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FMEA- Failure Mode Effects Analysis

Overview

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Date
Time Country
Venue
4/11/2016 - 9AM Armada Hotel
Malaysia
4/11/2016 5PM
PJ

Failure Modes and Effects Analysis (FMEA) is a valuable tool for preventing failure in both
product and process design. FMEA is not a form to be completed alone by the responsible
engineer after the design has been completed. FMEA should be planned to coincide with
product development when risks can be mitigated to an acceptable level in advance of product
or process release.

To have a fail-proof successful FMEA, the FMEA training is imperative. A FMEA strategy is
comprised of three elements:
Commitment to the prevention of failure using FMEA
Acquisition of knowledge of FMEA and its proper use
Practice of efficient FMEA development using a clear method and process
Equip your people today with the right FMEA training. Attend iTrainingExperts courses, your
preferred training provider who study your needs.

Learning Outcomes

By the end of the course, you will be ablve to:

Describe the purpose of an FMEA and explain the benefits of using FMEAs in both
design and process engineering situations.
Explain the ten steps to conducting an FMEA.
Contribute effectively to an FMEA team.
Customize FMEA rating scales.

Who Must Attend

This course is designed for safety and health committee, working project team for OHSAS
18001, managers, Engineers, supervisors, managers, quality professionals. Anyone who will
be serving as a member or leader of an FMEA team.

Course Details

Morning session: 9.00am 1.00pm

Introduction and Voice of the Customer (VOC)
o FMEA Process Overview
o What is Risk?
o History and Purpose of FMEA
o Standards and Guidelines to be followed
o System / Subsystem / Component Design FMEA
o Manufacturing and Assembly Process FMEA
o Machinery and Equipment FMEA
o Typical Applications Aerospace, Medical, Automotive, Machinery, etc.

FMEA Development Methodology

o Special Characteristics (Critical and Significant)
o Collaboration on Special Characteristics
o Characteristics as Inputs to PFMEA
Workshop 1: Review Product and Processes to be performed
o Robustness Tools: Interface Analysis / Boundary (Block) Diagrams; Parameter Diagram (P
Diagram)
Workshop 2: Construct Boundary / Block Diagrams and Parameter Diagrams
o Morning Review and Q&A

Afternoon Session 2: 2.00pm 5.30pm

FMEA Development Methodology Three path model
Path 1
o Functions / Failure Modes / Effects of Failure / Severity
o Severity Ranking Guidelines
o Actions for High Severity (9 and 10)

Path 2
o Causes / Prevention Controls / Occurrence
o Occurrence Ranking Guidelines
o Inputs to Fault Tree Analysis (FTA)
o Actions to eliminate and / or reduce cause probability

Path 3
o Test and Verification Methods
o Detection Ranking Guidelines
o Actions to improve tests and verification techniques
o Risk Priority Number (RPN)
o Symbols and Structure
o FMEA Spreadsheet development
Workshop 3: spread sheet

 Process FMEA Pre-Work

Process Flow Diagrams

o Characteristics Matrix
Workshop 4: Process FMEA Complete Development
Keys to Success and Efficient FMEA Development

Technology Blocks for Failure Mode / Cause Mechanism History

o Eight Disciplines of Problem Solving (8D) and FMEA Links
o Role of FMEA Spreadsheet and SOP
o Reliability and Maintainability

Overall Review and Q&A

Methodology

Interactive lectures, discussions, case studies and presentation.

Course Leader

Mr S. Y. LEE

Qualification: B. Eng (US), MIEEE, AMIM, Dip Sc.

Mr LEE, Motorola Six Sigma Green Belt, is extensively involved test development, product
engineering, process engineering and handle various manufacturing engineering projects
internationally. He comes with 25+ years of experience in semiconductor manufacturing fields
and multi-lingual translator.
Professional Qualifications:
MIEEE (member of Institute of Electrical Electronic Engineer, USA)
AMIM (Associate Malaysia Institute of Management)
Bachelor Engineering (USA)
Certificate Chinese Education (Taiwan)
Diploma in Science (Malaysia)
Achievements:
NATIONAL SEMICONDUCTOR
Started as a Test & Product Engineer and built the first wafer bump process in National
Semiconductor factory in Malaysia.
Leads various productivity project and process improvement project in the factory.
Worked in National Semiconductor Malaysia, Singapore and Santa Clara factories for 9
years till Year-2002 as the Senior Engineer.
MOTOROLA / FREESCARE SEMICONDUCTOR
In 2002, worked in Motorola Semiconductor Kuala Lumpur (currently known as Freescale
Semiconductor Malaysia (M) Sdn. Bhd.) as Senior Test Engineer
2004, Promoted to Senior Staff Engineer to engage extensively in process, yield and
productivity improvement.
Successfully stabilize one of the most important platforms in the Motorola Kuala Lumpur

