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OPA820
SBOS303D JUNE 2004 REVISED DECEMBER 2016
3 Description
2 Applications
PACKAGE
SOIC (8)
4.90 mm 3.91 mm
SOT-23 (5)
2.90 mm 1.60 mm
0.1 PF
RS
24.9
2k
REFT
(3 V)
2k
OPA820
IN
50
100 pF
ADS850
14-Bit
10 MSPS
5 V
2k
402
IN
402
0.1 F
2k
(2 V) (1 V)
REFB VREF
SEL
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
OPA820
SBOS303D JUNE 2004 REVISED DECEMBER 2016
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
7.1
7.2
7.3
7.4
7.5
7.6
7.7
8
9
1
1
1
2
3
3
3
Device Support......................................................
Documentation Support ........................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
37
37
37
38
38
38
38
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (August 2008) to Revision D
Page
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ............................... 1
Deleted Ordering Information table; see Package Option Addendum at the end of the data sheet ...................................... 1
Deleted Lead temperature (soldering, 300C maximum) from Absolute Maximum Ratings table......................................... 3
Changed Open-loop voltage gain test condition in Electrical Characteristics: VS = 5 V table From: VO To: VCM ................ 5
Changed Open-loop voltage gain test condition in Electrical Characteristics: VS = 5 V table From: VO To: VCM .................. 8
Changed R2 From: 505 To: 517 , C1 From: 150 pF To: 100 pF, and C2 From: 100 pF To: 160 pF in 5-MHz
Butterworth Low-Pass Active Filter image............................................................................................................................ 28
Page
Page
OPA820
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DUAL CHANNEL
TRIPLE CHANNEL
QUAD CHANNEL
FEATURES
OPA354
OPA2354
OPA4354
CMOS RR output
OPA690
OPA2690
OPA3690
High-slew rate
OPA2652
8-Pin SOT23
OPA2822
Low noise
OPA4820
Quad OPA820
DBV Package
5-Pin SOT-23
Top View
NC
Inverting Input
Noninverting Input
+VS
Noninverting Input
Output
VS
NC
Output
VS
Noninverting Input
+VS
Noninverting Input
NC
Inverting Input
Pin Functions
PIN
I/O
DESCRIPTION
NAME
SOIC
SOT-23
Disable
Inverting Input
Inverting input
1, 5, 8
No connection
Noninverting Input
Noninverting input
Output
Output of amplifier
+VS
VS
NC
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
Power supply
Internal power dissipation
MAX
UNIT
6.5
VDC
1.2
VS
Junction temperature, TJ
150
125
65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
OPA820
SBOS303D JUNE 2004 REVISED DECEMBER 2016
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(1)
(2)
Electrostatic discharge
3000
1000
300
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
TA
MIN
NOM
MAX
10
12
UNIT
V
45
25
85
RJC(top)
DBV (SOT-23)
D (SOIC)
5 PINS
8 PINS
UNIT
150
125
C/W
141.1
72.6
C/W
RJB
42.9
68.2
C/W
JT
23.5
28.1
C/W
JB
42
67.8
C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
TEST CONDITIONS
MIN
TYP MAX
UNIT
AC PERFORMANCE
G = 1, VO = 0.1 VPP, RF = 0 , Test level = C
G = 2, VO = 0.1 VPP,
Test level = B
Small-signal bandwidth
G = 10, VO = 0.1 VPP,
Test level = B
170
TA = 0C to 70C
160
TA = 40C to 85C
155
TA = 25C
23
TA = 0C to 70C
21
TA = 40C to 85C
(2)
(3)
4
240
MHz
30
20
TA = 25C
220
TA = 0C to 70C
204
TA = 40C to 85C
200
280
Gain-bandwidth product
38
Peaking at a gain of 1
0.5
dB
Large-signal bandwidth
85
MHz
Slew rate
G = 2, 2-V step,
Test level = B
800
TA = 25C
TA = 25C
192
TA = 0C to 70C
186
TA = 40C to 85C
180
MHz
MHz
240
V/s
1.5
ns
Test levels: (A) 100% tested at 25C. Overtemperature limits by characterization and simulation. (B) Limits set by characterization and
simulation. (C) Typical value only for information.
TJ = TA for 25C specifications.
TJ = TA at low temperature limits; TJ = TA + 9C at high temperature limit for over temperature.
