2010-36-0037I

Accelerating the Vehicle Development Process by

Employing EMI and EMC Numerical Analysis Assisted by
High Performance Computing
Juliano Fujioka Mologni, Mateus Bonadiman and Antonio Carlos Guimares
ESSS - Engineering Simulation & Scientific Software

Leonardo Alvarenga and Arnaud Colin

Fiat Automveis S.A.

Jose Osvaldo S. Paulino

UFMG

Copyright 2010 SAE International

ABSTRACT
Since the majority of the innovative trends in automotive
industry today are based in advanced electronics
technology, mastering the EMI (Electromagnetic
Interference) between embedded electronic subsystem and
the EMC (Electromagnetic Compatibility) features of a
vehicle in its early design phase becomes one of the crucial
technical challenges faced by all automotive manufacturers.
Even if all electronic subsystems in a vehicle are validated
under the EMC standards, the integration between them
may create numerous points of potential hazards that affects
the total electromagnetic behavior of the entire system,
hazards that can be detected only once the first complete
prototype is available, and whose resolution at this phase of
the process is very time consuming and expensive. This
paper presents the state of the art regarding electromagnetic
numerical analysis using Ansoft HFSS (High Frequency
Structure Simulator) tool and a parallel HPC (High
Performance Computing) consisting of numerous computer
nodes connected to a network. An application of this
approach to a vehicle modeling is presented. Adaptations to
CAD (Computer Aided Design) models are proposed in
order to improve CAE (Computer Aided Engineering)
analysis and save computer effort with the objective to
reach a correct level of industrial efficiency. EMI between
subsystems are investigated using field solvers and a SI
(Signal Integrity) analysis is performed in a wiring harness
transmitting a random CAN J1939 standard signal. A
complete analysis on EMI and EMC properties is
performed, and a conclusion concerning the practical use of

numerical simulation at early stages of the vehicle design is

proposed.

INTRODUCTION
The amount of electronics content in vehicles has been
increasing significantly during the last years, and the
prevision is to keep rising in the future specially with the
development of hybrid vehicles. The economical emergent
market largely mentioned in the media today (comprised by
Brazil, Russia, India and China - BRIC) is the main target
for almost all automotive companies. It is expected that the
BRIC countries will be responsible for approximately 72%
of total automotive global share by 2013. Although the
vehicles of such countries are classified as A and/or B entry
cars, their EEA (Electrical and Electronic Architecture) is
becoming more complex due to the increasing customer
demand for advanced multimedia and infotainment features.
Today the value of electronics in a medium sized vehicle
represents about 35% of the total vehicle cost. The increase
in vehicle electronic components and modules has occurred
not only in ECU (Electronic Control Units) and operational
systems for the vehicle itself, but also in mobile
communications, navigation, information, security and
entertainment devices.
In light of this automotive electronic expansion it is crucial
that the multiple ECUs in a vehicle are electromagnetically
compatible and do not interfere in external devices [1-8].
The EMC of vehicles has been a global consideration for
much longer than most commercial EMC standards have
existed. Unfortunately, the electromagnetic behavior of the

Figure 1. Element definition: a) rectilinear; b) curvilinear.

entire vehicle can be tested only when the first complete

prototype is available, and whose resolution at this phase of
the process is very time consuming and expensive. This
paper presents a numerical methodology using the benefits
of HPC that enables the simulation of very large field
problems. Guidelines to change the CAD mathematical
model are addressed in order to improve CAE analysis and
save computer effort. EMI between subsystems are
investigated using field solvers and a SI analysis is
performed in a wiring harness transmitting a CAN J1939
clock signal. A complete analysis on EMI and EMC
properties is realized, and a conclusion is proposed
concerning the practical use of numerical simulation at early
stages of the vehicle design. The methodology presented
herein strongly reduces the development lead time and
enables engineers to evaluate the EMI and EMC issues
through virtual prototyping.

