Advancements In

MEMS Technology
By :-
Muneer Khan Aayush Tripathi
Undergraduate Undergraduate
(Department of Electronics and Communication) (Department of Electronics and Communication )
Birla Institute of Applied Sciences, Bhimtal Birla Institute of Applied Sciences, Bhimtal

Guided By :-
Mr. Anil Kumar Chaurasia
Assistant Professor
(Department of Electronics and Communication)
Birla Institute of Applied Sciences, Bhimtal
Outline of The PPT. Presentation………

 What are MEMS ????

 Components of MEMS……….
 Need of MEMS……
 Advantages of MEMS……….
 MEMS Manufacturing Technology……
 MEMS Accelerometers………
 MEMS Pressure Sensors…….
 MEMS Thermal Actuators……….
 MEMS Patient Monitoring System Sensors……
 Capacitive MEMS RF Switch………
 Other Examples…….
 What are MEMS ????
 Micro(small)

http://eed.gsfc.nasa.gov/562/SA_MEMs.htm

 Electro(electric components/functionality) http://www.memx.com/

 Mechanical(mechanical components/functionality)
http://www.memx.com/

 Systems(integrated, system-like functionality)

http://www.forbes.com/2008/04/22/mems-apple-nintendo_leadership_clayton_in_jw_0421claytonchristensen_inl_slide.html
Components of MEMS……….
 Need of MEMS……

 Large bandwidth operational range

 Small Size (Typically .1-100um
feature size)
Red Blood Cells ~ 10um
 Low Hysteresis loss
 High shock resistance
 Wide temperature operational range
 Low power consumption
Human Hair thickness ~ 50um
 Good Isolation
Advantages of MEMS……….

 Low cost, High yield

 Use existing IC fabrication technology
 Made primarily on Silicon Wafers
MEMS Manufacturing Technology……
 Bulk Micromaching Technique
Bulk micromachining involves the
removal of part of the bulk substrate. It
is a subtractive process to create large
pits, grooves and channels.

This is one the oldest technologies that

is being used to developed MEMS.
MEMS Manufacturing Technology…contd.

 Surface Micromaching
Technique
Surface micromachining involves
processing above the substrate. Material is
added to the substrate in the form of
layers of thin films on the surface of the
substrate.
These layers are known as sacrificial
layers as they can be easily removed
afterword.
This technology came into existence in
1980’s
MEMS Accelerometers………

 Most applicable MEMS device.

 Cost efficient.
 Capacitance value based device.
 Has a pair of capacitors.
 Based on the motion the value of
capacitance changes and result in the
change of output voltage
Examples……….

 Air bag crash sensors

 Active suspension systems
 VR Systems
 Ride control systems
 Anti-Lock Breaking Systems

Ford’s Automotive Airbag Accelometer

MEMS Pressure Sensors…….

 Consists of a Diaphragm which has

mechanical properties in it.
 Diaphragm is made up of sodium
nitride, which is etched over the
silicon wafer.
 Flexible diaphragm deforms in the
presence of a pressure difference;
this deformation is converted to
an electrical signal which is
output of the sensor in volts.
 Prepare through Bulk
Micromaching technique.
MEMS Thermal Actuators……….

 Two different materials are sandwiched

together which when undergo a
temperature change, lead to a movement in
the sandwich assembly.
 Change of temperature leads to change of
resistance and hence, different output
voltage at output.
 The output voltage is temperature
dependent.
 Ex- Thermocouples and Thermistor Resistors.
MEMS Patient Monitoring System
Sensors………..
 These are the sensors that our embedded
into our body for monitoring our health.
 Very small in size.
 Measure very accurately.
 Used to measure:
Body Temperature.
Glucose Level Body.
Obtain DNA Samples.
Blood Pressure.
 Capacitive MEMS RF Switch………

 Enable mechanical ON/OFF

switching with MEMS technology.
 Superb endurance (more than
100M switching operations)
 Small size (5.2 x 3.0 x 1.8 mm)
 Low power consumption (less than
10μW)
Other Examples…….

 World’s smallest car sitting on a coin.

 4.8mm long.
 Equipped with .67mm width motor.

 World’s smallest Guitar made from Si.

 10 µm long……
(Equal to size of a single cell)
 Each string 50 nm wide.
Pill Camera………
Conclusion………

 So at the end of my presentation I would simply conclude by saying that :

1. MEMS Technology is going to change our future drastically.
2. Make New Technology cheap day by day.
3.Encorporate large amount of data in small space.
4.Increase Accuracy of our devices.
References………

 1. Peterson, K E, ‘Silicon as a mechanical material,’ Proc. IEEE, 70 (982)420–457.

 2. Bryzek, J, Peterson, K and McCulley, W, (1994). ‘Micromachines on the
march,’ IEEE Spectrum, May, 1994, 20–31.
 3. Fan, L -S, Tai, Y -C and Muller, R S, (1987). ‘Pin joints, gears, springs,
cranks and other novel micromechanical structures,’ Proc. Transducers, 849–852.
 4. Varadan, V K, (ed.), (1995). ‘Smart Electronics,’ vol. 2448, Proc. SPIE, Bellingham, WA.
 5. Tani, J and Esashi, M, (eds.), (1995). ‘Intelligent Materials and Robots, Proceedings of the
International Symposium on Microsystems, Tohoku University, Japan.
 6. Varadan, V K and Varadan, V V, (1995). ‘3D MEMS Structures and their Applications’ Invited
Paper presented at the International Symposium on Microsystems, Intelligent Materials, and
Robots, Tohoku University, Japan.