Draft

High Temperature Materials and Mechanisms

Editor: Yoseph Bar-Cohen, JPL/Caltech, Pasadena, CA

Publisher: CRC Press / Taylor and Francis Group

Preliminary cover-page graphics

Hypersonic X-51A Scramjet vehicle (http://www.space.com/8497-air-force-51-scramjet-sets-record-longest-hypersonic-
flight.html) - credit: U.S. Air Force

DRAFT OF THE CURRENT BOOK OUTLINE

Chapter 1: High Temperatures Materials and Mechanisms Introduction: Y. Bar-Cohen, JPL
1.1 Introduction ..............................................................................................................................
1.2 Historical perspective...............................................................................................................
1.3 The need for high strength high temperature materials ...........................................................
1.4 HT Materials ............................................................................................................................
1.5 HT Processes ............................................................................................................................
1.6 Actuators, devices mechanisms and jet engine turbines ..........................................................
1.7 NDE and characterization methods for HT materials and mechanism ....................................
1.8 Summary/Conclusions .............................................................................................................
1.9 Acknowledgement ...................................................................................................................
1.10 References ................................................................................................................................
1.10.1 Internet links ................................................................................................................................

Chapter 2: High Temperature Materials Chemistry and Thermodynamics - Sulata Kumari Sahu
and Alexandra Navrotsky, University of California at Davis
2.1 Introduction ..............................................................................................................................
2.2 How Materials Fail at High Temperature ................................................................................
2.3 Noble Metals ............................................................................................................................
2.4 Materials above 2000 oC ..........................................................................................................
2.5 Silicon Based Refractories .......................................................................................................
2.6 High Temperature Oxidation ...................................................................................................
2.7 Volatile Oxides ........................................................................................................................
2.8 Summary ..................................................................................................................................

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2.9 Acknowledgement ...................................................................................................................
2.10 References ...............................................................................................................................

Chapter 3: Refractory metals, ceramics and composites for high temperature structural and
functional applications - Jeffrey W. Fergus, Auburn University and Wesley P
Hoffman, Air Force Research Laboratory, Edwards California
3.1 Introduction ..............................................................................................................................
3.1.1 Advantages of and needs for high temperatures..........................................................................
3.1.2 Challenges associated with high temperatures ............................................................................
3.2 Types of High Temperature Materials .....................................................................................
3.2.1 High Temperature Metals ............................................................................................................
3.2.2 Ceramic Materials .......................................................................................................................
3.2.3 High Temperature Composites ....................................................................................................
3.2.3.1 Carbon-Carbon Composites ...................................................................................................
3.2.3.2 Ceramic Matrix Composites ...................................................................................................
3.2.3.3 Metal Matrix Composites ........................................................................................................
3.3 High Temperature Stability......................................................................................................
3.3.1 Reaction with the environment....................................................................................................
3.3.2 Vaporization ................................................................................................................................
3.3.3 Ablation .......................................................................................................................................
3.3.4 Reaction among components.......................................................................................................
3.4 High Temperature Performance ...............................................................................................
3.4.1 Mechanical properties .................................................................................................................
3.4.1.1 Metals ......................................................................................................................................
3.4.1.2 Ceramics .................................................................................................................................
3.4.1.3 Composites ..............................................................................................................................
3.4.2 Ionic conduction ..........................................................................................................................
3.4.3 High temperature electronics.......................................................................................................
3.4.4 Thermal conduction .....................................................................................................................
3.4.4.1 Metals ......................................................................................................................................
3.4.4.2 Ceramics .................................................................................................................................
3.4.4.3 Composites ..............................................................................................................................
3.4.4.4 Thermoelectric Energy Conversion ........................................................................................
3.4.5 Transduction properties ...............................................................................................................
3.5 Summary/Conclusions .............................................................................................................
3.6 Acknowledgement ...................................................................................................................
3.7 References ................................................................................................................................

Chapter 4: High Temperature adhesives and bonding - R. Peter Dillon, JPL

4.0 Introduction ..............................................................................................................................
4.1 Fundamentals of Adhesion ......................................................................................................
4.1.1 Mechanical ..................................................................................................................................
4.1.2 Adsorption and Wetting ..............................................................................................................
4.1.3 Chemisorption .............................................................................................................................
4.1.4 Electrostatic .................................................................................................................................
4.1.5 Diffusion......................................................................................................................................
4.1.6 Weak boundary layer...................................................................................................................

