A. Choudhuri, P. S. Mohanty
Additive Manufacturing Process Laboratory, University of Michigan, Dearborn, Michigan, USA
J. Karthikeyan,*
ASB Industries, Barberton, Ohio, USA
*E-mail: karthi@asbindustries.com
Experimental
Bond line
Substrate
HAP
Ti
The microstructure of sponge Ti and HAP coating is shown in Figure 8: High magnification view of Sponge-Ti + 20% HAP
Fig. 7. As seen here a very dense coating with well distributed coating in Fig. 7 (etched to reveal the boundary).
Composite Coating
HAP Powder