Submit Documentation Feedback
OPA820
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TEST CONDITIONS
G = 2, VO = 2-V step,
Test level = C
G = 2, f = 1 MHz,
VO = 2 VPP, RL = 200 ,
Test level = B
MIN
To 0.02%
22
To 0.1%
18
TA = 25C
85
TA = 0C to 70C
ns
81
79
TA = 25C
90
TA = 0C to 70C
dBc
85
83
TA = 40C to 85C
81
TA = 25C
95
TA = 0C to 70C
90
89
TA = 40C to 85C
88
TA = 25C
dBc
110 105
TA = 0C to 70C
102
TA = 40C to 85C
100
2.5
2.7
TA = 0C to 70C
2.8
TA = 40C to 85C
2.9
TA = 25C
Input current noise
UNIT
80
TA = 40C to 85C
TA = 25C
Input voltage noise
TYP MAX
1.7
TA = 0C to 70C
2.6
2.8
TA = 40C to 85C
nV/Hz
pA/Hz
Differential gain
0.01%
Differential phase
0.03
DC PERFORMANCE (4)
AOL
TA = 25C
62
TA = 0C to 70C
61
TA = 40C to 85C
60
TA = 25C
Input offset voltage
66
dB
0.2
TA = 0C to 70C
TA = 40C to 85C
4
9
(4)
V/C
17
TA = 0C to 70C
19
TA = 40C to 85C
23
TA = 0C to 70C
30
TA = 40C to 85C
50
TA = 25C
1.2
TA = 0C to 70C
TA = 25C
mV
TA = 40C to 85C
Average input offset voltage drift
0.7
5
nA/C
100 400
TA = 0C to 70C
600
TA = 40C to 85C
700
TA = 0C to 70C
TA = 40C to 85C
nA
nA/C
OPA820
SBOS303D JUNE 2004 REVISED DECEMBER 2016
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TEST CONDITIONS
MIN
TYP MAX
UNIT
INPUT
Common-mode input range (5)
CMIR
CMRR
Test level = A
VCM = 0 V, Input-referred,
Test level = A
TA = 25C
3.8
TA = 0C to 70C
3.7
TA = 40C to 85C
3.6
TA = 25C
76
TA = 0C to 70C
75
TA = 40C to 85C
73
4
V
85
dB
18 || 0.8
k || pF
6 || 1
M || pF
OUTPUT
TA = 25C
3.5
TA = 0C to 70C
3.4
2
TA = 40C to 85C
3.4
TA = 25C
3.5
TA = 0C to 70C
3.4
5
TA = 40C to 85C
3.4
TA = 25C
90
TA = 0C to 70C
80
TA = 40C to 85C
75
3.7
3.6
110
Output current
VO = 0 V, Test level = A
mA
125
mA
0.04
POWER SUPPLY
TA = 25C
Quiescent current
PSRR
(5)
VS = 5 V, Test level = A
TA = 0C to 70C
5.45
5.6
5.75
6.2
TA = 40C to 85C
4.8
6.4
TA = 25C
64
TA = 0C to 70C
63
TA = 40C to 85C
62
mA
72
dB
Tested at less than 3 dB below the minimum specified CMRR at CMIR limits.
OPA820
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TEST CONDITIONS
MIN
TYP
MAX
UNIT
AC PERFORMANCE
G = 1, VO = 0.1 VPP, RF = 0 , Test level = C
G = 2, VO = 0.1 VPP,
Test level = B
Small-signal bandwidth
G = 10, VO = 0.1 VPP,
Test level = B
550
TA = 25C
168
TA = 0C to 70C
155
TA = 40C to 85C
151
TA = 25C
21
TA = 0C to 70C
20
TA = 40C to 85C
230
MHz
28
19
TA = 25C
200
TA = 0C to 70C
190
TA = 40C to 85C
185
260
Gain-bandwidth product
Peaking at a gain of 1
0.5
dB
Large-signal bandwidth
70
MHz
Slew rate
G = 2, 2-V step,
Test level = B
TA = 25C
145
TA = 0C to 70C
140
TA = 40C to 85C
135
Settling time
G = 2, VO = 2-V step,
Test level = C
G = 2, f = 1 MHz,
VO = 2 VPP, RL = 200 ,
Test level = B
200
V/s
1.7
To 0.02%
24
To 0.1%
21
TA = 25C
80
TA = 0C to 70C
TA = 25C
TA = 0C to 70C
(1)
(2)
(3)
92
91
TA = 40C to 85C
90
98
TA = 0C to 70C
dBc
95
93
TA = 40C to 85C
92
2.5
TA = 0C to 70C
TA = 25C
dBc
79
75
100
2.8
2.9
TA = 40C to 85C
Input current noise
76
77
TA = 40C to 85C
TA = 25C
ns
74
83
TA = 0C to 70C
TA = 25C
ns
75
TA = 40C to 85C
TA = 25C
Input voltage noise
MHz
nV/Hz
3
1.6
2.5
TA = 0C to 70C
2.7
TA = 40C to 85C
2.9
pA/Hz
Test levels: (A) 100% tested at 25C. Overtemperature limits by characterization and simulation. (B) Limits set by characterization and
simulation. (C) Typical value only for information.
TJ = TA for 25C specifications.
TJ = TA at low temperature limits; TJ = TA + 9C at high temperature limit for over temperature.
