2) United States Patent Baks et al. (64) MILLIMETER-WAVE RADIO FREQUENCY INTEGRATED CIRCUIT PACKAGES WITH INTEGRATED ANTENNAS, (71) Applicant: International Business Machines Corporation, Araionk, NY (US) (72) Inveators: Christian W. Baks, Poughkoepsie, NY (US); Niaoxiong Gu, White Plains. NY (US); MD. Rashidul IL (US): Duisian Liu, Sea ws) International Business Machi Corporation, Armonk, NY (US) (03) Assignee: (*) Notice: Subject to any disclaimer, the term of this pateat is extended or adjusted under 38 USC. 1540) by 388 days. (21) Appl. Noz 13/688,262 (22) Filed: Nov. 26,2012 63) Prior Publication Data US 201401458831 May 29, 2014 (1) Ince Hog V38 (2006.01) HOI 122 (2006.01) us.cl. CPC. HOIg 12283 (2013.01), ¥107 29449016 01501) (58) Field of Classification Search src 291600; 348/850, 700 MS Se application ile for complete search history. 66) References Cited USS, PATENT DOCUMENTS asa 4 20080291115 Al aono0n2263 Al S989. Mekenna etal 72003 Baily eta 112008 Doan. 123000 Chouiary 40700 MS oa 'US009196951B2 (10) Patent No. 4s) Date of Patent: No US 9,196,951 B2 ‘. 24, 2015 2011/0285606 At 2o12007S154 AL aor 0090006 AL* W201 De Gra 32012 Biglbegian ea. 42013 Hong eta assuoz FOREIGN PATENT DOCUMENTS 2 2003168920 46 2003 OTHER PUBLICATIONS T Seki etal, "Milimeter-Wave High-Eicieney Multilayer Pasi Microstrip Antenna Array on Teflon Subtae” IEEE Transactions fon Microwave Theory and Techniques, Jun, 2005, pp. 2101-2106, 0,53, No 6, * cited by examiner Primary Examiner (74) Attome, Agent, or Firm ‘Mason & Lewis, LLP Diew H Duong Anne V. Dougherty; Ryan, 6 ABSTRACT A package structure includes a planar core structure, ‘antenna structure disposed on one side of the planar core Structure, and an interface structure disposed on an opposite side of the planar coe structure, The antenna strveture and interface structure are each formed oF a plurality of lasinated layers, each laminated layer having a patteraed conductive layer formed on an insulating layer. The antenna structure includes a planar antenna formed on one or more patemcd condctive layers the laminated layers. The interlace struc- ture includes a power plano, aground plane, signal lines, and ccontaet pads formed! on one oF moze pattemed conductive layers of the laminated layers of the interface structure. The package structure firther includes an antenna feed lin seve ture formed in and routed through, te interface steuere and the planar ore siucture, and connected tothe planar antenna, 32 Claims, 9 Drawing Sheets sa bow 3 bwU.S. Patent Nov. 24, 2015 Sheet 1 of 9 US 9,196,951 B2 = a g ss e y Ze = t a a iU.S. Patent Nov. 24, 2015 Sheet 2 of 9 US 9,196,951 B2 — a a ssas FS2599 39 () 2] 8 of “GUD S a dele i SB 3 Ser ; EI s* a) ie i $ : 4 [ se] éU.S, Patent Nov. 24,2015 Sheet 3 of 9 SN eo a 5 Le oD . AN = S Wet Me 5 22 / 3 152U.S. Patent Nov. 24, 2015 Sheet 4 of 9 US 9,196,951 B2 420 10 330 NV sees ze fsaa5e 8 in 3 gs a / ‘| : UNE =< TU.S, Patent Nov. 24,2015 Sheet Sof 9US 9,196,951 B2 Sheet 6 of 9 Noy. 24, 2015 U.S, Patent wl wh 0s} ‘a1 09h ZEh 1 SH a1 sa n ee He Lg os< ormed inthe upper buildup antenna structure, and low fre- _quency pockaging components such as power planes, contol, ‘and base band connections are Formed in the bottom buildup interface stricture to interface with an integrated cre chip (ex, REIC chip). An antenna fee line strcture has various sections formed inthe antenna structure, core substrate and Jmerface layer, connecting the antenna inthe upper antenna structure (© appropriate contact pads on the RFIC chip. Embodiments othe invention implement SLC (sure ami nar circuit) manufacturing processes or other similar mami- ‘acturing processes that can be used to build package struc- tures having the requisite tolerances andl design rues that are esd for ing packge component ori ean millimeter wave applic Iti tobe understood that the various layers andor eons showin in the accompanying drawings are not drawn to scale, and that one or more layers andor regions of a type com ‘monly used in integrated chip packages may not be explicitly showin ina given drawing. This does not imply thatthe layers and/or regions not explicitly shown are omitted from the actual integrated chip packages. Moreover, the same ors ference numbers used throughout the drawings are wed todenotethe same or similar features, clement, or structures and thus, a detailed explanation ofthe same or similar fe tures, elements, oe steutires will not be repeated for each of the drawings, IG. A schematically depictsa package structure according to an embodiment of the invention. In particular, FIG. 1s. @ side schematic view of a package stricture 100 comprising & planar core strcture 10, an antenna structure 120 disposed ‘on a frst (upper) sie of the planar core structure 110. an, interface structure 130 disposed on a second (bottom) side of the planar core structure 110, an antenna food line stractore (140,141, 148, 146), and an integrated circuit chip 150 (eg FIC chip) The antenna sirctare 120 comprises phuraity ‘oflaminated layers (11,12, 13,4, wherein each laminated Jayer(L1, L2,L3, L4) comprises a respective patterned con- ‘ductive layer (M1, M2, M3, Md) formed on a respective diclecric/insulating layer (DI, D2, D3, D3), which form various components inthe antena structure 120. The inter fice layer 130 comprises a plurality of laminated layers (L.1, 12,13, 14, L8), wherein each laminated layer (L1, 12, 13, 4, [8) comprises respective paternad condvctive layer (MI, M2, M3, M4, MS) formed on a respective dielectric! insulating layer (DY, D2, D3, DS, DS) The planar care stwc- ture 110 comprises substrate layer 12 having a first pround 0 o 4 plane 114 formed na ist side ofthe substrate layer 12, and 4 second ground plane 116 formed on a second side of the substrate layer 112 “The antenna sircture 120 comprises # planar antenna 122, tat is formed by one or more patterned conductive layers of the laminate layers ofthe antenna strocture 120, In patie Jar, the planar antenna 122 shown in FIG. 1 isa probe fed stacked