Anda di halaman 1dari 56

Crystal Surround Air

Track (Active Speaker


System)
Model Name HW-E350

Model Code HW-E350/XL

SERVICE MANUAL
Crystal Surround Air Track Contents
(Active Speaker System)
1. Precaution

2. Product Specification

HW-E350 3. Disassembly and Reassembly

4. Troubleshooting

5. PCB Diagram

6. Schematic Diagram

Refer to the service manual in the GSPN (see the rear cover) for more information.
Contents

Contents
1. Precaution........................................................................................................................................ 1 1
1.1. Safety Precautions ................................................................................................................... 1 1
1.2. Servicing Precautions ............................................................................................................... 1 3
1.3. Precautions for Electrostatically Sensitive Devices (ESDs) .............................................................. 1 4
2. Product Specification ......................................................................................................................... 2 1
2.1. Product Feature ....................................................................................................................... 2 1
2.2. Specifications.......................................................................................................................... 2 2
2.3. Specifications Analysis ............................................................................................................. 2 3
2.4. Accessories ............................................................................................................................ 2 5
2.4.1. Supplied Accessories ................................................................................................... 2 5
3. Disassembly and Reassembly .............................................................................................................. 3 1
3.1. Overall Disassembly and Reassembly .......................................................................................... 3 1
4. Troubleshooting ................................................................................................................................ 4 1
4.1. Checkpoints by Error Mode ....................................................................................................... 4 1
4.1.1. No Power................................................................................................................... 4 2
4.1.2. No Output .................................................................................................................. 4 3
4.2. Measures to be taken when the Protection Circuit operates............................................................... 4 8
4.2.1. Operation of Power Block Protection Circuit .................................................................... 4 8
4.2.2. Power Protection ......................................................................................................... 4 8
4.2.3. Check AMP in Power Protection .................................................................................... 4 9
4.3. Initialization & Update ............................................................................................................. 4 10
4.3.1. How to check the Firmware version ................................................................................ 4 10
4.3.2. How to initialize.......................................................................................................... 4 10
4.3.3. USB Update procedure ................................................................................................. 4 11
5. PCB Diagram ................................................................................................................................... 5 1
5.1. Wiring Diagram....................................................................................................................... 5 1
5.2. VFD PCB Top......................................................................................................................... 5 2
5.2.1. Pin Connection ........................................................................................................... 5 3
5.3. VFD PCB Bottom.................................................................................................................... 5 4
5.4. MAIN PCB Top ...................................................................................................................... 5 5
5.4.1. Pin Connection ........................................................................................................... 5 6
5.4.2. Test Point Wave Form .................................................................................................. 5 7
5.5. MAIN PCB Bottom.................................................................................................................. 5 8
5.6. HDMI PCB Top ...................................................................................................................... 5 9
5.6.1. Test Point Wave Form .................................................................................................. 5 10
5.7. HDMI PCB Bottom.................................................................................................................. 5 11
5.7.1. Pin Connection ........................................................................................................... 5 12
5.8. USB PCB Top......................................................................................................................... 5 13

i Copyright 1995-2012 SAMSUNG. All rights reserved.


Contents

5.9. USB PCB Bottom .................................................................................................................... 5 14


5.9.1. Pin Connection ........................................................................................................... 5 15
5.10. SMPS PCB Top....................................................................................................................... 5 16
5.11. SMPS PCB Bottom .................................................................................................................. 5 17
6. Schematic Diagram ........................................................................................................................... 6 1
6.1. Overall Block Diagram ............................................................................................................. 6 1
6.2. VFD...................................................................................................................................... 6 2
6.3. MAIN-1................................................................................................................................. 6 3
6.3.1. Test Point Wave Form .................................................................................................. 6 4
6.4. MAIN-2................................................................................................................................. 6 5
6.5. MAIN-3................................................................................................................................. 6 6
6.6. MAIN-4................................................................................................................................. 6 7
6.7. MAIN-5................................................................................................................................. 6 8
6.7.1. Test Point Wave Form .................................................................................................. 6 9
6.8. HDMI ................................................................................................................................... 6 10
6.8.1. Test Point Wave Form .................................................................................................. 6 11
6.9. USB ...................................................................................................................................... 6 12
6.10. SMPS .................................................................................................................................... 6 13

Copyright 1995-2012 SAMSUNG. All rights reserved. ii


1. Precaution

1. Precaution
Follow these safety instructions while servicing the ESD to prevent damage and to protect against potential hazards
such as electrical shock and X-rays.

1.1. Safety Precautions

1) When reinstalling the chassis and its assemblies, be sure to restore all of the protective devices, including the control
knobs and the compartment covers.

2) Make sure that there are no cabinet openings through which people (particularly children) can make contact with
dangerous internal components.

3) Design Alteration Warning : Never alter or add to the mechanical or electrical design of the unit.
Example : Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard. Also, any
design changes or additions will void the manufacturers warranty.

4) Leakage Current Hot Check Figure 1.1 AC Leakage Test :

WARNING

Do not use an isolation transformer during this test. Use a leakage-current tester or a metering system that complies
with American National Standards Institute (ANSI C101.1, Leakage Current for Appliances), and Underwriters
Laboratories (UL Publication UL1410, 59.7).

With the unit completely reassembled, plug the AC cord directly into a 120 V AC outlet. With the units power switched
from the ON to the OFF position, measure the current between a known ground and all exposed metal parts.
Known Grounds - Earth
Known Metal parts - Screwheads, Metal Cabinets, etc.

LEAKAGE (READING
DEVICE CURRENT SH OULD NOT BE
UNDER TES TER ABOVE 0.5m A)
TES T
TES T ALL
EXPO SED METAL
SU RFACES
2-WIRE C ORD
ALSO TES T WITH
PLUG REVER SE D
(US ING AC EARTH
ADAPTER PLUG GROUND
AS R EQ UIRED)

Figure 1.1 AC Leakage Test

1-1 Copyright 1995-2012 SAMSUNG. All rights reserved.


1. Precaution

5) Insulation Resistance Cold Check :


(1) With the units AC plug disconnected from the AC source, connect an electrical jumper across the two AC prongs.
(2) Set the power switch to ON.
(3) Measure the resistance between the shorted AC plug and any exposed metallic parts.
Example : Screwheads, Metal Cabinets, Antenna Port, etc. If any of the exposed metallic parts has a return path to
the chassis, the measured resistance should be between 1 and 5.2 megohms. If there is no return path, the measured
resistance should be infinite. If the resistance is outside these limits, a shock hazard might exist.
See Figure 1.2 Insulation Resistance Test

Ante nn a
Term ina l

Expo se d
Meta l Pa rt

oh m
Ohmme te r

Figure 1.2 Insulation Resistance Test

6) Components, parts and wiring that appear to have overheated or that are otherwise damaged should be replaced with
parts that meet the original specifications. Always determine the cause of damage or overheating, and correct any
potential hazards.

7) Observe the original lead dress, especially near the following areas :
Antenna wiring, sharp edges, and especially the AC and high voltage power supplies. Always inspect for pinched,
out-of-place, or frayed wiring. Do not change the spacing between components and the printed circuit board. Check the
AC power cord for damage. Make sure that no wires or components touch thermally hot parts.

8) Product Safety Notice :


Some electrical and mechanical parts have special safety-related characteristics which might not be obvious from visual
inspection. These safety features and the protection they give might be lost if the replacement component differs from
the originaleven if the replacement is rated for higher voltage, wattage, etc.

9) Components that are critical for safety are indicated in the circuit diagram by shading, or .
Use replacement components that have the same ratings, especially for flame resistance and dielectric strength
specifications. A replacement part that does not have the same safety characteristics as the original might create
shock, fire or other hazards.

Copyright 1995-2012 SAMSUNG. All rights reserved. 1-2


1. Precaution

1.2. Servicing Precautions

1) Servicing precautions are printed on the cabinet. Follow them.

2) Always unplug the units AC power cord from the AC power source before attempting to :
(a) Remove or reinstall any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a
test component in parallel with an electrolytic capacitor.

3) Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes used.
The internal wiring may be clamped to prevent contact with thermally hot components. Reinstall all such elements
to their original position.

4) After servicing, always check that the screws, components and wiring have been correctly reinstalled. Make sure that
the portion around the serviced part has not been damaged.

5) Check the insulation between the blades of the AC plug and accessible conductive parts (examples : metal panels,
input terminals and earphone jacks).

6) Insulation Checking Procedure :


Disconnect the power cord from the AC source. Connect an insulation resistance meter (500 V) to the blades of the
AC plug. The insulation resistance between each blade of the AC plug and accessible conductive parts (see above)
should be greater than 1 megohm.

7) Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies) unless all
solid-state heat sinks are correctly installed.