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4.2 High Temperature Environments and Adhesives It might not just be a dry heat .................
4.3 High Temperature Adhesives: Structures and Properties ........................................................
4.3.1 Epoxy and Epoxy Phenol Novolacs ............................................................................................
4.3.2 Polyimide (PI) .............................................................................................................................
4.3.3 Bismaleimide (BMI)....................................................................................................................
4.3.4 Polybenzimidazole (PBI) ............................................................................................................
4.3.5 Cyanate Esters .............................................................................................................................
4.3.6 Silicones ......................................................................................................................................
4.4 Bonding for High Temperature Applications and Applications Requiring Bonding at High
Temperatures............................................................................................................................
4.5 Evaluating High Temperature Adhesive Performance ............................................................
4.5.1 Characterizing the bulk adhesive for cohesive performance .......................................................
4.5.2 Screening tests for adhesive performance ...................................................................................
4.6 Acknowledgement ...................................................................................................................
4.7 References ................................................................................................................................
5.7.1 Internet resources ........................................................................................................................

Chapter 5: Oxidation of High Temperature Materials - James L. Smialek and Nathan S.

Jacobson, NASA Glenn Research Center
5.1 Introduction ..............................................................................................................................
5.2 Experimental Considerations ...................................................................................................
5.3 Major Features of High Temperature Oxidation and Corrosion ..............................................
5.3.1 Overview ...........................................................................................................................................
5.3.3 Metals, Alloys, and Intermetallics ...............................................................................................
5.3.3.1 Copper alloys ..........................................................................................................................
5.3.3.2 Iron alloys (Steels). .................................................................................................................
5.3.3.3 High Temperature Nickel-Based Alloys. .................................................................................
5.3.3.4 Intermetallic Aluminide and Silicide Compounds..................................................................
5.3.3.5 Refractory Metals and Silicide Coatings. ...............................................................................
5.3.3.6 MAX Compounds. ...................................................................................................................
5.4 Oxidation of SiO2 Forming Ceramic Materials .......................................................................
5.4.1 Passive Oxidation ........................................................................................................................
5.4.2 Active Oxidation. ........................................................................................................................
5.4.3 SiC-Based Composites ................................................................................................................
5.5 Corrosion in Complex Gas/Deposit Environments..................................................................
5.5.1 Corrosion in Mixed Gases ...........................................................................................................
5.5.2 Hot corrosion of alloys ................................................................................................................
5.5.2.1 Type I Hot Corrosion ..............................................................................................................
5.5.2.2 Type II Hot Corrosion. ............................................................................................................
5.5.2.3 Hot Corrosion of SiC and Si3N4 Ceramics ..............................................................................
5.5.2.4 CMAS and Volcanic Ash Considerations. ...............................................................................
5.6 Re-entry Materials ...................................................................................................................
5.7 Closing remarks .......................................................................................................................
5.8 Acknowledgement ...................................................................................................................
5.9 References ................................................................................................................................

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Chapter 6: High Temperature Materials Processing - Olivia A. Graeve, University of
California, San Diego (UCSD) and Alfred University, Editor-in Chief of the High Temperature
Material Processes journal; and James P. Kelly, Alfred University
6.1 Introduction ..............................................................................................................................
6.2 Powder Synthesis .....................................................................................................................
6.2.1 Introduction .................................................................................................................................
6.2.2 Tantalum Carbide: Model System for UHTC Syntheses ............................................................
6.2.3 Synthesis of Carbides and Borides ..............................................................................................
6.3 Consolidation of Bulk Specimens ............................................................................................
6.3.1 Tantalum Carbide: Model System for UHTC Sintering..............................................................
6.3.2 Sintering of Carbides and Borides...............................................................................................
6.4 Summary ..................................................................................................................................
6.5 Acknowledgements ..................................................................................................................
6.6 References ................................................................................................................................

Chapter 7: Characterization of Metals, Alloys, Ceramics and Composite High Temperature

