DS9800W/10/37/93

Docking Speaker System

Contents

Page

1 Technical Specification and Connection Facilities

.................................................1-1 to 1-7
2 Laser Beam Safety Precautions......................................... 2-1

Page

Contents

14 Deputy Frequency Divider Board

Circuit Diagram .................................................12-3
Layout Diagram.................................................12-3
15 Ipod Board
Circuit Diagram .................................................12-4
Layout Diagram ................................................12-4

3 Important Safety Precautions .................................. 3-1 to 3-2

4 Safety Check After Servicing ............................................. 4-1
5 Safety Information General Notes & Lead Free
Requirements .................................................................... 5-1
6 Standard Notes For Servicing,Lead Free Requirements
& Handling Flat Pack IC .......................................... 6-1 to 6-4
7 Direction of Use ....................................................... 7-1 to 7-2
8 Cabinet Disassembly Instructions ........................... 8-1 to 8-2
9 Troubleshooting ................................................................. 9-1

16 LED and DC Board

Circuit Diagram .................................................12-5
Layout Diagram ................................................12-5

10 Block Diagram .................................................................10-1

11 Wiring Diagram ...............................................................11-1

18 Decoder Board
Circuit Diagram ...............................................12-8
Layout Diagram ..............................................12-9

12 Key-press+MPS Line+LED and Remote incept Board

Circuit Diagram ....................................................12-1
Layout Diagram ...................................................12-1
13 Main Frequency Divider Board
Circuit Diagram ................................................12-2
Layout Diagram ...............................................12-2

17 Power Board
Circuit Diagram ...............................................12-6
Layout Diagram ..............................................12-7

20 Exploded View..............................................................13-1 to 13-2

21 Revision List .....................................................................14-1

Feature
Different

Features
Copyright 2011 Philips Consumer Electronics B.V. Eindhoven, The Netherlands.
All rights reserved. No part of this publication may be reproduced, stored in a
retrieval system or transmitted, in any form or by any means, electronic,
mechanical, photocopying, or otherwise without the prior permission of Philips.

Published by Sophie-KM 1148 AVM

Version 1.1

Printed in the Netherlands

/10

/37

/93

RDS
Voltage Selector
ECO Standby
DTS
Subject to modi cation

EN 3141 785 36251

Technical Specification and Connection Facilities

Location of PC Boards

Remote Incept Board

Decoder Board

Power Board
Main Frequency Divider Board

Version Variations
Type /Versions:

DS9800W

Service policy
Board in used:
Key-Press+MPS Line+LED Board
Remote Incept Board
Main Frequency Divider Board
Power Board
Decoder Board
Deputy Frequency Divider Board
WIFI Board
Ipod Board
LED Board
DC Board

/05

/10

/12

/37

/55

Features

/61

/79

/93

M
M
C
M
C

M
M
C
M
C

M
M
C
M
C

Type /Versions

Feature diffrence

/58

/94

/96

/98

/94

/96

/98

DS9800W
/05

/10

/12

/37

RDS
VOLTAGE SELECTOR
ECO STANDBY - DARK
DTS
* TIPS : C -- Component Lever Repair.
M -- Module Lever Repair
-- Used

1-1

/55

/58

/61

/79

/93

Technical Specification and Connection Facilities

Technical Specification
2. General Information and Requirement
Product Family Features
2.1.1

Identity and Key Features

2.1

DS9800W series are wireless speaker for iPhone,

Elements to include as generic requirements:
1. Detachable mains cord
2. Safety certification (cUL/FCC and CB/EMC/CE)
Following is a list of key features:
1. iPod/iPhone Airplay support
2. MP3 Link (via headphones jack from PC or MP3 player)
3. Total output power
2x50Wrms @10%THD
2.1.2

Styling, Forms and Functions

DS9800W appearances are defined in their respective MUS. MUS is the leading document where product
appearance is applicable..
Features

Products

DS9800W

Stroke versions
Design
Front
Dimension

All
Refer to MUS[3] for
details

IR Receiver
Height of feet

Y
3mm

Apparatus tray closed

W x D x H (mm)
Weight
Cosmetics

2.1.3

Without packaging

11kg

Color
Buttons

Black

External I/O Connections

Model
Stroke Version
30pin connector on
docking
MP3 Link
(3.5mm audio jack)
L Speaker out

DS9800W
All

1-2

Technical Specification and Connection Facilities

2.1.4

ACCESSORIES (tbc)

Model
Stroke Version
Region
Power Cord

12

93
China

1.8M

1.8M

1.8M

0.5M

0.5M

0.5M

6M

6M

6M

8keys

8keys

8keys

CR2032

CR2032

CR2032

Audio cable
(3.5mm audio)
Speaker cablex1
Remote Control
Battery for Remote
control
Quickly guide

DS9800W
10
Europe

IFU

Mechanical General Information

The product appearances and functions are defined in their respective MUS. Product management
approves the MUS and it is a leading document where product appearance is applicable.
Please refer to Sh560 for mechanical information.
Safety Standards

Where applicable:
/12, /05 EN-60065:2002 (Edition 7.0) +A1 +A11 +C11 +C12, UL-6500:2006 (Edition 2), other strokes IEC60065:2005 (Edition 7.1), or
/12, /05 EN-60950:2006 +A1, /37 UL-60950 (Edition 2), /55 /79 /97 (other strokes than /12, /05, /37)
IEC-60950 +A1 (Edition 2)
EMC Requirements

Where applicable:
/12 Audio functions: EN55013:2001; +A1:2003, +A2:2006, EN55020:2007
IT-functions: EN55022:2006,+A1:2007, EN55024:1998, +A1:2001, +A2:2003
WiFi-function: ETSI EN 300 328 (V1.7.1.), ETSI EN 301 489-1 (V1.8.1.) & -17 (V1.3.2), EN
62311:2008
Generic functions: EN 61000-3-2:2006, EN 61000-3-3:1995; +A1:2001; +A2:2005 or alternatively
EN61000-3-3:2008
/97 (/55) Audio functions: CISPR-13:2006 (or alternatively CISPR-13:2009), CISPR-20:2005;
IT-functions: CISPR-22;2008, CISPR-24:1997; +A1:2001, +A2:2002; IEC 62311:2007
Generic functions: IEC 61000-3-2:2005,+A1:2008,+A2:2009 or alternatively IEC 61000-3-2:2009, IEC
61000-3-3:2008
/37 FCC-15.247 (Part B, C), OET Bulletin 65, Edition 97-01 Table 1; RSS-210 Issue 7

1-3

Technical Specification and Connection Facilities

ESD Requirements(TBC)
The product shall withstand electro static discharges on all user accessible parts of the product.
Reference: IEC61000-4-2.
For contact discharges:
Level
General (kV)
1
0-2
2
>2-4
3
>4-5
4
>5-7
5
-

USA (kV)
0-3
>3-4
>4-5
>5-7
>7-8

Requirement
No deviations allowed.
Short perceptible deviations allowed
Normal recallable functions function changes allowed.
Control recallable functions function changes allowed.
No loss of stored data allowed.