8) Always connect a test instruments ground lead to the instrument chassis ground before connecting the positive lead;
always remove the instruments ground lead last.

CAUTION

First read the Safety Precautions section of this manual. If some unforeseen circumstance creates a conflict between the
servicing and safety precautions, always follow the safety precautions.

1-3 Copyright 1995-2012 SAMSUNG. All rights reserved.


1. Precaution

1.3. Precautions for Electrostatically Sensitive Devices (ESDs)

Some semiconductor (solid state) devices are easily damaged by static electricity.
Such components are called Electrostatically Sensitive Devices (ESDs).
Examples include integrated circuits and some field-effect transistors.
The following techniques will reduce the occurrence of component damage caused by static electricity :

1) Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from your
body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to remove it
prior to applying powerthis is an electric shock precaution.)

2) After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent
accumulation of electrostatic charge.

3) Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.

4) Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.

5) Use only an anti-static solder removal device. Many solder removal devices are not rated as anti-static (these can
accumulate sufficient electrical charge to damage ESDs).

6) Do not remove a replacement ESD from its protective package until you are ready to install it.
Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam, aluminum
foil or other conductive materials.

7) Immediately before removing the protective material from the leads of a replacement ESD, touch the protective material
to the chassis or circuit assembly into which the device will be installed.

8) Minimize body motions when handling unpackaged replacement ESDs. Motions such as brushing clothes together, or
lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.

Copyright 1995-2012 SAMSUNG. All rights reserved. 1-4


2. Product Specification

2. Product Specification

2.1. Product Feature

120 W (30 W x 2 + 60 W)

2.1 Ch, Built In Subwoofer


Dolby Digital, DTS 2.0
1 Analog
HDMI OUT 1 / HDMI IN 1
Smart Volume II
Virtual Surround (Music / News / Movie / Drama / Game / Sports / Pass)
3D Sound
1 Way 1 Spk
USB HOST

2-1 Copyright 1995-2012 SAMSUNG. All rights reserved.


2. Product Specification

2.2. Specifications

Basic Specification
Power supply AC 120 V, 60 Hz

Standby power consumption 0.45 W

Power
Main unit 30 W
consumption

General Weight Main unit 4.76 Ibs

Dimensions
Main unit 28.9 x 3.35 x 3.15 inches
(W x H x D)

Operating temperature range +41 F to +95 F

Operating humidity range 10 % to 75 %

Rated output Front 30 W/CH, 8 OHM, THD = 10 %, 1 KHz


power Subwoofer 60 W/CH, 4 OHM, THD = 10 %, 100 Hz

Amplifier Input sensitivity / Impedance 570 mV / 20 Kohm

S/N Ratio (Analog Input) 75 dB

Separation (1 kHz) 65 dB

Frequency Analog Input 20 Hz ~ 20 kHz ( 3 dB)


response Digital Input / 48 kHz PCM 20 Hz ~ 20 kHz ( 3dB)

NOTE

S/N ratio, distortion, separation and usable sensitivity are based on measurement using AES (Audio Engineering Society)
guidelines.
Samsung Electronics Co., Ltd reserves the right to change the specifications without notice.
Weight and dimensions are approximate.

Copyright 1995-2012 SAMSUNG. All rights reserved. 2-2


2. Product Specification

2.3. Specifications Analysis

Model Name HW-E350 HW-D350

Photo

RMS (10% THD),


120 W 120 W
Output Power REF: 1ch

Output Power (ch) 30 W x 2 + 60 W 60 W x 2

Disc playback N/A N/A


Compatible
media iPod Dock (selected
- -
region only)

Wireless Ready - -

Extra Features USB HOST O -

Bluetooth - -

Progressive Scan
DVD (Video) - -
(NT/PAL)

Virtual Surround O O

3D SOUND O O

ASC - -
DSP
Smart Volume Smart Volume II Smart Volume II

Audio Up scale - -

Power Bass - -

Dolby Digital / Plus Dolby Digital 2.0 Dolby Digital 2.0


Audio
Dolby True HD N/A N/A
Decoding
DTS / DTS-HD (HR/MA) DTS DTS

Component Out - -

Video HDMI Out (CEC) O -

HDMI Input O -

Mini Jack Audio In AUX1 (3.5) AUX1 (3.5)


Audio In/Out
RCA Input - -

Optical Jack In (Digital In) - O (2)

Headphone Headphone Jack (3.5) - -

FM - -
Tuner
Preset Memory - -

Internal Type Internal Type


Type (Sat/Tallboy) (Main Frame Built-In Type) (Main Frame Built-In Type)
Speaker 1 way 1 spk 2 way 3 spk

Active (Powered) S/W Built In Subwoofer -

2-3 Copyright 1995-2012 SAMSUNG. All rights reserved.


2. Product Specification

TIP

O : Feature Included
X : Not Included

Copyright 1995-2012 SAMSUNG. All rights reserved. 2-4


2. Product Specification

2.4. Accessories

2.4.1. Supplied Accessories

Accessories Item Item code Remark

Remote Control AH59-02433A

Bracket-Wall Mount AH61-02952A

Ferrite Core 3301-000144

Ferrite Core 3301-001068

Local Samsung Dealer

Batteries (AAA size) 4301-000116

Audio Cable AH39-01077A

USB Cable AH39-01178A

User Manual AH68-02430K

2-5 Copyright 1995-2012 SAMSUNG. All rights reserved.


3. Disassembly and Reassembly

3. Disassembly and Reassembly

3.1. Overall Disassembly and Reassembly


CAUTION

Be careful to follow the disassembly sequence described in the manual. Otherwise, the product may be damaged.

Be sure to carefully read and understand the safety instructions before performing any work as the IC chips on
the PCB are vulnerable to static electricity.

In order to assemble reverse the order of disassembly.

Description Description Photo

1. Unfasten 13 screws on the Rear.


: BH,+,-,B,M3,L10,ZPC(BLK)

2. Remove Cover Jack, Cover HDMI.

CAUTION

Be careful not to make any scratches as you remove them.

3. Remove AC Cord.

4. Remove Cover Rear.

Copyright 1995-2012 SAMSUNG. All rights reserved. 3-1


3. Disassembly and Reassembly

Description Description Photo

5. Disconnect FPC wire and SPK wire 3ea.

6. Unfasten 1 screw on the HDMI.


: BH,+,-,B,M3,L8,ZPC(SILVER)

7. Remove HDMI PCB.

8. Unfasten 4 screws on the SMPS.


: BH,+,-,B,M3,L8,ZPC(SILVER)

9. Unfasten 4 screws on the SHIELD-PCB.


: BH,+,-,B,M3,L8,ZPC(SILVER)

10. Remove MAIN PCB.

11. Unfasten 8 screws on the COVER-FRONT.


: BH,+,-,B,M3,L10,ZPC(SILVER)
Remove HOLDER-PCB, BUTTON-PCB, ASSY SPK, ASSY
VFD.

12. Unfasten 3 screws on the Rear.


: BH,+,-,B,M3,L6,ZPC(SILVER)

13. Remove COVER-FRONT.

3-2 Copyright 1995-2012 SAMSUNG. All rights reserved.


4. Troubleshooting

4. Troubleshooting

4.1. Checkpoints by Error Mode

Oscilloscope Setting Values Normal Voltage 24 MHz 32.768 KHz

Voltage/DIV 2 V/div 0.5 V/div 0.5 V/div

TIME/DIV 100 ms/div 10 ns/div 5 us/div

Copyright 1995-2012 SAMSUNG. All rights reserved. 4-1


4. Troubleshooting

4.1.1. No Power

The po we r doe s not turn on.

Che ck if 3.4V is Che ck if 3.4V is Che ck the power c ircuit


No No No
me a su re d on the Ma in P CB mea sure d a t the Powe r PCB( SMPS) of S MPS P CB TRANS (TA901) Re place the S MP S .
PC N1 P IN 3. CN802 pin 3. ou tput.

Ye s Ye s Ye s

Main PC B P CN1 cha nge . Che ck AC cord conne ctor


a nd AC cord.

Che ck if H(3.3V) is
me a su re d a t the pin 26 of the No
Re pla ce the Micom(UIC1).
UIC1 whe n Ma in P CB
powe r is turn e d on.

Ye s

Che ck the po we r(12V)


a t the MAIN PCB.

Ye s

Cha nge Ma in P CB.

4-2 Copyright 1995-2012 SAMSUNG. All rights reserved.


4. Troubleshooting

4.1.2. No Output

No output

Check Sou nd output .

Check if 3. 3V power is No
measured at pin 94 of IC 9002 Cha nge Main P CB.
on the Main P CB.

Ye s

(1)
Check if s ignal is No No
Main to HD MI conne ction
measured at pin 2, 4 of AUX1 Cha nge HDMI P CB.
check .
on the HD MI P CB.