Materials Yoseph Bar-Cohen, JPL, and Robert Cormia, Foothill College, Los Altos Hills, CA
7.1 Introduction ..............................................................................................................................
7.2 Analyses of materials and processes ........................................................................................
7.2.1 Surface analysis techniques .........................................................................................................
7.3 Imaging and visualization analyzers ........................................................................................
7.3.1 Optical microscopes ....................................................................................................................
7.3.2 Scanning Electron Microscopy (SEM) ........................................................................................
7.3.3 Energy-Dispersive X-Ray Spectroscopy (EDS or EDX) ............................................................
7.3.4 Focused Ion Beam (FIB) .............................................................................................................
7.3.5 Transmission Electron Microscopy (TEM) .................................................................................
7.3.6 Electron Probe Micro-Analyzers (EPMA) ..................................................................................
7.3.7 Scanning Probe Microscopy (SPM) ............................................................................................
7.3.8 Scanning Tunneling Microscopy (STM) .....................................................................................
7.3.9 Atomic Force Microscopy (AFM)...............................................................................................
7.4 Materials and metallurgical analyzers .....................................................................................
7.4.1 X-Ray Diffraction Analysis (XRD).............................................................................................
7.4.2 X-Ray Fluorescence (XRF) Spectrometry ..................................................................................
7.4.3 X-ray Absorption Spectroscopy (XAS).......................................................................................
7.4.4 X-Ray Photoelectron Spectroscopy (XPS) ..................................................................................
7.4.5 Low Energy Electron Diffraction (LEED) ..................................................................................
7.4.6 Neutron Diffraction .....................................................................................................................
7.4.7 Auger Electron Spectroscopy (AES) ...........................................................................................
7.4.8 Raman spectroscopy ....................................................................................................................
7.4.9 Electron Micro-Probe (EMP) ......................................................................................................
7.4.10 Electron Energy Loss Spectroscopy (EELS) ...............................................................................
7.4.11 Inductively coupled plasma mass spectrometry (ICP-MS) .........................................................
7.4.12 Particle-Induced X-ray Emission (PIXE) ....................................................................................
7.4.13 Atomic Spectroscopy ..................................................................................................................
7.4.14 Static Secondary Ion Analysis (SSIMS)......................................................................................
7.5 Summary/Conclusions .............................................................................................................
7.6 Acknowledgement ...................................................................................................................
7.7 References ................................................................................................................................
7.7.1 Internet links ................................................................................................................................

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Chapter 8: Yoseph Bar-Cohen1, John D. Lekki2, Hyeong Jae Lee1, Xiaoqi Bao1, Stewart
Sherrit1, Shyh-Shiuh Lih1, Mircea Badescu1, Andrew Gyekenyesi3, Gary Hunter2, Mark Woike2,
and Grigory Adamovsky2
1
Jet Propulsion Laboratory/Caltech, 4800 Oak Grove Drive, M/S 67-119, Pasadena, CA 91109,
USA, Phone: 818-354-2610, e-mail: yosi@jpl.nasa.gov Web: http://ndeaa.jpl.nasa.gov
2
NASA Glenn Research Center, Cleveland, OH 44135, Phone: 216-433-5650,
John.D.Lekki@nasa.gov
3
Ohio Aerospace Institute, 22800 Cedar Point Road, Cleveland, Ohio 44142
8.1 Introduction
8.2 Nondestructive evaluation methods .........................................................................................
8.3 Health monitoring of steam pipes ............................................................................................
8.3.1 Ultrasonic methods of measuring water height thru pipe walls ..................................................
8.3.2 The transducer .............................................................................................................................
8.3.3 Test system ..................................................................................................................................
8.3.4 Signal processing and water height measurements .....................................................................
8.3.4.1 Surface perturbation and bubbles interference.......................................................................
8.3.4.2 High temperature tests ............................................................................................................
8.4 Monitoring curing of composite materials ...............................................................................
8.4.1 Dielectrics....................................................................................................................................
8.4.2 Fiber optics and fluorescence ......................................................................................................
8.4.3 Ultrasonics and use of piezoelectric sensors ...............................................................................
8.4.4 Thermography and heat flux monitoring .....................................................................................
8.4.5 Eddy-currents ..............................................................................................................................
8.5 Eddy current monitoring of heat treatment processes..............................................................
8.6 Eddy current monitoring of cracks growth ..............................................................................
8.7 Conclusions ..............................................................................................................................
8.8 Acknowledgement ...................................................................................................................
8.9 Reference .................................................................................................................................
8.9.1 Internet links ................................................................................................................................

Chapter 9: High Temperature Motors - Nishant Kumar, Honeybee Robotics

9.1 Introduction ..............................................................................................................................
9.2 Actuators ..................................................................................................................................
9.2.1 Actuation mechanisms and power sources .................................................................................
9.2.2 Actuation performance in different environment ........................................................................
9.3 Motors ......................................................................................................................................
9.3.1 Switched Reluctance Motors ......................................................................................................
9.3.1.1 The high temperature SRM design
9.3.1.2 Test Results
9.3.2 Brushless DC Motor....................................................................................................................
9.3.2.1 Design of BLDC (Honeybee Robotics) motor
9.3.2.2 Control of Brushless DC Motor
9.3.2.3 High-Temperature BLDC Motor Testing
9.4 Conclusion ...............................................................................................................................
9.5 Acknowledgement ...................................................................................................................
9.6 References ................................................................................................................................