patch antenna structure comprising a frst radiator clement 124 pattemed on a conductive layer Mi of an upper ‘most laminated layer [4 ofthe antenna structure 120, and a second radiator element 126 pattemed on a conductive layer 12 of a sevond laminated layer L2 of the antenna structure 120, disposed below the uppermost laminated layer L4, The fst radiator element 12435 lager in area than the second radiator element 126. With this antenna configuration, the ground plane 114 formed on the fist side ofthe core substrate 112 serves as an antenna ground plane forthe antenna raia- tors 124, 126. ‘The antenna structure 120 futher comprises a plurality of cconclctive vias 140 that form a portion of the antenna food Tine structure, The conductive vias 140 are formed in the first ‘nd second insulating layers D1, D2 of the first and second laminated layers L1, L2. The conductive vias 140 provide a vertical probe connection between the second antenna radia ‘or 126 anda vertical ansiton structure 14 that is formed in the planar core structure 110. The vertical transition structure 141 comprises plurality of ground vias 142 that are formext ‘rough the core subsiate 12 connecting he first and second _grcund planes 114 and 1160n the fst and second sides ofthe fore substrate 112, The vertical transition stracture 141 fue ther comprises a center vertical conductor 143 that extends ‘through the core substrate 112 consocting to the vertial Vias 140. The vertical ground vias 142 comprise a series of sepa sate vas that are formed through the core substrate 112 sur- rounding the center vertical conductor 143, thus forming & ‘eansmission line stactre that is similar to a coexil trans- ‘mission line, wherein the surrounding vertical ground vias 142 serve as an outer (shielding) conductor, and the center vertical via M43 serves asa center (signal) conductor. The plurality of vertical ground vias 142 may be arranged in a circular pattem surrounding the center vertical conductor 143, or other suitable pattem. An insulating, material 144 ‘within the vertical transition structure 141 comprises the core substrate 112 materia. “The interface structure 130 comprises high-frequency sig ‘nal wiring stretures that are pattemed on. conductive layer ‘MA of the first laminated layer L1 ofthe interface structire 130, a first ground plane pattemed on a second conductive layer M2 of the second laminated layer 12 of the interface structure 130, lowsfrequency wiring stroctures patterned ona conductive layer M3 ofthe third laminated layer L3 of the interlace stricture 130, a second (chip) ground plane pat {temed ona conductive layer Md ofthe fourth laminated layer ofthe interface stractire 130, plurality of vertical ground vias 131 extending through the fist and second laminated Jayers Land [2 connecting the second ground plane 116 of the core substrate 112 10 the ground plane of the second conductive layer M2, and a plurality of contact pads 132 pattemed a conductive layer MS ofthe fifth laminated layer 1s. ‘The RFIC chip 180 comprises a plurality of contact pads 152 formed on an active sie ofthe chip 180. The RFIC chip 150 comprises active cirevit elements foeming, for example, 4 receive, a transmitter of a transceiver cireit, and other ‘etive of passive circuit elements that are commonly used to ‘implement wireless RFIC chips. The contact pads 152 ofthe FIC chip 150 include pround pads, DC power supply pads,US 9,196,951 B2 5 ‘npuvoutput pads, control signal pad, ete, that form a por tionofa BEOL. (back end of line) wiring structure connected ‘o integrated circuit components ofthe RFIC chip 150, 2s is readily understood by those of ordinary skil inthe ar. The FIC chip 180i flip-chip mounted tothe interface structure 130 by connecting the contact pads 152 to comesponding ‘contact pads 132 of the conductive layer MS of the fifth laminated layer LS ofthe interface siracture 130 using stan- «dard techniques, suchas solder ball connections 160. The interface tcture 130 comprises «plurality of trans mission lines 145, 146, 147 and 148, In the illustrative ‘embodiment of FIG. 1, the transmission lines 148, 147, and 148 ae stripline transmission lines. Bach stip Kine transmis- sion line 148, 147, and 148 comprises signa fine fomed by portion ofthe patterned first conductive layer MI disposed between fist and second ground planes formed by the round plane 116 of the core structure 110 and the ground plane ormed by the second conductive layer M2. The portion 146 ‘ofthe antenna feed line isa vertical transition structure 146 that is formed dhrough two or more laminated layers of the interface sracture 130. The vertical transition structure 146 is Similar in stricture to the Vertical transition structure 141 discussed above, in that the vertical transition structure 146 ‘comprises « center vertical conductor connected between a ‘contact pal 132 on the patterned conductive layer MS and a ‘center conductor of the stripline transmission ine 145 on the pattemed conductive layer MA, and further comprises series ‘of vertical ground vias connecting the ground layers M2 and Ma (of the interface structure 130) surrounding the center ‘conductor. In this rogard, the vertical transition strocture 146 js similar in structure and function to a coaxial transmission Fine. “The transmission lines 145 and 146 comprise portions of the antenna feed line streture that is routed though the interface strucire 130, The various transmission lines 140, 441, 145 and 146 that form the antenna feed line serve 10 transmit elsetromagnetie energy between the antenna 122 andthe corresponding contact pad 1Sonthe etivesurliee of the RFIC chip 150, which is connected toa receiver, rans- miter or tansceivereireut, for example, formed inthe active side ofthe RFIC chip 150, Pr very high frequency applications, the stripline trans mission lines 148, 147 and 148 help to reduce interference celfeets of other package components such as power plane, Tow frequency control signal ines, and ober transiuission Tines The stripline sections 148, 