Re fe r to wa ve pa tter n
Ye s ima ge of Fig. 4-1 .

Che ck DS P.

(2)
Check if s ignal is No
No
me asur e d a t pin 101 ,102 of IC9002 Re pla ce IC3002. Cha nge Main P CB.
on the Main P CB.

Re fe r to wa ve pa tter n
Ye s ima ge of Fig. 4-2 .

(3)
Check if s igna l is
No No
measured at pin 69,70,71 ,74,75,76 Re pla ce AIC1. Cha nge Main P CB.
of IC900 2 on the
Main PC B.
Re fe r to wa ve pa tter n
Ye s ima ge of Fig. 4-3 .

Speaker outp ut ch e ck.

(4)
Check if s igna l is No Cha nge sp e a ke r co nne ctor No
meas ure d at pin 36,37,44,45 of AIC1 Cha nge Main P CB.
ACN1, ACN2.
on the Main P CB.

Re fe r to wa ve pa tter n
Ye s ima ge of Fig. 4-4 .

Cha nge Sp e a ke r L,R.

Copyright 1995-2012 SAMSUNG. All rights reserved. 4-3


4. Troubleshooting

GCC02-01 39R
AUX1

7 (1)
1/16W
470OHM
6 AAR1
5
4 AAR2
3
2 AAR3

100N F
1

100NF

50V
50V
AAC4 16V

16V
MLVS-0603- E08
MLVS-0603-E08

AAC5

AAC6

AAC8
(1)
AAD1

AAD2

22P F
22P F
16V

100N F 16V

100N F 16V

AABD1
0.01OHM
AAC1

AAC2

* 6. 8. HDMI
AAC3
F

(1)
HIC1
HC N1

(1)

* 5. 6. HDMI P CB Top

<Fig. 4-1>

4-4 Copyright 1995-2012 SAMSUNG. All rights reserved.


4. Troubleshooting

75OHM
R110
R111

R8014
R11

R801
16.5KO HM
1/10
USB_FAULT

10V
16V
1/ 16W
16W
1/16W
4.7KOH M
R8053

1/10 W
DGND DGND C1020 10UF
10V

100NFF
AUX_R

10UF
DGND

100N
VC3. 3V VD3. 3V

KOHM
VC_USB_3. 3V AUX_L

M
56KOHM
56 KOH
10UF
C1021 10V
DGND

USB_DM

100NF
USB_DP
AVD3. 3VS

16V
C8018
10KOHM

10V
C8019
R3105

10UF
1/16 W

C8016
R8020 392OHM

R8022
R8023
C8020
1/10 W

C8021

100NF
100NF

16V
16 V
C8017
VC3. 3V D+1. 35V
DGND
AGND R8031
100KOHM
1/ 16W

103
10 2
10 1
10 0
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104

27PF 50V
99
98
97

C8025
X8001
27MHZ

USB_DM
VD3. 3VPLL

PAD_COMP

VDAC
VS33 AADC

VD33 AADC
SYSCLK

USB_AGND
VDD

VDD

USB_VCCA
USB_DP

VD33VDAC

VS33VDAC
VDAC

VDDAADC
PAD_RSET

PAD_REF
VD33

LI NE_I N_R1
LI NE_I N_L1
LI NE_I N_R2
LI NE_I N_L2
LI NE_I N_R3
LI NE_I N_L3
DMA[ 11 ]
DMA[ 2]

DMA[ 3]

DMA[ 9]
DMA[ 8]
DMA[ 7]
DMA[ 6]

DMA[ 5]
DMA[ 4]
C8023

VS33
1 DMA[ 1] VS33PLL
96
2 95
DMA[ 0] VD33PLL
100NF 16V DGND
3 DMA[ 10 ] SPDI F_I N
94
R8005 33OHM BA1_ST 4 DRAS2_ B VD33
93
R8006 1/ 16W BA0_ST 5 92 R802 9 33OHM
33OHM
1/ 16W
6
DRAS1_ B
DCS1 _B
(2) VI D_XI
VI D_XO
91 1/16 W
33OHM 7 DCS0 _B VDD
90
R8007 1/ 16W RAS_PLL2 8 DRAS0_ B MCLK
89
R8008 33OHM CAS_PLL3 9 DCAS_B VSS/ VS33
88 R320 0
R3014 1/ 16W DWE_PLL1 10 87 10KOHM
DWE_B SR[ 05]
R8009 33OHM 11 DSCK SR[ 07]
86
33OHM 1/ 16W 12 85
1/ 16W VDD VSS/ VS33
R8010 DQM_PLL0 13 DQM
IC900 2
DAC_O6R
84
33OHM 14 ES868 0DSC 83
1/ 16W VD33 VS33ADAC AGND
1 2 15 DB[ 7] VD33ADAC
82
3 4 R80 01 16 DB[ 6] DAC_O6L
81
5 6 17 80
MGND

33OHM
1

100NF
C8024
DB[ 5] DAC_O5R

16V
7 8 1/ 16W 18 79
DB[ 4] DAC_O5L
1 2 R80 02 19 DB[ 3] DGND DAC_O4R
78
3 4 33OHM 20 77
DB[ 2] DAC_O4L
5 6 1/ 16W 21 76 AGND R321 1 330OHM
DB[ 1] DAC_O3R
7 8 22 DB[ 0] DAC_O3L
75 R321 0 330OHM
23 VDD DAC_O2R
74 R320 5 330OHM
1 2 24 DB[ 8] VS33ADAC
73 AGND
* 6. 7. MAIN-5

(2)

IC9002
(2)

* 5. 4. MAIN P CB Top

<Fig. 4-2>

Copyright 1995-2012 SAMSUNG. All rights reserved. 4-5


4. Troubleshooting

R80 220

C80 17
VC3. 3V D+1. 35V
DGND
AGND R8031
100KOHM
1/ 16W

103
102
101
100
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104

27PF 50V
99
98
97

C8025

C8027
X8001
27MHZ
VD3. 3VPLL

PAD_COMP

VS33VDAC
VS33AADC
USB_DM
USB_AGND
VDD

SYSCLK

VDD

USB_VCCA
USB_DP

VD33VDAC

VS33VDAC
VDAC

VDDAADC

VD33AADC
PAD_RSET

LIN E_IN_ R1

LIN E_IN_ R2
PAD_COMP
PAD_REF

LIN E_IN_ L1
VD33

LIN E_IN _R3


LIN E_IN _L2

LIN E_IN _L3


DMA[ 11 ]
DMA[ 2]

DMA[ 3]

DMA[ 9]
DMA[ 8]
DMA[ 7]
DMA[ 6]

DMA[ 5]
DMA[ 4]
C8023
1 DMA[1] VS33PLL
96
2 95
DMA[0] VD33PLL
100NF 16V DGND VC3. 3V
3 DMA[10 ] SPDI F_I N
94
R800 5 33OHM BA1_ST 4 DRAS2_ B VD33
93
R800 6 1/16 W BA0_ST 5 92 R8029 33OHM
DRAS1_ B VI D_XI
33OHM 6 91 1/ 16W
1/16 W DCS1_B VI D_XO
33OHM 7 DCS0_B VDD
90
R800 7 1/16 W RAS_PLL2 8 DRAS0_ B MCLK
89
R800 8 33OHM CAS_PLL3 9 DCAS_B VSS/ VS33
88 R3200
R301 4 1/16 W DWE_PLL1 10 87 10KOHM
DWE_B SR[ 05]
R800 9 33OHM 11 DSCK SR[ 07]
86
33OHM 1/16 W 12 85
1/16 W VDD VSS/ VS33
R801 0 DQM_PLL0 13 DQM
IC90 02
DAC_O6R
84
33OHM 14 ES86 80DS C 83
1/16 W VD33 VS33ADAC AGND
1 2 15 DB[ 7] VD33ADAC
82
3 4 R80 01 16 81

MGND1
DB[ 6] DAC_O6L
5 6 33OHM 17 80

100NF
C8024
DB[ 5] DAC_O5R

16V
7 8 1/16 W 18 79
DB[ 4] DAC_O5L
1 2 R80 02 19 DB[ 3] DGND DAC_O4R
78
3 4 33OHM 20 77
DB[ 2] DAC_O4L
5 6 1/16 W 21 76 AGND R3211 330OHM
DB[ 1] DAC_O3R
7 8 22
23
DB[ 0] (3) DAC_O3L
75
74
R3210 330OHM
VDD DAC_O2R
R3205 330OHM
1 2 24 DB[ 8] VS33ADAC
73 AGND
3 4 R80 03 25 DB[ 9] VD33ADAC
72
5 6 33OHM 26 DB[1 0] DAC_O2L
71 R3209 330OHM
7 8 1/16 W 27 DB[1 1] (3) DAC_O1R
70 R3207 330OHM
28 VD33 DAC_O1L
69 R3047 330OHM
1 2 29 DB[1 2] SR[ 06]
68 R3108
3 4 R80 04 30 67 LRCK_I N 33OHM
DB[1 3] SR[ 32]
5 6 33OHM 31 66 R3109
1/16 W DB[1 4] SR[ 15]
33OHM D_CO_MI
7 8 32 65
SPDI F_OUT
_OUT