For air discharge:

Level
General (kV)
1
0-4
2
>4-8
3
>8-10
4
>10-15
5
-

USA (kV)
0-6
>6-8
>8-10
>10-15
>15-18

Requirement
No deviations allowed.
Short perceptible deviations allowed.
Normal recallable functions function changes allowed.
Control recallable functions function changes allowed.
No loss of stored data allowed.

General requirement:
1. 10 arcs for positive and negative polarity for unit on and off for 1kV incremental steps.
2. Component or mechanical damage is not allowed. No loss of fixed stored data (stored in EEPROMs).
3. Hang-ups and malfunctions are allowed, as long as the customer can recover from the hang-up by
pressing the Standby or ON/OFF button of the set.
4. Failures that disappear only by unplugging the AC mains cord and/or power sources are not acceptable.
Environmental Condition

The environmental condition requirements and test method is according to UAN-D1590.

Ambient temperature
Apparatus acc. to spec.

: max. 40 C - all climates

: +5 to + 35 C

Vibration test (acc. IEC 60 068/2/6) : operational vibration test to be proceeded in operating position of the
set.

1-4

Technical Specification and Connection Facilities

3. Technical Specifications
Power Supply
3.1.1

Type and versions

3.1.1.1

SMPS for main unit

Build-inSMPS will be used for all models and stroke versions.

All using figure '8' socket, will cater for all versions:
Versions

Region/Country

SMPS

Detachable mains cords

12 / 05

EUROPE / UK

EU (/12) round 2-pin & UK (/05) 3-pin

37

NAFTA

55

LATAM

1) 100 ~240Vac nom. (wide

range from 90V~264Vac limit)
used in all versions except
India.
Frequency: 47~63Hz.

98

APAC

94

India

UL flat pin (non-polarized)

INMETRO certified round 2-pin
EU round 2-pin

2) 100 ~310Vac limit (India

compatible with up cost) used
only for India.
Frequency: 47~63Hz.

EU (/12) round 2-pin

All requirements per defined for each country should be met with sufficient testing.
3.1.1.2

Adaptor for Docking

AC/DC adaptor 5V/ 2.1A for docking, wide range input voltage.

3.1.2

Surge Immunity (Lightning Test)

The product shall withstand mains interferences of:

Differential mode:
2kV/2 ohm criteria C for Europe.
6kV/12 ohm criteria C for NAFTA.
Parameters:
Bi-wave
Open circuit voltage: 2/50us
Short circuit current: 8/20us
From +/1kV to +/-2kV (for Europe) or +/-6kV (for Nafta) in steps of 1kV.
10 shots per combination.
One shot per minute.
Serial impedance: 2 Ohm for Europe, 12Ohm for Nafta.
Polarity and phase: Positive (phase 90) & Negative (phase 270)

1-5

Technical Specification and Connection Facilities

Common mode:
6kV/2 ohm criteria C for Europe.
6kV/12 ohm criteria C for Nafta.
Parameters:
Ring-wave (100kHz)
From +/3kV to +/-6kV in steps of 1 kV.
10 shots per combination.
One shot per minute.
Serial impedance: 2 Ohm for Europe, 12Ohm for Nafta
Polarity and phase: Positive (phase 90) & Negative (phase 270)
Reference: IEC61000-4-5 and for USA: 3135 019 8029 Reliability evaluation.
Requirements:
Apparatus should fulfil the leakage current requirements of IEC60065 point 9.1.1 (UAN-D1631)
Defects or permanent deviations are not allowed.

3.1.3

Mains Drop-out Immunity

The product shall withstand mains failures of:

Variation 0% (=100% dip) at T-event = 50 mSec. Performance criterion B
Variation 40% (=60% dip) at T-event = 100 mSec. Performance criterion B
Variation 0% (=100% dip) at T-event = 5 Sec. Performance criterion C
Additional for USA apparatus: See 3135 019 8029 Reliability evaluation.
Variation 0% (=100% dip) at T-event = 100 mSec in standby mode. Performance criterion B
Requirement:
No misoperation and no interference of user in order to guarantee continuation of performed function.
Reference: IEC61000-4-11 For measuring method refer to UAN-D1724, as far as applicable.
Performance criterions according to IEC61000-4-4 Amendment 1
Performance Requirement
Criterion A - No any degradation of specification.
Criterion B - Temporary degradation / self recoverable.
Criterion C - No damage, resolvable hang-up.
Criterion D - Not recoverable loss of function.
3.1.4

iPod/iPhone/iPad charging

3.1.5

Power Consumption

Power consumption at nominal AC input:

1. CD play mode at 1/8 P-rated output power DS9800W:
2. Low Power Standby Mode
:

1-6

22 W
0.5 W

Technical Specification and Connection Facilities

Technical Description
3.2.1

Audio part

Gerneral Part
Output Stage Protection:

NA

Temperature :

Indicators
Standby Mode Indicator:
Power Standby Mode:

Electrical Data
DSC:
DBB:
Bass:
Treble:
Loudness:

NA
NA
Y
Y
Y

Yes

Short Circuit:

Yes

Clock Display Active

LED Turns Off

Normal
3dB
100nW
40nW
40dB/35dB
<0.8%
90dBA(*3)

Channel Difference:
Hum (Volmin --- Volmax-20dB)
Residual Noise(Volume Minimum)
Channel Seperation:
1kHz/10kHz
THD,Maximal
SNR(*1) @ROP(A-weighted):
SNR @standard output(Aweighted)(*2):
Crostalk:

Audio Inputputs
Audio Input Sensitivity( 3dB) rated output power at 1kHz
MP3_link(front)
1000mV 200mV; Rin 22k
iPhone Airplay
tbc

82dBA

Limit
150nW

92dBA
78dBA

55dB

Audio Output

Docking charging current

2.1A

@5V voltage power supply

DS9800W
50W 1dB

( At Cold Condition with 10% THD

Output Power with limitation(shipment sample)

36W 1dB

( At Cold Condition with 10% THD

Frequency Response( 3dB)

