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FPAB30PH60

Smart Power Module for Front-End Rectifier


General Description

Features

FPAB30PH60 is an advanced smart power module of


PFC(Power Factor Correction) that Fairchild has newly
developed and designed mainly targeting mid-power
application especially for an air conditioners. It combines
optimized circuit protection and drive IC matched to high
frequency switching IGBTs. System reliability is futher
enhanced by the integrated under-voltage lock-out and
over-current protection function.

Low thermal resistance due to Al2O3-DBC substrate


600V-30A 2-phase IGBT PWM semi-converter including
a drive IC for gate driving and protection
Typical switching frequency of 20kHz
Isolation rating of 2500Vrms/min.

Applications
AC 180V ~ 264V single-phase front-end rectifier

Top View

Bottom View

44mm

26.8mm

Fig. 1.

2006 Fairchild Semiconductor Corporation

January, 2006

FPAB30PH60

January, 2006

PFC converter for single-phase AC/DC power conversion (Please refer to Fig. 3)

Integrated Drive, Protection and System Control Functions


For IGBTs: Gate drive circuit, Overcurrent circuit protection (OC), Control supply circuit under-voltage (UV) protection
Fault signaling: Corresponding to a UV fault
Input interface: 5V CMOS/LSTTL compatible, Schmitt trigger input

Pin Configuration

Top View

(1) VCC(L)
(2) COM
(3) NC
(4) IN(R)
(5) IN(S)
(6) VFO
(7) CFOD
(8) CSC

(21) VAC(22) NC
N
(23) NC
N

(9) NC
(10) NC
(11) NC
(12) NC
(13) NC
(14) NC
(15) NC
(16) NC
(17) NC
(18) NC
(19) RTH

(24) N
Case Temperature (TC)
Detecting Point
(25) R

(26) S
DBC Substrate
(27) PR

(20) VTH

Fig. 2.

2006 Fairchild Semiconductor Corporation

January, 2006

FPAB30PH60

Integrated Power Functions

FPAB30PH60

Pin Descriptions
Pin Number
1

Pin Name
VCC

Pin Description
Common Bias Voltage for IC and IGBTs Driving

COM

Common Supply Ground

IN(R)

Signal Input for Low-side R-phase IGBT

IN(S)

Signal Input for Low-side S-phase IGBT

VFO

Fault Output

CFOD

Capacitor for Fault Output Duration Time Selection

CSC

Capacitor (Low-pass Filter) for Over Current Detection

19

R(TH)

NTC Thermistor terminal

20

V(TH)

NTC Thermistor terminal

21

VAC-

24

Negative Rail of DCLink (IGBT)

25

Output for R Phase

26

Output for S Phase

27

PR

Positive Rail of DCLink

3, 9~18, 22~23

NC

No Connection

Negative Terminal of DCLink (DIODE) for Sensing

Internal Equivalent Circuit and Input/Output Pins


(20) V TH
(19) R TH

NTC
Therm istor

(27) P R
D1

D2

(8) C SC

CSC

(26) S

(7) C FOD

CFOD

(25) R

(6) V FO

VFO

(5) IN (S)

IN(S)

(4) IN (R)

IN(R)

OUT(S)

Q1

D3

Q2

D4

(24) N
(23) NC
OUT(R)

(2) COM

COM

(22) NC

(1) VCC

VCC

(21) V AC-

Note :
1) Converter is composed of two IGBTs including four diodes and one IC which has gate driving and protection functions.

Fig. 3.

2006 Fairchild Semiconductor Corporation

January, 2006

Unless Otherwise Specified)

Converter Part
Supply Voltage

Item

Symbol
Vi

Condition
Applied between R-S

Supply Voltage (Surge)

Vi(Surge)

Applied between R-S

500

VPN

Applied between P- N

450

VPN(Surge)

Applied between P- N

500

600

TC < 95C, Vi=220V, VPN= 390V,


VPWM=20kHz

20

TC < 95C, Vi=220V, VPN= 390V,


VPWM=20kHz, 1min Non-repetitive

25

Output Voltage
Output Voltage (Surge)
Collector-emitter Voltage

Rating
264

VCES

Input Current (100% Load)

Ii

Input Current (125% Load)

Ii(125%)

Collector Dissipation

PC

TC = 25C per One IGBT

Operating Junction Temperature

TJ

(Note 1)

Unit
VRMS

83

-20 ~ 125

Note
1. The maximum junction temperature rating of the power chips integrated within the SPM is 150 C(@TC 100C). However, to insure safe operation of the SPM,
the average junction temperature should be limited to TJ(ave) 125C (@TC 100C)