OPA820
SBOS303D JUNE 2004 REVISED DECEMBER 2016
www.ti.com
TEST CONDITIONS
MIN
TYP
TA = 25C
60
65
TA = 0C to 70C
59
TA = 40C to 85C
58
MAX
UNIT
(4)
TA = 25C
Input offset voltage
0.3
1.4
TA = 40C to 85C
1.6
TA = 0C to 70C
TA = 40C to 85C
4
8
18
TA = 40C to 85C
22
TA = 0C to 70C
30
TA = 40C to 85C
50
Test level = A
100
mV
V/C
16
TA = 0C to 70C
TA = 25C
1.1
TA = 0C to 70C
TA = 25C
Input bias current
dB
nA/C
400
TA = 0C to 70C
600
TA = 40C to 85C
700
TA = 0C to 70C
TA = 40C to 85C
nA
nA/C
INPUT
TA = 25C
CMRR
Test level = A
(4)
1.1
1.2
TA = 40C to 85C
1.3
TA = 25C
4.2
TA = 0C to 70C
4.1
TA = 40C to 85C
TA = 25C
VCM = 2.5 V, Input-referred,
TA = 0C to 70C
Test level = A
TA = 40C to 85C
74
0.9
TA = 0C to 70C
4.5
V
83
73
dB
72
15 || 1
k || pF
5 ||
1.3
M || pF
OPA820
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TEST CONDITIONS
MIN
TYP
3.8
3.9
MAX
UNIT
OUTPUT
TA = 25C
No load, Test level = A
Most positive output voltage
RL = 100 to 2.5 V,
Test level = A
TA = 0C to 70C
3.75
TA = 40C to 85C
3.7
TA = 25C
3.7
TA = 0C to 70C
TA = 40C to 85C
3.65
3.6
TA = 25C
No load, Test level = A
1.2
TA = 0C to 70C
1.4
TA = 25C
RL = 100 to 2.5 V,
Test level = A
1.2
TA = 0C to 70C
1.3
1.35
TA = 40C to 85C
Output current
1.3
1.35
TA = 40C to 85C
3.8
1.4
TA = 25C
80
TA = 0C to 70C
70
TA = 40C to 85C
65
105
mA
115
mA
0.04
POWER SUPPLY
TA = 25C
Quiescent current
VS = 5 V, Test level = A
TA = 0C to 70C
TA = 40C to 85C
PSRR
4.4
5.4
4.25
5.5
4.1
5.6
68
mA
dB
OPA820
SBOS303D JUNE 2004 REVISED DECEMBER 2016
www.ti.com
3
6
9
12
G=1
G=2
G=5
G = 10
15
3
6
9
12
G = 1
G = 2
G = 5
G = 10
15
18
18
1M
10M
100M
1G
10
Frequency (Hz)
VO = 0.1 VPP
RF = 0 at G = 1
See Figure 55
VO = 0.1 VPP
0
3
VO = 0.5 VPP
VO = 1 VPP
VO = 2 VPP
VO = 4 VPP
15
12
18
1
10
100
500
10
Frequency (MHz)
G=2
See Figure 55
G = 1
0.3
1.5
0.2
1.0
0.1
0.5
0.1
0.5
0.2
1.0
Large Signal 1 V
Small Signal 100 mV
1.5
0.4
2.0
See Figure 56
0.4
2.0
Large Signal 1 V
Small Signal 100 mV
0.3
1.5
0.2
1.0
0.1
0.5
0.1
0.5
0.2
1.0
0.3
1.5
0.4
2.0
See Figure 55
G = 1
10
500
2.0
0.4
G=2
100
Frequency (MHz)
0.3
See Figure 56
12
VO = 0.5 VPP
VO = 1 VPP
VO = 2 VPP
VO = 4 VPP
500
Gain (dB)
Gain (dB)
100
Frequency (MHz)
See Figure 56
OPA820
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2ndHarmonic
3rdHarmonic
75
70
80
85
90
95
2ndHarmonic
3rdHarmonic
80
85
90
95
100
105
100
100
2.5
1k
3.0
VO = 2 VPP
See Figure 55
VO = 2 VPP
G = 2 V/V
5.0
5.5
6.0
RL = 200
See Figure 55
G = 2 V/V
75
60
2ndHarmonic
3rdHarmonic
2ndHarmonic
3rdHarmonic
80
65
4.5
70
75
80
85
90
95
85
90
95
100
105
100
110
105
0.1
0.1
10
VO = 2 VPP
10
Frequency (MHz)
G = 2 V/V
See Figure 55
f = 1 MHz
RL = 200
See Figure 55
G = 2 V/V
70
70
2ndHarmonic
3rdHarmonic
75
4.0
Resistance ()
f = 1 MHz
3.5
80
85
90
95
100
105
2ndHarmonic
3rdHarmonic
75
80
85
90
95
100
110
1
10
Gain (V/V)
f = 1 MHz
RL = 200
See Figure 55
10
Gain (|V/V|)
VO = 2 VPP
f = 1 MHz
RL = 200
See Figure 56
VO = 2 VPP
11
OPA820
SBOS303D JUNE 2004 REVISED DECEMBER 2016
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45
100
10
40
35
30
25
20
15
1
10
100
1k
10k
100k
1M
10M
10
15
20
25
30
Frequency (MHz)
Frequency (Hz)
See Figure 48
Figure 14. Two-Tone, 3rd-Order Intermodulation Intercept
10
1
1
10
100
8
7
6
5
4
3
2
1
0
CL = 10 pF
CL = 22 pF
CL = 47 pF
CL = 100 pF
1
2
3
1000
10
90
80
80
70
70
60
40
50
60
40
80
30
100
20
120
10
140
160
400
See Figure 49
60
50
40
30
20
CMRR
+PSRR
PSRR
10
0
1k
10k
100k
1M
10M
100M
10
100
Frequency (Hz)
12
100
Frequency (MHz)
0
20 log (AOL)
AOL
20
OpenLoop Phase ()
RS ()
100
180
1k
10k
100k
1M
Frequency (Hz)
10M
100M
1G
OPA820
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10
1-W Internal
Output Current
Power Limit
Limit
Output Impedance ()
3
2
1
0
1
2
0.1
3
Output Current
Limit
5
150
1-W Internal
RL = 25
100
RL = 50
50