CAD MATHEMATICAL MODELS

The major part of companies is realizing that, by reordering
product design activities, they can guarantee a more
efficient product development process. By empowering
engineers with powerful 3D conceptual design tools with
early access to CAE, they can be sure their designs are
optimized before committing them to labor-intensive
manufacturing and tests. However, in a company, the team
responsible for developing CAD models is not the same
team in charge of CAE analysis. This can be very tricky,
since CAD models can be very useful for manufacturing
purposes but it still might present many issues to CAE
analysis.
In the finite element method (FEM), the mathematical CAD
model is subdivided into numerous small known elements.
In the global Cartesian coordinates (x, y, z), the field
quantities to be solved are expanded into a set of basis
functions, used to interpolate field values from nodal values
[9]. Since the basis functions are individually associated
with each element, it is convenient to write them in the local
coordinates (u, v, w), which are independent from the
elements shape. The local coordinates and the global
coordinates are linked by a transformation through a socalled Jocobian expressed by a matrix:

x y z
u u u

x y z

J=

x y z
w w w

(1)

Figure 2. FEM model with curvilinear elements.

In the case of a linear transformation, the elements are

called rectilinear elements (figure 1a), with straight edges
and planar faces; if the transformation is non-linear, such as
quadratic or cubic, the elements are called curvilinear
elements (figure 1b), with curved edges and/or curved faces.
The curvilinear elements are a more general type of
elements than their rectilinear counterparts. Where exists
difficulties to conform exactly with the curved boundaries,
the curvilinear elements conform better with less number of
elements than the rectilinear ones. As a result, curvilinear
elements often generate more accurate and usually faster
FEM solutions. Flaws in the mathematical CAD models can
lead the FEM analysis to a non-convergence problem.
Geometry gaps, sheet overlaps and missing faces are
common issues in the mathematical CAD model that leads
to a high density element region in the CAE model; hence a
higher computational effort is required to solve the same
model and sometimes it can even prevent the resolution of
the analysis. A computational tool called SpaceClaim has
been used to treat flaws in mathematical CAD models and
remove stubborn rounds, including those that overlap or
have complex intersections. SpaceClaim automatically
detects and removes small holes and faces, splits models
according to symmetry, automatically calculates
midsurfaces for thin-walled parts and chops off geometries
that are irrelevant to the electromagnetic analysis. Figure 2
shows the FEM model of a Fiat Punto door filled with
curvilinear elements. The density of elements is higher at
edges and geometry discontinuities where the
electromagnetic field gradient is higher.

ELECTROMAGNETIC ANALYSIS
The finite element method (FEM) is a very well established
numerical technique employed to solve electromagnetic
problems [10-16]. The application of this method is for a
general purpose and does not restrict any geometry or
material. Using the FEM model displayed in figure 2, one

can use Maxwells equations on each of the known elements

to solve the wave equation for the entire model. For each
propagation mode m, the solver solves the equation 2, also
known as wave equation, for each element in the model:
2
2
1
Em ( x, y )e m k 2 r Em ( x, y )e m = 0 (2)
r

where =2f is the angular frequency; c is the speed of

light; k=/c is the wave number of free-space; r(x,y) is the
complex relative permeability and r(x,y) is the complex
relative permittivity. By solving the equation, the electric
field mode pattern Em(x,y) and the propagation constant m
are both calculated for all the specified modes. For the
current based impedance calculations, the numeric
algorithm also solves Hm(x,y) independently using a
corresponding equation for the magnetic field.
The fields values over the radiation surface are used to
compute the fields in the space surrounding the device. This
space is typically divided into two regions: the near-field
region and the far-field region. The near-field region is the
region closest to the source. In general, the electric field
E(x,y,z) outside the region bounded by a closed surface is
evaluated using equation 3.

jr H tan G + Etan G +
ds (3)
E ( x, y, z ) =

S Enormal G

where the free space Greens function is given by:

G=

exp( jk r r ) r r
4 r r

(4)

When calculating the radiation patterns, HFSS uses the

Figure 4. 3106 Horn antenna gain pattern. Inset graph shows the
3D radiation pattern.

general expressions given in equation 3. The radial

coordinate r needs to be specified because the radiation
pattern can be used to compute fields at an arbitrary radius
from the radiating structure inside the air box previously
modeled for FEM analysis. All antenna parameters such as
gain, peak directivity, radiated power, radiation efficiency,
front to back ratio and decay factor can be computed using
the FEM described above using analytical equations [17].
Moreover, using all the equations and the procedure
described above, it is possible to calculate the electric field
value for all nodes and elements of our model. Figure 3
shows an electric field plot on a Fiat 310 door having a
1GHz incident plane wave as a source.
There are many EMC standards for the automotive industry.
The standard ISO 11451-2 specifies a vehicle test method
for determining the immunity of passenger cars and
commercial vehicles when submitted to electrical
disturbances from off-vehicle radiation sources, regardless
of the vehicle propulsion system (e.g. spark-ignition engine,
diesel engine, electric motor). It can also be readily applied
to other types of vehicles.
The electromagnetic
disturbances considered are limited to narrowband
electromagnetic fields. In order to expose a vehicle to a
radiated field, an antenna operating at different frequencies
is used. An usual antenna used in EMC tests is the 3106
horn type antenna, that radiates from 0.2GHz to 1GHz.
Figure 4 shows the gain radiation pattern for this 3106 horn
antenna operating at 200MHz with =0deg and =90deg
and ranging from -180deg to 180deg. The inset plot shows
the full 3D radiation pattern.