Control Part
Item
Control Supply Voltage

Symbol
Condition
VCC
Applied between VCC - COM

Input Signal Voltage

VIN

Applied between IN - COM

Fault Output Supply Voltage

VFO

Applied between VFO - COM

Fault Output Current

IFO

Sink Current at VFO Pin

Current Sensing Input Voltage

VSC

Applied between CSC - COM

Rating
20

Unit
V

-0.3~5.5

-0.3~VCC+0.3

mA

-0.3~VCC+0.3

Total System
Item
Module Case Operation Temperature

Symbol
TC

Storage Temperature

TSTG

Isolation Voltage

VISO

Condition

Rating
-20 ~ 100

60Hz, Sinusoidal, AC 1 minute, Connection


Pins to DBC

Unit
C

-40 ~ 125

2500

Vrms

Thermal Resistance
Item
Junction to Case Thermal
Resistance
(Referenced to PKG center)

Symbol
R(j-c)Q IGBT

Condition

Min. Typ.
-

Max.
1.2

Unit
C/W

R(j-c)HD High-side diode

2.0

C/W

R(j-c)LD Low-side diode

1.4

C/W

Note :
2. For the measurement point of case temperature(TC), please refer to Fig. 2.

2006 Fairchild Semiconductor Corporation

January, 2006

FPAB30PH60

Absolute Maximum Ratings (TJ = 25C,

Converter Part
Item
IGBT saturation voltage

Symbol
VCE(sat)

High-side diode voltage

VFH

Low-side diode voltage

VFL

Switching Times

tON

Min.
-

Typ.
2.4

Max.
3.1

Unit
V

IF = 30A

1.9

2.5

IF = 30A

1.2

1.6

VPN = 400V, VCC = 15V, IC =30A


VIN = 0V 5V, Inductive Load

550

ns

200

ns

(Note 3)

430

ns

tC(OFF)

180

ns

trr

60

ns

Irr

250

tC(ON)
tOFF

Collector - emitter
Leakage Current

ICES

Condition
VCC =15V, VIN = 5V; IC =30A

VCE = VCES

Note
3. tON and tOFF include the propagation delay time of the internal drive IC. tC(ON) and tC(OFF) are the switching time of IGBT itself under the given gate driving condition
internally. For the detailed information, please see Fig. 4

Control Part
Item
Symbol
Condition
Quiescent VCC Supply Cur- IQCCL VCC = 15V, IN = 0V VCC - COM
rent
Fault Output Voltage

Min.
-

Typ.
-

Max.
26

Unit
mA
V

VFOH

VSC = 0V, VFO Circuit: 4.7k to 5V Pull-up

4.5

VFOL

VSC = 1V, VFO Circuit: 4.7k to 5V Pull-up

0.8

0.5

0.55

V
V

Over Current Trip Level

VSC(ref)

VCC = 15V

0.45

Supply Circuit UnderVoltage Protection

UVCCD

Detection Level

10.7

11.9

13.0

UVCCR

Reset Level

11.2

12.4

13.2

Fault-out Pulse Width

tFOD

CFOD = 33nF (Note 4)

1.4

1.8

2.0

ms

Applied between IN - COM

3.0

0.8

@ TC = 25C (Note Fig. 9)

50

@ TC = 80C (Note Fig. 9)

5.76

ON Threshold Voltage

VIN(ON)

OFF Threshold Voltage

VIN(OFF)

Resistance of Thermistor

RTH

Note
4. The fault-out pulse width tFOD depends on the capacitance value of CFOD according to the following approximate equation : CFOD = 18.3 x 10-6 x tFOD[F]

2006 Fairchild Semiconductor Corporation

January, 2006

FPAB30PH60

Electrical Characteristics (TJ = 25C, Unless Otherwise Specified)

FPAB30PH60

Electrical Characteristics

Irr
120% of IC

100% of IC

VCE

IC
90% of IC
15% of VCE

IC

10% of IC

VCE 15% of VCE

10% of IC

VIN

VIN
tON

trr

tC(OFF)

tC(ON)

tOFF

(a) Turn-on

(b) Turn-off

Fig. 4. Switching Time Definition

Mechanical Characteristics and Ratings


Item

Limits

Condition

Mounting Torque

Mounting Screw: - M3

Device Flatness

Note Fig. 5

Recommended 0.62Nm

Weight

Units

Min.
0.51

Typ.
0.62

Max.
0.72

+120

15.00

Nm

(+)

(+)
(+)