30Hz-20kHZ

Loudspeaker(Boxes): Separable speaker box

Speaker driver Impedance:
Right/Left:
Subwoofer:

Refer to package document of Speaker Box Assy

8 @ 30 Hz ~ 20kHz(-1db)(tbc)

Output Power(*4)

At THD=10%, 1kHz sinewave

REMARKS:
Electrical Parameters are to be measured at Speaker Terminals across rated impedance Load(8ohm) with
Rated Input Signal in CD Mode setting in DBB/Loudness Off and Pre-eq at Flat unless specified otherwise.
*1) Add 10dB to the measured SNR for the final result as a -10dB reference signal is used (IEC (A)
weighted @ Vol.max with -10dB)
*2) standard output --- 1W output with 1kHz sinewave
*3) SNR value is defined at Airplay mode, at MP3-link mode are worse a little.(SNR @ROP(A-Weighted):
limit 85dBA, @1W output (A-Weighted): limit 78dBA)
*4) Test mode : press RESET and WPS key 5s, the set go to factory mode. Many electrical parameter
should measured at factory mode.

1-7

Laser Beam Safety Precautions

This Blu-Ray player uses a pickup that emits a laser beam.

Do not look directly at the laser beam coming

from the pickup or allow it to strike against your
skin.

The laser beam is emitted from the location shown in the figure. When checking the laser diode, be sure to keep
your eyes at least 30 cm away from the pickup lens when the diode is turned on. Do not look directly at the laser
beam.
CAUTION: Use of controls and adjustments, or doing procedures other than those specified herein, may result in
hazardous radiation exposure.

Drive Mechanism Assembly

Laser Beam Radiation

Laser Pickup

Turntable

Location: Inside Top of Blu-Ray mechanism.

2-1

Important Safety Precautions

Caution: These servicing instructions are for use by qualified service personnel only.To reduce the risk
of electric shock do not perform any servicing other than that contained in the operating
instructions unless you are qualified to do so.

Important
Read and understand all instructions before you use
your home theater. If damage is caused by failure to
follow instructions, the warranty does not apply.

For speakers with stands, use only the

supplied stands. Secure the stands to
the speakers tightly. Place the assembled
stands on flat, level surfaces that can
support the combined weight of the
speaker and stand.
Never place the product or any objects
on power cords or on other electrical
equipment.
If the product is transported in
temperatures below 5C, unpack the
product and wait until its temperature
matches room temperature before
connecting it to the power outlet.
Visible and invisible laser radiation when
open. Avoid exposure to beam.
Do not touch the disc optical lens inside
the disc compartment.
Risk of overheating!
Never install this product in a confined
space. Always leave a space of at least
four inches around the product for
ventilation. Ensure curtains or other
objects never cover the ventilation slots
on the product.
Risk of contamination!
Do not mix batteries (old and new or
carbon and alkaline, etc.).
Remove batteries if they are exhausted
or if the remote control is not to be used
for a long time.
Batteries contain chemical substances,
they should be disposed of properly.

Safety
Riskof electric shock or fire!
Never expose the product and
accessories to rain or water. Never place
liquid containers, such as vases, near the
product. If liquids are spilt on or into the
product, disconnect it from the power
outlet immediately. Contact Philips
Consumer Care to have the product
checked before use.
Never place the product and accessories
near naked ames or other heat sources,
including direct sunlight.
Never insert objects into the ventilation
slots or other openings on the product.
Where the mains plug or an appliance
coupler is used as the disconnect device,
the disconnect device shall remain readily
operable.
Disconnect the product from the power
outlet before lightning storms.
When you disconnect the power cord,
always pull the plug, never the cable.
Riskof short circuit or re!
Before you connect the product to the
power outlet, ensure that the power
voltage matches the value printed on the
back or bottom of the product. Never
connect the product to the power outlet
if the voltage is different.
Risk of injury or damage to the home theater!
For wall-mountable products, use only
the supplied wall mount bracket. Secure
the wall mount to a wall that can support
the combined weight of the product
and the wall mount. Koninklijke Philips
Electronics N.V. bears no responsibility
for improper wall mounting that results in
accident, injury or damage.

Product care
Do not insert any objects other than discs
into the disc compartment.
Do not insert warped or cracked discs
into the disc compartment.
Remove discs from the disc compartment
if you are not using the product for an
extended period of time.
Only use microfiber cloth to clean the
product.

3-1

Important Safety Precautions

Disposal of your old product and

batteries

Your product is designed and manufactured

with high quality materials and components,
which can be recycled and reused.

When this crossed-out wheeled bin symbol

is attached to a product it means that the
product is covered by the European Directive
2002/96/EC. Please inform yourself about the
local separate collection system for electrical
and electronic products.
Please act according to your local rules and
do not dispose of your old products with your
normal household waste.
Correct disposal of your old product helps to
prevent potential negative consequences for
the environment and human health.

Your product contains batteries covered by

the European Directive 2006/66/EC, which
cannot be disposed with normal household
waste.
Please inform yourself about the local rules
on separate collection of batteries because
correct disposal helps to prevent negative
consequences for the environmental and
human health.

3-2

Safety Check after Servicing

Examine the area surrounding the repaired location for damage or deterioration. Observe that screws, parts, and
wires have been returned to their original positions. Afterwards, do the following tests and confirm the specified
values to verify compliance with safety standards.

1. Clearance Distance
When replacing primary circuit components, confirm
specified clearance distance (d) and (d) between
soldered terminals, and between terminals and
surrounding metallic parts. (See Fig. 1)

Chassis or Secondary Conductor

Primary Circuit

Table 1: Ratings for selected area

AC Line Voltage
110V~220V
Note:

d'

Clearance Distance (d), (d)

3.2 mm (0.126 inches)

This table is unofficial and for reference only. Be

sure to confirm the precise values.

Fig. 1

2. Leakage Current Test

Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs) and
externally exposed accessible parts (RF terminals,
antenna terminals, video and audio input and output
terminals, microphone jacks, earphone jacks, etc.) is
lower than or equal to the specified value in the table
below.

Exposed Accessible Part

Z
AC Voltmeter
(High Impedance)

Measuring Method (Power ON):

Insert load Z between B (earth ground, power cord plug
prongs) and exposed accessible parts. Use an AC
voltmeter to measure across the terminals of load Z.
See Fig. 2 and the following table.

Earth Ground
Power Cord Plug Prongs
Fig. 2

Table 2: Leakage current ratings for selected areas

AC Line Voltage
110V~220V
Note:

Load Z
0.15 F CAP. & 1.5 k RES.
Connected in parallel

Leakage Current (i)

i

0.5 mA Peak

Earth Ground (B) to:

Exposed accessible parts

This table is unofficial and for reference only. Be sure to confirm the precise values.