147 and 148 can also reduce the complexities of antenna feod line outing especially for Jarge package phased aray applications. The vertical ground vias 131 can be implemented between adjacent stripline transmission lines 148, 148 and 145, 187 to reduce coupling between the stripline transmission lines. The coaxial rans- mission line 146 between the bottom stripline ground plane Tamed by the sevond conductive layer M2 and the chip ‘around plane formed by the fourth eondstive layer Ma serves to improve antenna fed line performance, by reducing ‘coupling effects between the antenna feed line and the sur rounding components and preventing the antenna feed line from radiating. Moreover, in the embodiment of FIG. 1, the round plane 116 formed on the bottom ofthe core substrate 2 serves asa ground plane forthe transmission lines 148, {47 and 148 formed in the interface strveture 130 and serves to reduce losses due to the lossy material forming the core substrate 112, ‘The laminatod layers 3, [4 and 18 of the interface strc ture 130 implement Various wiring structures for routing baseband signals and control signals to and from the RFIC chip 150 to other components circuits or systems connected 0 o 6 {0 the chip 150 via the interface structure 130. For instance, ‘control signals can be outed to and from the REIC chip 150 ‘using a Wiring stocture 133 formed by vertical eondocive vias formed in alignment though the insulating layers Dan DS of the laminated layers L4 and LS and a wiring stectore fof the patterod conductive layer ME of the third lmsinated layer ofthe interlace stricture 190. Moreover, chip round plane is formed by connecting the patterned condactive layer ‘Méof the fourth laminated layer L4 to a ground contset pad 152 ou the RFIC chip 180 using vertical vi connection 134 ‘formed through the insulating layer DS ofthe fifth minted layer LS. Inthe embodiment of FIG. 1, the planar core structure 110 provides a structurally sturdy layer upon which to build the Antenna and interface structures 120 and 130. [none embed ‘the planar core structure 110 comprises substrate 112 that is formed of standard FR4 material, or other standard materials that are typically used to comsruct a standard PCR (printed cireut board), The planar core srscture 100 can be Tormed with other materials having mechanical andeleteical properties that are similar to FR, providing a relatively rigid structure fo suppor the package structure. Depending on the Application frxquency the planar core stractare 110 ca have 8 thickness in range of about 10 mils to about 20 mils. For instance, for 94 GHz application, the thickness of the planar core sitetureis about 10 mils, Since the material Forming the core substrate 112 is typically losser than the buildup sub- stat, the vertical coaxial transition 141 that is formed through the core substrate 112 serves to reduce the loss and prevent parallel plate modes from occurring inthe package Structure 100, Moreover as noted above the laminated layers {orming the antenna and interface structures 120 and 130 can be formed using satcof the at fabrication teclniques sch as SLC or similar technologies, which ean meet the requisite tolerances and design rules noeded for high-frequency spp catia inthe range of 94 GH and higher, for example, With an SLC process, each of the laminated layers are separately tormed with a patemed metallization layer, and thea bonded to each other with an appropriate adhesive or epoxy material. For instance, in one embadiment, each laminated layer may be formed of dicletric/nsulating material, such as com mercially available ABF dielectric materials or similar mate- sal, witha thickness ina range of about 8 ur to about 33 um. ‘Moreover the conductive layers ean be fomed of copper, gol, or other suitable condvctive materials. Depending on the fabrication process employed, the conductive vis ean be ‘ormed by deiling or etching via holes ina substrate layer, ‘and then plating the via sidewalls wth a condietive material ‘orcompletely filing the via bole witha conductive material ng techniques readily understood by those of ordinary skill inthe art Ist be understood thatthe numberof laminated layers orming the antenna and interface structures will vary depending on the application, eg., antenna structure, VO ring requirements, power and ground plane requirements, ce, Those of ordinary skill inthe art readily nderstand that the antenna perfomance parameters such as antenna radia sion efficiency and bandwidth and operating resonant fre- ‘quency will vary depending on the dielectric constant, loss tangent, and thickness of the dicletrie/nsulating materials that fom the Laminated Layers. Moreover, the size and strue- ture of the patch radiators 124 and 126 ofthe antenna 122 shown in FIG. 1 will detommine the esonant feqnency ofthe Antenna sis well understood to those of ordinary skill inthe PIG. 2 schematically depicts package structure sccording tw another embodiment ofthe invention. ln paticule, FIG. 2US 9,196,951 B2 1 Js aside schematic view of package structure 200 compris- ing a planar core stricture 110, an antenna structure 120 disposed on a fist (upper) side ofthe planar core structure 0, an interface structre 230 disposedon a second (bottom) side of the planar core structure 110, an antenna feed line sinvcture (140, 141, 145, 246), and an integrate circuit chip 150(¢, RFIC chip). The planar core structure 110, antenna structure 120 and RFIC chip 150 in the package structure 200 ‘of FIG. 2 ae the same or similar in stuctureas those com= ponents 110, 120 and 180 shown in FIG. 1. As such, a dis- ‘cussion on structural details of the package components 110, 4120 and 150 will ot be repeted. “The interface layer 280 shown in FIG. 2i similar to the Interface layer 130 ofFIG- 1, except that in FIG. 2, a separate round plane (M2) for the transmission fines 145, 147 and 148 is eliminated, and the patterned conductive layer M2 of the second faminated layer L2 of the interface sircture 230 is tases both achip ground plane