RL = 100
50
Power Limit
100
1k
10k
100k
0
1
Output
5
Time (40 ns/div)
See Figure 55
G = 2 V/V
0.20
1.0
0.40
dG Negative Video
dG Positive Video
dP Negative Video
dP Positive Video
See Figure 56
0.32
0.28
0.12
0.24
0.10
0.20
0.08
0.16
0.06
0.12
0.04
0.08
0.02
0.04
0
2
0.36
Differential Phase ()
G = 2 V/V
Input
0.14
100M
0.16
10M
Frequency (Hz)
Input
Output
0.18
1M
0.01
150
0.5
10
10
0.5
1.0
50
25
25
50
75
100
20
125
Video Loads
G = 2 V/V
Figure 23. Composite Video dG/dP
13
OPA820
SBOS303D JUNE 2004 REVISED DECEMBER 2016
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12
VIN
+VIN
VOUT
+VOUT
100
75
50
Supply Current
Source Output Current
Sink Output Current
4
3
2
1
50
25
25
50
75
0
125
25
100
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
2500
Count
100k
1500
1000
10k
500
730
660
580
510
440
370
290
220
150
70
0
70
150
220
290
370
440
510
580
660
730
Input Impedance ()
2000
1M
1k
100
1k
10k
100k
1M
10M
100M
Frequency (Hz)
Mean = 30 V
Total count = 6115
Standard deviation = 80 V
Figure 27. Common-Mode and Differential Input
Impedance
2000
1800
1600
Count
1400
1200
1000
800
600
400
200
380
342
304
266
228
190
152
114
76
38
0
38
76
114
152
190
228
266
304
342
380
Mean = 26 nA
Standard deviation = 57 nA
14
OPA820
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3
6
9
12
G=1
G=2
G=5
G = 10
15
3
6
9
12
G = 1
G = 2
G = 5
G = 10
15
18
18
1M
10M
100M
1G
10
Frequency (Hz)
VO = 0.1 VPP
See Figure 57
VO = 0.1 VPP
0
3
VO = 0.5 VPP
VO = 1 VPP
VO = 2 VPP
VO = 4 VPP
15
12
18
1
10
100
600
10
Frequency (MHz)
G = 2 V/V
See Figure 57
G = 1
500
2.8
4.0
2.7
3.5
2.6
3.0
2.5
2.5
2.4
2.0
2.3
1.5
Large Signal 1 V
Small Signal 100 mV
1.0
2.1
0.5
See Figure 58
4.5
2.9
2.9
4.5
Large Signal 1 V
Small Signal 100 mV
2.8
4.0
2.7
3.5
2.6
3.0
2.5
2.5
2.4
2.0
2.3
1.5
2.2
1.0
2.1
0.5
G=2
100
Frequency (MHz)
2.2
See Figure 58
12
VO = 0.5 VPP
VO = 1 VPP
VO = 2 VPP
VO = 4 VPP
500
Gain (dB)
100
Frequency (MHz)
See Figure 57
G = 1
See Figure 58
15
OPA820
SBOS303D JUNE 2004 REVISED DECEMBER 2016
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2ndHarmonic
3rdHarmonic
80
75
85
90
95
100
105
100
70
80
90
100
110
0.1
1k
G = 2 V/V
f = 1 MHz
See Figure 57
VO = 2 VPP
G = 2 V/V
2ndHarmonic
3rdHarmonic
80
90
100
110
70
80
90
100
110
0.1
10
10
Gain (V/V)
f = 1 MHz
RL = 200
G = 2 V/V
f = 1 MHz
VO = 2 VPP
RL = 200
VO = 2 VPP
40
2ndHarmonic
3rdHarmonic
75
VO = 2 VPP
60
2ndHarmonic
3rdHarmonic
RL = 200
See Figure 57
70
80
85
90
35
30
25
20
95
100
15
10
Gain (|V/V|)
f = 1 MHz
RL = 200
10
15
20
25
30
Frequency (MHz)
VO = 2 VPP
16
10
Frequency (MHz)
Resistance ()
See Figure 50
Figure 41. Two-Tone, 3rd-Order Intermodulation Intercept
OPA820
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10
1
1
10
100
8
7
6
5
4
3
2
1
0
CL = 10 pF
CL = 22 pF
CL = 47 pF
CL = 100 pF
1
2
3
1000
10
10
0.5
0.5
1.0
10
25
25
50
75
100
125
12
Supply Current
Source Output Current
Sink Output Current
Output Current (mA)
15
1.5
1.5
50
300
See Figure 51
1.0
100
Frequency (MHz)
100
75
50
25
15
125
50
25
25
50
75
100
RS ()
100
0
125
Ambient Temperature ( C)
2000
1800
3000
1400
2000
1200
Count
Count
1600
2500
1500
1000
800
600
1000
400
500
200
1.08
0.97
0.86
0.76
0.65
0.54
0.43
0.32
0.22
0.11
0
0.11
0.22
0.32
0.43
0.54
0.65
0.76
0.86
0.97
1.08
380
342
304
266
228
190
152
114
76
38
0
38
76
114
152
190
228
266
304
342
380
Mean = 490 V
Total count = 6115
Standard deviation = 90 V
Figure 46. Typical Input Offset Voltage Distribution
Mean = 43 nA
Total count = 6115
Standard deviation = 50 nA
Figure 47. Typical Input Offset Current Distribution
17
OPA820
SBOS303D JUNE 2004 REVISED DECEMBER 2016
www.ti.com
+
OPA820
PO
50
200
402
402
Figure 48. Circuit for 5-V Two-Tone, 3rd-Order Intermodulation Intercept (Figure 14)
VI
RS
OPA820
VO
50
CL
1k
(1)
402
402
(1)
1 k is optional.