factory.
Speedy promotion to head the NPI (New Product Introduction) department to manage a
group of product and test engineers in the factory for all new products introduction
activities for Motorola Semiconductor Kuala Lumpur.
Champion and develop GAGE RR Project
Conducts ATE and tester trainings in Motorola and many trainings in Freescale factories
2007- Head of Test-Engineering team for Freescale Semiconductor (Motorola spun off),
Lead a group of system engineers, ATE application engineers and system admin team
In charge of various project across in Malaysia, various subcond houses, USA factories
and China factories.
IRIS CORPORATION
2010- Setup R&D department and in charge of continuous process improvement
Spearhead the Change Management board in the organization from 2010- 2012.
TRAININGS CONDUCTED:
Certified trainer Malaysia government's HRDC (Human Resource Development Council)
or PSMB since Dec 2012.
Clocked in more than 1000 hours of technical trainings for engineering manager,
engineers from various fields, technician, supervisor and technical specialist since 1997.
Course conducted includes since 1997:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.

FMEA
DMAIC
8D Methodology
Test system
Digital test methodology
Analog testing
Teradyne A575 system
Serial and parallel communication system
Daymarc Handler multi site testing in high volume manufacturing,
Operation Amplifier testing theory, Compact Programming,
C++ programming for beginners
MCT tester theory and application,
One Test Strategy Methodology for productivity and cost saving in high volume
manufacturing,
GRR
Source of variation,
Binary Coded Decimal Communication Protocol in handler, A360 tester programming
theory and hardware,
Teradyne J273 tester hardware and programming methodology,
Multi Site testing,
Hot Chuck theory and Procedures for wafer probing,
Teradyne tester analog hardware oscillation and debugging,
IMAGE programming, Microcontroller and Microprocessor test time reduction in final
testing, J750 test time reduction via system methodology,
J750 eFrame tester oscillation solution and multi site testing, J750 IGXL 3.40.09 Theory
and Conversion, New Product Introduction NPI Maturity Matrix,
Freescale files transfer system for subcond house KESM and TTM,
Gage Repeatability and Reproducibility application for engineering,
Problem Solving tools and Ichikawa diagram,

26. Manufacturing best practices,

27. Change Management Principles, Maverick Theory and statistical control, Engineering
investment and ROI calculation,
28. Manufacturing Ground rules, OEE (Overall Equipment Efficiency) Calculation,
29. ESD Theory
30. Lean Manufacturing Initiative and Theory.

Other involvements

Mr Lee is also passionate about sharing his knowledge and skills and lectures in many tertiary
institutions throughout Asia Pacific.
He is the technical supervisor for the:
post-graduate master degree program students for MARA university students in
Malaysia.
undergraduates for final year thesis of Monash University, Inti College, KDU, Nottingham
University, government SHRDC, as well as various local universities in Malaysia.

Testimonies

Investment

Normal fee
Sign up 1 pax
Pay before course starts
MYR 1,480.00
USD 350.00
Early Bird
Sign up 1 pax
Pay 14 days before course starts
MYR 1,280.00
USD 300.00
Group Fee
Sign up 3 pax or more
Pay 14 days before course starts
MYR 1,180.00
USD 280.00

(Fee inclusive of GST, Buffet Lunch, Refreshment, Welcome Pack, Training Materials Certificate of Achievement)

Certificate
Upon successful completion of this program, you will receive a Certificate of Achievement.
Certificates are distributed on the final day of the program.

Payment mode:

1. ONLINE PAYMENT by Credit card: You can opt to register and pay online with our latest
payment integration system through our website.
2. BANK IN CHEQUE
Bank in and then scan the Bank-in slip and email to us before the course commence to confirm
your seat.
Courier your cheque payment to our Finance HQ.
*Note that we DO NOT take any payments during the event.
3. BANK IN CASH:You can also pay by cash through bank-in our company bank account.
4. Telegraphic Transfer- You can also opt to use GIRO or telegraphic transfer of payment via
international banks.