LCP Technote e

TECHNICAL NOTE
Version 01 / Sep. 2010 Electronic Materials Division

00
Proper Use of SUMIKASUPER LCP
The contents of this document have been compiled based on are not intended as guarantees on product performance.
current documents, information, and data and may be revised Be aware of intellectual property rights when using this product.
when new information is available.
(1) Handling
The following items refer to essential points when handling
SUMIKASUPER LCP. Ensure that SUMIKASUPER LCP is handled
safely. Carefully read the Material Safety Data Sheet regarding
the handling of SUMIKASUPER LCP before use. Examine the
safety of any additives for use with SUMIKASUPER LCP.
[1] Safety and Health

Ensure that any gases emitted from drying or melting
SUMIKASUPER LCP do not come in contact with the eyes or skin
or are inhaled. In addition, be careful not to touch the resin
while it is still hot. Local ventilation equipment must be installed
and proper protective gear (such as protective goggles and
protective gloves) must be worn while drying or melting this
product.
[2] Flammability
SUMIKASUPER LCP is a flame-resistant material (classified as
UL94 V-0), however, it should be handled and stored in places
well away from sources of heat and flame. If the material catches
fire, toxic gases may be released. Use water, foam, or chemical
fire extinguishers to extinguish any flames.
[3] Disposal
SUMIKASUPER LCP may be disposed by burial or incineration.
Burial of the material should be conducted by certified industrial
waste processors or by the local municipal authorities in
accordance with the "Waste Management and Public Cleansing
Law". Incineration should be conducted using a furnace which
complies with the laws and regulations of the Air Pollution
Control Law. Toxic gases may be released when this product is
incinerated.
[4] Storage
Store SUMIKASUPER LCP at room temperature away from direct
sunlight, water, and humidity.
SUMIKASUPER LCP Technical Notes Index

(2) Applicable Standards
SUMIKASUPER LCP comes in a variety of grades which comply
with standards specified by the American Underwriters 1. General Chracteristics and Grade Line-up
Laboratories Inc., i.e. UL94 and UL746, and by the Electrical 1.1 Features 01
Appliance and Material Control Law, i.e. ball pressure 1.2 Grade Line-up 03
temperature. Refer to this booklet or contact Sumitomo 2. Physical Properties
Chemical for further details. Contact Sumitomo Chemical for 2.1 General Physical Properties 04
information regarding the use of this material in other special 2.2 Heat Resistance 06
applications. 2.3 Mechanical Properties 08
2.4 Flame Retardancy 11
(3) Security Trade Control
2.5 Electrical Properties 11
The products of SUMIKASUPER E5000 series, E4000 series,
2.6 Other Characteristics 12
E6000 series, SZ4000 series and SZ6000 series are on the control
3. Injection Molding / Fabricating
list of the Foreign Exchange and Foreign Trade Control Act of
Japan. 3.1 Moldability 14
The SUMIKASUPER E6000HF series and SZ6000HF series are not 3.2 Injection Molding Conditions 16
on the control list but implemented in catch-all control. 3.3 Design of Injection Molding Machine and Tools 19
3.4 Fabricating 24
(4) Others 4. Applications
All the data given in this document are for reference only and 4.1 Electronic Components 25
Version 01 / Sep 2010 Electronic Materials Division ©

01
1. General Characteristics and Grade Line-up
1.1 Features
SKIN LAYER
CORE LAYER
SKIN LAYER
SUMIKASUPER LCP is a thermotropic liquid crystalline polyester that possesses the highest heat resistance among all
engineering plastics.
Its basic chemical composition is shown in the diagram below. Thermotropic liquid crystalline polyester is one of the most
common types of liquid crystalline polymer.
Para-hydroxybenzonic acid Biphenol Phthalic acid
As indicated by their name, one property of liquid crystalline polymers is that they become liquid crystalline state when they
enter a molten state. This special phenomenon, unique to liquid crystal polymers, can be observed under a polarizing
microscope: as the temperature of a polymer increases and it begins to melt, its light transmittance also increases signifi-
cantly.
Figure 1.1 Device for Observing the Melting of Liquid Crystals Figure 1.2 Transmission of Light through Polalizer
Solid state Molten liquid crystalline state
Darkness in the case of

