Lectures on

MEMS and MICROSYSTEMS DESIGN

AND MANUFACTURE
Tai-Ran Hsu, ASME Fellow, Professor
Microsystems Design and Packaging Laboratory
Department of Mechanical and Aerospace Engineering
San Jose State University
San Jose, California, USA
E-mail: Tai-Ran.Hsu@sjsu.edu
Textbook: MEMS and Microsystems: design , manufacture, and nanoscale engineering,
2nd Edition, by Tai-Ran Hsu, John Wiley & Sons, Inc., Hoboken, New Jersey, 2008
(ISBN 978-0-470-08301-7)

CONTENT

Chapter 1 Overview of MEMS and Microsystems

Chapter 2 Working Principles of Microsystems

Chapter 3 Engineering Science for Microsystems Design and Fabrications

Chapter 4 Engineering Mechanics for Microsystems Design

Chapter 5 Thermofluid Engineering and Microsystems Design

Chapter 6 Scaling Laws in Miniaturization

Chapter 7 Materials for MEMS and Microsystems

 CONTENT Contd

Chapter 8 Microsystems Fabrication Processes

Chapter 9 Overview of Micromanufacturing

Chapter 10 Microsystems Design

Chapter 11 Assembly, Packaging, and Testing of Microsystems

Chapter 12 Introduction to Nanoscale Engineering

 Chapter 1

Overview of MEMS and Microsystems

Hsu 2008
 WHAT IS MEMS?
MEMS = MicroElectroMechanical System

Any engineering system that performs electrical and mechanical functions

with components in micrometers is a MEMS. (1 m = 1/10 of human hair)

Available MEMS products include:

Micro sensors (acoustic wave, biomedical, chemical, inertia, optical,

pressure, radiation, thermal, etc.)
Micro actuators (valves, pumps and microfluidics;
electrical and optical relays and switches;
grippers, tweezers and tongs;
linear and rotary motors, etc.)
Read/write heads in computer storage systems.
Inkjet printer heads.
Micro device components (e.g., palm-top reconnaissance aircrafts, mini
robots and toys, micro surgical and mobile telecom equipment, etc.)
 HOW SMALL ARE MEMS DEVICES?

in plain English please!

They can be of the size of a rice grain, or smaller!

Two examples:

- Inertia sensors for air bag deployment systems

in automobiles

- Microcars
Inertia Sensor for Automobile Air Bag Deployment System
Micro inertia sensor (accelerometer) in place:

Sensor-on-a-chip:
(the size of a
rice grain)

(Courtesy of Analog Devices, Inc)

 Micro Cars
(Courtesy of Denso Research Laboratories, Denso Corporation, Aichi, Japan)

Rice grains
MEMS = a pioneer technology for
Miniaturization

A leading technology for the 21st Century, and

an inevitable trend in industrial products and

systems development
 Miniaturization of Digital Computers
- A remarkable case of miniaturization!

Size: 106 down

Power: 106 up

A Lap-top Computer in 1996

The ENIAC Computer in 1946

Size: 108 down

Power: 108 up

A Palm-top Computer in 2001

This spectacular miniaturization took place in 50 years!!

MINIATURIAZATION The Principal Driving Force
for the 21st Century Industrial Technology
There has been increasing strong market demand for:

Intelligent,

Robust,

Multi-functional, and

Low-cost industrial products.

Miniaturization is the only viable solution to satisfy such

market demand
 Market Demand for Intelligent, Robusting, Smaller,
Multi-Functional Products - the evolution of cellular phones
Current State-of-the Art:
Mobil phones 10 Years Ago:

Size reduction

Palm-top Wireless PC

Transceive voice+ multi-media +

others (Video-camera, e-mails, calendar,
Transceive voice only and access to Internet, GPS and a PC with
key pad input)
The only solution is to pack many miniature function components into the device
 Miniaturization Makes Engineering Sense!!!
Small systems tend to move or stop more quickly due to low mechanical inertia.
It is thus ideal for precision movements and for rapid actuation.
Miniaturized systems encounter less thermal distortion and mechanical vibration
due to low mass.
Miniaturized devices are particularly suited for biomedical and aerospace
applications due to their minute sizes and weight.
Small systems have higher dimensional stability at high temperature due to
low thermal expansion.
Smaller size of the systems means less space requirements.
This allows the packaging of more functional components in a single device.

Less material requirements mean low cost of production and transportation.

Ready mass production in batches.

 Enabling Technologies for Miniaturization

Microsystems Technology A top-down approach

(MST)
(1 m - 1 mm)* Initiated in 1947 with the invention of
transistors, but the term Micromachining
was coined in 1982

Miniature devices
(1 nm - 1 mm)

A bottom-up approach
Inspired by Richard Feynman in 1959, with active
Nanotechnology (NT) R&D began in around 1995
(0.1 nm 0. 1 m)** There is a long way to building nano devices!