DB[1 5] VSS/ VS33


SPI _CLK
RESET_B

SPI _CS2
SPI _CS3

R8030
SPI _DO
AUX[7 ]
AUX[6 ]
AUX[5 ]

AUX[3 ]

AUX[2 ]

AUX[0 ]

SPI _DI

SR[ 13 ]
SP[ 21 ]
AUX[ 4]

AUX[ 1]

SR[ 10]
SR[ 11]
SR[ 12]
HM
M
4.7 KOHM

OP[ 2]

OP[ 6]
OP[ 7]
SPDIF
OP[ 0]
OP[ 1]

OP[ 3]
OP[ 4]
OP[ 5]
4.7 KOHM
4.7 KOHM
4.7 KOHM

VD33

VD33
KOH

VDD 4. 7KOHM
VDD

VDD
4.7 KO

DGND
58
59
60
61
62
63
64
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57

VC3. 3V
R8011

R8050
R8051
R8012
R8013

C8026
R8018
18

R8019
19
4. 7KOHM

BCK_I N
33 OHM
1/ 16W

1/ 16W
33 OHM
R80

R80
SPI _CS3

* 6. 7. MAIN-5

(3)

(3)

(3)

IC9002

* 5. 4. MAIN P CB Top

<Fig. 4-3>

4-6 Copyright 1995-2012 SAMSUNG. All rights reserved.


4. Troubleshooting

AC26
C1012

25V
AC2
10UF
C101
C1007

100NF
4.7UF
10V

50V
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
47KOHM
R1003
R1001

1/10 W
100OHM 1/16 W

GVDD_A

GND_A
GVDD_B
GND
GND

OUT_AA
OUT_A
VDD
PSU_RE F

PVDD_A
PVDD_A
NC
NC
NC
NC

BST_A
DGND

OUT_
R1002
30KOHM 1/10 W 1 48 DGN
OC_ADJ GND_A
100P F 50V 2 47

AC14

AC15
/RESE T GND_B
3 46

25V
4.7NF

25V
50V

10UF
10UF
C_S TARTUP GND_B
4 INPUT_A OUT_B
45
5 INPUT_B
(4) OUT_B
44
1NF 50V 6 VI_CM PVDD_B
43 50V 50V
7 42 100NF 100NF
8
GND
AIC1
PVDD_B
41 C1014 C1024
AGND BST_B
100N F 50V 9 TAS5612PHD 40
VREG BST_C
10
11
INPUT_C FL/FR PVDD_C
39
38
C1015
100NF
C1025
100NF
INPUT_D PVDD_C
12 37 50V 50V
TES T OUT_C
47KOHM 1/10W 13 (4) 36

AC10
NC OUT_C

AC11
14 35

10UF

10UF
25V

25V
NC GND_C
100OHM 1/16W 15 /SD GND_C
34
100OHM 1/16W 16 /OTW1 GND_D
33
GVDD_D
GVDD_C

PVDD_D
PVDD_D
READY

GND_D
OUT_D
OUT_D
BST_D
/OTW2
/CLIP

GND
GND
M1
M2
M3
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32

100OHM 1/16W
AC5
AC5
10UF
C1013

25V
C1013
4.7KOHM

50V
50V

100N F
AR8

50V

* 6. 3. MAIN-1
3

(4)

CN2 0 1

(4)

AI C 1 (4)

* 5. 4. MAIN P CB Top

<Fig. 4-4>

Copyright 1995-2012 SAMSUNG. All rights reserved. 4-7


4. Troubleshooting

4.2. Measures to be taken when the Protection Circuit operates

4.2.1. Operation of Power Block Protection Circuit

Protection Circuit operates when power problem occurs in the SMPS.


Protection Circuit Operation
Part Location Pin No. Remark
Open Short
SMPS PS+3.6V(3)
PCN1 PVDD+23V

(9, 10, 11, 12)

4.2.2. Power Protection

The Condition of Power Protection Active.

1) Voltage of SMPS's PVDD(+23V) is higher than standards.


Normal Condition Voltage Range : PVDD(+23V) : about +23V

2) Over-current occurs to FET. (Over-output or Output short)

3) FETs temperature exceed 150C.

4) No supply voltage on GATE DRIVER.

4-8 Copyright 1995-2012 SAMSUNG. All rights reserved.


4. Troubleshooting

4.2.3. Check AMP in Power Protection

If you think, there are problems at the AMP PCB, you can check the PCB without disassembling the set.

CAUTION

Do not connect the power cord during the test!

Resistance using Tester


F/R CH 10k

In case of large difference with above value AMP PCB has a problem

SET CHAS S IS

SPEA KER OUTPU T

GND

Copyright 1995-2012 SAMSUNG. All rights reserved. 4-9


4. Troubleshooting

4.3. Initialization & Update

4.3.1. How to check the Firmware version

1) Turn the power off.

2) Press the DRC button on the remote control.

3) After 5 seconds, the version will be displayed on the VFD

4.3.2. How to initialize

Using the remote control

1) Turn power off.

2) Press the "MUTE" vutton on the remote control for 5 seconds.

3) "ID SET" will be displayer on the VFD.

4-10 Copyright 1995-2012 SAMSUNG. All rights reserved.


4. Troubleshooting

4.3.3. USB Update procedure

1) Step 1 : Power on the device. You can see the following VFD display.

VFD HELLO DIGI.1

2) Step 2 : Prepare the USB disk with update files then plug-in to the USB port. You can see the following VFD display.

UPD ATE OK

3) Step 3 : Progressing update.


In case Micom, Touch key, DSP, HDMI (only HW-D550) and Wireless update, you can see the following VFD display.
Ca s e 1 : Mico m Upda te .

M 0% M 100% OK

Ca s e 2 : Touch Key Upda te .

T 0% T 100% OK

Ca s e 3 : DS P Upda te .

D 0% D 100 % OK

Ca s e 4 : Wire le ss Upda te .(The So und Ba r)

W 0% W 100 % OK

Ca s e 5 : HDMI Upda te .

H 0% H 100 % OK

Copyright 1995-2012 SAMSUNG. All rights reserved. 4-11


5. PCB Diagram

5. PCB Diagram

5.1. Wiring Diagram

USB VFD ASS 'Y

1 2 3 4 5 6 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
CN20 1
1 2 3 4 5 6 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
U_5 V
USB_COM _DM
USB_COM _DP
DGND
SW_ ADC
DGND

DGND
DGND
REM_DATA
ECO
DGND
M+3.3V
D+3.3V
DGND
VFD_RS T
VFD_CE
VFD_CLK
VFD_DATA
VFD+12V
VFD+12V
VFD+12V
DGND 1 1
DGND 2 2
CN3002 PS +3.4V 3 3
PO WER _VR 4 4
DGND 5 5
DGND 6 6
DGND 7 7
DGND 8 8
MAIN ASS Y PVDD+23 9 9 SMPS ASS Y
PVDD+23 10 10
PVDD+23 11 11
PVDD+23 12 12

PC N1
EP 92A2_RS T

CE C_ MICO M

AUX_S ENS
MAIN_S DA

MAIN_S CL
TV_DATA
TV_LRCK

H_S P DIF
TV_BCK
I2C_INT

M+3.3V
D+5.3V
D+5.3V

HP D_A

AUX_R
AUX_L
DGND

DGND

DGND

DGND
AGND

AGND

-
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
CN50 01
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23

HDMIASS Y

5-1 Copyright 1995-2012 SAMSUNG. All rights reserved.


5. PCB Diagram

5.2. VFD PCB Top

(1)

FCN1
Copyright 1995-2012 SAMSUNG. All rights reserved. 5-2
5. PCB Diagram

5.2.1. Pin Connection

1) FCN1
VFD CONTROL

Pin No. Signal

1 DGND

2 DGND

3 REM_DATA

4 ECO

5 DGND

6 M+3.3V

7 D3.3V

8 D

9 VFD_RST

10 VFD_CE

11 VFD_CLK

12 VFD_DATA

13 D+12V

14 D+12V

15 D+12V

5-3 Copyright 1995-2012 SAMSUNG. All rights reserved.