4-1

Safety Information, General Notes & Lead Free Requirements

Safety Instructions

Warnings

1.1

General Safety

2.1

General

Safety regulations require that during a repair:

Connect the unit to the mains via an isolation transformer.
Replace safety components, indicated by the symbol
,
only by components identical to the original ones. Any
other component substitution (other than original type)

All ICs and many other semiconductors are susceptible to

electrostatic discharges (ESD, ). Careless handling
during repair can reduce life drastically. Make sure that,
during repair, you are at the same potential as the mass
of the set by a wristband with resistance. Keep
components and tools at this same potential.
Available ESD protection equipment:
Complete kit ESD3 (small tablemat, wristband,

Safety regulations require that after a repair, you must return

the unit in its original condition. Pay, in particular, attention to
the following points:
Route the wires/cables correctly
mounted cable clamps.

4822 310 10671.

Wristband tester 4822 344 13999.
Be careful during measurements in the live voltage
section. The primary side of the power supply, including
the heatsink, carries live mains voltage when you
connect the player to the mains (even when the
player is off!). It is possible to touch copper tracks and/
or components in this unshielded primary area, when
you service the player. Service personnel must take
precautions to prevent touching this area or components
in this area. A lightning stroke and a stripe-marked
printing on the printed wiring board, indicate the primary
side of the power supply.
Never replace modules, or components, while the unit is
on.

damage.
Check the electrical DC resistance between the mains
plug and the secondary side:
1. Unplug the mains cord, and connect a wire between
the two pins of the mains plug.
2. Set the mains switch to the on position (keep the
mains cord unplugged!).
3. Measure the resistance value between the mains
plug and the front panel, controls, and chassis
bottom.
4. Repair or correct unit when the resistance
5. Verify this, before you return the unit to the customer/
user (ref. UL-standard no. 1492).
6. Switch the unit off, and remove the wire between the
two pins of the mains plug.
1.2

2.2

The use of optical instruments with this product, will

Only quali ed service personnel may remove the cover or
attempt to service this device, due to possible eye injury.
Repair handling should take place as much as possible
with a disc loaded inside the player.
T
shield:

Laser Safety
This unit employs a laser
may remove the cover, or attempt to service this device (due
to possible eye injury).
Laser Device Unit
Type

CAUTION VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN AVOID EXPOSURE TO BEAM
ADVARSEL SYNLIG OG USYNLIG LASERSTRLING VED BNING UNDG UDSTTELSE FOR STRLING
ADVARSEL SYNLIG OG USYNLIG LASERSTRLING NR DEKSEL PNES UNNG EKSPONERING FOR STRLEN
VARNING SYNLIG OCH OSYNLIG LASERSTRLNING NR DENNA DEL R PPNAD BETRAKTA EJ STRLEN
VARO! AVATTAESSA OLET ALTTIINA NKYVLLE JA NKYMTTMLLE LASER STEILYLLE. L KATSO STEESEEN
VORSICHT SICHTBARE UND UNSICHTBARE LASERSTRAHLUNG WENN ABDECKUNG GEFFNET NICHT DEM STRAHL AUSSETSEN
DANGER VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN AVOID DIRECT EXPOSURE TO BEAM
ATTENTION RAYONNEMENT LASER VISIBLE ET INVISIBLE EN CAS DOUVERTURE EXPOSITION DANGEREUSE AU FAISCEAU

:AIGalnN(BD)
:AIGalnP(DVD)
: AIGalnP(CD)

Wavelength

Output Power

Beam divergence

Laser

:
:
:
:

650 nm (DVD)
780 nm (VCD/CD)
405nm(BD)
20 mW
(DVD+RW writing)
: 0.8 mW
(DVD reading)
: 0.3 mW
(VCD/CD reading)

Figure 2-2

: 60 degree

CLASS 1
LASER PRODUCT

Fi g u r e 2-1
Note: Use of controls or adjustments or performance of
procedure other than those speci ed herein, may result in
A

5-1

Standard Notes for Servicing, Lead Free Requirements & Handling Flat Pack IC

Circuit Board Indications

Pb (Lead) Free Solder

1. The output pin of the 3 pin Regulator ICs is

indicated as shown.

When soldering, be sure to use the Pb free solder.

Top View
Out

Information about lead-free soldering

Philips CE is producing lead-free sets from 1.1.2005
onwards.

Bottom View
In

Input

IDENTIFICATION
Regardless of special logo (not always
indicated)

2. For other ICs, pin 1 and every fifth pin are

indicated as shown.

One must treat all sets from 1 Jan 2005

onwards, according to the next rule:
Serial Number gives a 14-digit. Digit 5&6 shows the
YEAR, and digit 7&8 shows the WEEK.

5
Pin 1

So from 0501 onwards=from 1 Jan 2005 onwards

Important note : In fact also products of year 2004

must be treated in this way as long as you avoid
mixing solder-alloys (leaded/ lead-free). So best to
always use SAC305 and the higher temperatures
belong to this.

10
3. The 1st pin of every male connector is indicated as
shown.

Due to lead-free technology some rules have to be

respected by the workshop during a repair:
Use only lead-free solder alloy Philips SAC305 with
order code 0622 149 00106. If lead-free solderpaste is required, please contact the manufacturer
of your solder-equipment. In general use of solderpaste within workshops should be avoided because
paste is not easy to store and to handle.
Use only adequate solder tools applicable for leadfree solder alloy. The solder tool must be able

Pin 1

Instructions for Connectors

1. When you connect or disconnect the FFC (Flexible
Foil Connector) cable, be sure to first disconnect
the AC cord.
2. FFC (Flexible Foil Connector) cable should be
inserted parallel into the connector, not at an
angle.

To reach at least a solder-temperature of 400C,

To stabilize the adjusted temperature at the soldertip
To exchange solder-tips for different applications.
Adjust your solder tool so that a temperature around
360C - 380C is reached and stabilized at the
solder joint. Heating-time of the solder-joint should
not exceed ~ 4 sec. Avoid temperatures above
400C otherwise wear-out of tips will rise drastically
and flux-fluid will be destroyed. To avoid wear-out of
tips switch off un-used equipment, or reduce heat.
Mix of lead-free solder alloy / parts with leaded
solder alloy / parts is possible but PHILIPS
recommends strongly to avoid mixed solder alloy
types (leaded and lead-free).
If one cannot avoid or does not know whether
product is lead-free, clean carefully the solder-joint
from old solder alloy and re-solder with new solder
alloy (SAC305).
Use only original spare-parts listed in the ServiceManuals. Not listed standard-material (commodities)
has to be purchased at external companies.