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Chapter 10: High Temperature Electromechanical Materials Stewart Sherrit1, Hyeong Jae
Lee1, Shujun Zhang2, and Thomas R. Shrout2,
1
Jet Propulsion Laboratory/Caltech4800 Oak Grove Drive, M/S 67-119, Pasadena, CA 91109
2
The Pennsylvania State University, Materials Research Institute, University Park, PA 16802
10.1 Terrestrial and Extraterrestrial Extreme Environments ...........................................................
10.1.1 Introduction .................................................................................................................................
10.1.2 Applications ................................................................................................................................
10.2 High temperature dielectric electromechanical materials ........................................................
10.2.1 Piezoelectric materials .................................................................................................................
10.2.2 High temperature piezoelectrics ..................................................................................................
10.2.3 Electrostrictive materials .............................................................................................................
10.2.4 Electromechanical actuators .......................................................................................................
10.3 Competing actuation technologies ...........................................................................................
10.3.1 Magnetostrictive materials ..........................................................................................................
10.3.2 Shape memory alloys ..................................................................................................................
10.3.3 Phase change materials ................................................................................................................
10.3.4 Conventional electromagnetic actuators......................................................................................
10.4 Actuator life .............................................................................................................................
10.4.1 Thermal expansion ......................................................................................................................
10.4.2 Thermal aging, degradation .........................................................................................................
10.4.3 Creep ...........................................................................................................................................
10.5 Summary .................................................................................................................................
10.6 References ................................................................................................................................

Chapter 11: Thermoacoustic Piezoelectric Energy Harvesters - Mostafa Nouh, University of

Maryland, College Park, MD; Osama Aldraihem, King Saud University, Riyadh.
Saudi Arabia; and Amr Baz, University of Maryland, College Park, MD
11.1 Introduction ..............................................................................................................................
11.2 Thermoacoustic Phenomenon ..................................................................................................
11.3 Thermoacoustic-Piezoelectric System (TAP) ..........................................................................
11.4 Dynamically Magnified Thermoacoustic-Piezoelectric System (DMTAP) ............................
11.4.1 TAP vs. DMTAP .........................................................................................................................
11.4.2 Wave forms .................................................................................................................................
11.4.3 Magnification Ratio .....................................................................................................................
11.4.4 Power and Efficiency ..................................................................................................................
11.4.5 Onset Temperature of self-sustained oscillations .......................................................................
11.5 Experimental Validation ..........................................................................................................
11.5.1 Experimental Set-Up ...................................................................................................................
11.5.2 Voltage output from Piezo-elements ...........................................................................................
11.5.3 Vibrometer Scanning of Piezo surface ........................................................................................
11.6 Summary/Conclusions .............................................................................................................
11.7 Acknowledgement ...................................................................................................................
11.8 References ................................................................................................................................

Chapter 12: High temperature shape memory and superelastic alloys- Mohammad Elahinia,
Masood Taheri Andani and Christoph Haberland, Dynamic and Smart Systems Laboratory,
University of Toledo, Toledo, OH

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12.1 Introduction ..............................................................................................................................
12.2 Phase transformation in SMAs ................................................................................................
12.2.1 Phase transformation ...................................................................................................................
12.2.2 Shape memory effect ...................................................................................................................
12.2.3 Pseudoelasticity ...........................................................................................................................
12.3 High temperature shape memory alloys (HTSMAs) ...............................................................
12.4 Modeling and characterization .................................................................................................
12.4.1 Constitutive model ......................................................................................................................
12.4.2 Phase transformation kinetics ......................................................................................................
12.4.3 Heat transfer model .....................................................................................................................
12.5 Fabrication processes ...............................................................................................................
12.5.1 Conventional methods .................................................................................................................
12.5.2 Additive manufacturing ...............................................................................................................
12.5.3 Heat treatment, shape setting and training ..................................................................................
12.6 SMA actuation .........................................................................................................................
12.6.1 One-way and two-way actuation .................................................................................................
12.6.2 Superelasticity .............................................................................................................................
12.6.3 Antagonistic superelastic-shape memory ....................................................................................
12.6.4 Control .........................................................................................................................................
12.7 Summary ..................................................................................................................................
12.8 Acknowledgment .....................................................................................................................
12.9 References ................................................................................................................................

