0042-207X/9053.00 + .00
1990 Pergamon Press plc
I o n - S o l i d Interaction Division, Van de Graaff Group, National Accelerator Centre, Faure 7131,
South Africa
There is considerable interest in the solid state interaction between metals and silicon to form silicides, as
these compounds are widely used in silicon devices as interconnects and contacts. In this study an effective
heat of formation rule is formulated for predicting the sequence in which silicide phases form in metal-silicon
binary systems. In the presence of very small amounts of Au at the S i - C o interface, CoSi2 is the first phase
to form instead of C02Si. This reversal of phase sequence is explained using the effective heat of formation
rule. This concept is also used to evaluate the influence of oxygen impurities on nickel silicide formation.
1. Introduction
phases l
2. Effective heat of formation model
= AH
TAS
Phase
AH
(kcal g - i mol-t)
AH
(kcal g - i at-Z)
Cr3Si
CrsSi 3
CrSi
CrSi2
- 33.2
-78.4
- 19.0
-28.8
- 8.3
-9.8
-9.5
-9.6
R Pretorius:
Cr
1000
<10@
3000
2Mev
VIRGIN
2000
100(
3000
L;
1200k 6001
>-
Walser and Ben~ 13 postulated that during preparation of silicon-metal thin film couples by evaporation or sputtering the
interface consists essentially of a metallic glass with a concentration near the lowest-temperature eutectic in the binary system. Also, it can be expected that when such a structure is
heated, intermixing at the interface would take place at concentrations similar to that of the lowest eutectic. It is thus reasonable that for prediction of first phase silicide formation the
effective heat of formation of the different compounds which
could possibly form, should be compared at the lowest eutectic
composition of the particular binary system. It should also be
noted that the non-congruent silicide phases are relatively
unstable and are usually 'skipped' during silicide formation1.4. 14.
500~C-8min
o
z_
Cr
"
,~
oc
LLI 2000
I--"
" "
L)
co
Si
-,c 1000
1k,
3oook
300(3 S
"
500"C-20 rain
2000
~")t,,...
1000
(1)
C.r
..
0,~
o.B
1.2
1.6
2.0
ENERGY (MeV)
Figure 1. Rutherford backscattering spectra (E, = 2.0 MeV, 0 = 165),
showing the solid state interaction between a thin chromium film and
single crystal silicon to form CrSi2, which is the first and only phase to
form, even after extended periods of heating at higher temperatures.
The ratio of the Cr to Si signal heights as well as electron and X-ray
diffraction measurements are used for phase identification.
1039
-lz.c
'-~
-8.1
-2.1
F
20
20001
t.0
t_J
80
60
100
t~
16
I
g.
Lowest
eutectic
(at% Si)
Predicted
phase
Observedt
phase
AH'
(kcal/g- t a t - i)
Co
Cr
Fe
Mn
23
85
34
22
C o 2 Si
Mo
Nb
Ni
97
96
46
Pd
Pt
Ta
Ti
V
W
Zr
16
23
99
86
97
99
91
Co 2 Si
CrSi 2
FeSi
MnSi
MnsSi 3
MoSi2
NbSi2
Ni2Si
NiSi
Pd 2Si
Pt 2Si
TaSi 2
TiSi 2
VSi 2
- 6.4
-4.3
- 6.5
- 3.2
-3.5
-0.8
- 0.9
-9.2
- 9.8
- 3.3
- 4.8
-0.2
-4.5
-0.9
- 0.2
-3.4
WSi 2
ZrSi2(NC )
CrSi 2
FeSi
MnSi
-MoSi 2
NbSi2
Ni2Si
-Pd 2Si
Pt 2Si
TaSi 2
TiSi 2
VSi 2
WSi 2
ZrSi2(NC )
1/+00t
"
85/a
I I
il
II
1200
F
IO00L
0
System
,o.,
//
-6.C
-t+.O
,":
Cr
I
20
1335"E
i
/.,0
i
60
I
80
4. Phase sequence
100
Si
Atomic % Si
Table 2. Standard heats o f formation for various Cr, Co and Ni silicide phases, and the effective heat of formation A H ' given in the last column
as calculated for the lowest-melting eutectic composition for the metal-silicon binary system*
Phase
Composition
(Cr0.33 5i0.67 )
AH
(kcal g - ' m o l - ')
AH
(kcal g - ~a t - 1)
Limiting
element
AH"
(kcal g - ~a t - ')
- 33.2
- 78.4
- 19.0
-28.8
- 8.3
- 9.8
-9.5
-9.6
Cr
Cr
Cr
Cr
- 1.7
- 2.4
-2.9
-4.3
- - 27.6
--24.0
- - 24.6
- 9.2
- 12.0
-- 8.2
Si
Si
Si
- 6.4
-5.5
- 2.8
- - 72.1
-- 10.3
- 11.4
- 11.1
-- 10.7
-- 7.5
Ni
Ni
Ni
Si
Si
-- 7.8
-9.2
-9.9
- 9.8
- 5.2
(C00.67 5io.33 )
CoSi
(Coo.5oSio.5o)
CoSi 2
(C00.33 Si0.67 )
-34.1
-55.5
-- 21.4
- 22.5
-14.0
--
towest
eutectic/~
\'
":~ -t,.0
-10.0
|
20
t,0
80
60
100
o
kJ
1600
I/I
t..J
I~0(
1310"[I 77.5 ?
i
1259[
120(
F--
1000
8O0
0
Co
20
40
6'0
,I
I
80
i
100
Si
Atomic % 5i
Figure 3. Effective heat of formation (AH') diagrams for the Co-Si
system. In this case unlike for Cr, the lowest eutectic is on the metal
rich side of the phase diagram, resulting in the prediction that Co2Si
will be the first phase to form according to the effective heat of
formation rule.
t~
F-
ALPHA ENERGY{HeV}
-12.C
--
-10.0
6. S u m m a r y
-6.0
":~ -~.C
-2.0
0
20
t~O
60
80
100
.N
1600 -
t~
Z
e~
I/.00
and conclusion
,~ 1200
.=
i~ 1000
80C
600
Ni
20
t*0
60
80
100
5i
Atomic % Si
Figure 5. Effective heat of formation diagram for the Ni-Si system.
mation is the predominant first phase 17. It is known that during
the formation of amorphous silicon thin films by electron-beam
evaporation or sputtering, the films may contain a few atomic '
percent of oxgyen due to gettering in the vacuum. From the
N i - S i effective heat of formation diagram (Figure 5) and from
Table 3, it is clear that from a thermodynamic point of view
there is not much to choose between the formation of NizSi or
NiSi (Ni3Si2 is a non-congruent phase and is thus not expected
1042