Amount of light transmission
isotronic material
Analyzer
(polarization plate)
Specimen
Temperature (˚C)
Heating stage
Polarizer
(polarization plate)
Light source
Optical spectrum

02
Figure 1.3 Polarization Microscopic Photograph
Figure 1.4 Characteristics of Liquid Crystalline Polymer (LCP)
Thermotoropic liquid crystalline polymer Crystalline polymer
Melting
Injection
molding
Solidification
Characteristics Based on Whollyaromatic Liquid Crystalline Polymer

Effects of Molecular Orientation Characteristics Based on
Wholy Aromatic Compounds
Advantages Disadvantages
High strength and rigidity Anisotropy (strength, shrinkage) High heat resistance (high DTUL,
Low viscosity, high moldability Low weld strength high heat aging resistance)
Low shrinkage, low coefficient Soldering heat resistance
of linear expansion (flow direction) Flame retardance
High-speed setting, with less Low water absorbency
flash production. Chemical resistance

03
1.2 Grade Line-up
Brands and Special Features
There are 4 types of SUMIKASUPER LCP product : E5000, E4000, E6000 and E6000HF series, in order of increasing heat
resistance.
Table 1.1 shows the special properties of each product series and grade and Figure 1.5 depicts the relationships between
each of the different grades.
Table 1.1 Characteristic and Grade Line-up

Standard
DTUL Molding Transport
Typical Grade Filler Features (˚C) Temperature Restrictions
(˚C) (Classification)
Ultra high heat resistance
E5006L Glass fiber 355
/ Low coefficient of thermal expansion
E5008L Glass fiber 339
/ Low coefficient of contraction
List Controlled
E5000 Ultra high heat resistance 400
series E5008 Glass fiber 335 Items
/ Low coefficient of linear expansion
E5204L Glass fiber / Low coefficient of thermal expansion 351
/ Low Dielectric constant
E4000 E4008 Glass fiber High heat resistance / High strength 313 List Controlled
380
series E4006L Glass fiber High heat resistance / Low shrinkage 310 Items
E6000 E6006L Glass fiber High intensity 284 List Controlled
350
series E6008 Glass fiber High strength / High moldability 279 Items
E6007LHF Glass fiber High moldability / Low warpage 269
E6807LHF Glass fiber / Inorganic filler High moldability / Low warpage 269 Not List
E6000HF
series E6808LHF Glass fiber / Inorganic filler High moldability / Low warpage 274 350 Controlled
E6808UHF Glass fiber / Inorganic filler High moldability / Low warpage 240 Items
E6810LHF Glass fiber / Inorganic filler High moldability / Low warpage 266
Note: Some of the above grades are custom manufactured products.
Figure 1.5 Grade Line-up
Milled GF Chopped GF GF/Inorganic Standard processing

Series Series Filler Series temperature
High E5000 Series E5008 E5006L 400˚C

335˚C / 340˚C 355˚C / 350˚C
E5008L
339˚C / 340˚C
E4008 E4006L
E4000 Series 313˚C / 330˚C 310˚C / 335˚C
380˚C
Heat resistance
E6008 E6006L
E6000 Series 279˚C / 300˚C 284˚C / 300˚C
360˚C
E6007LHF E6807LHF Z
E6000HF Series 269˚C / 300˚C 269˚C / 300˚C
350˚C
E6808LHF Z
274˚C / 300˚C
E6808UHF Z
240˚C / 290˚C
E6810LHF Z
266˚C / 280˚C
Low Anisotropy Low shrinkage

Small
The temperatures under each grade indicate deflection under load and solder resistance (1 minute dipping)
respectively. For assistance in selecting the grade that is best for your application, please contact us.

