2 00 7
A p p li c a t i o n N o t e N o . 0 5 0
A Power-Amplifier module at 1.9 GHz using
B F P 4 50 a n d B F P 4 9 0
S m a l l S i g n a l D i s c r et e s
Edition 2007-01-08
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
LEGAL DISCLAIMER
THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE IMPLEMENTATION
OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE REGARDED AS ANY
DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR QUALITY OF THE
INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION NOTE MUST VERIFY
ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. INFINEON TECHNOLOGIES HEREBY
DISCLAIMS ANY AND ALL WARRANTIES AND LIABILITIES OF ANY KIND (INCLUDING WITHOUT
LIMITATION WARRANTIES OF NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS OF ANY
THIRD PARTY) WITH RESPECT TO ANY AND ALL INFORMATION GIVEN IN THIS APPLICATION NOTE.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
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Application Note No. 050
Trademarks
SIEGET® is a registered trademark of Infineon Technologies AG.
+3V
D1=BAV99
R5=27 Ohm
R1=1.8k C11=10nF
C2=10nF
R2=47 Ohm R3=33 Ohm
R6=27 Ohm
C5=10nF C7=10nF C12=100pF
C3=82pF
AN050_application.vsd
Figure 1 Application
This power amplifier module operated at 1.9 GHz was realized by using microstrip lines as RFC and matching
components. It offers a very good 1 dB compression point and sufficient power for many wireless communication
systems, e.g. DECT. Further improvement is possible. Some hints are provided at follows:
• The layout size can be reduced by using chip-coils instead of the microstrip lines like TrL2 and TrL9.
• A better stabilization behaviour versus temperature and reduction of DC current gain distribution problems can
be obtained if the resistive biasing circuit of the BFP450 transistor is replaced with Infineon active bias
controller BCR400W. For further information, please refer to the application note No. 014. However Infineon
BAV99 of dual diodes and those biasing resistors are sufficient in most applications for stabilization purposes.
• Resistor R4 is for getting higher circuit-stability at low frequencies.
• The figures measured include losses of SMA-connectors and microstrip lines.
• Marking the PCB by proficient PCB manufacturer gets good plated-through holes and accurate microstrip line
dimensions.
• More output power and higher PAE is optainable by modifying the output matching circuit.
+V
Scale = 1:1
RFOut
dim.: 38mmx31.5mm
RFin
Siemens HL HF PE SIL
Scale = 1:4
BAV99 27 Ohm
47 Ohm
33 Ohm
+V
27 Ohm 10 nF
100 pF
1.8 k Ohm
10 nF 10 nF
82 pF
BFP490 100 pF
PTHs 10 Ohm
10 nF BFP450
8.2 pF RFOut
RFin
5.6 pF
2.7 pF 1 pF
2.7 pF 1 pF 3.9 pF
2.7 pF
5.6 pF
Siemens HL HF PE SIL
AN050_layout.vsd
Part List
Measured data
Small signal S-Parmeters
S21 LOG MAG. 20.000 dB/DIV S12 LOG MAG. 20.000 dB/DIV
S11 LOG MAG. 10.000 dB/DIV S22 LOG MAG. 10.000 dB/DIV
1 1
1.9 GHz
1
AN050_S-parameters.vsd
Figure 3 S-parameter
24
Pout [dBm] & Gain [dB)
P-1dB at
22
(7.8, 26.1)
20
18
16
14
Pout [dBm]
12 Gain [dB]
10
-10 -8 -6 -4 -2 0 2 4 6 8 10 12 14 16 18
Pin [dBm]
35
400
30
375
Current [mA]
PAE [%]
25
350
20
325
15
Current
300
10
Current [mA]
275 5
PAE [%]
250 0
-8 -6 -4 -2 0 2 4 6 8 10 12 14 16
Pin [dBm] AN050_Input_Power_Sweep.vsd