Explanation
Circuit diagram
Explanation
This jam circuit can be used in quiz contests wherein any
participant who presses his button (switch) before the other
contestants, gets the first chance to answer a question. The circuit
of more than one switch, the higher priority number (switch no.) will
be displayed. Simultaneously, the logic 0 output of gate N1 drives the
buzzer via p-n-p transistor BC158 (T1). The buzzer as well the
display can be reset (to show 0) by momentary pressing of reset
switch S9 so that next round may start.
No.
560
9
1
1
Capacitors
Specificati
ons
0.01 F
0.1 F
No.
1
1
Transistors
Specificati
ons
BC547
No.
1
ICs
Specificati
No.
ons
IC 74373
IC 74147
IC 7447
IC 7404
IC 7400
IC 7430
1
1
1
1
1
1
Miscellaneous
Specifications
Buzzer
Push to ON
switches
7 Segment display
No.
1
8
1
PCB Layout
Bottom copper
Top copper
Simulation
The software used in our project for simulation purposes is
Proteus.
Proteus
Introduction:
Many CAD users dismiss schematic capture as a necessary evil in the process
of creating PCB layout but we have always disputed this point of view. With
PCB layout now offering automation of both component placement and track
routing, getting the design into the computer can often be the most time
consuming element of the exercise. And if you use circuit simulation to develop
your ideas, you are going to spend even more time working on the schematic.
ISIS has been created with this in mind. It has evolved over twelve years
research and development and has been proven by thousands of users
worldwide. The strength of its architecture has allowed us to integrate first
conventional graph based simulation and now - with PROTEUS VSM interactive circuit simulation into the design environment. For the first time ever
it is possible to draw a complete circuit for a micro-controller based system and
then test it interactively, all from within the same piece of software. Meanwhile,
ISIS retains a host of features aimed at the PCB designer, so that the same
design can be exported for production with ARES or other PCB layout software.
Soldering is a process in which two or more metal items are joined together by
melting and flowing a filler metal into the joint, the filler metal having a relatively
low melting point. Soft soldering is characterized by the melting point of the filler
metal, which is below 400 C (752 F).[1] The filler metal used in the process is
called solder.
Solders
Soldering filler materials are available in many different alloys for differing
applications. In electronics assembly, the eutectic alloy of 63% tin and 37% lead
(or 60/40, which is almost identical in performance to the eutectic) has been the
alloy of choice. Other alloys are used for plumbing, mechanical assembly, and
other applications.
A eutectic formulation has several advantages for soldering; chief among these
is the coincidence of the liquidus and solidus temperatures, i.e. the absence of
a plastic phase. This allows for quicker wetting as the solder heats up, and
quicker setup as the solder cools. A non-eutectic formulation must remain still
as the temperature drops through the liquidus and solidus temperatures. Any
differential movement during the plastic phase may result in cracks, giving an
unreliable joint. Additionally, a eutectic formulation has the lowest possible
melting point, which minimizes heat stress on electronic components during
soldering.
Flux
In high-temperature metal joining processes (welding, brazing and soldering),
the primary purpose of flux is to prevent oxidation of the base and filler
materials. Tin-lead solder, for example, attaches very well to copper, but poorly
to the various oxides of copper, which form quickly at soldering temperatures.
Flux is a substance which is nearly inert at room temperature, but which
becomes strongly reducing at elevated temperatures, preventing the formation
of metal oxides. Secondarily, flux acts as a wetting agent in the soldering
process, reducing the surface tension of the molten solder and causing it to
better wet out the parts to be joined.
Fluxes currently available include water-soluble fluxes (no VOC's required for
removal) and 'no-clean' fluxes which are mild enough to not require removal at
all. Performance of the flux needs to be carefully evaluated; a very mild 'noclean' flux might be perfectly acceptable for production equipment, but not give
adequate performance for a poorly-controlled hand-soldering operation.
Basic soldering techniques
Soldering operations can be performed with hand tools, one joint at a time,
or en masse on a production line. Hand soldering is typically performed with a
from the copper trace and any device leads that are present. This will leave a
bright, shiny, clean junction to be resoldered.
Soldering defects
Various problems may arise in the soldering process which lead to joints which
are non functional either immediately or after a period of use.
The most common defect when hand-soldering results from the parts being
joined not exceeding the solder's liquidus temperature, resulting in a "cold
solder" joint. This is usually the result of the soldering iron being used to heat
the solder directly, rather than the parts themselves. Properly done, the iron
heats the parts to be connected, which in turn melt the solder, guaranteeing
adequate heat in the joined parts for thorough wetting. In 'electronic' hand
soldering solder the flux isembedded in the solder. Therefore heating the
solder first may cause the flux to evaporate before it cleans the surfaces (pcb
pad and component connection) being soldered.
An improperly selected or applied flux can cause joint failure, or if not properly
cleaned off the joint, may corrode the metals in the joint over time and cause
eventual joint failure. Without flux the joint may not be clean, or may be
oxidized, resulting in an unsound joint.
Movement of metals being soldered before the solder has cooled will cause a
highly unreliable cracked joint. In electronics' soldering terminology this is
known as a 'dry' joint. It has a characteristically dull or grainy appearance
immediately after the joint is made, rather than being smooth, bright and shiny.
This appearance is caused by crystallization of the liquid solder. A dry joint is
weak mechanically and a poor conductor electrically.