04
2. Physical Properties
2.1 General Physical Properties
Table 2.1 General Physical properties of SUMIKASUPER LCP -A

E5000 Series E4000 Series
Item Test method Unit E5008L E5006L E5008 E5002L E5204L E4008 E4006L E4205L
Filler —
Glass Glass Glass Glass Glass fiber Glass Glass Glass fiber
— fiber fiber fiber fiber /inorganic fiber fiberr /inorganic
Standard molding temperature — ˚C 400 400 400 400 400 380 380 380
Specific gravity ASTM D792 — 1.69 1.6 1.69 1.45 1.21 1.7 1.6 1.18
Water absorption coefficient ASTM D570 % 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02
MD Sumitomo % 0.05 0.02 0.06 0.07 0.57 0.10 0.11 0.66
Mold shrinkage Chemical
TD method % 0.81 0.86 1.25 1.27 1.70 1.32 0.78 1.67
Tensile strength MPa 123 151 111 150 89 150 182 82
ASTM D638
Elongation at break % 3.7 4.5 4.8 4.7 5.5 5.0 5.6 5.0
23˚C MPa 127 152 127 127 93 139 155 85
Flexural strength ASTM D790
200˚C MPa 39 — 39 — — 39 47 —
23˚C GPa 13.4 14.2 12.2 9.51 6.96 12.3 11.9 5.60
Flexural modulus ASTM D790
200˚C GPa 6.37 — 5.88 — — 6.30 5.78 —
Izod impact 6.4t notched J/m 49 109 88 175 — 108 137 —

ASTM D256
strength 6.4t without notched J/m 324 382 441 480 343 520 461 309
Shear strength ASTM D732 MPa 53 — 50 — — 52 58 —
Poisson's ratio ASTM D785 — 0.44 0.48 0.41 0.51 — 0.49 0.48 —
Rockwell hardness ASTM D785 R scale 89 90 89 — 90 91 91 —
DTUL(1.82MPa) ASTM D648 ˚C 339 355 335 354 351 313 310 305
Soldering resistance Sumitomo Chemical method ˚C 340 350 340 350 — 330 335 —
Linear expansion MD Sumitomo 10 /K

–5
0.2 1.7 0.1 0.2 1.3 1.4 0.2 —
Chemical
coefficient (150˚C) TD 10 /K
–5
6 7.3 6.4 8.1 7.3 6.2 8.1 —
method
Limiting oxygen index JIS K7201 — 47 — 47 — — 48 44
flame class V–0 V–0 V–0 V–0 V–0 V–0 V–0 V–0
Flame retardancy color UL94 mmt ALL ALL ALL ALL NC,BK NC,BK NC,BK BK
thickness 0.3 0.3 0.3 0.3 0.29 0.3 0.3 0.3
Thermal conductivity JIS R2618 W/(m･K) 0.56 0.54 0.56 0.44 0.38 0.57 0.53 0.41
(10 Hz)
3
4.7 — 4.7 — — 4.5 4.4 —
Dielectric constant (10 Hz) 6
— 4.2 3.7 4.2 3.4 3.1 3.9 3.7 2.9
(10 Hz)
9
— 3.4 — 3.1 2.8 — — —
ASTM D150
(10 Hz)
3
0.013 — 0.015 — — 0.018 0.018 —
Dielectric tangent (10 Hz)
6
— 0.031 0.022 0.031 0.023 0.018 0.034 0.035 0.013
(10 Hz)
9
— 0.004 — 0.004 0.003 — — —
Specific volume resistance ASTM D257 Ωm 10 13
10 13
10 13
10 14
10 13
10 13
10 13
1013
Arc resistance ASTM D495 sec 128 — 128 — — 130 130 —
Tracking resistance IEC method V 185 — 175 — — 145 185 —

