1. Product profile
1.3 Applications
12 V and 24 V loads General purpose power switching
Automotive systems Motors, lamps and solenoids
2. Pinning information
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 G gate
mb D
2 D drain
3 S source
G
mb D mounting base; connected to
drain mbb076 S
1 2 3
SOT78 (TO-220AB)
3. Ordering information
Table 3. Ordering information
Type number Package
Name Description Version
BUK9508-55B TO-220AB plastic single-ended package; heatsink mounted; 1 mounting SOT78
hole; 3-lead TO-220AB
BUK9508-55B All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved.
4. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Typ Max Unit
VDS drain-source voltage Tj 25 C; Tj 175 C - - 55 V
VDGR drain-gate voltage RGS = 20 k - - 55 V
VGS gate-source voltage -15 - 15 V
ID drain current Tmb = 100 C; VGS = 5 V; see Figure 1 [1] - - 75 A
Tmb = 25 C; VGS = 5 V; see Figure 1; [2] - - 110 A
see Figure 3 [1] - - 75 A
IDM peak drain current Tmb = 25 C; tp 10 s; pulsed; - - 439 A
see Figure 3
Ptot total power dissipation Tmb = 25 C; see Figure 2 - - 203 W
Tstg storage temperature -55 - 175 C
Tj junction temperature -55 - 175 C
Source-drain diode
IS source current Tmb = 25 C [2] - - 110 A
[1] - - 75 A
ISM peak source current tp 10 s; pulsed; Tmb = 25 C - - 439 A
Avalanche ruggedness
EDS(AL)S non-repetitive ID = 75 A; Vsup 55 V; RGS = 50 ; - - 352 mJ
drain-source VGS = 5 V; Tj(init) = 25 C; unclamped
avalanche energy
BUK9508-55B All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved.
03nn57 03na19
120 120
Capped at 75 A due to package
ID Pder
(A) (%)
80 80
40 40
0 0
0 50 100 150 200 0 50 100 150 200
Tmb (C) Tmb (C)
Fig 1. Continuous drain current as a function of Fig 2. Normalized total power dissipation as a
mounting base temperature function of mounting base temperature
03nn55
103
100 s
100 ms
1
1 10 102
VDS (V)
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage
BUK9508-55B All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved.
5. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-mb) thermal resistance see Figure 4 - - 0.74 K/W
from junction to
mounting base
Rth(j-a) thermal resistance vertical in still air - 60 - K/W
from junction to
ambient
03nn56
1
= 0.5
Zth(j-mb)
(K/W)
0.2
101 0.1
0.05
0.02
tp
102 P =
T
single shot
tp t
T
103
106 105 104 103 102 101 1
tp (s)
Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration
BUK9508-55B All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved.
6. Characteristics
Table 6. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V(BR)DSS drain-source ID = 0.25 mA; VGS = 0 V; Tj = 25 C 55 - - V
breakdown voltage ID = 0.25 mA; VGS = 0 V; Tj = -55 C 50 - - V
VGS(th) gate-source threshold ID = 1 mA; VDS = VGS; Tj = 25 C; 1.1 1.5 2 V
voltage see Figure 10
ID = 1 mA; VDS = VGS; Tj = -55 C; - - 2.3 V
see Figure 10
ID = 1 mA; VDS = VGS; Tj = 175 C; 0.5 - - V
see Figure 10
IDSS drain leakage current VDS = 55 V; VGS = 0 V; Tj = 175 C - - 500 A
VDS = 55 V; VGS = 0 V; Tj = 25 C - 0.02 1 A
IGSS gate leakage current VDS = 0 V; VGS = 15 V; Tj = 25 C - 2 100 nA
VDS = 0 V; VGS = -15 V; Tj = 25 C - 2 100 nA
RDSon drain-source on-state VGS = 4.5 V; ID = 25 A; Tj = 25 C - - 9.3 m
resistance VGS = 5 V; ID = 25 A; Tj = 175 C; - - 16.8 m
see Figure 11; see Figure 12
VGS = 10 V; ID = 25 A; Tj = 25 C - 6.2 7 m
VGS = 5 V; ID = 25 A; Tj = 25 C; - 7.1 8.4 m
see Figure 11; see Figure 12
Dynamic characteristics
QG(tot) total gate charge ID = 25 A; VDS = 44 V; VGS = 5 V; - 45 - nC
QGS gate-source charge Tj = 25 C; see Figure 13 - 9 - nC
QGD gate-drain charge - 16 - nC
Ciss input capacitance VGS = 0 V; VDS = 25 V; f = 1 MHz; - 3960 5280 pF
Coss output capacitance Tj = 25 C; see Figure 14 - 517 620 pF
Crss reverse transfer - 206 282 pF
capacitance
td(on) turn-on delay time VDS = 30 V; RL = 1.2 ; VGS = 5 V; - 29 - ns
tr rise time RG(ext) = 10 ; Tj = 25 C - 123 - ns
td(off) turn-off delay time - 131 - ns
tf fall time - 86 - ns
LD internal drain from drain lead 6 mm from package to - 4.5 - nH
inductance center of die ; Tj = 25 C
from contact screw on mounting base to - 3.5 - nH
center of die ; Tj = 25 C
LS internal source from source lead to source bond pad ; - 7.5 - nH
inductance Tj = 25 C
BUK9508-55B All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved.
