CHAPTER-1
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Cooling Electronic components using natural convection is considerably more
challenging than forced air cooling. That is because the thermal resistance of a heat sink
may be up to 20% higher in a natural convection environment than in a high-air speed
environment. The various heat sink configurations are frequently encountered in the
natural convection cooling of electrical equipment ranging from transformers to main
frame computer and from transistors to power supply.
CHAPTER-2
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Natural convection heat transfer rate from fin arrays has been investigated for
several geometries in literature. The theoretical and experimental investigations were
performed for different geometries and configurations to find the optimum geometric
parameters for achieving maximum heat transfer rates from the finned surfaces.Numerical
studies were also done to find a convenient model for the phenomena.
CHAPTER-3
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The experimental set-upismade for making measuring on rectangular heat sinks.
The experimental set-up primarily consists ofvarious instruments for measuring the
ambient temperature, base-plate temperature and the power input for the heater. A
schematic view of the interconnections between the instruments used in the experimental
set-up is shown in Figure 3.1. Figure 3.2 shows a photograph of the experimental set-up
and the instrumentation.
CHAPTER-4
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1. A.C. power is supplied to the heater coil from mains through a stabilizer and UPS
which, in turn, is connected to an auto-transformer.
2. The voltage V and current I are set at the required values and the temperature
readings of the all the thermocouples T1, T2, T3, T4,Tamb, in, Tamb, and the
out
It is important to ensure that steady state conditions are reached before the
corresponding heat transfer coefficient values are computed. For this purpose a
temperature history curve is obtained by measuring the temperatures as function of time.
The readings of the temperatures T1, T2, T3, T4,Tamb, in,Tamb, out and Tamb, Hg are taken at regular
intervals of time till steady state is reached. The results of the measurements for a typical
case are shown in Table 4.1
The data from the Table 4.1 are processed by using the formulas given below and
Table 4.2 is prepared. It should be noted that in the formulas we consider only one half of
the heat sink geometry.
V*I
Qinput= 2 (3.1)
Q input
q = L*W (3.2)
T 1 +T 2+T 3 +T 4
Tavg = 4 (3.3)
Table 4.1 A typical Temperature History for Heat Sink-1 with S/H =0.25
Time t, V I T1 T2 T3 T4 Tamb, in Tamb, out Tamb, Hg
(s) (volts) (amps) (C) (C) (C) (C) (C) (C) (C)
0 45.1 0.14 29.9 29.9 29.9 30 29.7 29.8 32
103 45.1 0.14 30.9 31.4 31.1 31.6 29.9 29.8 32
176 45.1 0.14 31.9 32.6 32.2 32.9 30 29.9 32.5
261 45.1 0.14 32.9 33.8 33.4 34.4 30.1 30 32.5
350 45.1 0.14 33.9 35 34.7 35.7 30.3 30.1 32.5
430 45.1 0.14 34.9 36.2 36.2 37.1 30.5 30.2 32.5
522 45.1 0.14 35.9 37.3 37.4 38.4 30.6 30.3 32.5
637 45.1 0.14 36.9 38.5 38.5 40 30.7 30.5 32.5
734 45.1 0.14 37.9 39.6 39.6 41.3 31 30.6 32.5
898 45.1 0.14 38.9 40.8 40.8 43 31.2 30.8 33
1008 45.1 0.14 39.9 41.9 42.3 44.1 31.3 30.9 33
1167 45.1 0.14 40.9 43 43.8 45.5 31.5 31.2 33
1329 45.1 0.14 41.9 44.1 44.8 46.8 31.8 31.4 33
1509 45.1 0.14 42.9 45.2 46.2 48 31.9 31.5 33
1784 45.1 0.14 43.9 46.3 47.4 49.4 32.1 31.7 33
2234 45.1 0.14 44.9 47.7 49.3 51 32.4 31.9 33
2786 45.1 0.14 45.9 48.6 49.9 52.2 32.7 32.1 33
3650 45.1 0.14 46.9 49.6 50.5 53.3 33 32.6 33
4519 45.1 0.14 47.1 50 51 53.8 33.4 32.6 33
2.5
Log10Ra
Fig. 5.35 Nusselt number based on Base area plotted against Rayleigh number for both Heat
sinks with S/H = 0.25, 0.5, 1.0, 2.0 (where Y= Log10 NuX= Log10 Ra)
CHAPTER-6
In the present work the heat sink is electrically heated with heating coil attached to
it. Power input is calculated by measuring the input voltage and current. Temperature
measurement is done using thermocouples for varying heat inputs. Heat transfer
coefficient values are calculated from the measured data. This is done for the heat sink
configurations having different S/H ratios. Variation of Nusselt number with Rayleigh
number for different S/H ratios has been obtained in the form of logarithmic plots.
1. Heat transfer coefficient h (Base Area) values are the highest for S/H =0.25
configuration followed by 0.5, 1.0, and 2.0in that order. This is true for the both cases,
namely,Heat sink-1 and Heat Sink-2.
2. Heat transfer coefficient h (Total Area) values are the highest for S/H = 2.0
configuration, followed by1.0, 0.5 and 0.25 in that order. This is true for the both
cases, namely,Heat Sink-1 and Heat Sink-2.
3. From the experimental results it could be seen that the heat transfer coefficient values
are the highest in case of Heat Sink-1 when compared to Heat Sink-2.
4. Thermal Resistance values are the highest for S/H =2.0 configuration, followed by
1.0, 0.5 and 0.25 in that order. This is true for the both cases, namely,Heat Sink-1 and
Heat Sink-2.
CHAPTER-7
1. Heat sinks with fin spacings and dimensions other than those studied in thepresent
work, in particular, of different aspect ratio, can be taken up in the future work.
2. Scale down and scaled up models of present work, can be taken up in the future work.
3. Numerical modeling can be carried out.
4. CFD simulations can be carried out.
5. Geometrical similarity approach can be applied to other heat transfer problem cases.
6. Similar studies can be taken for heat sinks with non-rectangular geometries.
7. Optimization studies can be carried out to optimize fin spacing and heat sink
dimensions.
REFERENCES
[1] W. Elenbaas, The Heat Dissipation of Parallel Plates by Free Convection. Physica,
vol. DC, 110. I, January, 1942, pp. 1- 28.
[2] Nottage H. B. (1945), Efficiency of Extended Surface, Trans. of the ASME, Vol.
67, pp. 621-631.