Figure 49. Circuit for 5-V Frequency Response vs Capacitive Load (Figure 55)
5V
806
0.01 F
PI
+
OPA820
57.6
PO
806
200 k
402
402
0.01 F
Figure 50. Circuit for 5-V Two-Tone, 3rd-Order Intermodulation Intercept (Figure 41)
18
OPA820
www.ti.com
806
0.01 F
VI
RS
OPA820
57.6
806
VO
CL
1k
(1)
402
402
0.01 F
(1)
Figure 51. Circuit for 5-V Frequency Response vs Capacitive Load (Figure 43)
19
OPA820
SBOS303D JUNE 2004 REVISED DECEMBER 2016
www.ti.com
9 Detailed Description
9.1 Overview
The OPA820 provides an exceptional combination of DC precision, wide bandwidth, and low noise while
consuming 5.6 mA of quiescent current. With excellent performance extending from DC to high frequencies, the
OPA820 can be used in a variety of applications ranging from driving the inputs of high-precision SAR ADCs to
video distributions systems.
External
Pin
VCC
Copyright 2016, Texas Instruments Incorporated
Source
Power-supply
decoupling not shown.
174
V1
50
+
D1
D2
50
OPA820
VO
50
RF
301
RG
301
5 V
OPA820
www.ti.com
21
OPA820
SBOS303D JUNE 2004 REVISED DECEMBER 2016
www.ti.com
(1)
OPA820
RS
EO
IBN
ERS
RF
4kTRS
RG
4kTRF
IBI
4kT
RG
EO
22
2
ENI
IBNRS
4kTRS NG2
IBIRF
4kTRFNG
(2)
OPA820
www.ti.com
EN
IBNRS
4kTRS
IBIRF
NG
4kTRF
NG
(3)
Evaluating these two equations for the OPA820 circuit shown in Figure 55 gives a total output spot noise voltage
of 6.44 nV/Hz and an equivalent input spot noise voltage of 3.22 nV/Hz.
9.2.7 DC Offset Control
The OPA820 device can provide excellent DC-signal accuracy because of high open-loop gain, high commonmode rejection, high power-supply rejection, low input-offset voltage, and low bias-current offset errors. To take
full advantage of this low input-offset voltage, careful attention to input bias-current cancellation is also required.
The high-speed input stage for the OPA820 device has a moderately high input bias current (9 A typical into the
pins) but with a very close match between the two input currentstypically 100-nA input offset current. The total
output-offset voltage can be considerably reduced by matching the source impedances looking out of the two
inputs. For example, one way to add bias current cancellation to the circuit of Figure 55 is to insert a 175-
series resistor into the noninverting input from the 50- terminating resistor. When the 50- source resistor is
DC-coupled, the source impedance for the noninverting input bias current increases to 200 . Because this value
is now equal to the impedance looking out of the inverting input (RF || RG), the circuit cancels the gains for the
bias currents to the output leaving only the offset current times the feedback resistor as a residual DC error term
at the output. Using a 402- feedback resistor, this output error is now less than 0.4 A 402 = 160 V at
25C.
9.2.8 Thermal Analysis
The OPA820 device does not require heat sinking or airflow in most applications. The maximum desired junction
temperature sets the maximum allowed internal power dissipation as described in this section. Make sure that
the maximum junction temperature does not exceed 150C.
Use Equation 4 to calculate the operating junction temperature (TJ).
TA + PD RJA
(4)
The total internal power dissipation (PD) is the sum of quiescent power (PDQ) and additional power dissipated in
the output stage (PDL) to deliver load power. Quiescent power is the specified no-load supply current times the
total supply voltage across the part. PDL depends on the required output signal and load but, for a grounded
resistive load, is at a maximum when the output is fixed at a voltage equal to of either supply voltage (for equal
bipolar supplies). Under this worst-case condition, use Equation 5 to calculate PDL.
