Summary:

The article describes the growth of packaging in electronic industry. The packaging
coast is considered I total coast of the product. Since the packaging affects the market
performance of the product.
The challenges in packaging industry are to produce an innovative pack, which can be
manufactured by simple process without affecting the coast of the product. The requirement
for electronic packaging and assemble for packaging depends on market demand, while the
cost of the total product remains unchanged. The time is also an important factor in
packaging design and devotement. The package design process needs constant improvements
in design and analysis tools. These tools should minimize the short comes of packaging
designs and enhance its usability. To create this integrated packaging system or to introduce
this kind of shift industry needs 2001 ITRS assembly and packaging industry will be
expanded.
The packaging reliability of packages is more important, although the packaging for
electronics goods should be invisible. Hence the material used for packaging is selected
carefully. Although the pack is not for long term use, still package should have long shelf life,
and sustain throughout the processing.

Critical Analysis of article

Rationale for study:
The author has described 2001 ITRS Assembly process with rapid electrical,
optoelectronics system, flip chip packaging, to increase the usability and sustainability of the
package and minimize the cost of manufacturing.
Purpose of study:
The purpose of the study is to introduce the specific features in various process of
packaging to increase the production and accuracy without affecting the cost.
Hypothesis/Model/ Claims:
The Author claims that the methodology described, is completely applicable and there
are no drawbacks of the this system.

Research Design:
Author has described varies package processing methods and variations that affects
the total outputs. First he describes the importance of package, the evolution required in
packaging and the requirements for that that. The chart has also been given that specifies
difficult challenges involve in packaging and assembly. The total article guides about creating
innovation in packaging development with useful utilization of assembly, by introducing the
2001 ITRS technology. We can see the gradual improvement through 2001 to 2007 with
single chip packaging technology requirement.

What critical analysis helps me understand for my own research?

I find this article very interesting. The methodology given to improve the processing
and increase the output is well described and interesting. However author claims that this
methodology is completely effective and has no drawbacks, still we do not find any practical
application of his hypothesis. In introduction part, author has stated the importance of
advance packaging, the innovation required in packaging and how the field is grown through
the years, but there are so little described about the solution or the implementation. There are
so many conditions and requirements or ideal states required for implementation. It involves
the complex procedures.
At the same time, this article has helped me to understand, how to put hypothesis for any
research. What parameters we should consider and how to think in scientific way.

Reference: (APA style)

Adam, J., Chi Shih Chang, Stankus, J. J., Iyer, M. K., & Chen, W. T. (2002).
Addressing packaging challenges. IEEE Circuits and Devices Magazine, 18(4), 4049.