and lower ground plane for the transmission fines 145, 147 and 148. In this regard, @ vertical transition siructure 246 (which is similar in structire and function ofa coaxial transmission fin and which forms & portion ofthe antenna feed line) has a plurality of vertical ‘round vias 234 (faming an outer conductor) that each com- prise plurality of vertically aligned conductive vis Formed through the insulating layers M3, Mid and MS of the lami nated layers 3, L4, [Sand connected to ground coataet pads 182.0 the ative surface of the RFIC chip 180. The vertical transition structure 246 further comprises a center conductor 238 comprising « plialty of vertically aligned conductive vias formed through the insulating layers M3, M4 and MS of the laminated layers 3,14, 5 and connected to signal fed ‘contact pad 18200 the ative surface of the REIC ep 180, In the embodiment of FIG. 2, the bottom ground plane Mf the striplines can be used asthe chip round plane in applications ‘where the operating lrequency iso too high ad the package 1VO routing i not complicated FIG. schematically depicts a package structure according tw another embodiment of the invention In parieulag, FIG. 3 js a side schematic view of package struct 300 comprise ing a planar core streture 110, an antenna structure 120 disposed on a first (upper) side ofthe planar core structure 1110, an interface structure 330 disposed on a second (batlom) side of the planar core structure 110, an antenna feed line structure (140, 141, 348, 346), and an integrated cteult chip 180 e., RFIC chip), The planar ore structure 110, antenna structure 120 and RFIC chip 150 in the package structure 300 ‘OFFIG. 3 are the same or similar in structure as those come ponents 110, 120 and 150 shovsn in FIG. 1. As sueh, a dis- ‘custo on the stictral details of the package components 10, 120 and 150 will not be repeated. ‘The interlacestcture 330 shown ia FIG. 3issimilaetothe Jimerface structure 130 of FIG. 1, except that in FIG. 3, 8 Separate ground plane (M2) used forthe transmission lines 145, 147 and 148 js eliminated, and the pattemed conductive layer M2 of the second laminated layer L2 of the interface structure 330 shown in FIG. 3 ists asa DC power plane In the embodimeat of FIG. 3, rather than using stipines as ia previously discussed embodiments, one or more microstrip Fines ean be implemented in the laminated layers L1 ad L2 for transmitting higher frequency signals in the package structure 300, For example, a8 shown in FIG. 3, a microstrip Fine:348s formedas part ofan antenna feed ine, wherein the microstrip line 345 comprises signal line patterned on the first condoctve layer MI anda ground plane implemented by the second ground plane 116 of the core substrate 112. More- ‘over, a portion ofthe antenna feed line shown in FIG. 315, Jmplemented by a simple vertical probe 346 (as opposed 0.8 0 o 8 vertical coaxial ine) which is formed by a plurality of verti cally aligned conductive vias formed through the insulating layers M2, M3, Md and MS of the laminated layers L2, L3, 14,18, and connectod toa signal feed contact pad 152 on the active surface ofthe RFIC chip 180. The conductive layer M4 Serves asa chip ground plane. Furthermore, in the embodi- ‘meat of FIG. 3, the a portion 338 ofthe power plane formed fon conductive layer M2 can be used to route DC supply connections between the RFIC chip 1110 and an extemal circuit or application board connected tothe interface struc- ture 330, The embodinent of FIG, 3 can be implemented when the ow frequency’ components in the bottom buildup layers are properly designed fo nt affect, or be affected by, higher frequency signals that are outed on the antenna feed line orother mirostrp lines formed in the laminated layers of the interface streture 390, 'FIG.4 schematically dopics a package structure according ‘another embodiment of the invention. In particular, FIG. 4 isa side schematie view of package structure 400 compris- ing a planar core sircture 110, aa antenna structure 420 isposed on a fist (upper) side of the planar core strctare 110, an interface structure 330 disposed ona second (bottom) side of the planar core stracture 110, an antenna feed line structure (424, 140, 141,348, 346), and an integrate circuit chip 150 (eg, RFIC chip). The planar core structure 110, jerlace structure 380 and RFIC chip 150 in the package structure 400 of FIG. 4 are the same or similar structure as those components 110, 330 and 180 in the embodiment shown in FIG. 3. Assuch, adiscussion on thestructural details fof the package components 110, 830 and 150 will not be ‘pete The antenna stature 420 shown in FIG. 4 inchides a planar probe fed, coupled patch antenna structure, which ‘comprises a patch radiator element 422 patterned on a con- ductive layer M4 ofthe uppermost laminated layer L4 ofthe ‘antenna sirutire 420, and fee ine element 424 pattemed ‘ona conductive layer M2 ofthe second laminated layer 2 oF the antenna structure 420 and disposed below the pateh acia- torelement 422, The vertical pmbe 143 extending through the core subsirate 112 is connected tothe fed line element 424 by the vertical vias 140, thereby forming an L-shaped food clement that couples electromagnetic energy’ to and from the patch radiator element 422. In this embodiment, the frst suround plane 114 formed on the fist side ofthe core subsieate 112 serves as an antenna ground plane, and as. ground plane {forthe horizontal fod line element 424, wheeeby amicrostin Tine is formed by the fed line element 424 and the ground plane 114, FIG. S schematically depictsa package structure scoring to another embodiment ofthe invention. In paticular, FIG. isa side schematic view of a package structure 500 compe ing a planar core structure 510, an antenna structure 520 isposed on a frst (upper) side ofthe planar core structure '510, an interface structure $30 disposed oi. second (bottom) Side’ of the planar core structure 110, an antenna feed line structure (40, S41, 846), and an integrated circuit chip 180 (eg, REIC chip). The