FFC Cable

Connector
CBA

* Be careful to avoid a short circuit.

6-1

Standard Notes for Servicing, Lead Free Requirements & Handling Flat Pack IC

How to Remove / Install Flat Pack-IC

Special information for BGA-ICs:

- always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for desoldering always use the lead-free temperature
profile, in case of doubt)
- lead free BGA-ICs will be delivered in so-called
'dry-packaging' (sealed pack including a silica gel
pack) to protect the IC against moisture. After
opening, dependent of MSL-level seen on indicatorlabel in the bag, the BGA-IC possibly still has to be
baked dry. (MSL=Moisture Sensitivity Level). This
will be communicated via AYS-website.
Do not re-use BGAs at all.
For sets produced before 1.1.2005 (except products
of 2004), containing leaded solder-alloy and
components, all needed spare-parts will be available
till the end of the service-period. For repair of such
sets nothing changes.
On our website
you find more
www.atyourservice.ce.Philips.com
information to:

1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:
1. Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)

Fig. S-1-1

BGA-de-/soldering (+ baking instructions)

2. Remove the flat pack-IC with tweezers while

applying the hot air.

Heating-profiles of BGAs and other ICs used in

Philips-sets

3. Bottom of the flat pack-IC is fixed with glue to the

CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)

You will find this and more technical information within

the magazine, chapter workshop news.
For additional questions please contact your local
repair-helpdesk.

4. Release the flat pack-IC from the CBA using

tweezers. (Fig. S-1-6)
CAUTION:
1. The Flat Pack-IC shape may differ by models. Use
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not supply hot air to the chip parts around the
flat pack-IC for over 6 seconds because damage
to the chip parts may occur. Put masking tape
around the flat pack-IC to protect other parts from
damage. (Fig. S-1-2)

6-2

Standard Notes for Servicing, Lead Free Requirements & Handling Flat Pack IC

3. The flat pack-IC on the CBA is affixed with glue, so

be careful not to break or damage the foil of each
pin or the solder lands under the IC when
removing it.

CBA

4. Release the flat pack-IC from the CBA using

tweezers. (Fig. S-1-6)
With Iron Wire:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)

Hot-air
Flat Pack-IC
Desoldering
Machine

2. Affix the wire to a workbench or solid mounting

point, as shown in Fig. S-1-5.
3. While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the CBA
contact pads as shown in Fig. S-1-5.

Masking
Tape
Tweezers

4. Bottom of the flat pack-IC is fixed with glue to the

CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)

Flat Pack-IC

Fig. S-1-2

5. Release the flat pack-IC from the CBA using

tweezers. (Fig. S-1-6)

With Soldering Iron:

Note:

1. Using desoldering braid, remove the solder from

all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)

Flat Pack-IC

When using a soldering iron, care must be

taken to ensure that the flat pack-IC is not
being held by glue. When the flat pack-IC is
removed from the CBA, handle it gently
because it may be damaged if force is applied.

Desoldering Braid
Hot Air Blower

or
Soldering Iron

Iron Wire

Fig. S-1-3
Soldering Iron

2. Lift each lead of the flat pack-IC upward one by

one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)

To Solid
Mounting Point
Fig. S-1-5

CBA

Fine Tip
Soldering Iron

Sharp
Pin
Fine Tip
Soldering Iron

Flat Pack-IC

Fig. S-1-4

Tweezers

3. Bottom of the flat pack-IC is fixed with glue to the

CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)

Fig. S-1-6
6-3

Standard Notes for Servicing, Lead Free Requirements & Handling Flat Pack IC

Instructions for Handling Semiconductors

2. Installation
1. Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA
so you can install a replacement flat pack-IC more
easily.

Electrostatic breakdown of the semi-conductors may

occur due to a potential difference caused by
electrostatic charge during unpacking or repair work.

2. The mark on the flat pack-IC indicates pin 1.

(See Fig. S-1-7.) Be sure this mark matches the 1
on the PCB when positioning for installation. Then
presolder the four corners of the flat pack-IC. (See
Fig. S-1-8.)

1. Ground for Human Body

Be sure to wear a grounding band (1 M ) that is
properly grounded to remove any static electricity that
may be charged on the body.

3. Solder all pins of the flat pack-IC. Be sure that

none of the pins have solder bridges.

2. Ground for Workbench

Be sure to place a conductive sheet or copper plate
with proper grounding (1 M ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on
clothing will not escape through the body grounding
band, be careful to avoid contacting semi-conductors
with your clothing.

Example :

<Incorrect>
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.

Fig. S-1-7

Presolder
CBA

Flat Pack-IC

<Correct>

Grounding Band

CBA
Fig. S-1-8
1M

CBA

1M
Conductive Sheet or
Copper Plate

6-4

Direction of Use

*The following excerpt of the DFU/QSG serves as an introduction to the set.

The Complete Direction for Use can be download in different languages from
the internet site of Philips Customer care Center : www.support.philips.com


WPS

 $

WPS

 %

 $


LED
1

LED
WIFI SETUP

WPS

LED

00:00:35

LED

7-1

Direction of Use

 %
LED

3KLOLSVB)LGHOLRB$LUSOD\



1HWZRUN&RQILJXUDWLRQ

00:00:05

LED

WIFI SETUP

00:00:05

LED

3KLOLSVB)LGHOLR

MP3-LINK

ZZ ZSKLOLSVFRPVXSSR
UW
ON/OFF

7-2

Cabinet Disassembly Instructions

Note:

1. Disassembly Flowchart

(1) Identification (location) No. of parts in the figures

This flowchart indicates the disassembly steps to gain

access to item(s) to be serviced. When reassembling,
follow the steps in reverse order. Bend, route, and
dress the cables as they were originally.

(2) Name of the part

(3) Figure Number for reference
(4) Identification of parts to be removed, unhooked,
unlocked, released, unplugged, unclamped, or
desoldered.
Axx = Screw, CNxx/Jxx/CONxx = Connector
D3.5X12BA is specification of screw.