5. PCB Diagram

5.3. VFD PCB Bottom

Copyright 1995-2012 SAMSUNG. All rights reserved. 5-4


5. PCB Diagram

5.4. MAIN PCB Top

CN 3 0 0 4
(1)

IC8003
CN201
(2)
AC N 2
C N 1 02
IC8 0 0 4
TP3
AIC 1

CN 30 02
IC 9 0 0 6
TP2

IC 3 0 02
AC N 1 IC 9 0 0 2
PCN 1

(3) IC 5 0 0 1
(4)
AIC 2
AC N 3

PI C2
(5) CN5 0 0 1 (6)
PI C7
IC 3001

5-5 Copyright 1995-2012 SAMSUNG. All rights reserved.


5. PCB Diagram

5.4.1. Pin Connection

1) CN201 3) PCN1 6) CN5001


VFD CONTROL POWER SIGNAL CONNECTOR HDMI CONTROL

Pin No. Signal Pin No. Signal Pin No. Signal

1 OPEN 1 DGND 1 D+5.3V

2 OPEN 2 DGND 2 D+5.3V

3 OPEN 3 PS+3.4V 3 TV_LRCK

4 VP-27V 4 POWER_VR 4 EP92A2_RST

5 -VFD-21V 5 DGND 5 TV_DATA

6 -VFD-18V 6 DGND 6 HPD_A

7 DGND 7 DGND 7 TV_BCK

8 VFD_RST 8 DGND 8 I2C_INT

9 VFD_CE 9 PVDD+23V 9 H_SPDIF

10 VFD_CLK 10 PVDD+23V 10 MAIN_SDA

11 VFD_DATA 11 PVDD+23V 11 CEC_MICOM

12 DGND 12 PVDD+23V 12 MAIN_SCL

13 DGND 13 DGND
4) ACN1
14 M_+3.3V 14 AUX_L
FRONT R-CH OUTPUT
15 M_+3.3V 15 AUX_SENS
Pin No. Signal
16 DGND
2) ACN2 1 FR-
17 DGND
FRONT L-CH OUTPUT 2
18 AUX_R
Pin No. Signal 3 FR+
19 DGND
1 FL-
20 DGND
5) ACN3
2 FL+
SUBWOOFER OUTPUT 21 DGND

Pin No. Signal 22

1 SW+ 23 DGND

2 SW-

Copyright 1995-2012 SAMSUNG. All rights reserved. 5-6


5. PCB Diagram

5.4.2. Test Point Wave Form

TP2

TP3

5-7 Copyright 1995-2012 SAMSUNG. All rights reserved.


5. PCB Diagram

5.5. MAIN PCB Bottom

IC 8 0 0 1

IC800 2
IC3003

Copyright 1995-2012 SAMSUNG. All rights reserved. 5-8


5. PCB Diagram

5.6. HDMI PCB Top

HCN2

H IC 1
HCN1

HC N7
TP1

5-9 Copyright 1995-2012 SAMSUNG. All rights reserved.


5. PCB Diagram

5.6.1. Test Point Wave Form

TP1

Copyright 1995-2012 SAMSUNG. All rights reserved. 5-10


5. PCB Diagram

5.7. HDMI PCB Bottom

(1)
HCN3
IC1 001

5-11 Copyright 1995-2012 SAMSUNG. All rights reserved.


5. PCB Diagram

5.7.1. Pin Connection

1) HCN3
HDMI CONTROL

Pin No. Signal

1 H5.3V

2 H5.3V

3 TV_LRCK_H

4 EP92A2_RST_H

5 TV_DATA_H

6 HPD_A_H

7 TV_BCK_H

8 I2C_INT_H

9 H_SPDIF_H

10 MAIN_SDA_H

11 CEC_MICOM_H

12 MAIN_SCL_H

13 HDGND

14 AUX_L_H

15 AUX_SENS_H

16 HAGND

17 HDGND

18 AUX_R_H

19 HDGND

20 HAGND

21 HDGND

22 OPTICAL_0_H

23 HM3.3V

Copyright 1995-2012 SAMSUNG. All rights reserved. 5-12


5. PCB Diagram

5.8. USB PCB Top

5-13 Copyright 1995-2012 SAMSUNG. All rights reserved.


5. PCB Diagram

5.9. USB PCB Bottom

SCN1
(1)

Copyright 1995-2012 SAMSUNG. All rights reserved. 5-14


5. PCB Diagram

5.9.1. Pin Connection

1) SCN1
USB CONTROL

Pin No. Signal

1 USB_5V

2 USB_DM

3 USB_DP

4 DGND

5 SW_ADC

6 DGND

5-15 Copyright 1995-2012 SAMSUNG. All rights reserved.


5. PCB Diagram

5.10. SMPS PCB Top

DANGER High Volta ge


12P IN

Copyright 1995-2012 SAMSUNG. All rights reserved. 5-16


5. PCB Diagram

5.11. SMPS PCB Bottom

5-17 Copyright 1995-2012 SAMSUNG. All rights reserved.


6. Schematic Diagram

6. Schematic Diagram

6.1. Overall Block Diagram

Main System uses Digital Signal Processor which is ESS Crescendo2+ (ESCD8680).
Serial
DRAM
Fla s h The Crescendo2+ include DIR, ADC, DAC, PWM IC.
All displays is registered by VFD.
Serial Interface between I2S is operated with various protocol over the whole system.
Le ft
DSP (ESD8680) implement DSP Audio Decoding function by 12s.
Analog 2 ch TAS 5612AP
BTL 30W + 30W(8 )
Power, proper for each part, will be generated by SMPS.
Ana log Inp ut

USB HO S T Right Power On/Off by Micom port is possible.


USB Function and sound field can be controlled by remote controller and keys.
Cr ec e n d o II +

TAS 5612AP
HDMI repeater IC includes internal HDMI Micom.
BTL 60W(4 ) S ub Woofe r

4 Line Co m
VFD
DIS P LAY
SPDIF(ARC )
Main Mic o m
SPDIF(L ega cy) SPDIF(For TV) Re m o c o n
IR
I2 C CEC
HDMI IN1 Fu n c tio n TACT
HDMI Repeater CEC in c lu d e d Ke y

Int ern a l
HDMI
Micom
HDMI OUT
S MP S (23V 6A)

Copyright 1995-2012 SAMSUNG. All rights reserved. 6-1


6. Schematic Diagram

6.2. VFD

POWER
D+12V

100N F 50V 6-BD-02INK

FC30
FC22

25V
10UF
MGND2

/RESET
FVFD1

IC(1G)

IC(2G)

IC(3G)

IC(4G)

IC(5G)

IC(6G)
IC(6G)

LGND
PGND
15

VDD
TSA
TSB

OSC
VFD+

/CS
DA

VH
D+12V

CP

F+
F+
F-
F-
14
13
12 DGND

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
VFD_DATA VFD_DATA
VFD_CLK 11
VFD_CLK VFD+
VFD_CE 10

100N F 50V
VFD_CE M+3.3V D3.3V

100N F 50V
VFD_RST 9 VFD_RST
8

FC19
FC17
D3.3V
7
6 DGND
M+3.3V
5 DGND
4 VFD- VFD-
100N F

100N F
FC24
FC23

ECO ECO
3 D3.3V_1
16V

16V
REM_DATA FC7 FC8
2 REM_DATA 100NF 100NF
DGND2 VP+_1
1 50V 50V
VP+
MGND1 OS C

FR8 33KOHM
FCN1 DGND DGND
DGND DGND VP+

100N F 50V
05002H R-H15J05 FR9 FR10
D3.3V 10O HM 10O
10OHM
HM
DGND VFD TRANS VFD SPEC FC20
100NF

FC18
FBD2 50V
EF : 4.2V EF : 2.15V, 123MA 0.01O HM FC16
100NF
VP : 30 .5V VP : 23 V,10MA 50V
CB2012UA300T
ECO

VFD_DATA FR4
100OHM
VFD_DATA_1
VFD_C LK FR5 DGND
100OHM
VFD_CLK_1
D+12V FR6
VFD_CE 100OHM
VFD_CE_1
CB2012 UA300T VFD_RST FR7 VFD_RS T_1

50V
100OHM
FD3 1/10W
FC14 FC15
FC9 FC13
FBD1
0.01OHM

FR1 B260A-13- F R1001 47OHM VFD+ 68P F 100NF 10UF 100NF


3.9KO HM 50V 16V 10V 16V
1SR1 54-400T E25

R1002 47OHM
FC4

FC1 1
FC4
FR2 FD4 6.3V
47UF
C

68P F
FC1
400V

R1003 47OHM FVD2


FD1

B
1NF
50V E
10KO HM B260A-13- F MLVS-0603-E08 11
11
FQ1
1/10W
5 6
KTC437 8 FC10 FC12
FR15 4 7
FC2 8

68P F 100NF
FC28

VFD-
6.3V

DGND
47U F
47UF

1OHM 1/8W 3 8 50V 16V

10OHM
FR16 2 9 FR13
1SR1 54-400T E25

FC3
100NF 1OHM 1/4W 1 10 1/10W DGND

Z02W2.4V-X
E
DGND 50V
FC2
400V
FD2

B FD5
1NF C
FQ2 FT1 1SR154-400TE25
FC37

50V 400V
10UF

AH26-0 0389B

FR12
FZD1

KTC437 8 100OHM 1/4W


25V

2.28

2.4V
1KOHM
FC27
FC27
25V
10UF

1/10W

DGND
FC299
25VV
10UF
FC2
25

DGND
R1004
FC5

1.5KO HM VP+
25V
10UF

SDZ24VG 10OHM
FR14

24 1/10W

R1005
33KOHM
FR3

1.5KO HM
FC6

FZD2
10UF

FD6
25V

M+3.3V
FEYE1 1SR154-400TE25
400V
346HF12A DGND
DGND
REM_DATA 1
OUT
MGND1
FR11
2
VCC
47OHM MGND2
3
MLVS-0603-E08
FVD1

1/10W
FC26

GND
10UF

FC25
11

10V

100NF
16V

DGND

6-2 Copyright 1995-2012 SAMSUNG. All rights reserved.