Chapter 13: Thermoelectric Materials for Energy Harvesting, University of Arkansas

Vijay K. Varadan1, Linfeng Chen1, Jungmin Lee1, Gyanesh N. Mathur1, Hyun Jung Kim2, and
Sang H. Choi3
1
Department of Electrical Engineering University of Arkansas, Fayetteville, Arkansas
2
National Institute of Aerospace, 100 Exploration Way, Hampton, VA 23666, USA
3
NASA Langley Research Center, Hampton, VA 23681, USA
13.1 Introduction ..............................................................................................................................
13.1.1 Thermoelectricity and thermoelectric generators ........................................................................
13.1.1.1 Thermoelectric parameters
13.1.1.2 Thermoelectric generators
13.1.2 Choice and optimization of thermoelectric materials ..................................................................
13.1.2.1 Typical thermoelectric materials
13.1.2.2 Optimization of thermoelectric materials
13.1.2.3 Nanoscale effects
13.2 Thermoelectric nanomaterials ..................................................................................................
13.2.1 Nanoparticles ...............................................................................................................................
13.2.1.1 Bi2Se3 nanoflakes
13.2.1.2 Bi2Te3 nanoparticles
13.2.2 Nanorods and nanowires .............................................................................................................
13.2.2.1 Bi2S3 polycrystalline nanorods
13.2.2.2 Bi2Te3 ultrathin nanowires
13.2.3 Superlattice structures .................................................................................................................
13.2.3.1 InGaAs/ InGaAsP superlattice
13.2.3.2 Bi2Te3/Sb2Te3 superlattice
13.2.4 Complex nanomaterials ...............................................................................................................

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 13.2.4.1 Flower-like dendritic PbTe
13.2.4.2 Bi0.4Te3Sb1.6 porous thin film
13.2.5 Consolidation and densification ..................................................................................................
13.3 Thermoelectric generators .......................................................................................................
13.3.1 Basic structure of a thermoelectric generator ..............................................................................
13.3.2 MEMS thermoelectric generators................................................................................................
13.3.3 Flexible thermoelectric generators ..............................................................................................
13.3.3.1 PDMS-based thermoelectric generator
13.3.3.2 SU-8 based thermoelectric generator
13.3.4 Nanostructured thermoelectric generators ...................................................................................
13.3.5 Printed thermoelectric generators ................................................................................................
13.4 Thermoelectric generator systems ............................................................................................
13.4.1 Cascaded thermoelectric generators ............................................................................................
13.4.2 Parallel thermoelectric generators ...............................................................................................
13.4.3 Hybrid systems ............................................................................................................................
13.4.3.1 Photovoltaic-thermoelectric hybrid system
13.4.3.2 Battery thermoelectric generator hybrid system
13.5 Applications of thermoelectric generators and thermoelectric generator systems ..................
13.5.1 Automotive waste heat recovery .................................................................................................
13.5.2 Stationary plant waste heat recovery ...........................................................................................
13.5.3 Body heat energy harvesting .......................................................................................................
13.5.3.1 Harvestable body heat
13.5.3.2 Wearable biometric sensors
13.5.3.3 Biomedical autonomous devices
13.5.4 Power supply for wireless devices ..............................................................................................
13.5.4.1 Self-contained thermoelectric generator for cell phones
13.5.4.2 Battery-free wireless sensors
13.6 Concluding remarks .................................................................................................................
13.6.1 Thermoelectricity at nanoscale ....................................................................................................
13.6.2 Cost-efficiency trade-off .............................................................................................................
13.7 Acknowledgement ...................................................................................................................
13.8 References: ...............................................................................................................................