[1].Decoration Ring
[2].Wooden Box

[3].Speaker decorative ring

* = Unhook, Unlock, Release, Unplug, or Desolder

[4].Treble tube

e.g. 7(A01) = seven Screws

[5].Decorative ring

[6].Woofer Speaker
[7].Speaker Box
Back Cabinet

2. Disassembly Method
Removal
ID/Loc.
NO.

Part

Remove/Unhook
Fig.NO. /Unlock/Release/
Unplug/Desolder

[1]

Decoration
Ring

D1

[2]

Wooden Box

D2

[3]

Speaker
decorative ring

D3

[4]

Treble tube

D4

[5]

Decorative ring

D5

[6]

[7]

Woofer
Speaker
Speaker Box
Back Cabinet

A01
Note

Fig. D1

4(A01) D3*12 FA

D6

D7

Fig. D2

8-1

Cabinet Disassembly Instructions

Fig. D3

Fig. D6

Fig. D4

Fig. D7

Fig. D5

8-2

Troubleshooting

FLOW CHART NO.1

No effect on the remote control

No

Check the battery if there is power

Replace the batteries

Yes

Check the remote operation is normal or not

No

Replace the remote conrol

Yes

Check the remote control board CN002 pin 3.3V

power supply is normal or not

No

Check the power supply part of the circuit

Yes
No

Replace the MCU board

Replace the remote control board

FLOW CHART NO.2

No Sound

Check the mute function is turned on

Yes

Cancel the mute setup

No
Test the amplifier output whether of normal

Yes

Check the audio output cable

No
Switch to state Wirless(Ipod)MP3 LINK,
confirm whether all no sound

No

Check the sound channel

Yes
Check the CS48520, TAS5707 and public output portion
of the circuit

9-1

Block Diagram

SW_WIFI
Charge only

WIFI

Adapter
5v

I2C, RST

WIFI MODULE
DM870

SPI
HOST_IRQ/BUSY

key

Apple Ceriticiate
CP2.0B

I2S, data wifi

I2S, mclk,bclk,lrck

AC220Vin

SW_MCU

3 colour led

MCU
LM3S800

IR

I2C

OP
LM324

Audio detect

ADC
PCM1808

MP3 LINK

Rst,cs,
SPI
lrq busy watchdog

stby

upgrade

Eeprom
24c02

Rst-amp
Amp_mclk
8ohm 50W thd=10%

AUDIO DSP
I2S amp

I2S data adc

CS48520CQZ

AMPLIFIER
STA326
2 * 50W

FL

FR
8ohm 50W thd=10%
stby
APM2301

AC220V in

EE19A

5.6V

PSU SMPS
EE33

10-1

30V

DC/DC
TPS54286

LDO
TLV70018

3.3V 1A

1.2V
700mA

5.6V

LDO
TPS79901

3.3V
1.8VD
200mA
5VA 10mA

10-1

Wiringe Diagram

5V
GND

SPKR+
SPKR-

SPKL+
SPKL-

Adapter 5V/2.1A

5V
GND

MAIN

PSU

2.0/2P

5V
IR
GND

2.0/2P

L
R
GND

LED
GND

2.0/4P

2.0/3P

RST
TCK
TMS
TDI
TDO
GND

KEY-RST
KEY-WPS
LED1
LED2
LED3
GND

IPHONE5V
GND

2.0/9P

2.0/6P
1.0/6P

11-1

11-1

AC1
AC2

KEY-Press+MPS Line+LED and REMOTE INCEPT BOARD -- Circuit and Layout Diagram

47uf/16v

R230

47

C228

REM
GND
Vcc
104
C227

LED001
3

4
2
1

1
2
3

SW502
OP/CL

S201
REMOTE

10

J501
4P

RST

1P1T

3
2
1

P_206
9P

MP3_L
MP3_R
MP3_GND
KEY RST
KEY WPS

REMOTE INCEPT BOARD

R229

SW501
9
8
7
6
5
4
3
2
1

MP3_GND
1
MP3_R
2
MP3_L
3
MP3_GND
4

REM

KEY-PRESS+MPS LINE+LED Board

P-204
3P

12-1

12-1

Main Frequency Divider Board -- Circuit and Layout Diagram

Main Frequency Divider Board

L1
AUDIO IN+

1mH/1.0mm
R3
3R3/10W

WF+
TW-

WF+
WF-

C1
10UF/100V
AUDIO IN6.8UF/100V
C3

R1 6R/10W

R2
3.3R/5W
L2
0.5mH/0.6mm

12-2

TW+

TW+

TW- TW-

12-2

Deputy Frequency Divider Board -- Circuit and Layout Diagram

Main Frequency Divider Board

L1
AUDIO IN+

1mH/1.0mm
R3
3R3/10W

WF+
TW-

WF+
WF-

C1
10UF/100V
AUDIO IN6.8UF/100V
C3

R1 6R/10W

R2
3.3R/5W
L2
0.5mH/0.6mm

12-3

TW+

TW+

TW- TW-

12-3

Ipod Board -- Circuit and Layout Diagram

CN101
IPOD_DET
R101
NC/0

R102
NC/0
CN102
3
2
1

IPOD_DET
+5V
GND

R103
NC/0

3P

R107
NC/549K 1%
+5V
R104 75K 1%

R105
104 43.2K 1%
R106
49.9K 1%

105

C102

R108
49.9K 1%

C101

30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
A6
A5
A4
A3
A2
A1

GND
GND
LINE-OUT R
LINE-OUT L
LINE-IN R
LINE-IN L
Rem
Video
SC
SY
Accessory Detect
RX
TX
Reserved
GND
GND
Reserved
3V3
F/W PWR+
F/W PWR+
Accessory Identify
TPBUSB PWR
TPB+
USB DTPAUSB D+
TPA+
GND
GND
GND
GND
GND
GND
GND
GND
IP3

