaction: Metals form ions at local anode.
Reduction reaction: Metal is reduced in local charge at
Local cathode.
Oxidation and reduction takes place at same rate.
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E=E +
0
0.0592
n
log Cion
E = Net emf of half cell
E0 = Standard emf of half cell
n = Number of electrons transferred
Cion = Molar concentration of ions.
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Ref: J. Wulff et al., The Structure and Properties of Materials, vol. II, Wiley, 1964, p.164.
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Grain boundary
(cathode)
anode
Cartridge Brass
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