PDL = VS2 / (4 RL)
where
(5)
NOTE
The power in the output stage and not in the load that determines internal power
dissipation.
As a worst-case example, compute the maximum TJ using an OPA820IDBV (SOT23-5 package) in the circuit of
Figure 55 operating at the maximum specified ambient temperature of 85C.
PD = 10 V (6.4 mA) + 52 / (4 (100 || 800 )) = 134 mW
Maximum TJ = 85C + (134 mW 150C/W) = 105C
(6)
(7)
23
OPA820
SBOS303D JUNE 2004 REVISED DECEMBER 2016
www.ti.com
+
0.1 F
50-
2.2 F
Source
VIN
VO
50-
50
Load
OPA820
50
RF
402
RG
402
0.1 F
2.2 F
VS
5 V
Copyright 2016, Texas Instruments Incorporated
24
OPA820
www.ti.com
+
0.1 F
+
RT
205
0.01 F
50-
50
50-
Load
OPA820
RG
402
Source
VO
2.2 F
RF
402
VI
RM
57.6
0.1 F
2.2 F
5 V
Copyright 2016, Texas Instruments Incorporated
(8)
Equation 8 is a result of adding the 50- source in the noise gain equation which results in a considerably higher
bandwidth than the noninverting gain of 10. Using the 240-MHz gain bandwidth product for the OPA820 device,
an inverting gain of 10 from a 50- source to a 50- RG gives 55-MHz bandwidth, whereas the noninverting
gain of 10 gives 30 MHz.
25
OPA820
SBOS303D JUNE 2004 REVISED DECEMBER 2016
www.ti.com
+
0.1 F
50-
Source
806
0.01 F
DIS
VI
VO
OPA820
57.6
6.8 F
100
VS/2
806
RF
402
RG
402
0.01 F
Copyright 2016, Texas Instruments Incorporated
26
OPA820
www.ti.com
+
0.1 F
806
6.8 F
DIS
VO
OPA820
100
VS/2
806
0.01 F
0.01 F
RG
402
RF
402
VI
27
OPA820
SBOS303D JUNE 2004 REVISED DECEMBER 2016
www.ti.com
28
OPA820
www.ti.com
R3
500
+
OPA820
R4
500
5V
R1
124
R2
517
V1
C2
1000 pF
VO
OPA820
C1
100 pF
R1
1.58 k
RF
402
RG
402
R5
158
R2
158
VOUT
OPA820
VIN
C1
1000 pF
5 V
Copyright 2016, Texas Instruments Incorporated
0.707
10
DC GAIN (dB)
The transfer function of a high-Q bandpass filter shown in Figure 64 is given by Equation 9.
R R4
S 3
VOUT
R1R4C1
R3
1
VIN
S2 S
R1C1 R2R4R5C1C2
ZO2
R3
R2R4R5C1C2
(9)
(10)
1
R1C1
wO
; 1MHz
fO =
2p
ZO
Q
(11)
(12)
Use Equation 11 and Equation 12, along with the filter specifications in table to find the relationship between 0,
Q, R1, and C1. Set C1 = 1000 pF, which results in R1= 1.5915 k. The closest E96 standard value resistor value
is 1.58 k.
Notice that the DC load driven by the OPA820 driving the output VOUT = R3 + R4. Select the total load to be 1 k
and R3 = R4, which results in a value of 500 .
To simplify the filter design, set C1 = C2 = 1000 pF.
Submit Documentation Feedback
29
OPA820
SBOS303D JUNE 2004 REVISED DECEMBER 2016
www.ti.com
Plugging the values of R3, R4, C1, and C2 into Equation 10 and assuming R2 = R5 results in a value of 159.15 .
The closest standard E96 value is 158 .
See Figure 61 for the frequency response of the filter shown in Figure 60.
10.2.1.2.2 Low-Pass Butterworth Filter Design Procedure
The transfer function of a low-pass Butterworth filter shown in Figure 59 is given by Equation 13.
VOUT
K
= 2
VIN
s (R1R2C1C2 ) + s R1C1 + R2C1 + R1C2 (1 - K ) + 1
where
R
K = 1 + F
RG is the low-frequency DC gain
(13)
The values for RF and RG are the standard recommended values in the data sheet.
The cutoff frequency is in Equation 14.
1
w0 =
R
C
( 1 1R2C2 )
(14)
R1R2C1C2
R1C1 + R2C1 + R1C2 (1 - K )
(15)
From Table 1, Q = 0.707 and 0 = 2 5 MHz. To aid in solving this circuit, assume C1 = 100 pF and
R1 = 124 . Plugging these values into Equation 14 and Equation 15 and finding the closest standard value
components results in R2 = 517 and C2 = 160 pF. See Figure 62 for the frequency response of the filter shown
in Figure 59.