12-4

12-4

LED and DC Board -- Circuit and Layout Diagram

LEDBOARD

R221

LED5V

4.7K
R223
47K

DC BOARD

+5V

Q101
9014

R224 100K

R2 R

VSS

LED2
LED
LED3
LED

S1

R3 R

D1
5

R1
4

C1

Q1
2

CN103
3P

Q1

IC202 TC4013
1
2
3

CN101
3P

LED1
LED

R1 R

S2

9
D2

R2

11
C2

12
Q2

C210
10uF

10

D215
4148

C208
10uF

13

14

DET

C207
104

Q2

DETC From IPAD

CN202
4P

CK5V
LED5V

VDD

R220
4.7K

4
3
2
1

C106
47uF/10V

1
2
3
4

POWER

3
2
1

R211 47

CN102
4P

SW205

C209
104

R212 10K

C099
10uF

D215
4148

12-5

POWER_ON/OFF

R030 47K

R203 4.7K

12-5

Power Board -- Circuit Diagram

1nF/AC250V
CY500

P6KE-200A
D502

1
T500
2

FR107
D501
C500
22uF/400V CD263

10
9

C502
1000uF/10V

L503 L-3
GND1

C508
50V/47uF CD263

10nF/50V

L501 L-3
5.6VD

1000uF/10V

R500
1R

5.6V

L500 3.3uH

C501

D500
FR107

C504

SK56C 60V/5A
D503

L502
L-3

EE19C

12VD
C

Q500
2SB647

1kV/100pF C509
TNY280 IC500
5

C503
100nF/50V

C507
50V/47uF CD263

R501
2.2K

OP500

R503
22K

R507
200R

BP

C510
100nF/50V

UV

R506 200R

GND

5.6VD

OP501

PC817

J500

9
8
7
6
5
4
3
2
1

IC501
TL431
2

PC817

K502

C511
220nF/50V

R510 3.3K

STB
1N4007
D504 R504 100R

R512
2.2K 1%

R508
1K
3

R502
22K

R513
1.8K 1%

12VD

R505 100R

TH501
5D-11
3

R525 120R

Relay-SPST
D505
B6S

C514

D506
GUB606
3

R519
680K

150uF/400V CD294
4

CX501
220nF/250VAC

1
D508
FR207

L506 L-3

FR107
D507

1nF/AC250V
L505

R521
10R

R518
680K
1

XM504
HOLE

10
9

R509
1k
PC817

F
5

R527
1.8K
OP502

R520
6.8R

R530
6.8K

3.3k R511

R528
11K
C518
220nF/50V

1
C506
100nF/50V

C520
47uF/25V

C519
1000uF/50V CD263

S501

IC502
TL431
R531
976R

GND2

12-6

30VD

L508
C517
1000uF/50V CD263

XM503
HOLE

2
XM501
HOLE

XM502
HOLE

100PF/1KV

S500

MARK2

L-3
R529
10K

D509
MUR1620

EE33C

C515
10uF/50V

IC503
TOP249Y
C

C513

MARK1

XM500
HOLE

M501

WARNING

M500

WARNING

K501

C505
100nF/50V

P500

K500

L507

L-3

22uH

2
3

R517
680K

CY503

L511
12
11

1nF/AC250V
L510
2MH

L509
10MH
2

R515
330K

CON3-3.96

4
R516
330K

330nF/250VAC

CX500

1
2
3

1000PF/1KV

R524 120R
C512

CY502

MA IN IN

AC230v10%

J501

R526 120R

1 T501

L-3
R514
330K

1nF/AC250V

R522
68k/3W

10nF/400V

L504

C516

TH500
5D-11

GND2
30VD

CON9

R523 120R

CY501
1

2
FUSE500
T5AL250V

5.6VD
GND1
STB

12-6

L-3

GND2

Power Board -- Layout Diagram

12-7

12-7

Decoder Board -- Circuit Diagram

P202
5.6V

A23
A22
AV3CTRL1
AV3CTRL0
AV0CTRL2
AV0CTRL1
AV0CLK
AV0DATA3
AV0DATA2
AV0DATA1
AV0DATA0

BR_LRCLK

BR_LRCK

BR_SD

BR_SD

AV2CTRL0
AV2DATA3
AV2DATA2
AV2DATA1
AV2DATA0
ETH_RXETH_RX+
ETH_CT
ETH_TXETH_TX+
NWAIT
NPD_RF

R208 4.7K

20
19
18
17
16
NC
NC
NC
NC
NC

U203
CP20B

5.6V
100nF

47uFC234
GND
GND

AOUTRN
AOUTRP

1.2V

C241
100nF

+5VD

Audio_Detect

R235

D205
1N4148

10K
C261 220nF
1
2
3
4
5
6
7
8
9
10
11
12

RST
D209
1N4148

C266 C267
+

R245
10K

1uF

0.1uF

C270
10UF/16V

C268
22pF

Y200

7.3728M
C271
22pF

R246
100K

PE5
PE4
PE3
PE2
RST
LDO
VDD
GND
OSC0
OSC1
PC7/C2PC6/C2+

GND

R259 33R

1
2
3
4
5
6
7

VREF
AGND
VCC
VDD
DGND
SCKI
LRCLK

U209
PCM1808

GND

C273

10uF

1
2
3

1
2
3
4
5
6
8
7
6
5
1
2
3
4

FB200
100M/80R

8
7
6
5
3.3VD
100M/450ohms
L211
C281

0.1uF

AMP_MCLK
BR_LRCK
BR_BCLK
ADC_SD

L212 FB

R265 100R
R266 100R
R267
R268
GND

FAC_RESET
HOST_NIRQ

GND

C282

0.1uF

C279

C278

0.1uF

0.1uF

3.3V

C283

10uF

GND

GND

Header 6

10K
10K

PE1
PE0
PB3/I2CSDA
PB2/I2CSCL
VDD
GND
PB1
PB0
PD3/U1TX
PD2/U1RX
PD1
PD0

13
14
15
16
17
18
19
20
21
22
23
24

C272
0.1uF

GND

GND

GND
AMP_MCLK
BR_LRCK
BR_BCLK
ADC_SD
KEY_RST_1
KEY_WPS_1

GND
C280
0.1uF

R254

R253
10k

82pF

VINR
VINL
FMT
MD1
MD0
DOUT
BCK

U200
LM3S800

33R R264

KEY AND LED

10k

82pF

R255 10k

C277

14
13
12
11
10
9
8

33R R262

C264
1UF

U207B
LM324

R242 10K

C1815
Q202

R240 1K

2.5V

PD7
PD6
PD5/CCP2
PD4/CCP0
PB6/C0PB6/C1PB6/C0+
PB7/TRST
PC0/TCK
PC1/TMS
PC2/TDI
PC3/TDO

GND

PC5
PC4
VDD
GND
PA0/U0RX
PA01U0TX
PA2/SSICLK
PA3/SSIFSS
PA4/SSIRX
PA5/SSITX
VDD
GND

Z203
3.3V
C262
100PF

33R R263

11

Z202
3.3V

D207
1N4148

3.3V

C1815
Q201

D206
1N4148

GND

5
4

R222
C249