EMC VIRTUAL TESTING USING HIGH

PERFORMANCE COMPUTING

Figure 3. Electric field distribution from an incident plane wave.

There are two radiated emissions standards in common use:

95/54/EC and CISPR-25. Both of them share many
common features in their chamber, test set-up and the
results of each are very comparable. The test consists in
generating radiated electromagnetic fields using antenna
sets with a radio frequency source capable of producing the
desired field strength over the range of frequencies. The

Figure 5. Physical dimensions of the electromagnetic model.

radiation source needs to be positioned toward the vehicle,

which should be placed at a certain distance. This test is
usually done in an anechoic or semi anechoic chamber and
the electromagnetic environment can be very large.
Figure 5 shows the arrangement of the test having a 3106
horn antenna as a radiation source and the Fiat Punto door
positioned 3.25m away. The total environment physical
3
volume is 3.6m x 3.7m x 1.2m = 16m . However, the total
electromagnetic environment depends on the frequency and
it is very common to measure the total model as a function
of the wavelength =c/f. Therefore, the electromagnetic
3
3
model has a dimension of 11.7 for 220MHz and 53.3
for 1GHz. This means that if we decide to simulate the same
physical model (same physical dimension), we will need 5
times more computer power to simulate at 1GHz compared
to a simulation with the same model at 220MHz. To
overcome this issue we use a technique called DDM
(Domain Decomposition Method) that uses HPC to solve
very large field problems. DDM has emerged as a powerful
and attractive HPC technique due to its inherent parallelism
which enables the use of distributed memory. DDM is based
on a divide-and-conquer philosophy where, instead of
solving a large and complex problem directly, the original
problem as defined by the mesh is partitioned into smaller
and easier parts to solve sub meshes or sub-domains. In this
approach it is critical to enforce continuity of
electromagnetic fields at the interfaces between adjacent
sub-domains through some suitable boundary conditions
[18]. To address the basic idea of DDM, we solve a FEM
matrix by decomposing the original problem into two
domains:
A11 A12 x1 b1
A
=
21 A22 x 2 b2

(5)

Figure 6. Domain Decomposition Method splitting a model into 4

sub-domains.

Where Aii, xi and bi, i=1,2 are the matrix system, the
solution vector and the right hand solution for domain i,
respectively; and A12, A21 are the coupling matrices
between the two domains. To solve in parallel sub-domain
problems, one popular domain decomposition algorithm is
of Jacobi type:
A11 A12 A11 0 0 A12
A
=
+

21 A22 0 A22 A21 0

(6)

Using (6) and applying iteration, (5) can be solved as

A11 0 x1
b1 0 A12 x1
0 A x = b A

22 2
2 21 0 x 2

(7)

Through some simple algebra, equation (7) leads to two

coupled systems:
A11 x1

( )

= b1 A12 x 2

( 1 )

A22 x 2

( )

= b2 A21 x1

( 1 )

(8)
-1

By setting x1(0)=x2(0)=0, the initial guess xi(1)=Aii bi is

obtained from (8), and then the final solution can be found
through iterative refinement by the coupling matrices A12
and A21. The approach (7) is known as a stationary Jacobi
solution of (5) which unfortunately converges rather slowly.
This advanced Domain Decomposition Method maximizes
the use of all hardware resources because it can balance the
memory for each sub-domain, so every computer connected
to the network can be used. A detailed diagram showing

Figure 8. Near field results of a cell phone PCB solved in SIwave

and the respective link to the door model in HFSS. A door wiring
harness is also modeled.