antenna structure $20 of FIG. 8 is Similar to the antenna structure 120 shown in FIG. 3, for example, except thatthe antenna structure 520 of FIG. $ comprises a differential probe fed stacked patch antenna structure, ‘Inpartcula, the planar antenna 122 shown in FIG. §com- rises a frst patch radiator clement 124 patterned on a con- tive layer Md of an uppermost laminated layer 4 ofthe ‘antenna structure 520, anda second patch radiator element 126 patlemedon aconductive layer M2 of second laminated layer L2 of the ates strcture $20, disposed below theUS 9,196,951 B2 9 ‘uppermost laminated layer L4. The first patch radiator ele- micnt 124 is lager in area than the second pach radiator ‘element 126, With this antenna configuration, the ground plane 114 formed on the first side ofthe core substrate 112 Serves as an antenna ground plane forthe antenna radiators 124,126. Te antenna structure $20 further comprises a plurality of ‘conductive vias 540 that form a portion of a differential antenna fed line stevcrure. The conductive vias S40 comprise {vo parallel differential lines formed in the first and second insulating layers D1, D2 of the fist and second laminated layers LA, [2, The conductive vias 840 provide a dual (i= ‘erential vertical peobo conneetion betseeea the second patch radiator 126 and a Vertical transition sinvcture S41 that is Formed in the planar core streture 510. Tn particular, the vertical transition srcture $41 comprises apluality of ground ias 582 that are formed through the core Substrate 112 connecting the fist and second ground planes 1L4and 116 on the frstand second sides ofthe cae substrate 112, The vertical tunstion siructure $41 further comprises to center vertical conductors $43 that extend through the core substrate 112 connecting to connecting to comesponding vertical vine S40, The vertical ground vias 542 comprise @ series of separate vias that are formed through the core sub- strate 112 surrounding the center vertical conductors 543, thus forming a transmission line structure that is similar (0.8 ‘coaxial transmission line, wherein the surrounding vertical ‘round vias 842 serve as an outer (shielding) conductor, and the center vertical vias $43 serves as differential center (sig- nal) conductor. The plurality of vertical ground vias $42 may be arranged ina circular pattem surrounding the center ver tical conductors £43, or other suitable patter. A insulating ‘material $44 within the vertical transition strcture S41 com- prises the core substrate 112 material The interlacestructure$30 shown ia FIG. Sissimilartothe terface structnee 330 shown in FIG. 3, except that a porion ‘ofthe antenna feed ine shown in PIG. 8 is implemented by 3 «differential vertical probe structure $46 comprising two par. alle differential signal lines that are formed by a plurality of vertically aligned conductive vias formed through the insi- lating layers M1. M2, M3, Mid and MS ofthe laminated layers 11, 12,13, L4, LS. The vertical probe strcture 546 further ‘comprise short horizontal offsets pattemed in the frst con “ductive layer MI ofthe interface secure $30 to align he wo ‘differential Lines of he vertial transition stuctire S46 ith the two differential feed lines 543 of the vertical transition structure S41 inthe planar core structure $10. The to differ ‘ential signal Fines ofthe vertical transition steueture 546 ace ‘eonncted to a signal feed contact pad 152 on the active surface ofthe RFIC chip 150, FIG. 6schematically depictsa package structure according ‘w another embodiment of the invention In panicular, FIG. 6 ‘aside schematic view ofa package siucture 600 compris- ing a planar core stricture 110, an antenna stricture 620 between the application board 840 and the RFIC chip 880. For instance, as shown in FIG. 8,some BGA connections 826 are connected to metal traces 33 that are formes ss part of the Interface structure 330 to provide DC power fom the appli cation board tote RFIC chip 850. Other BGA connections > '826,re connected to metal traces 133 thal are formed 3s part ‘of the interface structure 330 to send 1} of contol signals, between the RFIC chip 880 and the application board 860. Tn an alternative embodiment, the aplication board 860 may be formed with an opening that insertably receives the FIC chip 850, so that smaller vertical connections can be Tormed hetween the interface stricture 330 and the aplica- tion hoard! 860 In this embodiment, the backside ofthe RFIC ‘chip would not need to be ground down and thinned forthe package to be mounted tothe application board 860. More- ‘over, withthe opeaing formes in the application beard 860, a3, ‘optional heat sinkean beattached to the non-active surface of the RFIC chip 850, to provide means for dissipating heat generated hy the RFIC chip 850, Ta the illstrative embodiments discussed above with r= ‘erence to FIGS. 1-8, a planar eore structure is included inthe package stricture t provide steutural integrity in applica tions were the build-up layers of the antenta and interface structures ar relatively large in area for phase-aray antenna ‘applications where the package sicture can include a lange rmberof antennas. In other embodiments where the pack- ‘age structures are formed with one or two antennas, for ‘example, the planar core structure may not be necessary 10 provide seta integrity to the package stricture, and may be omited. For example, FIG. 9 schematically depiets package strc ture aecoring to another embodiment ofthe invention, in Which a planar core structure is no implemented for strue- ‘ural integrity. In particular, FIG. 9 sa side schematic view of ‘a package structure 900 that comprises plurality of lami nated layers L1.2,(3,14,18,16,17,[8,and 9 stackedon ‘each other, each laminated layer comprising a patterned con- ‘ductive layer fomed on an insulating layer. fist (op) portion ofthe laminated layers (ie, layersL6,L7, LBandL9) ‘comprises an antenna structure 920 that issimila instectare to the anteana structure 120 of FIG. 1. second (bottom) portion ofthe