03nn52 03nn51
300 25
5 4.8 Label is VGS (V) RDSon
ID (m)
(A) 4.6
20
10
4.4
200
4.2
15
4
3.8 10
100 3.6
3.4
3.2 5
3
2.8
2.6
0 0
0 2 4 6 8 10 0 5 10 15
VDS (V) VGS (V)
Fig 5. Output characteristics: drain current as a Fig 6. Drain-source on-state resistance as a function
function of drain-source voltage; typical values of gate-source voltage; typical values
03ng53 03nn49
101 120
ID
(A) gfs
102 (S)
104
40
105
106 0
0 1 2 3 0 25 50 75 100
VGS (V) ID (A)
BUK9508-55B All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved.
03nn50 03ng52
100 2.5
ID VGS(th)
(A) (V)
2.0
75 max
1.5
typ
50
1.0 min
25
Tj = 175 C Tj = 25 C 0.5
0 0
0 1 2 3 4 60 0 60 120 180
VGS (V) Tj (C)
Fig 9. Transfer characteristics: drain current as a Fig 10. Gate-source threshold voltage as a function of
function of gate-source voltage; typical values junction temperature
03nn53 03ne89
30 2
Label is VGS (V)
RDSon a
(m)
3 3.2 1.5
20
3.4
3.6
3.8
4 1
5
10
10 0.5
0 0
0 50 100 150 200 250 -60 0 60 120 180
ID (A) Tj (C)
Fig 11. Drain-source on-state resistance as a function Fig 12. Normalized drain-source on-state resistance
of drain current; typical values factor as a function of junction temperature
BUK9508-55B All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved.
2
2000
Crss
0 0
0 10 20 30 40 50 102 101 1 10 102
Q G (nC) VDS (V)
Fig 13. Gate-source voltage as a function of gate Fig 14. Input, output and reverse transfer capacitances
charge; typical values as a function of drain-source voltage; typical
values
03nn47
100
IS
(A)
75
50
25
Tj = 175 C Tj = 25 C
0
0.0 0.5 1.0 1.5
VSD (V)
BUK9508-55B All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved.
7. Package outline
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78
E A
p A1
q mounting
D1 base
L1(1) L2(1)
Q
b1(2)
L (3)
b2(2)
(2)
1 2 3
b(3) c
e e
0 5 10 mm
scale
DIMENSIONS (mm are the original dimensions)
L2(1)
UNIT A A1 b b1(2) b2(2) c D D1 E e L L1(1) p q Q
max.
4.7 1.40 0.9 1.6 1.3 0.7 16.0 6.6 10.3 15.0 3.30 3.8 3.0 2.6
mm 2.54 3.0
4.1 1.25 0.6 1.0 1.0 0.4 15.2 5.9 9.7 12.8 2.79 3.5 2.7 2.2
Notes
1. Lead shoulder designs may vary.
2. Dimension includes excess dambar.
BUK9508-55B All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved.
8. Revision history
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BUK9508-55B v.3 20100615 Product data sheet - BUK95_96_9E08 v.2
Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Type number BUK9508-55B separated from data sheet BUK95_96_9E08 v.2.
BUK95_96_9E08 v.2 20030313 Product data - -
(9397 750 12052)
BUK9508-55B All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved.
9. Legal information
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
Right to make changes NXP Semiconductors reserves the right to make No offer to sell or license Nothing in this document may be interpreted or
changes to information published in this document, including without construed as an offer to sell products that is open for acceptance or the grant,
limitation specifications and product descriptions, at any time and without conveyance or implication of any license under any copyrights, patents or
notice. This document supersedes and replaces all information supplied prior other industrial or intellectual property rights.
to the publication hereof.
BUK9508-55B All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved.
Export control This document as well as the item(s) described herein may Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
be subject to export control regulations. Export might require a prior FabKey, GreenChip, HiPerSmart, HITAG, IC-bus logo, ICODE, I-CODE,
authorization from national authorities. ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE are trademarks of NXP B.V.
9.4 Trademarks
HD Radio and HD Radio logo are trademarks of iBiquity Digital
Notice: All referenced brands, product names, service names and trademarks Corporation.
are the property of their respective owners.
BUK9508-55B All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved.
11. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 General description . . . . . . . . . . . . . . . . . . . . . .1
1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . .1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1
2 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2
3 Ordering information . . . . . . . . . . . . . . . . . . . . . .2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3
5 Thermal characteristics . . . . . . . . . . . . . . . . . . .5
6 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .6
7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10
8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 11
9 Legal information. . . . . . . . . . . . . . . . . . . . . . . .12
9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12
9.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
9.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13
10 Contact information. . . . . . . . . . . . . . . . . . . . . .13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section Legal information.