* 1 m = 10-6 m one-tenth of human hair

** 1 nm = 10-9 m span of 10 H2 atoms
 The Lucrative Revenue Prospects for
Miniaturized Industrial Products
Microsystems technology:
$43 billion - $132 billion* by Year 2005
( *High revenue projection is based on different definitions
used for MST products)

Source: NEXUS http://www.smalltimes.com/document_display.cfm?document_id=3424

 The Lucrative Revenue Prospects for
Miniaturized Industrial Products Contd

Nanotechnology:
$50 million in Year 2001
$26.5 billion in Year 2003
(if include products involving parts produced by nanotechnology)

$1 trillion by Year 2015 (US National Science Foundation)

An enormous opportunity for manufacturing industry!!

There has been colossal amount of research funding to NT by

governments of industrialized countries around the world b/c
of this enormous potential.
MEMS Products
 MEMS as a Microsensor:

Power
Supply

Micro
Input Transduction Output
Sensing
Signal Unit Signal
Element

Micro pressure sensors

MEMS as a Microactuator- motor: Power
Supply

Micro
Output Transduction
Actuating
Action Unit
Element

Micro motor produced

Rotor by a LIGA Process
Torque
Stators Transmission
Gear
Components of Microsystems

Power
Supply

Signal
Transduction &
Processing
Unit

Sensor Actuator

Microsystem
Typical Microsystems Products
Inertia Sensor for Air Bag Deployment System
(Courtesy of Analog Devices, Inc.)
Inertia Sensor for Automobile Air Bag Deployment System
Micro inertia sensor (accelerometer) in place:

Sensor-on-a-chip:
(the size of a
rice grain)

Collision

(Courtesy of Analog Devices, Inc)

 Unique Features of MEMS and Microsystems
- A great challenge to engineers

Components are in micrometers with complex geometry

using silicon, si-compounds and polymers:

25 m

A micro gear-train by
Sandia National Laboratories

25 m
 Capillary Electrophoresis (CE) Network Systems for Biomedic Analysis
A simple capillary tubular network with cross-sectional area of 20x30 m is illustrated below:

Buffer
Reservoir,B
Analyte Analyte Waste
Reservoir,A Reservoir,A
Injection Channel

Separation Channel
Plug

Waste
Reservoir,B Silicon Substrate

Work on the principle of driving capillary fluid flow by applying electric voltages at the
terminals at the reservoirs.
 Commercial MEMS and Microsystems Products

Micro Sensors: Micro Actuators:

Acoustic wave sensors Grippers, tweezers and tongs

Biomedical and biosensors Motors - linear and rotary
Chemical sensors Relays and switches
Optical sensors Valves and pumps
Pressure sensors Optical equipment (switches, lenses &
Stress sensors mirrors, shutters, phase modulators,
filters, waveguide splitters, latching &
Thermal sensors
fiber alignment mechanisms)

Microsystems = sensors + actuators

+ signal transduction:
Microfluidics, e.g. Capillary Electrophoresis (CE)
Microaccelerometers (inertia sensors)
 Intelligent Microsystems - Micromechatronics systems

Package on a single Chip

INPUT:
Desired Sensing and/or
Transduction
Measurements actuating
unit
or element Signal
functions Conditioner
& Processor
MEMS

OUTPUT:
Controller Actuator Measurements
or Actions

Signal
Processor

Comparator Measurements
 Evolution of Microfabrication

There is no machine tool with todays technology can produce any device or MEMS
component of the size in the micrometer scale (or in mm sizes).

The complex geometry of these minute MEMS components can only be produced
by various physical-chemical processes the microfabrication techniques originally
developed for producing integrated circuit (IC) components.
Significant technological development towards miniaturization was
initiated with the invention of transistors by three Nobel Laureates, W.
Schockley, J. Bardeen and W.H. Brattain of Bell Laboratories in 1947.

This crucial invention led to the development of the concept of

integrated circuits (IC) in 1955, and the production of the first IC three
years later by Jack Kilby of Texas Instruments.

ICs have made possible for miniaturization of many devices and

engineering systems in the last 50 years.

The invention of transistors is thus regarded as the beginning of

the 3rd Industrial Revolution in human civilization.
 Comparison of Microelectronics and Microsystems
Microelectronics
Primarily 2-dimensional structures
Stationary structures
Transmit electricity for specific electrical functions
IC die is protected from contacting media
Use single crystal silicon dies, silicon compounds,
ceramics and plastic materials
Fewer components to be assembled
Mature IC design methodologies
Complex patterns with high density of electrical
circuitry over substrates
Large number of electrical feed-through and leads
Industrial standards available
Mass production
Fabrication techniques are proven and well
documented
Manufacturing techniques are proven and well
documented
Packaging technology is relatively well established
Primarily involves electrical and chemical
engineering
Microsystems (silicon based)
Complex 3-dimensional structure
May involve moving components
Perform a great variety of specific biological, chemical,
electromechanical and optical functions
Delicate components are interfaced with working media
Use single crystal silicon dies and few other materials,
e.g. GaAs, quartz, polymers, ceramics and metals
Many more components to be assembled
Lack of engineering design methodology and standards
Simpler patterns over substrates with simpler electrical
circuitry
Fewer electrical feed-through and leads
No industrial standard to follow in design, material
selections, fabrication processes and packaging
Batch production, or on customer-need basis
Many microfabrication techniques are used for
production, but with no standard procedures
Distinct manufacturing techniques
Packaging technology is at the infant stage
Involves all disciplines of science and engineering
 The Multi-disciplinary Nature of Microsystems Engineering
Natural Science:
Physics & Biochemistry