laminatod layers (i.e, L1, 2, 3, 4 and 5) ‘comprises an interface stevemre 980 tht is similar in stue= ture to the interface structure 130 of FIG. 1. “The embodiment of FIG. 9 issimsila to the embodiment of IG. 1 except that the package stntetre 900 does ot inchade the planar core structre 110 of FIG. 1, and the package o 12 structure 900 js built from the bottom layer Lp tothe top layer 9. As a final sep. an addtional conductive layer MIO is Tormed and pattemed on the insulating layer D9 of the ‘uppermost layer L9 to provide metallization for the antenna radiator 124, Inthe embodiment of FIG. 9, the pattemed condoctive layer M6 of layer L6 serves as & grovind plane (similar in function othe ground planes 114 and 116 of the planar core structure 110 of FIG. 1), and vertical transition Structure 941 connects the second radiator element 126 with the center conductor of the stripline transmission line 145 (eliminating the need for & coaxial-type transmission line Structure 14 as shown in FIG. 1), Inthe embodiment of FIG. 9, the verical transition structure 941 comprises a portion of ‘an antenna feelin formed by structures 941, 145 and 146. The remaining elements/components shown in FIG, are the structure withthe same reference numerals as shown in FIG. 1, and thus a detailed deseription thereof will ot be repeated ‘Those of ordinary skill nthe art will eadily appreciate the various advantages associated with integrated chipvantenna package structures according to embodiments ofthe inven- tion. For instance, the package structure canbe readily fabe- cated using known manuficturing and packaging techniques {o fbricate and packageantenna structures with semieonde- tor RFIC chips to form compact intewrated radio/ wireless ‘communications systems for millimeter wave and Teraher2 applications. Moreover, integrated chip packages according tw embodiments of the invention enable antennas tobe inte agrally packaged with IC chips such as transceiver chips, ‘whieh provide compact designs with very low oss between the transceiver and the antenna, Various types of antenna designs can be implemented including patch antensss, sot fntennas, slot ring antennas, dipole antennas, and cavity ‘antennas, for example, Moreover, the use ef integrated ‘antenna IC chip packages according to the present invention saves significant space, size, cost, and weight, which is a premium for viwally eny commercial or military applica: Sion, “Although embodiments have heen described herein with reference othe accompanying drawings for purposesofillus- tration, it sto be understood thatthe present invention isnot limited to those precise embodiments, and that various other changes and modifications may be affected hercin by one shilled in the act without departing from the scope of the We claim: 1A package stricture, comprising: planar core structure comprising a first side and a second side opposite theirs side, wherein the planar eorestruc~ ‘ue comprises as core substrate formed ofan insulting ‘material anantenna structure disposed on the fist side of the planar ‘core sintture, the antenna siructure comprising 2 pl rality of laminated layers, each laminated layer comps inga patterned conduetve layer formedon an insulating layer wherein the antenna structure comprises a planar antenna formed on one or more patemed conductive layers of the laminated layers ofthe antenna structure; an interface structure disposed on the second side ofthe planar core structure, wherein the interfoe structure ‘comprises a plurality of laminated layers, each lami hated layer comprising a pattemed conductive layer formed on an insulating layer, wherein the interface sinicture comprises « power plane, a ground plane, sig nal lines, and eontaet pads formed on one or mor pa temed conductive layers ofthe laminated layers ofthe interface structure; andUS 9,196,951 B2 13 ‘an antenna fee Tine stricture formed in, and routed ‘through, the interface structure and the planar corestruc- ture, and connected to the planar antenna, ‘wherein the insulating material forming the core substrate isdifferent from an insulating material forming he ins lating layers of the antenna structure and interface strc ture 2. The package structure of claim 1, wherein the planar ‘core strcture comprises an FRA substrate 3. The package strcture of claim 1, wherein a portion of the antenna feed line whieh passes through the planar core ‘ruclure comprises a vertical larson structure comprising ‘atleast one center vertical va that extends through the planae ‘ore structure and a plurality of grounded vertical vias Which ‘extend through the planar core structure and sueround the at least one center vertical va, 4 The package structure of claim I, where at least portion ‘of the antenna feed line stctire formes in the interlace Structure comprises a verial transition that passes through ‘0 or more laminated layers ofthe interface structure. '. The package structure of claim 4, wherein the vertical transition comprises a center vertical via that extends though ‘vor more laminated layers ofthe interface strate an 2 phirlity of grounded verial vias which exten through 660 ‘oF more laminated layers ofthe interface structure and sur round the eenter vera vi, 6. The package structure of claim 1, wherein at least a portion ofthe anenna feed line structure formed in the inter- Jae structure comprises a stripline transmission fine, wherein the stripline comprises a first ground plane, a second ground plane, anda signal line disposed between the fist and second round planes, wherein the signal line is formed on a frst laminated layer of the interface structure, and at least ane of the fist and second ground planes is formed on a second laminated layer of the interface structure adjacent the first Jaminated layer of the interface structure 7. The package siracture of elaim 6, wherein a eastone of the first and second ground planes ofthe stipine is @ con- ‘ductive layer formed on the second side ofthe planar core structure ‘8 The package stricture of claim 1, wherein at least 3 portion ofthe antenna feed line structure formed inthe inter= fice structure comprises @ microstrip line transmission linc, wherein the mierostip line comprises a round plane and & signal line disposed adjacent the ground plane. 