OFF BOARD SYSTEMS VIRTUAL EMI

TESTING

Figure 7. Cross sectional electric field plot for the antenna

operating at: a) 200MHz and b) 1GHz.

how the mesh is distributed across many processors

connected to a network is shown in figure 6. Besides the
great advantage of simulating very large field problems, the
DDM also provides a linear acceleration on the simulation
of normal problems. This means that if you split your
domain into 4 sub-domains, the problem is solved 4 times
faster with the same accuracy. Figure 7 shows the electric
field plot for the model at two distinct frequencies: 200MHz
and 1GHz. It is possible to clearly observe the wavelength
difference in those plots and the shielding provided by the
door. For lower frequencies, the wavelength is large and
does not penetrate through the window. That is one of the
reasons that most of the AM and FM radio antennas are
installed outside the vehicle chassis. In the other hand,
personal GPS systems operate at 1.575GHz thus it can be
installed inside the vehicles. The far field pattern also
presents significant changes. For 1GHz, the wavelength is
small enough so it can propagate through the upper and
lower screen part of the antenna. The computational RAM
memory required for the 200MHz analysis was 2.35 GB of
RAM, while for the same model @1GHz, 7.67 GB of RAM
was needed. This model represents only the door of the
vehicle; however, with the DDM technology presented
herein, an entire vehicle can be simulated without any major
issues.

The numerical methodology presented so far allows a

complete evaluation of any mathematical model in terms of
electromagnetic behavior in an isolated environment (an
anechoic chamber for example). In real world, off board
systems like cell phones, bluetooth devices, video games,
DVD players and spark plugs can electromagnetically
interfere in any vehicular electronic embedded system. In
order to evaluate intrasystem interference, we can use
electromagnetic models of any of those devices, including
products small details like the traces, vias, real signal
profiles and the whole PCB layout. Ansoft SIwave is a code
that analyzes entire PCBs prevalent in modern electronic
products. The software allows engineers to perform
complete signal and power integrity analyses from DC to
beyond 10 Gb/s. Ansoft SIwave extracts frequencydependent circuit models of signal nets and power

Figure 9. Electric field distribution on the door due to cell phone

radiation.

Figure 10. Cell phone radiation pattern.

distribution networks directly from electrical CAD layout

databases and couple the electromagnetic model to HFSS. A
full generic PCB of a cell phone has been analyzed in
SIwave and the near fields have been calculated for a wide
range of frequencies. The PCB near field results can be
dynamic linked to the door model in HFSS and the
interference of the cell phone on a door wiring harness can
be investigated in details. The dynamic link is necessary
because if it is necessary to solve frequencies that havent
been previously solved by HFSS, the software will
automatically open SIwave and it will calculate the fields
for the missing frequencies.
Figure 8 shows the SIwave near filed results from the PCB
and the door modeled in HFSS including a simplified
wiring harness model. For this simulation the wiring harness
is assumed to have a matched 50 termination on both ends
and it is considered a victim line in this coupled simulation.
The incident waves from the PCB generate an electric field
which is captured by the wiring harness. The cell phone
PCB acts as a transmitting antenna operating at 850Mhz,
while the wiring harness acts as a receiver antenna. The

Figure 11. Electric field magnitude inside the wiring harness.

electric field distribution on the metallic parts of the door

can be seen in figure 9. As expected, it is possible to
observe that the highest values are found near the PCB. The
cell phone radiation pattern is plotted on figure 10. The
radiation pattern points to the inner side of the vehicle
because the metallic door is considered a ground plane for
the cell phone PCB, reflecting most of the incident waves.
In an initial state, the wiring harness has no electric
potential. When HFSS simulates all the electromagnetic
sources in one unique environment, an electric field will be
captured by the wiring harness due to the radiation coming
from the cell phones PCB. This electric field can be
quantified in every space inside the harness. Figure 11
shows the electric fields magnitude spatially distributed
inside the wiring harness. The highest values are found on
the closest region in relation to the cell phone. This kind of
numerical methodology is extremely useful for EMC and
EMI analysis because engineers are able to create or study
tier one supplier specifications to see if their products, in
this case a wiring harness, is going to have a good
performance even in the presence of cell phones or any
other off board electronic system.
We can go further into this investigation by inserting a
known signal into the wiring harness and investigated the
behavior of this signal when the cell phone is turned on.
Ansoft Designer is a circuit and system integration tool
capable
of
coupling
electronics
circuits
with
electromagnetic models developed on HFSS. With the
dynamic link between all those numerical tools, engineers
are able to insert an electrical signal into an electromagnetic
model and a complete evaluation can be done. In this case,
we have inserted a random CAN J1939 signal, which is one
of the automotive standards protocol, and a complete
investigation in terms of signal integrity. Statistical signal
integrity tools are employed in order to investigate the
integrity of the wiring harness as a communication channel.
Eye diagrams are useful tools to help answering one of the
fundamental questions of signal integrity: if we transmit a
sequence of ones and zeros into a channel, separated in time