6
0
6
12
18
24
30
36
42
48
54
60
66
72
6
3
Gain (dB)
Gain (dB)
0
-3
-6
100k
1M
10M
100M
-9
10k
100k
1M
Frequency (Hz)
Frequency (Hz)
10M
D001
OPA820
www.ti.com
(SFDR) of the converter, the SFDR of the amplifier must be at least 18 dB greater than the converter. The
OPA820 device has a minimal effect on the rated distortion of the ADS850 device, given the 79-dB SFDR at 2
VPP, 1 MHz of the ADS850 device. The greater than 90-dB (<1 MHz) SFDR for the OPA820 device in this
configuration implies a less than 3-dB degradation (for the system) from the specification of the converter. For
additional SFDR improvement with the OPA820 device, use a differential configuration.
Successful application of the OPA820 device for ADC driving requires careful selection of the series resistor at
the amplifier output and the additional shunt capacitor at the ADC input. To some extent, the selection of this RC
network is determined empirically for each converter. Many high-performance CMOS ADCs, such as the
ADS850, perform better with the shunt capacitor at the input pin. This capacitor provides low source impedance
for the transient currents produced by the sampling process. Improved SFDR is often obtained by adding this
external capacitor, whose value is often recommended in the data sheet of the converter. The external capacitor,
in combination with the built-in capacitance of the ADC input, presents a significant capacitive load to the
OPA820 device. Without a series isolation resistor, an undesirable peaking or loss of stability in the amplifier can
occur.
Because the DC bias current of the CMOS ADC input is negligible, the resistor has no effect on overall gain or
offset accuracy. See Figure 15 (5 V) and Figure 42 (5 V) to obtain a good starting value for the series resistor
which ensures a flat-frequency response to the ADC input. Increasing the external capacitor value allows the
series resistor to be reduced. Intentionally band limiting using this RC network can also be used to limit noise at
the converter input.
5V
5V
VIN
0.1 PF
RS
24.9
2k
REFT
(3 V)
2k
OPA820
IN
50
100 pF
ADS850
14-Bit
10 MSPS
5 V
2k
402
IN
402
0.1 F
2k
(2 V) (1 V)
REFB VREF
SEL
31
OPA820
SBOS303D JUNE 2004 REVISED DECEMBER 2016
335
www.ti.com
402
75-
Transmission Line
75
OPA820
Video
Input
VOUT
+
75
75
75
VOUT
75
75
VOUT
75
High output current drive capability allows three back-terminated 75- transmission lines to be simultaneously driven.
50
OPA820
R2
RG
RF
VO
RF
(V1 V2 )
RG
when
R2
R1
RF
RG
V2
5 V
Copyright 2016, Texas Instruments Incorporated
OPA820
www.ti.com
(16)
The differential to single-ended conversion is still performed by the OPA820 output stage. The high-impedance
inputs allow the V1 and V2 sources to be terminated or impedance-matched as required. If the V1 and V2 inputs
are already truly differential, such as the output from a signal transformer, then a single-matching termination
resistor can be used between them. Remember, however, that a defined DC signal path must always exist for
the V1 and V2 inputs; for the transformer case, a center-tapped secondary connected to ground would provide an
optimum DC operating point.
5V
V1
+
OPA2822
5V
RF1
500
500
+
VO
OPA820
500
RG
500
RF1
500
5 V
500
500
OPA2822
V2
+
5 V
Copyright 2016, Texas Instruments Incorporated
33
OPA820
SBOS303D JUNE 2004 REVISED DECEMBER 2016
1
2SRFCF
f
3 dB
www.ti.com
GBP
4SRFCD
(17)
GBP
2SRFCD
(18)
+
OPA820
High-Speed
DAC
VO = IDRF
500
ID
CD
CF
34
OPA820
www.ti.com
12 Layout
12.1 Layout Guidelines
Achieving optimum performance with a high-frequency amplifier such as the OPA820 device requires careful
attention to board layout parasitics and external component types. This section lists recommendations to
optimize performance.
12.1.1 Minimizing Parasitic Capacitance
Minimize parasitic capacitance to any AC ground for all of the signal I/O pins. Parasitic capacitance on the output
and inverting input pins can cause instability. On the noninverting input, parasitic capacitance can react with the
source impedance to cause unintentional band limiting. To reduce unwanted capacitance, a window around the
signal I/O pins must be opened in all of the ground and power planes around those pins. Otherwise, ground and
power planes must be unbroken elsewhere on the board.
12.1.2 Minimizing Distance from Power Supply to Decoupling Capacitors
Minimize the distance, less than 0.25 inches, from the power-supply pins to high-frequency 0.1-F decoupling
capacitors. At the device pins, the ground and power-plane layout must not be in close proximity to the signal I/O
pins. Avoid narrow power and ground traces to minimize inductance between the pins and the decoupling
capacitors. The power-supply connections must always be decoupled with these capacitors. Larger (2.2-F to
6.8-F) decoupling capacitors, effective at lower frequency, must also be used on the main supply pins. Place
these capacitors somewhat farther from the device. These capacitors can be shared among several devices in
the same area of the PCB.
