Folder
Sample &
Buy
Support &
Community
Tools &
Software
Technical
Documents
3 Description
2 Applications
Device Information(1)
AV Receivers
Embedded PCs
Netbooks
Video Broadcasting and Infrastructure: Scalable
Platforms
PART NUMBER
PACKAGE (PIN)
NE5532x, SA5532x
SOIC (8)
4.90 mm 3.91 mm
NE5532x, SA5532x
PDIP (8)
9.81 mm 6.35 mm
NE5532x
SO (8)
6.20 mm 5.30 mm
4 Simplified Schematic
VIN
RIN
+
VOUT
RG
RF
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features...................................................................1
Applications.............................................................1
Description..............................................................1
Simplified Schematic..............................................1
Revision History......................................................2
Pin Configuration and Functions..........................3
Specifications..........................................................4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
Detailed Description...............................................7
8.1 Overview.....................................................................7
Layout Guidelines...................................................11
Layout Example......................................................11
Related Links..........................................................13
Trademarks.............................................................13
Electrostatic Discharge Caution.............................13
Glossary..................................................................13
5 Revision History
Changes from Revision I (April 2009) to Revision J
Page
Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table,
Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section....................................................................................................1