05
Table 2.1 General Physical properties of SUMIKASUPER LCP -B

E6000 Series E6000HF Series
Item Test method Unit E6008 E6006L E6109F E6007AS E6007LHF E6807LHF E6808LHF E6808UHF E6810LHF
Filler —
Glass Glass inorganic Glass fiber Glass Glass fiber Glass fiber Glass fiber Glass fiber
— fiber fiber /inorganic fiber /inorganic /inorganic /inorganic /inorganic
Standard molding temperature — ˚C 350 350 350 350 350 340 350 350 350
Specific gravity ASTM D792 — 1.7 1.61 1.8 1.63 1.65 1.67 1.7 1.72 1.82
Water absorption coefficient ASTM D570 % 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02
Mold MD Sumitomo % 0.18 0.19 0.25 0.31 0.20 0.11 0.17 0.22 0.13
shrinkage Chemical
TD method % 1.16 0.74 1.21 1.08 0.60 0.63 0.40 1.02 0.38
Tensile strength MPa 147 164 126 121 157 134 130 100 105
ASTM D638
Elongation at break % 5.2 5.0 5.5 6.8 5.1 4.5 4.5 5.0 4.0
Flexural
23˚C MPa 143 153 112 126 158 145 140 120 133
ASTM D790
strength 200˚C MPa 33 34 — — — 29 — — —
Flexural
23˚C GPa 12.3 11.3 11.5 9.80 11.8 12.1 12.5 9.40 12.6
ASTM D790
modulus 200˚C GPa 4.90 5.10 — — — 4.50 — — —
Izod impact
6.4t notched J/m 108 137 — — — 118 96 — —
ASTM D256
strength 6.4t without J/m 412 363 382 343 251 343 270 350 200
notched
Shear strength ASTM D732 MPa 51 55 — — — 53 54 — —
Poisson's ratio ASTM D785 — 0.46 0.45 — — — 0.41 0.40 — —
Rockwell hardness ASTM D785 R scale 103 103 91 — 106 101 97 96 102
DTUL(1.82MPa) ASTM D648 ˚C 279 284 270 274 269 269 270 240 266
Soldering resistance Sumitomo Chemical method ˚C 300 300 300 300 300 295 274 290 280
Linear
expansion MD Sumitomo 10–5/K 1.3 2.0 1.4 — 0.2 1.0 0.4 1.0 —
coefficient Chemical
(150˚C) TD method 10–5/K 5.6 8.9 7.8 — 8.5 6.3 8.1 6.2 —
Limiting oxygen index JIS K7201 — 48 42 — — 40 45 44 48 48
flame class V–0 V–0 V–0 — V–0 V–0 V–0 V–0 V–0
Flame
retardancy color UL94 mmt ALL NC,BK BK — ALL ALL NC,BK NC,BK NC,BK
thickness 0.3 0.3 0.81 — 0.3 0.3 0.3 0.3 0.3
Thermal conductivity JIS R2618 W/(m･K) 0.52 0.53 — — — 0.56 — — —
(103Hz) 4.4 4.3 — — — 4.3 — — —
Dielectric (106Hz) — 3.9 3.7 — — 3.8 3.8 3.8 3.8 4.1
constant
(109Hz) — — — — 3.5 — 3.6 3.4 3.8
ASTM D150
(103Hz) 0.022 0.023 — — — 0.024 — — —
Dielectric (106Hz) — 0.022 0.034 — — 0.026 0.03 0.038 0.033 0.02
tangent
(109Hz) — — — — 0.004 — 0.004 0.004 0.004
Specific volume resistance ASTM D257 Ωm 1013 1013 1013 104~11 1013 1013 1013 1013 1013
Arc resistance ASTM D495 sec 130 130 — — 124 180 140 132 181
Tracking resistance IEC method V 125 115 — — 175 150 190 200 200

06
2.2 Heat Resistance
Thermal Decomposition Temperature

SUMIKASUPER LCP possesses high thermal stability.
The results from a TGA (Thermogravimetric Analysis) (shown in Figure 2.1 and Table 2.2) indicate that the temperature of
thermal decomposition in nitrogen is quite high, being approximately 450°C, and the decrease in mass at a temperature of
500°C is extremely small (only 1%). Therefore, SUMIKASUPER LCP can be seen to exhibit high thermal stability.
Figure 2.1 TGA Curve Table 2.2 Thermal Decomposition Temperature

10
Decomposition temperature(°C)
E6006L Resin
1%weight loss Main decomposition
E6807LHF components
0 temperature temperature
E6008
E5008
520 559
Weight change (%)
E5008 E5008L
−10
E4008 E4008 520 555
E6008
500 550
E6006L
−20 PPS
PBT E6807LHF 500 550
PBT(GF-30%) 370 421
−30
PPS(GF-40%) 460 556
−40 Measuring instrument : TG50 model by Simadzu Seisakusho