ESS _FL+
ESS _FL-

ESS _FR -
ESS _FR +
6.3. MAIN-1

AUDIO

SD_PO WER
OTW
POWER

RST_POW ER
DGND
GVDD+12V

AR4

AR6
AR5

AR7
0.01OH M
ABD1
CB2012 UA300T

AC22 C1005

C1004
C1003
C1002
C1001
10UF 10UF

GVDD+12V

Copyright 1995-2012 SAMSUNG. All rights reserved.


10V 10V

R1001

R1002

1NF
30KO HM 1/10W
100OHM 1/16W

100NF
4.7N F
100P F

50V

100OHM 1/16W
100OHM 1/16W
AC24 AC23

100OHM 1/16W
47KO HM 1/10W
10UF 10UF

50V
50V
10V 10V

50V

ABD2

0.01OH M
AMP_READY

CB2012 UA300T
R1003
47KOHM
1/10W

16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
C1006

NC
NC

/SD
C1007 100NF

GND

TES T
VREG
AGND

/OTW1
VI_CM
50V
/RESE T
OC_ADJ

4.7UF

INPUT_C
INPUT_B

INPUT_D
INPUT_A
AR8 17 64 10V
C_STARTUP

4.7KOHM /OTW2 VDD


18 63
/CLIP PS U_REF
19 62

DGND
READY NC
20 61

1/10W
M1 NC

1/10W
3.3OHM
R1004
21 60 C1008

3.3OHM
R1005
M2 NC
1/10W

1/10W

22 59 100NF

DGND
R1006
3.3OHM

R1007
3.3OHM

M3 NC 50V
C1009 100NF 50V 23 58
AIC1

GND GND
C1011 100NF 50V 24 57
GND GND
25 56
GVDD_C GVDD_B
FL/FR
TAS5612PHD

26 55 C1010 100NF
GVDD_D GVDD_A 50V
27 54
1 1 BST_D BST_A
28 53
2 OUT_D OUT_A
TP3
2 C10233
C102 C1013 29 52 C1012 C1022
OUT_D OUT_A

X1001
100NF 100NF 30 51 100NF 100NF
50V 50V PVDD_D PVDD_A
1 31 50 50V 50V
1 PVDD_D PVDD_A
2 2
32 49
GND_D GND_A

X1002
AC9 AC5
AC5 AC26 AC25

DGND
UNDEF INED
10UF 10UF 10UF 10UF
BST_C
BST_B

OUT_C
OUT_C
OUT_B
OUT_B

SMR-TS-4- 3.5-3
25V 25V 25V
PVDD_C
PVDD_C
PVDD_B
PVDD_B

GND_C
GND_C
GND_B
GND_B

GND_D
GND_A

25V
33
34
35
36
38
39
37
40
41
42
43
44
45
46
47
48

UNDEF INED
DGND
DGND

AC10
10UF
25V AC14
10UF
50V

50V
100NF
100NF

25V
C1015
C1014

AC11 AC15
50V

10UF
50V
100NF

10UF
100NF

25V
C1024

C1025

25V
PVDD+23V

DGND
DGND

R1011 AC30 AC29 R1008 R1010 AC28 AC27 R1009


18OHM 330PF 330PF 18OHM 18OHM 330PF 330PF 18OHM
50V 50V 1/10W 1/10W 50V 50V 1/10W
1/10W
8.2UH

8.2UH
8.2UH

L1001

L1002
L1004

L1003
8.2UH

AC34 DGND AC33


1UF 1UF AC32 DGND AC31
50V 50V 1UF 50V 1UF 50V

AC40 AC39 AC38 AC37


100NF 100NF 100NF
50V 50V 100NF 50V
50V
DGND

AC49
PVDD+23V

220UF
35V AR20 C1019 C1018 R1013 R1012 C1017 C1016 AR17
3.3OHM 10NF 10NF 3.3OHM 3.3OHM 10NF 10NF 3.3OHM
1/10W 100V 100V 1/10W 1/10W 100V 100V 1/10W
AC50
220UF
35V
AC44 AC43 AC42 AC41
2.2NF 50V 2.2NF 50V 2.2NF 50V
AC51 2.2NF 50V
220UF AC46
35V 10NF 50V AC45
10NF 50V
DGND

AC52 AC48 AC47


220UF 10NF 10NF
35V 50V 50V
DGND
FR+

FR+

FL+
FR-

FL+ FL-
FR-

FL-
1
2
3

1
2
MGND1

ACN2
MGND2
ACN1

SMW200-02P
SMW200-H03G
6-3
6. Schematic Diagram
6. Schematic Diagram

6.3.1. Test Point Wave Form

TP3

6-4 Copyright 1995-2012 SAMSUNG. All rights reserved.


6. Schematic Diagram

6.4. MAIN-2

POWER
AUDIO

CB2012 UA300T
GVDD+12V 0.01OH M AR22
3.3OHM
ABD3 1/10W
PVDD+23V

AR33
3.3OHM

AC76
AC63
10UF

10UF
10V
1/10W AL3

10V

AC88
50V
100NF
8.2UH

50V

18OHM
100NF

AR31

1/10W
AC58

AC81
100NF
AC71

AC84
100NF
50V

AC64
50V
10UF
10UF

10UF
10V

10V

25V
100NF
AC78
C2001
DGND

50V

AC35
AC66

330PF
50V

1UF
50V

AC69

3.3OHM
AR25
100NF
AC68

50V

1/10W
10UF
4.7UF

25V
AC55
64 10V

50V

50V
SSW+
W+ SSW-
W-

AC70

AC75 10NF

10NF
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
AR21 100OHM

2.2NF
50V
RST_POW ER 47KOHM

AC74

10NF
100V
1/16W
1/10W

AC82
AR28

GVDD_A
GVDD_B

GND_A
PVDD_A
PVDD_A
GND
GND
DGND

OUT_A
OUT_A
PS U_REF
VDD

BST_A
NC
NC
NC
NC

DGND
DGND
1/10W SW+ SW-
AR30 1 48 DGND
30KO HM OC_ADJ GND_A

AC80

AC77

AC61
10NF
100V
AC36
2 47

330PF
AC57 100P F 50V

2.2NF
50V

50V
ACN3

1UF
50V
AC79

AC59
/RESE T GND_B
AC65 4.7N F 50V 3 46

10UF

10UF
25V
25V

AC73
C_STARTUP GND_B

100NF
4 45

50V
ESS _SW + INPUT_A OUT_B

YW396-02V
5 44 2

3.3OHM
INPUT_B OUT_B
ESS _SW - 6 43

1/10W
AC60 11NF
NF 550V
0V

AR32
VI_CM PVDD_B 50V 50V 1
7 42 100NF 100NF

18OHM
GND PVDD_B AC62 AC89

AR27

1/10W
8 AGND
AIC2 BST_B
41
AC72 100NF 50V 9 TAS5612PHD 40 AL4
VREG BST_C
10
11
INPUT_C SW PVDD_C
39
38 8.2UH
INPUT_D PVDD_C
12 TES T OUT_C
37
AR24 47KO HM 1/10W 13 NC OUT_C
36
14 NC GND_C
35
SD_PO WER AR23 100OHM 1/16W 15 /SD GND_C
34
OTW AR26 100OHM 1/16W 16 /OTW1 GND_D
33
GVDD_D
GVDD_C