9, The package structure of elaim 8, wherein the ground plane ofthe microstrip Hine isa metalic layer formed on the second side of the planar core structure 10. The packoge structure of claim 1, wherein the interface structure comprises a first transmission line and a second tronsinission line, anda ground via connecting a ist around plane and a second ground plane in te interface structure, Wherein the ground via is disposed between the frst and second transmission lines to redaeecoupling between the fst ‘and second transmission ines 11, The package structure of claim 1, wherein the planar ‘core structire futher comprises: 4 frst ground plane formed on a fist side of the core substrate; a second ground plane formed on the second side of the ‘ore substrate 4 vertical transition structure formed inthe core substrate, ‘wherein the vertical transition structure isa portion of the antenna teed line, wherein the vertical transition Simeture comprises: atleast one vertical strate; and i extending through the eore sub- 0 o 14 plurality of ground vertical vias extending through the ‘core substrate connecting te first and second ground planes on the first and second sides of the core sub= ‘rite and surrounding the atleast one vertical via, 12, The package structure of elaim 11, wherein the planar antenna comprises a probe fed stacked patch antenna stmc- ture, comprising frst radiator element patterned on a conductive layer of ‘an uppermost frst laminated layer of the antenna struc- ture a second radiator element pattemed on a conduetive ayer ‘ofa second laminated layer of the antenna stature, clisposed below the uppenost frst laminated layer. and ‘an antenna ground plane formed by the fist ground plane firmed on a first side ofthe core substrate ‘wherein the at least one vertical via extending through the ‘core substrate is connected to the second radiator ele- 12, wherein the fest radiator element is Jager in area than the second radiator clemeat. 14, The package structure of clan 12, wherein the at least ‘one vertical via extending through the core substrate com- prises a fist vertical via and a sscond vertical via forming @ ‘ferential feod line, which is connected tothe second raciae tor element. 15, The package structure of claim 11, wherein the planar antenna comprises a probe fed, coupled patch antenna stme- ‘ure, comprising ‘radiator element pattemed on 9 conductive layer of an uppermost frst laminated layer of the antenna structure: «feed line element patered on a conductive layer of 3 second laminated layer of the antenna structure, di ‘posed below the uppermost frst laminated layer and ‘an antenna ground plane formed by te fist ground plane formed on a frst sie ofthe core substrate, ‘wherein the at least one vertical via extending through the core substrate is connected to the Teed line element forming an L-shaped food element that couples elect ‘magnetic enemy to and from the fist radiator element. 16. The package structure of claim 11, wherein the planar antexna comprises an aperture coupled stacked patch antenna Sructure, comprising: first radiator element patterned on a conductive layer of ‘an uppermost frst laminated layer ofthe antenna struc- ture; 1 second radiator element pattemed on a conduetive ayer ‘ofa second laminated layer of the antenna structure, clsposed below the uppenost frst laminated layer. and anantenna ground plane formed on conductive layer of third laminated layer of te antenna structure, below the second laminated layer, the antenna ground plane com esinganapertue formed therein in aignmen withthe Second radiator element, a fle ne elomen ptere ona eondvetve lye of fourth laminated layer of the antenna steueture, disposed below the tied laminated layer and ‘wherein te at least one vertical via extending through the ‘ore substrate is connected to the Teed Tine element forming an L-shaped feed element that couples electo- magnetic energy to and from the second radiator ele= ment through the aperture of the antenna ground plane, and ‘wherein the foc line element patterned on the eondctive layer ofthe fourth laminated layer is disposed betweenUS 9,196,951 B2 15, the antenna ground plane and the fist ground plane formed on a first side ofthe core substrate, forming as stripline tcansmission line 17. The package structure of elaim 11, wherein the plan ‘antenna comprises a sot antenna stature, comprising ‘radiator element patemed om a8 conductive layer of an ‘uppermost first laminated layer ofthe antenna structure, ‘wherein the radiator element comprises slot clement formed in an antenna grownd plane; and feed line element patterned on # conductive layer of 3 second laminated layer of the antenna structure, dis- posedbelow the uppemos first laminated layerinaliga- ‘ment with the slot element; wherein the at least one vertical via extending through the core substrate is connected to the feed line element forming an L-shaped feed element that couples electro _magnetic energy to and from the raditor element, and ‘wherein the fed line clement patterned, onthe conductive layer ofthe second laminated layer is disposed between the antenna ground plane and the fist ground plane formed on a frst side ofthe core substrate, forming & teipline transmission line 18. The package structure of claim 17, futher comprising ‘conductive via element connecting an end portion of the fe line element to the radiator element adjacent the slot ‘element. 19. The package structure of claim 1, wherein the antenna strueture ad the interlace siruture are SLC (Surface laminae ruit structures. 