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Bringing Your MEMS to Market

Silicon Optical Bench


Platform for Integration and Alignment of Multiple Optical Components

Overview Benefits of a Silicon Optical Bench Platform


A Silicon Optical Bench (SiOB) • Passive alignment and automated assembly
system serves as a platform to • Greater sub-component integration capabilities
integrate optical components • Scalable production yielding lower per unit manufacturing costs
and subsystems while, at the • Fewer process and assembly steps
same time, reducing develop- • Greater versatility to integrate new applications into existing product platforms
ment and manufacturing costs. • Enhanced testing and measurement capabilities

Silicon Optical Bench (SiOB) Diagram

Custom SiOBs
Micralyne custom designs and manufactures application-specific SiOBs for
customers using our core competencies in thin-film metallization, silicon
micromachining, and MEMS. Micralyne works closely with its customers from
product design, through prototype MEMS development and into volume MEMS
manufacturing.

www.micralyne.com ETDS306_Rev040-0907_SIOB
Bringing Your MEMS to Market

Silicon Optical Bench


Specifications

About Micralyne SiOB Capabilities


Micralyne is a world leading Micralyne integrates its core capabilities to custom design and manufacture
independent MEMS foundry. application-specific SiOBs for clients. The following summarizes Micralyne’s
From its state-of-the-art standard capabilities:
50,000 ft2 manufacturing
facility, Micralyne develops and Wafer Material: Silicon
manufactures MEMS-based Thickness: Standard: 450 - 550 µm; Other thickness and
components in volume.
tolerances can be specially ordered
Micralyne is a profitable and
growing company located in Resistivity: High resistivity wafers available
Edmonton, Alberta, Canada.
Silicon Etch Depth: ± 10% <140µm deep; ± 20% >140µm
Width: ± 5% <140µm deep; ± 10% >140µm
Features Wells, V-Grooves, Double Level Etching

Oxidization PECVD and Thermal Available


Metallization Conductor System: Ti/Pt/Au, Ti/Mo/Au, or Custom
Resistor System: TaN
Solder Material System: AuSn (80/20); Electroplated
For More Information... Thickness: 1 to 20 µm

Micralyne Inc. Dicing Die Size Tolerances: ± 50 µm


1911 – 94 Street Edge of Die to First Feature: ± 25 µm
Edmonton, Alberta
Canada T6N 1E6

Tel: +1.780.431.4400
Fax: +1.780.431.4422

info@micralyne.com
www.micralyne.com

Side View of Silicon Optical


Bench Step Etch

ETDS306_Rev040-0907_SIOB
www.micralyne.com

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