12.1.3 Selecting and Placing External Components
Careful selection and placement of external components preserves the high-frequency performance of the
OPA820 device. Resistors must be a very-low reactance type. Surface-mount resistors work best and allow a
tighter overall layout. Metal-film and carbon composition, axially leaded resistors can also provide good highfrequency performance. Again, keep the leads and PCB trace length as short as possible. Never use wire-wound
type resistors in a high-frequency application. Because the output pin and inverting input pin are the most
sensitive to parasitic capacitance, always position the feedback and series output resistor, if any, as close as
possible to the output pin. Other network components, such as noninverting input termination resistors, must also
be placed close to the package. Where double-side component mounting is allowed, place the feedback resistor
directly under the package on the other side of the board between the output and inverting input pins. Even with
a low parasitic capacitance shunting the external resistors, excessively high resistor values can create significant
time constants that can degrade performance. Good axial metal-film or surface-mount resistors have
approximately 0.2 pF in shunt with the resistor. For resistor values greater than 1.5 k, this parasitic capacitance
can add a pole, a zero, or both below 500 MHz that can effect circuit operation. Keep resistor values as low as
possible consistent with load-driving considerations. A good starting point for design is to set RG || RF = 200 .
Using this setting automatically keeps the resistor noise terms low, and minimizes the effect of the parasitic
capacitance.
12.1.4 Connecting Other Wideband Devices
Connections to other wideband devices on the board can be made with short, direct traces or through onboard
transmission lines. For short connections, consider the trace and the input to the next device as a lumped
capacitive load. Relatively wide traces (50 mils to 100 mils) must be used, preferably with ground and power
planes opened up around them. Estimate the total capacitive load and set RS from the plot of Figure 15 (5 V)
and Figure 42 (5 V). Low parasitic capacitive loads (<5 pF) may not require an RS because the OPA820 device
is nominally compensated to operate with a 2-pF parasitic load. Higher parasitic capacitive loads without an RS
are allowed as the signal gain increases (increasing the unloaded phase margin). If a long trace is required, and
the 6-dB signal loss intrinsic to a doubly-terminated transmission line is acceptable, implement a matched
impedance transmission line using microstrip or stripline techniques (consult an ECL design handbook for
microstrip and stripline layout techniques). A 50- environment is normally not necessary onboard, and in fact, a
higher impedance environment improves distortion as shown in Figure 7 and Figure 36. With a characteristic
board-trace impedance defined based on board material and trace dimensions, a matching series resistor into
the trace from the output of the OPA820 device is used as well as a terminating shunt resistor at the input of the
destination device. Remember also that the terminating impedance is the parallel combination of the shunt
Submit Documentation Feedback
35
OPA820
SBOS303D JUNE 2004 REVISED DECEMBER 2016
www.ti.com
36
OPA820
www.ti.com
PACKAGE
ORDERING NUMBER
USER'S GUIDE
OPA820
SOIC (8)
DEM-OPA-SO-1A
OPA820
SOT-23 (5)
DEM-OPA-SOT-1A
The demonstration fixtures can be requested through the OPA820 product folder.
13.1.1.2 Macromodels and Applications Support
Computer simulation of circuit performance using SPICE is often a quick way to analyze the performance of the
OPA820 device and the device circuit designs. This is particularly true for video and RF amplifier circuits where
parasitic capacitance and inductance can play a major role on circuit performance. A SPICE model for the
OPA820 device is available through www.ti.com. The applications department is also available for design
assistance. These models predict typical small-signal AC, transient steps, DC performance, and noise under a
wide variety of operating conditions. The models include the noise terms found in the electrical specifications of
the data sheet. These models do not attempt to distinguish between the package types in their small-signal AC
performance.
13.1.2 Development Support
For the OPA820 PSpice Model, see SBOC048.
For the OPA820 TINA-TI Reference Design, see SBOC094.
For the OPA820 TINA-TI Spice Model, see SBOM176.
37
OPA820
SBOS303D JUNE 2004 REVISED DECEMBER 2016
www.ti.com
13.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.7 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
38
www.ti.com
9-Aug-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
OPA820ID
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
OPA
820
OPA820IDBVR
ACTIVE
SOT-23
DBV
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
NSO
OPA820IDBVRG4
ACTIVE
SOT-23
DBV
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
NSO
OPA820IDBVT
ACTIVE
SOT-23
DBV
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
NSO
OPA820IDBVTG4
ACTIVE
SOT-23
DBV
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
NSO
OPA820IDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
OPA
820
OPA820IDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
OPA
820
OPA820IDRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
OPA
820
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
www.ti.com
(4)
9-Aug-2016
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF OPA820 :
NOTE: Qualified Version Definitions:
Addendum-Page 2
2-Mar-2016
Device
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
OPA820IDBVR
SOT-23
DBV
3000
180.0
OPA820IDBVT
SOT-23
DBV
250
OPA820IDR
SOIC
2500
B0
(mm)
K0
(mm)
P1
(mm)
8.4
3.2
3.1
1.39
4.0
180.0
8.4
3.2
3.1
1.39
330.0
12.4
6.4
5.2
2.1
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
8.0
Q3
4.0
8.0
Q3
8.0
12.0
Q1
2-Mar-2016
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
OPA820IDBVR
SOT-23
DBV
3000
210.0
185.0
35.0
OPA820IDBVT
SOT-23
DBV
250
210.0
185.0
35.0
OPA820IDR
SOIC
2500
367.0
367.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
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supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
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