20, Thepackage sructurofelaim , farther comprising an inogroted circuit chip having contact pads formed on an ‘ctve surfice ofthe integrated circuit chip, wherein the inte ‘arated circuit chip is mounted to the interlace layer by con necting the contact pads of the integrated circuit chip to the ‘contact pads formed on a conductive layer of an outermost Jaminated layer ofthe interface structure. "The package structure of claim 1, wherein the core substrate as thickness which i grater than a thickness of ‘cach insulating layer ofthe antenna structure and the interlace structure 22. The method of claim 1, wherein the core substrate has a thickness which is greater than a thickness of each insulat- Jing layer of the antenna structure andthe interlace structure 23. An apparatus, comprising ‘a package strucure, comprising: planar core structure comprising a fist side and a second side opposite the first side: an antenna structure disposed on the frst side ofthe ‘lana core stricture, the antenna structure compris Ing to plurality of laminated layers, each laminated layer comprising a patterned conductive layer formed ‘on an insulting laver, wherein the antenna structure ‘comprises planar antenna formed on one or more patterned conductive layers of the laminated layers of the antenna stature an interface stricture disposedon the second side of the planar core structure, Wherein the interface structure ‘comprises plurality of laminated layers, each lami nated layer comprising a patterned conductive layer formed on an insulating layer, wherein the interlace sirucure comprises a power plane, 2 round plane, signal fines, and contact pads formed on one or more patterned conductive layer of the laminated layers of the interface stactre; and fan antenn feed Tine sirvetre formed ia, ad routed ‘through, the interface structure and the planar core siveture, and connected tothe planar antennas 16 an RFIC (radio frequency integrated circuit) chip comp ing a semicoadvetor substrate having an ative surface ‘and an inactive sufice, and a BEOL (back end of line) structure formes on the active surface of the semicon 5 ductor substrate, wherein the RIC chip is mounted to the package stricture by connecting the EOL stractare ‘of the RFIC chip to contact pads ofthe interface struc- circuit board mounted to package structure by connecting ‘contact pads ofthe circuit board to contact pads of the interface stvcture 24. The apparatus of claim 28, wherein the eiruit board ‘hasan opening forming a window through which the RFIC chip is inserted. 25. The apparatus of elaim 23, wherein the planar core structure comprises: 8 core substrate formed ofan insulating material; fist ground plane formed on a first side of the core substate: a second ground plane formed on the second side ofthe ‘core substrate «vertical transition structure formed inthe core substrate ‘wherein the verical trinstion strcture portion of the ‘antenna fee line, wherein the veieal transition struc- ture comprises: at Jeat one vertical via extending through the core sub- strate; and ‘plurality of ground vertical vias extending throogh the ‘core substrate connecting te first and second ground planes on the first and second sides of the core sub= Strate and surrounding the atleast one vertical via. 26. The apparatus of claim 28, wherein the core substrate core passes an FR substrate 227, The apparatus of claim 23, wherein the antenna struc ture and the interfiee structure are SLC (surface laminar circuit) structures, 28. A method for constructing a package structure, come 4 pesing: ‘uilding an antenna structure on a fist side ofa planar core structure by stacking a plurality of diserete laminated layers on op ofeach other onthe first side ofthe planar core structure, wherein each diserete laminated layer forming the antenns stricture comprises a pattemed ‘conductive layer formed on an insulting layer wherein ‘theantenna sireture comprises planarantenna formed ‘on one of more patterned conductive layers ofthe lami nated layers ofthe antenna structure ‘ilding an interface structure on a second side of the planar core structure, opposite the firs side, by tacking 2 plurality of diserete laminated layers on top of each ‘other on the second side of the planar core structure, ‘wherein cach discret laminated layer forming the inter= face layer comprises a pattemed conductive layer formed on an insulating layer, wherein the interface sinicture comprises a power plane, ground plane, sig ‘al lines, and contact pas formed on one or more pat- temed conductive layers ofthe laminated layers ofthe imerfoe structure; and Forming anntenns fed ine structure in the packagesteuc- ture, which is routed through the interlace structure and the planar cre stricture, and connected to the planar ‘wherein the planar core stricture comprises a cote sub- Strate formed of an insulating material, and 0 oUS 9,196,951 B2 17 ‘wherein the insulating material forming the core substrate isiffrent fom an insulating material forming the insite lating ayers ofthe antenna structure and interace struc- 29, Tho method of claim 28, wherein the planar core stre= ture further comprises: ‘8 first ground plane formed on a fist side of the core substi «a second ground plane formed on the second side of the ‘ore substrate Vertical eansition structure formed inthe core subsieate, ‘wherein the vertical trusiton structure is portion of the antenna feed Tine, wheeein the vertical transition Sireture comprises at least one vertical via extending through the core sub- rate and plurality of ground vertical vias extending through the ‘core substrate connecting the fist and second ground planes on the frst and second sides ofthe eoresub- ‘rate und surrounding the at least one vertial vi 30, The method of claim 29, wherein the core substrate ‘comprises an FRS subsea 31. The method of claim 28, wherein the antenna structure ‘and the interface structure are constricted using an SLC (surface laminar eect) buildup process. ‘32, The method of elsim 28, further comprising mounting an integrated circuit chip to the interlace layer by connecting ‘contact pas of the inteprated iret chip tothe contact pads Tormed ona conductive layer of an outermost laminated layer ‘of the imerice structive, 18