PVDD_D
PVDD_D
READY

GND_D
OUT_D
OUT_D
BST_D
/OTW2
/CLIP

GND
GND
M1
M2
M3
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32

AR29 100OHM
1/16W
50V
50V
4.7KOHM
AR34

100NF
100NF

DGND

DGND
AC19
AC20

AMP_READY
GVDD+12V CB2012 UA300T
0.01OH M
3.3OHM
ABD4 1/10W
AR37
AR38
3.3OHM
1/10W

Copyright 1995-2012 SAMSUNG. All rights reserved. 6-5


6. Schematic Diagram

6.5. MAIN-3
PS+ 3.4V M+3.3V D+3.3V
CB2012UA 300T CB2012UA300T
D+5.3V 0.01OHM
0.01O HM BD3007
POWER BD3001
R3008 IC3002
PCN1 10KOHM 1/16W AP1117EGZ-13-89
D+5.3V CB2012UA300T
A+3.3V
0.01OHM
12 R3007 R3009 BD3003 BD3008
PVDD+23V 1 OUT 3
11 D+12V IN OUT

100NF
10 56KOHM 10OHM

47UF

47UF
MGND1

47UF
1.2KOHM

6.3V

6.3V
0.01OHM

6.3V
R3012

16V
L3002

R3017
ADJ

1OHM
9 CB2012UA300T

C3016
100NF
8 PIC2

25032 HS-12A00

16V
7 1 PGND NC
8 4.7UH
6 2 7

C3018

C3022

C3023
VIN SS
5

2KOHM
R3013
3 6

C3020
LX

C3014
10UF
AGND EN
4

10V
4 5

10KOHM
MGND1
POWER_VR

1100NF VF
FB COMP

5FV
5FV
1 0225V
0225V
0550V
3

00N
10UF
110UF

100NF 50V
U
U

1/16 W
47KOHM

0V
R3010

1 0 UF 110V
PS+ 3.4V

10UF 10V
10UF 10V
2 AOZ1051P I

1/10 W
1

10KOHM

10UF
1NF
50V
DGND

OVER VOLTAGE PROT ECTION

C3008
R3006

2.2NF
C3007
C3006
TP3001

TP3003

50V
TP3002

R3011
PC20
C3011
C3012
C3013
TP3004
IC3003 A+1.35 V

C3009
C3010
DGND AP1117EGZ-13-89
GVDD+12V

BD3005 BD3010

D+5.3V
AS CLOS E AS POSSIBLE 1 IN
OUT
OUT
3
MGND1

47UF

47UF
0.01OHM 0.01OHM

6.3V
6.3V
R3018
ADJ
CB2012UA300T

1KOHM
R3015
PVDD+23V DDC+23V DGND CB2012UA300T

1OHM
2
OPEN

C3017
100NF
UDZS16B-TE-17

16V
BD3012 M+3.3V

UDZ6.8B-T E-17

C3019

C3021
GVDD+12V VFD+12 V

C3015
100OHM

10UF
R3016
0.01OH M

10V
CB2012 UA300T GVDD+12V BD3000
MGND1

Q3004 ZXMP6A17G
ZD302

0.01OHM
ZD303
16

D+12V
6.8

L3001 CB2012UA300T
D

R3032 R3036 10UH BD3002


12KO HM 1KOHM AGND
G

C3004

10UF

10UF
10UF
SDB30A40 -PF

10UF

25V

25V
220OHM

0.01OHM

25V

25V
100NF
220OHM

50V
12KOHM

R3034

1/16W 1/16W TPS54331D CB2012UA300T


R3037

DDC+23V 50V

40

C3005
R3033

R3003
10KOHM
1/16W

PC7

PC8

PC9

PC11
IC3001
1/16W

NC7SZ 32P 5X_NL


1/16W

10KOHM

D3001
M+3.3V IC3004 1 8 PR33

100NF
BOOT 1/16W
PH
5 1 2 7

10UF

10UF
25V
25V
VIN
10KOHM

D+1.35V
VCC A
100NF
GND PR32 PR34
2 3 6
R3031

PC3
PC2

PC3
B EN COMP
4 3 4 5
1/16W

50V

PC6
C3001

Y GND SS VSENSE
3KOHM 3.9KOHM

698OHM
R3004
222PF
2 P F 550V
0V PL3 BD3011
10U F
10UF

10UF

150N F
25VV

25V
1KOHM

PC10 PR11
1KOHM

PR10
R3035

25

DGND
R3038

25V
DTC114EU PIC7
1/16W

PC4
PC1
1/16W

C
Q3003 1 8 4.7UH 0.01OHM

PC5
PL_SHUTD OWN B 390PF 56KO HM 1.6KOHM BD3004 PGND NC CB2012UA300T

R3005
E 50V 2 7
VIN SS
3 LX
6

0OHM

10UF 25V
10UF 25V
0.01OHM 4
AGND EN
5

10KOHM
MGND1
CB2012UA300T FB COMP

50V

50V
47UF 6.3V
47UF 6.3V
100NF
DGND

100KOHM 1/16W
PC34 2.2NF 20KOHM
50V
DGND DGND AOZ1051P I

1/10W
DGND DGND DGND

50V PR35

100NF

100NF
1NF
50V
POWER_O N
R3002

PC33

PR31
470OHM

PC31
PC32
R3001
10KO HM

PC38
PL_DETECT

PC37

PC39
PC36
PR36
PC35
DGND

AS CLOS E AS POSSIBLE DGND

VARIABLE POWER DC PROTEC TION POWER OFF MUTE


PVDD+23V
PVDD+23V
PVDD+23V GVDD+12V
HM
22KOHM

R7005
R7006

47KOHM
1/16W

12KOHM
R1104
22KO

1/16W
R3020

Q7001 SD_POWER
22KO HM 2SA1037AK E

2S A1037 AK
Q3001 1/16W B UNDEFINED
C
R7009 33KOHM D7001 E
RS T_POWER
2SA1037AK SD_POWER
22KOHM

Q7003
R7007

E
B
FL+
W
47KOHM

1/16W

C
B
1/16W
47KOHM

1N4148WS
1/16

C
R7010 33KOHM
R7003

75
1/16W

SRC1203 S
470KOHM

470KOHM

Q7006
SW+ C
1/16W

22KOHM
B

R7002
R3022

R3019

R3021

R7011 33KOHM

1/16W
1/10W

22KO HM C E
1/16W

Q55 B
FR+
1/16W

SRC1203 S
SBT42 E 1/16W

Q7005
C
22KOH M
22KOHM
22KOHM
R7001

B
R7004

47UF
47UF
1/16W

1/16W

16V

16V

E
VRP_CTL

POWER_VR C
Q7004 B

SBT42 E
DTC114EU
C7002

C7003

C C
Q3002
C7001

B B
VRP_CTR
50V
1NF

E E
DGND
Q7002
2SA1037AK R7008 R7012 33KOHM
1/16W FL-
DGND 1KOHM R7013
1/16W 33KOHM
SW-
DGND 1/16W
R7014 33KOHM
FR-
1/16W

6-6 Copyright 1995-2012 SAMSUNG. All rights reserved.


6. Schematic Diagram

6.6. MAIN-4
Q101 M+3.3V
2S A1037A K

POWER

C
POWER_ON

22KOHM
B

1/16W
R134
D+3.3V
M+3.3V D+3.3V D+3.3V
R133

4.7KOHM
4.7KOHM

1/16W
1/16W

10KOHM
R130

10KOHM
R1055

10KOHM
R100

R160
R10
1/16W

1/16W

1/16W
AUX_SE NS
SW_ADC
ECO SD_POWER
M+3.3V AMP_READY

100OHM
PWM_MUTE

100OHM

100OHM
100OHM
100OHM
R153

1/16W

R1511/16W
100OHM
CN102 0811
R136
10KOHM

R152
SMW200-H04G

R126
R125
R146
MGND1
1 DEBUG _RX_TX M+3.3V
2

54
53
52
51
50
49
64
63
62
61
60
59
58
57
56
55
3 UPDATE_RESET
4 R104
10KO HM

P130

P21/A NI1/AVREFM
P22/A NI2
P23/A NI3
P24/A NI4
P25/A NI5
P26/A NI6
P27/A NI7
P140/PC LBUZ0/INTP6
P141/PC LBUZ1/INTP7

P01/TO00

P04/S CK10-/S CL10

P20/A NI0/AVREFP
P00/TI00

P02/A NI17/SO1 0/TxD1


1/16W

P03/A NI16/SI10/RxD1/SDA10
MGND2 R206
100OHM
VFD_CE 7 8 1 48 R141 100OHM
P120 /ANI19 P147/ANI18 1/16W RS T_POWER
VFD_RST 5 6 2 47 R159 100OHM
DGND P43 P146 1/16W FANET_CTL
VFD_DATA 3 4 3 P42/TI0 4/TO04 P10/SCK00-/SCL00
46
VFD_CLK 1 2 4 P41/TI0 7/TO07 P11 /SI00/RxD0/TOOLRxD/SDA00
P11/SI00/RxD0/TOOLRxD/SDA00
45 R142 100OHM
DEBUG_MR_DT
1/16W
R103 DEBUG _RX_TX R144 100OHM 5 P40/TOOL 0 P12/SO00/TxD0/TOOLTxD
44 R143 100OHM
DEBUG_MT_DR
1/16W 1/16W
UPDATE_RESET
6 /RESE T P13/TxD2/SO20
43
0OHM M+3.3V 7 P124 /XT2/EXCLKS P14/RxD2/SI20/SDA20
42
8 P123 /XT1
IC5001 P15/SCK20-/SCL20
41
M+3.3V 9 40
P137 /INTP0
R5F 100LGAF B P16/TI01/TO01/INTP5
10 P122 /X2/EXCLK P17/TI02/TO02
39 R118 100OHM
REM_DATA
1/16W
11 38 R129
10KO HM