200 300 400 500 600 700 Temperature ramp rate : 10°C/min
Temperature (˚C) Atmosphere : Under nitrogen
Deflection Temperature Under Load

The approximate deflection temperature under load for each grade of SUMIKASUPER LCP is as follows:
E5000 Series 330~360˚C

E4000 Series 310~320˚C
E6000 Series 270~290˚C
E6000HF Series 250~280˚C
Long-term Heat Resistance
SUMIKASUPER LCP possesses outstanding long-term heat resistance.

• UL Temperature Index
Table 2.3, below, indicates the relative temperature index values (UL746B) for SUMIKASUPER LCP.
Table 2.3 Relative Temperature Index Figure 2.2 Heat Aging Property of SUMIKASUPER LCP
（t=3.2mm）
(260°C in air)
Item 200
Grade Mechanical
Electric
With impact Without impact E4008
E5008 240 220 240 E6006L
E5008L 240 220 240 150
Tensile strength (MPa)
E4008 200 200 240 E6008

E6807LHF
E6008 220 200 240
100 E5008
E5008L
• Heat Aging Resistance (260°C).
Figure 2.2 depicts the strength retention characteristics of
SUMIKASUPER LCP in an atmosphere having a
50
temperature of 260°C.
0
0 500 1000 1500 2000 2500
Aging time (hr)

07
Continuous Service Temperature
Figure 2.3 Continuous Service Temperature and DTUL
300
SUMIKASUPER LCP
E5000 Series
PTFE polyimide
Polyamid
PEEK imide PEEK-GF
Continuius temperature (°C)
200 SUMIKASUPER LCP

E6000 Series
PPS-GF
PES Fluoline
PEF co-polymer GF
PAR
Meramne/Epoxy
Modified PBT
PPO GF
100
Acetal Nylon GF
PC
Nylon PC
GF GF-reinforce
50
ABS grade
0 100 200 300

DTUL 1.82MPa (°C)
Soldering Heat Resistance

SUMIKASUPER LCP possesses the highest soldering heat resistance among all heat-resistant engineering plastics.
Solder bath temperature (˚C)
220 240 260 280 300 320 340 360
E5000 Series >60 5
10
SUMIKASUPER LCP E4000 Series >60
10
E6000 Series >60
10
PEEK 450GL30 >60 3
GF40% >60 5 3
PPS
High filler content 10
>60 1
Dimensions of specimen : JIS K7113 1(1/2) dumbbell 1.2mmt,

Solder : H60A (Tin60%, Iead40%)
* The values within the above graph represent the limit, in seconds (">60" means the product
will not deform, even when soaked in a solder bath for 60 seconds).
Blistering may occur, even in temperatures less than the above deformation temperatures,
depending upon the molding conditions.

08
2.3 Mechanical Properties
Thickness dependence of moldings

The molecules of SUMIKASUPER LCP are easily oriented due to shearing forces at the time of melting. The thinner the
walls of moldings, the greater the percentage of the skin layer. This skin layer has a very uniform molecular orientation,
therefore providing greater relative strength per area of cross section. Table 2.4, Figure 2.4 and Figure 2.5 show the strength
dependant on specimen thickness, for each type of SUMIKASUPER LCP.
Table 2.4 Strength Dependant on Specimen Thickness