Fig. 5. Flatness Measurement Position

2006 Fairchild Semiconductor Corporation

January, 2006

FPAB30PH60

Time Charts of SPMs Protective Function


In p u t S ig n a l
In te rn a l IG B T
G a te -E m itte r V o lta g e

P3

C o n tro l S u p p ly V o lta g e

P2

UV
re s e t

P5
UV
d e te c t

P6

P1
O u tp u t C u rr e n t

P4

F a u lt O u tp u t S ig n a l

P1 : Normal operation - IGBT ON and conducting current


P2 : Under voltage detection
P3 : IGBT gate interrupt
P4 : Fault signal generation
P5 : Under voltage reset
P6 : Normal operation - IGBT ON and conducting current

Fig. 6. Under-Voltage Protection


P5
In p u t S ig n a l
P6
In te r n a l IG B T
G a t e - E m it te r V o lta g e

O C D e t e c tio n

P1
P4
P7

O u tp u t C u r r e n t

P2
O C R e fe r e n c e
V o lt a g e ( 0 .5 V )

S e n s in g V o lta g e
R C F ilt e r D e la y

F a u lt O u tp u t S ig n a l

P3

P8

P1 : Normal operation - IGBT ON and conducting current


P2 : Over current detection
P3 : IGBT gate interrupt / Fault signal generation
P4 : IGBT is slowly turned off
P5 : IGBT OFF signal
P6 : IGBT ON signal - but IGBT cannot be turned on during the fault Output activation
P7 : IGBT OFF state
P8 : Fault Output reset and normal operation start

Fig. 7. Over Current Protection

2006 Fairchild Semiconductor Corporation

January, 2006

FPAB30PH60

V ac

+5V

PFCM
VTH
NTC
Therm istor

R TH
C SC

M icro
controller

C FO D
V FO

or

IN (S)
IN (R)

DSP

PR
S

CSC
R

CFOD

Inverter

VFO
OUT(S)

IN(S)
IN(R)

OUT(R)

CO M

COM

Rshunt

VCC

V AC-

VCC

Fig. 8. Application Example

R-T Graph
120

Resistance [k]

100
80
60
40
20
0
20

30

40

50

60

70

80

90 100 110 120 130

Temperature [C]
Fig. 9. R-T Curve of the Built-in Thermistor

2006 Fairchild Semiconductor Corporation

January, 2006

FPAB30PH60

Detailed Package Outline Drawings

2006 Fairchild Semiconductor Corporation

January, 2006

FPAB30PH60

Detailed Package Outline Drawings

2006 Fairchild Semiconductor Corporation

January, 2006

FPAB30PH60

Detailed Package Outline Drawings

2006 Fairchild Semiconductor Corporation

January, 2006

TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.

ACEx
FAST
ActiveArray
FASTr
Bottomless
FPS
Build it Now
FRFET
CoolFET
GlobalOptoisolator
CROSSVOLT GTO
DOME
HiSeC
EcoSPARK
I2C
E2CMOS
i-Lo
EnSigna
ImpliedDisconnect
FACT
IntelliMAX
FACT Quiet Series
Across the board. Around the world.
The Power Franchise
Programmable Active Droop

ISOPLANAR
LittleFET
MICROCOUPLER
MicroFET
MicroPak
MICROWIRE
MSX
MSXPro
OCX
OCXPro
OPTOLOGIC
OPTOPLANAR
PACMAN
POP
Power247
PowerEdge

PowerSaver
PowerTrench
QFET
QS
QT Optoelectronics
Quiet Series
RapidConfigure
RapidConnect
SerDes
ScalarPump
SILENT SWITCHER
SMART START
SPM
Stealth
SuperFET
SuperSOT-3

SuperSOT-6
SuperSOT-8
SyncFET
TCM
TinyLogic
TINYOPTO
TruTranslation
UHC
UltraFET
UniFET
VCX
Wire

DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY
ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT
CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
2. A critical component is any component of a life
1. Life support devices or systems are devices or
support device or system whose failure to perform can
systems which, (a) are intended for surgical implant into
be reasonably expected to cause the failure of the life
the body, or (b) support or sustain life, or (c) whose
support device or system, or to affect its safety or
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
effectiveness.
reasonably expected to result in significant injury to the
user.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification

Product Status

Definition

Advance Information

Formative or
In Design

This datasheet contains the design specifications for


product development. Specifications may change in
any manner without notice.

Preliminary

First Production

This datasheet contains preliminary data, and


supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.

No Identification Needed

Full Production

This datasheet contains final specifications. Fairchild


Semiconductor reserves the right to make changes at
any time without notice in order to improve design.

Obsolete

Not In Production

This datasheet contains specifications on a product


that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I18

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