M_RST 100OHM
USB_FAULT
1MOHM
R107

P30/IN TP3/RTC1HZ/SC K11-/SCL11


P121 /X1 P55
R102

1/16W
C105 1UF 12 37 R128
1/16W

1/10W

M+3.3V 25V 100OHM


RT9818C- 29PV USB_EN

CL01
REGC P54

1-/SCL01
UIC2 13 36 1/16W

P74/K R4/INTP8/SI01/SDA01
VSS P53
14 35

R5/INTP9/SCK01-/S

P70/K R0/SCK21-/S CL21


3 /RESET,R ESET 1 EVSS 0 P52

P31/TI03/TO 03/INTP4

P75/K R5/INTP9/SCK0

P71/K R1/SI21/SDA21
VDD C106 16V 100NF 15 VDD P51/INTP2/SO11
34
16 33

P77/K R7/INTP11
P76/K R6/INTP10
C107 16V 100NF R119 100O HM 1/16W
I2C_INT

P73/K R3/SO01
P72/K R2/SO21

P06/TI06/TO 06
P05/TI05/TO 05
GND EVDD0
R101

P50/INTP1/SI11/SDA11
R101

33OHM

P61/S DAA0
P60/S CLA0
1/16W

C108
2

P62
P63
100NF
C102

16V

10UF
10V

28
29
30
31
32
17
18
19
20
21
22
23
24
25
26
27
100NF
C1011

16V
C10

DGND

100OHM

100O HM
VFD+12V

100OHM
M+3.3V

100OHM
1/16W
2
4
6
8

1/16W
DGND

2
4
6
8

4.7KOHM

4.7KOHM
1/16W
1/16W
R131

R132

C201
100NF
50V
R121 MGND2

R202

R120
1
3
5
7
15

R201
D+5.3V D+12V

1
3
5
7
PL_SHUTDO WN
CB2012 UA300T 14

PL_DET ECT
0.01OH M
UNDEFINED CII_RESET 13 DGND
BD2003 D_MO_CI CEC_MICOM VFD_DATA 12 VFD_DATA
D_CO_MI HPD_A VFD_CLK 11 VFD_CLK
CST_MAK EP92A2_RST VFD_CE 10 VFD_CE M+3.3V D+3.3V
D+3.3V
MAIN_SCL VFD_RST 9 VFD_RS T
MST_CAK
D+5.3V MAIN_SDA
20043WS-H241 3E 8
CEC_M ICOM MAIN_SCL
M+3.3V D3.3V 7
H_SPDIF MAIN_SDA
CN50 01 M+3.3V 6
TV_BCK I2C_INT
5
TV_DATA HPD_A 4.7KOHM
1/16W
R114

C200
R113

C202
ECO

100NF
4

100NF

16V
MALE ECO

16V
TV_LRCK 1 2 EP92A2_ RST REM_DATA

*
NC
REM_DATA 3
TV_LRCK 3 4 EP92A 2_RST DGND2 2
TV_DATA 5 6 HPD_A 1
TV_BCK
7 8 I2C_INT MGND1
H_SPDIF
9 10 MAIN_SDA
11 12 MAIN_SCL DGND DGND
CEC_MICOM
13 CN201
14 15 AUX_S ENS_2 05002HR- H15J 05
R115

R140

AUX_L AUX_S ENS


16 17
33O HM

CB2012 UA300T
1/16W

DGND
18 19 0.01OH M
NC

AUX_R M+3.3V
*

20 21 BD102 MODE0 MODE1


22 23 E550 0 0
E450 0 1
DGND E350 1 0
AUX_L RES ERVE 1 1
AUX_R
AGND M+3.3V2
DGND1

AGND DGND

Copyright 1995-2012 SAMSUNG. All rights reserved. 6-7


6. Schematic Diagram

6.7. MAIN-5
M+3.3V CB20 12 UA30 0T
0. 01 OHM
VC_USB_3. 3V
POWER BD80 04

10KOHM
R320 2
IC 90 06
TS3USB221ERSER

10
VCC

C803 1

C803 6
1 9
AUDIO DEBUG_MR_DT
DEBUG_MT_DR 2
3
1D+
1D- D+
S
8
7
FANET_CTL
USB_COM_DP
10 0NF 10 UF
USB_DP 2D+ D- USB_COM_DM 16 V
USB_DM
4 6 10 V

GND
2D- / OE
D+3. 3V VC3. 3V
DGND VD3. 3V

10 0OHM
R320 3

C802 2
10 0NF BD80 01 BD80 03

5
D+5.3V 16 V
0. 01 OHM

C803 7
0. 01 OHM CB20 12 UA30 0T

C803 2
MGND1 CB20 12 UA30 0T
33OHM
1 1/ 16W D800 1 DGND 10 0NF
U_5V 10 UF

UF 10 V
SDB30A40- PF
U_DM 2 R108 USB_COM_DM
TP8001 16 V 10 V

C801 3
C801 1

10 UF
3 R109

10 V
U_DP USB_COM_DP TPS2 55 3DBVR

10 UF
4 DGND VD3. 3VPLL
DGND IC 80 01

1/ 10 W
33OHM BD30 06
47KOHM

5 1/ 16W
47KOHM

1/1 6W
R110 1/1 6W

ADC SW_ADC 6 1
6 OUT IN
CB20 12 UA30 0T
5 2

R802 1
DGND 0. 01 OHM

75 OHM
I LI M GND

C803 3

C803 8
4 3
R111

MGND2 / FAULT EN USB_EN


R801 4

VDDADC1
.35V
1/ 10W
16. 5KOHM

CN30 02 10 0NF
12507WR- H06G DGND USB_FAULT 10 UF

10 V
16 V
16 V

1/ 16 W
1/ 16 W
10 V
4. 7KOHM
R805 3

1/ 10W
DGND DGND C102 0 10 UF A+3. 3V AUD3. 3V DGND AVD3. 3VS
10 V

10 0NF
AUX_R BD80 02 BD80 05

10 UF
DGND
VC3.3V VC_USB_3.3V VD3.3V

HM
56 KOHM
AUX_L

56 KOHM
10 UF A+1. 35V VDDADC1. 35V
C102 1 10 V
DGND CB20 12 UA30 0T BD80 06

C803 9
10 0NF
USB_DM

C803 4
USB_DP
ADD4 0. 01 OHM 0. 01 OHM

16 V
AVD3.3VS CB20 12 UA30 0T

C801 8
ADD5

10 V
C801 9
10KOHM

10 UF
R310 5
10 0NF 10 UF

1/ 16W

C801 6
ADD6

R802 0 39 2OHM

R802 2
R802 3
16 V 10 V 0. 01 OHM
ADD7

C802 0
1/ 10 W
CB20 12 UA30 0T

10 0NF
C802 1
10 0NF

16 V
ADD8 AGND

16V
ADD9 VC3. 3V

C801 7
ADD11 VC3.3V D+1. 35V
ADD3 DGND
AGND R803 1
10 0KOHM
1/ 16 W VC3. 3V
D300 4
12 8
12 7
12 6
12 5
12 4
12 3
12 2
12 1
12 0
11 9
11 8
11 7
11 6
11 5
11 4
11 3
11 2
11 1
11 0
10 9
10 8
10 7
10 6
10 5
10 4
10 3
10 2
10 1
10 0

27 PF 50 V
99
98
97
SF_DI

27 PF 50 V

R804 8
RB55 1V-3 0TE- 17

SF_CK
SF_DO
C802 5

10KOHM
20

R804 6
C802 7
X800 1

10KOHM
SF_CS IC 80 04
27 MHZ W25Q16BVSSI G
VD3. 3VPLL
USB_DM
VDD

SYSCLK

VDD
USB_AGND

USB_VCCA
VD33VDAC
VDAC

VS33VDAC
VS33AADC
VDDAADC

VD33AADC
PAD_RSET
USB_DP

PAD_COMP
PAD_REF
VD33

LI NE_I N_R1
LI NE_I N_L1