Figure 12. Eye diagrams for the cases: a) cell phone on; and b) cell
phone on and the output power multiplied by 5.

by a specified unit interval, what are the chances of

correctly detecting the sequence of bits at the far ends? In a
traditional eye diagram, copies of the waveform generated
at the far end of the channel by transient analysis are
overlaid at a spacing of one unit interval. For certain types
of channels, the resultant diagram resembles an eye, hence
the name. The required width of the eye depends on the
BER (bit error rate) due to timing variations such as jitter
and variations in setup and hold times. The required height
of the eye depends on the noise margin. Slicing through the
eye at the midpoint of the amplitude displays the BER as a
bathtub curve. Comparison between the eye diagrams
shows the principal cause of bit errors, the intersymbol
interference. When the response of the channel to a
transition takes more than a unit interval to settle, the effects
of previous bits affect the waveform for the current bit.
Figure 12a shows the eye diagram when the cell phone is
-10
on, indicating a BER of 10 , and figure 12b displays the
eye diagram when the cell phone is on and the output power
-3
is multiplied by five, showing a BER of 10 . The rose mask
displayed in the middle of the eye in figure 12 is a mask that
guarantees that there is no intersymbol interference in the
channel. In figure 12b it is possible to observe a closed eye
signals overlapping the mask, indicating that ISI will occur
in this case.

SUMMARY
We have addressed a detailed numerical methodology
capable of simulating very large field problems with the use
of domain decomposition technique supported by high
performance computing.
An anechoic chamber
environment with a real horn antenna and a Fiat Punto door
have been simulated at 200MHz and 1GHz using HPC and
DDM by having the entire model spit into four subdomains, which in turn was calculated on four different
computers connected to a high speed network. It has also
been shown a methodology that enables design engineers to
proactively reduce EMI issues on automotive embedded
system. A dynamic link between electromagnetics, PCB and
circuit simulation, allows a complete analysis, with actual
signals that are used by automotive protocols, leading to
very accurate results, independently of the complexity and
size of the geometries being evaluated. The interference of
the cell phone in a wiring harness carrying a CAN J1939
signal was also evaluated. Through the use of statistical
tools, it is possible to verify that the cell phone radiation
reduces the signal integrity, leading to an increase in the bit
detection error probability. The numerical methodology
presented herein can be employed to predict any intrasystem
interactions, optimizing test time and reducing costs through
virtual prototyping and above all, increasing the safety of
vehicles.

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CONTACT INFORMATION
Corresponding author:
Juliano Fujioka Mologni
ESSS - Engineering Simulation & Scientific Software
Rua do Rocio 423 Suite 1001, 04552-000, Vila Olmpia,
So Paulo - SP, Brazil
juliano.mologni@esss.com.br
Leonardo Alvarenga Lopes Santos
Fiat Automveis S.A.
Rodovia Ferno Dias, km 429, CEP 32530-000 Betim
MG
leonardo.alvarenga@fiat.com.br

DEFINITIONS/ABBREVIATIONS
3D
THREE DIMENSION
AM
AMPLITUDE MODULATION
BRIC
BRASIL, RUSSIA, INDIA AND CHINA
CAD
COMPUTER AIDED DESIGN
CAE
COMPUTER AIDED ENGINEERING
CAN
CONTROLLER AREA NETWORK
DDM
DOMAIN DECOMPOSITION METHOD
EEA
ELECTRICAL ELECTRONIC ARCHITECTURE
ECU
ELECTRONIC CONTROL UNIT
EMC
ELECTROMAGNETIC COMPATIBILITY
EMI
ELECTROMAGNETIC INTERFERENCE
FM
FREQUENCY MODULATION
GPS
GLOBAL POSITIONING SYSTEM
HFSS
HIGH FREQUENCY STRUCTURE SIMULATOR
HPC
HIGH PERFORMANCE COMPUTING
RAM
RANDOM ACCESS MEMORY

SI
SIGNAL INTEGRITY
PCB
PRINTED CIRCUIT BOARD