Tools
Hand-soldering tools include the electric soldering iron, which has a variety of
tips available ranging from blunt to very fine to chisel heads for hot-cutting
plastics, and the soldering gun, which typically provides more power, giving
faster heat-up and allowing larger parts to be soldered. Hot-air guns and pencils
allow rework of component packages which cannot easily be performed with
electric irons and guns.
Testing of circuit
TROUBLE SHOOTING:
Troubleshooting and fault analysis requires a good theoretical knowledge and
analytical thinking. It is not something which can be studied from books, but has
to be acquired through constant troubleshooting and experimenting. However,
there are guidelines that can be followed to the troubleshooting process. Nearly
anyone who is familiar with basic electronic theory can learn troubleshooting
techniques and fix many types of electronic failures. To troubleshoot, you simply
follow logical, step-by-step procedures to arrive at a solution. Basically,
troubleshooting depends on the circuit complexity, on symptoms, and on the
personal experience. The most common troubleshooting techniques are listed
below:
Power check:
Many times a simple issue such as a blown fuse or a flat battery is the cause of
a circuit malfunction. Initially, therefore, ensure that the power cord is plugged in
and that the fuses are not blown. If the circuit is battery powered, make sure
that the voltage level is acceptable. If a power supply rectifier is present, check
the level of the voltage at the output and make sure that the circuit is powered
with the correct polarity.
Visual inspection:
This inspection is part of the so-called sensory checks. Sensory checks rely on
the human senses to detect a possible fault. The visual inspection of the PCB is
the simplest troubleshooting technique (which is very effective in many of the
cases). The soldered joints have to be inspected thoroughly. If any doubts exist
about the quality of a certain joint, it has to be re-soldered. The PCB has to be
inspected visually for any burnt components.
Sometimes, components that overheat leave a brown mark on the board. They
can be used as starting points' in the troubleshooting process and the reasons
why they overheat have to be determined. It is bad practice simply to replace
such components, without trying to find out what actually caused the
component to overheat. In many cases, the reason is a faulty (or out of range)
component near the failed component. It also has to be replaced.
Using a sense of touch
Overheated components can be detected by simply touching them. However,
this check has to be performed with extreme caution. The circuit has to be
turned off, and some time allowed for the large capacitors to discharge. Always
touch the components with the right hand only. This is important because in the
case of electric shock it is less likely that the current will pass through the heart.
If possible, wear insulated shoes.
In addition, care should be taken not to burn the fingers. Using the sense of
touch is a very useful troubleshooting technique in circuits, where everything
seems to work properly for a while, and then the circuit fails, due to overheating
of a certain component. Identifying such components helps to detect the
possible cause of the fault. Special freezing sprays are available, which allow
instant freezing of components. If the circuit begins to operate properly
ICs information
Features
Choice of 8 latch or 8 D type flip flop in a single
package.
3 State bys driving output.
Full parallel access for loading.
buffered control inputs.
IC 7400
The MM74HC00 NAND gates utilize advanced silicon-gate CMOS
technology to achieve operating speeds similar to LS-TTL gates with
the low power consumption of standard CMOS integrated circuits. All
gates have buffered outputs. All devices have high noise immunity
and the ability to drive 10 LS-TTL loads. The 74HC logic family is
function-ally as well as pin-out compatible with the standard 74LS
logic family. All inputs are protected from damage due to static
discharge by internal diode clamps to VCC and ground.
Features
Typical propagation delay: 8 ns
Wide power supply range: 26V
Low quiescent current: 20 A maximum (74HC Series)
Low input current: 1 A maximum
Fanout of 10 LS-TTL loads
7430 8-input
This device contains a single gate which performs the logic NAND
Function.
Alternate Military/Aerospace device (5430) is available. Contact a
National Semiconductor Sales Office/Distrib-utor for specifications.
The 47A feature active-low outputs designed fordriving commonanode LEDs or incandescent indicators di-rectly. All of the circuits
have full ripple-blanking input/out-put controls and a lamp test input.
Segment identification and resultant displays are shown on a
following page. Dis-play patterns for BCD input counts above nine are
unique symbols to authenticate input conditions. All of the circuits
incorporate automatic leading and/or trail-ing-edge, zero-blanking
control (RBI and RBO). Lamp test (LT) of these devices may be
performed at any time when the BI/RBO node is at a high logic level.
All types contain an overriding blanking input (BI) which can be used
to con-trol the lamp intensity (by pulsing) or to inhibit the outputs.
Features
Seven segment displays are very common for electronic product to display numerical output.
Many common devices like calculators, watches, electronic weighing scales,ovens etc use
them.
PIN Configuration
Now you know the basic of these displays, to use them you should know the pin configuration of the
commercially available displays. As you must have guessed these displays should have nine pin( one
for each segment + decimal point +common) but the available modules have two pins for common.
They are internally connected. So they have total of 10 PINs.
Thus it actually jams the first input and thus it acts as fastest
finger first.
Applications:
It can be used in Quiz contests to make Game Shows Priority
Less.
It can also be used in voting machines where, if a voter presses a
button the LED lamp glows & the buzzer rings. Once a button is
pressed all the other buttons are jammed. The officer has a switch
to reset the voting machine after each voter votes.
Advantages:
It is a handy device.
It has low Power consumption.
Its much easier to use.
It is more accurate.
Also Visual Interface adds its advantage.
Its response time is very fast.
It is highly sensitive.
It got a wide supply range.
It has high noise immunity.
Its cost is very low.
Disadvantages: