finished so that it can alert the user that the feed is finished
then the SMS will go, then the sensor used here is the surface
1
microcontroller it sends a serial data commands and message
This device is used in poultry farms to alert the shepherd that the
feed is finished.
1 Background study
surface area where the feed is poured into for the chickens or
hens to feed from, this will receive darkness when the tray is
2
full there by telling the microcontroller that the feed bucket is
GSM protocol and dial and send SMS to the user for him/her to
take action.
This system can be used not only in cock rearing farms but
2 Statement of problem
Many times has cocks terrestrial based die due to poor feeding,
3
The aim of this project is to design and implement a GSM based
cock feed alert system use to alert farm owner about the
And also will lean how to design a basic circuit and program
of the cocks.
6 Project limitations
GSM/GRPS services even doe are wide range network services
4
battery due to car system fails which depends on the location
of the user
7 Definition of important terms
data services.
5
and steps which lead to the construction of the project.
6
CHAPTER TWO: LITERATURE REVIWE
GSM technology
GSM was introduced in the late 1980s where it was define as the
.GSM also known for the existing of 2G and 2.5G digital cellular
the 2G era offer voice and low data rates. GSM network are circuit
7
Like a GSM mobile phone, a GSM modem requires a SIM card from
8
its own unique identification which is known as International
[7].
SIM900 AT Command
9
modem, mobile phone as well as control them. Most GSM
active, when the user dills the feed cage with feeds or food for the
10
the cock feed reduces then the sensor will be activated to send
the try.
The sensor used in is the light dependent resistor, then the GSM
11
The devices is always powered by a 12 dc battery so to keep it
active, when the user dills the feed cage with feeds or food for the
the cock feed reduces then the sensor will be activated to send
12
Fig 3.1 Block diagram of the circuit
13
c. The microcontroller unit controls the entire circuit network by
This includes the stages passed for the design and construction of
this project.
1 Information Gathering
The link which enhanced my knowledge to the design and
which was gotten from the internet research I did, some from the
then others was from my teacher and supervisor etc. all this
project.
5 Design pattern
In the designation of this project, we employed different design
when fully designed. From the origin of the design, from the list of
14
the circuit symbol, the way they operate help me to have a better
the test operation for each component for clarifications and better
understanding of them.
6 Design procedure
Before the design we first of all have our design designed using
designer, eagle, livewire and proteuslite which they all gave use
7 Design processes
The procedures that lead to the complete designs of this project
15
components to fit the operation of the circuit which is dependent
off from the circuit which can cause permanent damage to the
component circuitry.
Clearing always cause before comes after soldering, as it is the
room for errors after design. This also helps to correct the network
6 Project testing
Project testing is the art of placing the design in a running mode
for test and operation analysis, this helps to show the designer
16
that how accurate his/her work is and encourage upgrading the
who gaze at it what it really is. The appearance of any design one
17
c. C1815 bipolar transistor
d. 10uf,100uf,1nf capacitor
e. Led
f. Resistors
g. Buzzer
h. GSM module (Network Provider)
i. Vero board
j. Soldering iron
k. Soldering lead
l. Connecting copper wire
industry standard MCS-51 instruction set and pin out. The on-chip
18
highly flexible and cost effective solution to many embedded
control application.
modes. The idle mode stops the CPU while allowing the RAM,
functioning. The power down mode saves the RAM contents but
freezes the oscillator disabling all other chip functions until the
Features of AT89S52
19
8Kbytes of in-system Reprogrammable flash memory - Endurance:
20
Fig 4.2 Block diagram of AT89s52 internal circuitry
Pin description
Vcc
Supply voltage.
GND
Ground.
Port 0
port, each pin can sink eight TTL inputs. When 1s are written to
21
port 0 pins, the pins can be used as high impedance inputs. Port 0
the code bytes during Flash programming, and outputs the code
Port 1
Port 1 output buffers can sink/source four TTL inputs. When 1s are
written to Port 1 pins they are pulled high by the internal pull-ups
externally being pulled low will source current (IIL) because of the
Port 2
Port 2 output buffers can sink/source four TTL inputs. When 1s are
written to Port 2 pins they are pulled high by the internal pull-ups
22
and can be used as inputs. As inputs, Port 2 pins that are
externally being pulled low will source current (IIL) because of the
Port 2 also receives the high-order address bits and some control
Port 3
Port 3 output buffers can sink/source four TTL inputs. When 1s are
written to Port 3 pins they are pulled high by the internal pull-ups
Port 3 pins that are externally being pulled low will source current
23
Alternate functions of port 3
and verification.
RST
Reset input. A high on this pin for two machine cycles while the
ALE/PROG
Address Latch Enable output pulse for latching the low byte of the
can be disabled by setting bit 0 of SFR location 8EH. With the bit
mode.
PSEN
except that two PSEN activations are skipped during each access
EA/VPP
25
internal program executions. This pin also receives the 12-volt
XTAL1
regulator
may get damaged if there is any deviation from the fixed rate.
26
The AC power supply gets converted into constant DC by this
Description:
input terminal and the output terminal of the IC regulator. For the
output filter, capacitors are used. While the bypass capacitors are
27
used to check the small period spikes on the input and output
level. Bypass capacitors are mainly of small values that are used
28
In the Diode tutorials we saw that simple diodes are made up
Ic = .Ib
29
Saturation the transistor is Fully-ON operating as a
and Ic = 0
way back in their early days of development. There are two basic
being given a name to identify it from the other two. These three
30
terminals are known and labelled as the Emitter ( E ), the Base ( B
two transistor types PNP and NPN, is exactly the same the only
31
Bipolar Transistor Construction
The construction and circuit symbols for both the PNP and NPN
bipolar transistor are given above with the arrow in the circuit
flow between the base terminal and its emitter terminal. The
32
region to the negative N-type region for both transistor types,
circuit with one terminal being common to both the input and
Current Gain.
Voltage Gain.
Voltage Gain.
33
As its name suggests, in the Common Base or grounded base
signal AND the output signal with the input signal being applied
output signal is taken from between the base and the collector
The input current flowing into the emitter is quite large as its the
34
This type of amplifier configuration is a non-inverting voltage
amplifier circuit, in that the signal voltages Vin and Vout are in-
diode.
resistance gain.
35
The common base circuit is generally only used in single stage
response.
input signal is applied between the base and the emitter, while
the output is taken from between the collector and the emitter as
junction.
36
The Common Emitter Amplifier Circuit
37
Since the electrical relationship between these three currents, Ib,
one electron will flow from the base terminal for every 100
38
Where: Ic is the current flowing into the collector terminal, Ib
gain than that of the common base configuration but its voltage
connected directly to the base, while the output is taken from the
39
high input impedance, in the region of hundreds of thousands of
series with the emitter so its current is equal to that of the emitter
current.
transistor configuration also has both the collector current and the
40
input current of the base flowing through it. Then the current gain
circuit in that the signal voltages of Vin and Vout are in-phase. It
has a voltage gain that is always less than 1 (unity). The load
base and collector currents giving a large current gain (as with
41
We can now summarize the various relationships between the
42
d. 10uf,100uf,1nf capacitor
A capacitor
(originally
known as a
Type Passive
condenser)
Invent
Ewald Georg von Kleist is a passive
ed
two-
Electronic symbol
terminal
electrical
component
43
used as parts of electrical circuits in many common electrical
44
The larger the surface area of the "plates" (conductors) and the
narrower the gap between them, the greater the capacitance is.
flow.[1]
e. Led
45
Blue, green, and red LEDs in
5 mm diffused case
Working
Electroluminescence
principle
Oleg Losev (1927)[1]
James R. Biard
Invented (1961)[2]
Nick Holonyak
(1962)[3]
First
October 1962
production
Pin
Anode and cathode
configuration
Electronic symbol
46
Parts of an LED. Although unlabeled, the flat bottom surfaces of
the anvil and post embedded inside the epoxy act as anchors, to
a light diffusing dome and E27 screw base, using a built-in power
activated.[4]
47
the energy of the photon) is determined by the energy band gap
of the semiconductor.
48
over incandescent light sources including lower energy
e. Resistors
50
A typical axial-lead resistor
Type Passive
Working
Electric resistance
principle
Electronic symbol
tape during assembly and the part is inserted into the board.
resistors.
52
analysis. Generally, the Y- transform, or matrix methods can
Power dissipation
through it. Using Ohm's law, the two other forms can be
rises excessively.
f. Debouncing button
53
it from one conductor to another. [1][2] The mechanism of a switch
Switch Debouncing
live with when playing with switches and digital circuits. If you
multiple presses.
pull-up resistor. The right hand image shows the trace at the
54
pressing the switch does not provide a clean edge. If this signal
Note that the same can also occur on the release fo a switch.
The problem is that the contacts within the switch don't make
slow, so you can recreate the trace, and the problem quite easily.
55
There are many different approaches to cleaning up switch
closed.
56
Debouncing circuit in switch open and closed states
logic 0.
logic 1.
But what about bounce conditions? If bounce occurs and there are
57
capacitor, the hysteresis of the Schmitt trigger input will stop the
when the switch is closed. Without the diode, D1, both R1 and R2
would form the capacitor charge path when the switch is open.
charge time, slowing down the circuit. So, can't you just make R1
across the supply rails, so too small a resistor value would lead to
g. Buzzer
58
Electromechanical
They were mainly used in early doorbells until they were phased
softer tone.[2]
Piezoelectric
Type of buzzers
Electromechanical
59
causing the contacts to buzz. Often these units were anchored to
made.
Mechanical
require drivers.
Piezoelectric
60
Interior of a readymade buzzer, showing a piezoelectric-disk-
central, small electrode joined with red wire in this photo), and an
Modern applications
include:
Novelty uses
Judging Panels
Educational purposes
Annunciator panels
61
Electronic metronomes
Electrical alarms
62
used to provide mobile internet connectivity, many of them can
also be used for sending and receiving SMS and MMS messages.
For the purpose of this document, the term GSM modem is used
63
GSM modems can be a quick and efficient way to get started with
not required. In most parts of the world, GSM modems are a cost
i. Vero board
The first single-size Vero board product was the forerunner of the
64
The generic terms 'Vero board' and 'strip board' are now taken to
be synonymous.
h. Soldering iron
(supplied through an
65
element. Cordless irons can be heated by combustion of gas
flame. Simple irons less commonly used than in the past were
Soldering irons are most often used for installation, repairs, and
production lines use other soldering methods. [1] Large irons may
welding.
i. Soldering lead
Lead solder
66
Sn60Pb40 solder
The greater the tin concentration, the greater the solders tensile
soldering are 60/40 Sn-Pb, which melts at 188 C (370 F),[6] and
1. has the lowest melting point (183 C or 361 F) of all the tin-
50/50. This had the advantage of making the alloy solidify more
soldering, the solder could be wiped over the joint to ensure water
appreciated, lead solder was still used until the 1980s because it
67
was thought that the amount of lead that could leach into water
from the solder was negligible from a properly soldered joint. The
by a layer of tin(II) oxide with finely dispersed tin and lead, and
Lead, and to some degree tin, as used in solder contains small but
lead.[11][12]
of current flow.
4.4 Circuit diagram of the project
69
BUZ1
U5
7805
BUZZER
1 3
Q1
VI VO
GND
BAT1
12V
2
IRF3205
R3
X1
1k D2 D1
1 2 U1 R2 LED-RED LED-GREEN
19 39
XTAL1 P0.0/AD0
38
U2 CRYSTAL P0.1/AD1 1k
37
PHONE PWR 4 C A 1 18
P0.2/AD2
36
n XTAL2 P0.3/AD3
1 35
P0.4/AD4
34
P0.5/AD5
3 2 33
2 U3 P0.6/AD6
CELL BUTTON P E K 9 32
PHONE SELECTC
4 PC817 A 1
RST P0.7/AD7
n
1 21
P2.0/A8
R1 P2.1/A9
22
2
3
U4
2 10k P2.2/A10
23 R7
SCROLL
CELL BUTTON P E K 29
PSEN P2.3/A11
24 R101k
C
4 PC817 A 1 30 25 1k
n ALE P2.4/A12
1 31 26
EA P2.5/A13
1
27
P2.6/A14
2
3 2
P2.7/A15
28 LDR3 LDR2 LDR1
CELL BUTTON P E K
R4 TORCH_LDRTORCH_LDR TORCH_LDR
PC817 R5 1 10
P1.0/T2 P3.0/RXD
R6
100R 2 11
P1.1/T2EX P3.1/TXD
100R 3 12
P1.2 P3.2/INT0
2
100R 4 13
P1.3 P3.3/INT1
5 14
P1.4 P3.4/T0
6 15
P1.5 P3.5/T1
7 16
P1.6 P3.6/WR
8 17
P1.7 P3.7/RD
AT89C52
Weak Up
70
In writing the software for this project a modular approach
was employed. This made it easier to check for errors and debug
process; the keil C51 compiler was used to translate from the
source code into the object code. The SDCC was employed to link
the program while the PACKIHX did the conversion from binary to
hex.
another.
common.
71
4.6.1 Programming language
the source code into the disk file. As noted earlier, the text editor
also functions to correct error in the program. The text editor used
#include "At89x52.h"
72
#define relay P3_7
int main(){
while (1){
P0_1 = 1;
P0_2 = 0;
P0_0 = 0;
relay = 1;
msdelay(1000);
if (P3_0 == 1) { //
alarm = 1;
P0_1 = 0;
73
P0_2 = 1;
Send_sms();
relay = 0;
P0_2 = 1;alarm = 0;
}}
design
Then after that the microcontroller will now be inserted into the
4.7 Packaging
75
and the microcontroller which but was corrected by packing the
The final test was undergone for proper function and design
usage.
76
CHAPTER FIVCE: SUMMARY
the expected result and the actual result was very close. The
5.2 recommendation
uses
d. Uses white light on the cock feed.
77
5.3 Problem encounter
During the course of the design of this system, there were series
The final packaging of the design was also another trouble, as this
components and also with the wiring. This was actually one of the
78
5.4 solutions for more improvement
5.6 Conclusion
craftsmanship.
79
REFERENCE
November 2014.
2. Farago, PS, An Introduction to Linear Network Analysis, pp.
ISBN 978-981-281-388-6.
5. Swiger Coil Systems. "Edgewound Coils". Swiger Coil
105.
80
81