16K 1% 10uF

R223
5.1K 1%

GND

+5.6V
R224 200R

IR

R226 10K

D210
1N4148

GND
R341

STB

4.7K

R237

1
C258
1UF
LM324 R229 1K

C274 1uF

GND
KEY_RST
KEY_WPS
LED1
LED2
LED3

FB

C251
10UF/6.3V

48
47
46
45
44
43
100R R228
42
41
40 33R
R230
39 33R
R231
38 33R
R232
37
R233
33R

10UF/6.3V

5VA

FB203
100M/600R
5
4
6
3
7
2
8
1

1
2
3
4
RST
TCK
TMS
TDI
TDO

1N4148

R227C255
1K

0.1UF C257

U207A

P206

OUT

U206
TPS79901
Close ADC

L210
FB

GND

D203

C254

10uF

+5VD

2.5V

C276

R341
1K

R286 4.7K Q200

36
35
34
33
32
31
30
29
28
27
26
25

3.3VD

3.3VD

3.3V
C263

R241
R243

SDA
SCL

33R
33R

GND
1
2
3
4

C265

0.1uF
GND
GND

A0
A1
A2
VSS

0.1uF

VCC
WP
SCL
SDA

U208
NA

8
7
6
5

SCL
SDA
GND

BR_RESET
AMP_RST#

R247

33R

R249
R251
R252
R256

DSP_BUSY
33R DSP_IRQ
DSP_IRQ
33R DSP_nRST
DSP_nRST
33R DSP_WATCHDOG
DSP_WATCHDOG
33R

R257
R258
R260
R261

33R
33R
33R
33R

DSP_BUSY

DSP_MOSI
DSP_MISO
DSP_CS
DSP_SCLK

DSP_MOSI
DSP_MISO
DSP_CS
DSP_SCLK

GND

BR_NCS0
1
1
1

Z201
3.3V

D208
1N4148

C275 1uF

10K
STB

TP202
TP203
TP204

Z200
3.3V

C269 +

11.3k
11.3k

IN
GND
EN

3.3V

R269 100R
Q203
DTB114EK

LED1_1
R270 100R
R285 100R

Q205
DTB114EK

Q204
DTB114EK

LED2_1
LED3_1

12-8

C243

1uF
GND

Q156

R340
10K

R220
6.04K

GND

3.3VD

APM2301

R218 20K

5VA
1
2
3

P204

+5.6V

+5VD

6
5
4
3
2
1

GND

1.8VD
5

IN OUT
GND
EN NC

C242
47uF

C1815

IR CONNECTOR

FB201
100M/80R
1N4148
D202

R248
R250

C244

U205
TLV70018
1
2
3

ECO

PITCH=2.0MM

4.7uF

C250
100nF

R234 10K

R244
100K

100nF

150PF
C246
C247

R221 20R

D204
1N4148

C259

470PF

GND

GND

C252
1UF

1UF

3.3V

C239

U204
TPS54286

GND

R236

L208 6.8uH
33nF
C236

GND

GND

GND

56K
C260
150P

14
13
12
11
10
9
8

PVDD2
BOOT2
SW2
BP
SEQ
ILIM2
FB2

R219
20K

C256
100PF

FB202
100M/600R
1
8
2
7
3
6
4
5

PVDD1
BOOT1
SW1
GND
EN1
EN2
FB1

BR_BCLK

ETH_LED_ACT
ETH_LED_SPEED
MIICRS
MIICOL
MIITXER
MIITXCLK
MIITXD0
MIITXD1
MIIRXD0
MIIRXD1

150P

3
2
1

1
2
3
4
5
6
7

C245 150PF

AV4DATA1
AV4DATA0

10UF/10V

33nF

AMP_MCLK

BR_SCK

AV2CLK

C253

P205

C237
47uF

R217 10K

AMP_MCLK

AV2CTRL1

R225 56K

C235

FAC_RESET

To BridgeCo Module

R
GND

L209 4.7uH

1.2V
HOST_NIRQ

PDOUT1
VCO1
PDOUT0
VCO0
AV3CLK
AV0CTRL0
AV1DATA3
AV1DATA2
AV1DATA1
AV1DATA0

P203

MP3

C232
100nF

FB

C233

SOFTWARE UPDATE

GND

L207

5.6V

USB_VBUS

C240
100nF

AOUTLP
AOUTLN

33R BR_RESET

D201
MBRS320

USB_DN
USB_DP
USBVBUSDRV

33R BR_NCS0

R214

Header 9

GND

R216 33R

SSMD7
SSMD5
SSMD3
SSMD0
SSMCLK
SSMCP

GND
R213

AV3CTRL1
AV3CTRL0

Vss

C248
20PF

SPI_DOUT
SPI_DIN
SPI_CLK
TXD0
RXD0
RXD1
TXD1

Vcc

R239 4.7K

33R
33R
33R

R210
R211
R212

TP200 1
1
TP201

3.3V
C231
0.1u

GND

R238 4.7K

DSP_SCLK

RST_CP
1V9_OUTSIDE
TMS
TCK
TDI
TDO
SPI_NCS0
SPI_NCS1
NRESET_MOD
SSMD6
SSMD4
SSMD2
SSMD1
SSMCMD
SSMWP
NCS3
NCS2

1
2
3
4
5
6
7
8
9

STB
+30V

+30V

MBRS320
D200

DSP_MISO
DSP_MOSI

1.2V

15
NC
NC
14
MODE1/SPI_nss MODE0/SPI_CLK
13
NC
I2C_SDA/SPI_SOMI
12
nRESET
I2C_SCL/SPI_SIMO
11

R215 33R C238

470PF

3V3RTC

1
2
3
4
5

GND

33R

1.2V
1V9_OUTSIDE

3.3V

NC
NC
NC
NC
NC

3.3V

2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
82
84
86
88
90
92
94
96
98
100
102
104
106
108
110
112
114
116
118
120

6
7
8
9
10

1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
81
83
85
87
89
91
93
95
97
99
101
103
105
107
109
111
113
115
117
119

R209 4.7K

3.3V

J200
14-5046-120-145-829+

12-8

Decoder Board -- Layout Diagram

12-9

12-9

Exploded View

SPEAKER BOX BACK CABINET

BE

T TU
POR

PCB

100

AIRPROOF COVER

PCB5
PCB2
DE

Base

TI
RA

CO
NG

RI

WOODEN BOX
PCB6
PCB4/(PCB7 for deputy speaker)
SPEAKER BRACKET
Treble Neck

PCB3

AL

UM

Aluminum trim ring

IR RECEIVER LENS

IN

UM

SH

EL

OO

Treble Head

FE

KE

EA

SP

TWEETER

13-1

13-1

Docking Exploded View

PC Sheet

PET Sheet

Scutcheon
114
Socket Fix Iron-Sheet
CN101

Rubber Foot
112

PCB8
PCB9
Preforming(L&R)

PCB10

Cast Iron

Glue Sheet
111

113

Leading Light Seat(PMMA)

13-2

13-2

Revision List
Revision List
Version 1.0
* Initial Release
Version 1.1
* Addition of DOCKING Exploded View

14-1