Chapter 14: High temperature drilling mechanisms for planetary exploration - Y. Bar-Cohen,
Xiaoqi Bao, Mircea Badescu & Stewart Sherrit, JPL; Kris Zacny, Honeybee
Robotics; Thomas Shrout and Shujun Zhang, Penn State University
14.1 Introduction ..............................................................................................................................
14.2 Geothermal and oil drilling ......................................................................................................
14.3 Rotary Drill Powered by High Temperature Actuators ...........................................................
14.4 The Ultrasonic/Sonic Driller/Corer (USDC) ...........................................................................
14.4.1 HT piezo-ceramic actuators.........................................................................................................
14.4.2 Materials for fabricating the drill ................................................................................................
14.4.3 Modeling and analysis of transducers of the HT USDC .............................................................
14.4.4 Testbed setup ...............................................................................................................................
14.4.5 HT Piezoelectric actuated drills ..................................................................................................
14.4.5.1 Basic designs of the HT piezo-actuated drills
14.4.5.2 The 2.5 cm (1 inch) diameter samplers
14.4.5.3 The 3.81 cm (1.5 inch) diameter Bismuth Titanate samplers
14.4.5.4 The 4.83 cm (2 inch) diameter LiNbO3 samplers

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 14.4.5.5 Special technical measures for the operation at HT
14.5 Thermal drilling .......................................................................................................................
14.5.1 Thermal spalling ..........................................................................................................................
14.5.2 Melting and vaporization.............................................................................................................
14.6 Summary and Conclusions ......................................................................................................
14.7 Acknowledgement ...................................................................................................................
14.8 References ................................................................................................................................
14.8.1 Internet websites ..........................................................................................................................

Chapter 15: High temperature electronics - Zhenxian Liang, Oak Ridge National Laboratory;
15.0 High Temperature Electronics Systems ...................................................................................
15.1 Introduction .................................................................................................................................
15.2 Operating Temperature of Electronics Systems ..........................................................................
15.3 Thermal Management and Challenges ........................................................................................
15.2 High Temperature Semiconductor Devices .............................................................................
15.2.1 Temperature Effects of Semiconductors .....................................................................................
15.2.2 Thermally Induced Failures.........................................................................................................
15.3 High Temperature Semiconductor Technologies ....................................................................
15.4 High Temperature Limits of Passive Components ..................................................................
15.4.1 Temperature Characteristics of Capacitor Materials ...................................................................
15.4.2 Thermally Induced Failures of Capacitors ..................................................................................
15.4.3 Temperature Characteristics of Magnetic Materials ..................................................................
15.4.4 Thermally Induced Failure of Magnetic Components.................................................................
15.4.5 High Temperature Passive Materials...........................................................................................
15.5 Summary ..................................................................................................................................
15.6 Acknowledgement ...................................................................................................................
15.7 References ................................................................................................................................

Chapter 16: Ultra-high temperature ultrasonic sensor design challenges - Matthew Kropf,
University of Pittsburgh Bradford, PA
16.1 Systems for ultra-high temperature sensors .............................................................................
16.1.1 Applications: sensors in extreme environments; geo-technical, space, nuclear reactors, gas
turbines, etc. ...............................................................................................................................................
16.1.2 Materials and environmental limitations: ....................................................................................
16.2 Sensor material selection for high and ultra-high temperature applications............................
16.2.1 Application specific environmental limitations on material selection ........................................
16.2.2 Useful life limitations in extreme environments: ........................................................................
16.3 Thermal mechanisms for consideration in extreme environments ..........................................
16.3.1 Thermal expansion ..........................................................................................................................
16.3.1.1 Thermal expansion of sensor package
16.3.1.2 Thermal expansion of sensing element and waveguide
16.3.2 Mechanical degradation mechanisms ..........................................................................................
16.4 Design for thermal expansion compensation ...........................................................................
16.4.1 Maintaining structural integrity and environmental seals ...........................................................
16.4.2 Compensating for thermal mechanisms ......................................................................................
16.5 Future approaches for the integration of packaging and sensor electronics ............................
16.6 Acknowledgement ...................................................................................................................
16.7 References ................................................................................................................................

9
Chapter 17: High temperature materials and mechanisms - applications and challenges - Y. Bar-
Cohen, JPL
17.1 Introduction ..............................................................................................................................
17.2 Operating underground and at great Earth depths ...................................................................
17.2.1 Geothermal energy ......................................................................................................................
17.2.2 Oil and gas exploration................................................................................................................
17.2.3 Underground Mining ...................................................................................................................
17.2.4 Underground steam pipes ............................................................................................................
17.3 Space exploration of hot planets ..............................................................................................
17.4 Super-fast flights - commercial and military applications .......................................................
17.5 Electronics................................................................................................................................
17.5.1 Military electronics......................................................................................................................
17.5.2 Automobile electronics................................................................................................................
17.5.3 Aerospace electronics ..................................................................................................................
17.6 Summary/Conclusions .............................................................................................................
17.7 Acknowledgement ...................................................................................................................
17.8 References ................................................................................................................................
17.8.1 Internet links ................................................................................................................................

10