Electrochemical Quantum physics

Material
Processes Solid-state physics
Science
Scaling laws

Mechanical Engineering
Machine components design
Electrical Engineering Precision machine design Materials Engineering
Power supply Mechanisms & linkages Materials for substrates
Electric systems for Thermomechanicas: & package
electrohydro- (solid & fluid mechanics, heat Materials for signal
dynamics and transfer, fracture mechanics) mapping and transduction
signal transduction Intelligent control Materials for fabrication
Electric circuit Micro process equipment processes
design design and manufacturing
Integration of MEMS Packaging and assembly design
and CMOS

Chemical Engineering
Micro fabrication Industrial Engineering
processes Process design
Thin film technology Production control
Micro assembly
 Commercialization of MEMS and Microsystems

Major commercial success:

Pressure sensors and inertia sensors (accelerometers) with

worldwide market of:

Airbag inertia sensors at 2 billion units per year.

Manifold absolute pressure sensors at 40 million units per year.
Disposable blood pressure sensors at 20 million units per year.

Recent Market Dynamics

Old MEMS New MEMS
Pressure sensors BioMEMS
Accelerometers IT MEMS for Telecommunication:
Other MEMS (OptoMEMS and RF MEMS)
 Application of MEMS and Microsystems
in
Automotive Industry

52 million vehicles produced worldwide in 1996

There will be 65 million vehicle produced in 2005

Principal areas of application of MEMS and microsystems:

Safety
Engine and power train
Comfort and convenience
Vehicle diagnostics and health monitoring
Telematics, e.g. GPS, etc.
 Principal Sensors
(7)
(4) (6)(1)
(3)

(2)
(10)
(9) (5)
(8)
(1) Manifold or Temperature manifold (6) Gasoline direct injection pressure sensor
absolute pressure sensor
(7) Fuel tank evaporative fuel pressure sensor
(2) Exhaust gas differential (8) Engine oil sensor
pressure sensor
(3) Fuel rail pressure sensor (9) Transmission sensor
(4) Barometric absolute pressure sensor (10) Tire pressure sensor
(5) Combustion sensor
Silicon Capacitive Manifold Absolute Pressure Sensor
 Application of MEMS and Microsystems
in
Aerospace Industry

Cockpit instrumentation. Sensors and actuators for safety - e.g. seat ejection
Wind tunnel instrumentation Sensors for fuel efficiency and safety
Microsattellites
Command and control systems with MEMtronics
Inertial guidance systems with microgyroscopes, accelerometers and fiber optic gyroscope.
Attitude determination and control systems with micro sun and Earth sensors.
Power systems with MEMtronic switches for active solar cell array reconfiguration, and
electric generators
Propulsion systems with micro pressure sensors, chemical sensors for leak detection, arrays
of single-shot thrustors, continuous microthrusters and pulsed microthrousters
Thermal control systems with micro heat pipes, radiators and thermal switches
Communications and radar systems with very high bandwidth, low-resistance radio-frequency
switches, micromirrors and optics for laser communications, and micro variable capacitors,
inductors and oscillators.
 Application of MEMS and Microsystems
in
Biomedical Industry
Disposable blood pressure transducers:
Lifetime 24 to 72 hours; annual production 20 million units/year, unit price $10

Catheter tip pressure sensors

Sphygmomanometers

Respirators

Lung capacity meters

Barometric correction instrumentation

Medical process monitoring

Kidney dialysis equipment

Micro bio-analytic systems: bio-chips, capillary electrophoresis, etc.

 Application of MEMS and Microsystems
in
Consumer Products

Scuba diving watches and computers

Bicycle computers

Sensors for fitness gears

Washers with water level controls

Sport shoes with automatic cushioning control

Digital tire pressure gages

Vacuum cleaning with automatic adjustment of brush beaters

Smart toys
 Application of MEMS and Microsystems
in the
Telecommunication Industry

Optical switching and fiber optic couplings

RF relays and switches

Tunable resonators
Microlenses: Microswitches:
Projected Market for OptoMEMS

Unit: $million
Micro Optical Switches

2-Dimensional

3-Dimensional
 Concluding Remarks

1. Miniaturization of machines and devices is an inevitable trend

in technological development in the new century.

2. There is a clear trend that microsystems technology will be further

scaled down to the nano level.
(1 nm = 10-3 m = 10 shoulder-to-shoulder H2 atoms).

3. Despite the fact that many microelectronics technologies can be

used to fabricate silicon-based MEMS components, microsystems
engineering requires the application of principles involving multi-
disciplines in science and engineering.

4. Team effort involving multi-discipline of science and engineering is

the key to success for any MEMS industry.
End of Chapter 1