Property Thickness (mm) E5008L E5008 E4008 E6008 E6006L E6807LHF
0.5 151 161 178 199 215 174
0.8 151 139 171 184 194 161
Tensile Strength(MPa) 1.2 135 119 158 164 172 145
1.6 132 113 131 149 160 137
0.5 2.4 2.9 3.0 3.0 2.4 2.5
0.8 2.7 3.1 3.7 3.5 2.8 3.0
Tensile Elongation( % ) 1.2 2.8 3.3 4.1 4.0 3.4 3.5
1.6 3.1 3.5 4.5 4.2 3.7 3.8
0.5 18.6 17.6 19.5 18.6 21.7 18.4
0.8 16.1 15.4 17.1 16.5 15.8 14.2
Tensile Modulus(GPa) 1.2 14.1 12.4 13.4 12.4 12.2 11.5
1.6 11.6 11.0 10.8 11.0 9.8 9.8
Molding Temperature (°C) 400 380 350 340
Molding Machinery : PS40E5ASE, Nissei Plastic Industrial Test Piece : No.1 (1/2), JIS K7113 Dumbbell piece
Figure 2.4 Strength Dependant on Specimen Thickness Figure 2.5 Diagram of Skin / Core
250
E6006L Skin layer (Higher oriented, Higher strength)
E6008 Core layer (Lower oriented, Lower strength)
200
E4008 Thickness of test piece : thin
E5008
E6810
150
Tensile strength : high
100
PES (no reinforcement)
50
PBT (no reinforcement)
0
0 0.5 1.0 1.5 2.0
Test plate thickness (mm)
Anisotropy of Physical Properties

Table 2.5 shows the anisotropic characteristics of SUMIKASUPER LCP.
It is apparent that the values for the flow direction (MD) differ greatly from the values perpendicular to the flow direction (TD)
(Table 2.5). Please ensure that the gates are positioned properly when designing molds used in the injection molding process.
Table 2.5 Anisortopy of Physical Properties
Item Unit Measurement
directon E5008L E5008 E4008 E6008 E6006L
% MD 0.05 0.06 0.10 0.18 0.19
Mold shrinkage
% TD 0.81 1.25 1.32 1.16 0.74
MPa MD 137 130 138 136 156
Flexural strength
MPa TD 58 56 57 61 92
GPa MD 13.4 12.6 12.7 12.2 11.4
Flexural modulus
GPa TD 3.7 3.3 3.0 4.4 4.7
Molding : 64 x 64 x 3mmt 1mmt film gate
Test specimen : 13w x 3t x 64l mm
Span : 40mm
Injection molding Mchine : Nissei Jushi Kogyo PS40E5ASE type

09
Weld Strength
In general, liquid crystal polymers have high anisotropy and a rapid solidification speed, thus tend to have lower weld
strength (Figure 2.6). The appropriate design is of critical importance when producing molds.
Figure 2.6 Weld Strength of SUMIKASUPER LCP

120 Weld
Non-weld (flow merge section)
Weld1
100
Weld2
Flexural strength (MPa)
80
film gate
60
1mmt
Dimention : 64×64×3mmt
40
Hole diameter : 6mmØ
20
0
E5
E4
E6
E5
E6
E6
00
00
00
00
00
80
8
8
8L
6L
7L
H
F
Temperature Dependence of the Flexural Modulus

The elastic modulus of liquid crystal polymers, such as SUMIKASUPER LCP, does not decrease at the glass transition point
as greatly as that of crystalline or amorphous polymers. Rather, the elastic modulus tends to decrease gradually as the
temperature rises. All of the SUMIKASUPER LCP series products possess effective flexural modulus, even at a temperature
of 250̊C, thus are ranked highest among all heat resistant engineering plastics (Figure 2.7). In addition, performing heat-
treating of the moldings enhances the strength of their skin layers, thus improving the elastic modulus. Heat treatment also
improves the overall strength, deformation temperature and creep resistant of moldings, in addition to the elastic modulus.
Figure 2.7 Temperature Dependence of Flexural Modulus
10
PES (30% GF content)

Flexural modulus (GPa)
5 E5008
E4008
PPS E6008
E6006L
PES
PSF E6807LHF
PC
0
0 100 200 300
Temperature (°C)

10
Recyclability
Mixing 30% recycled SUMIKASUPER LCP to virgin material, a slight degradation of overall strength can be observed in the
initial few recycling periods. However, after being recycled for a third time, almost no changes are observed, and strength
retention is over 90% (Figure 2.8). In addition, the value of shrinkage does not change significantly (Figure 2.9).
Please consult with us in the event that the usage of recycled products must be greater than 30%.
Figure 2.8 Relation between Number of Repetition of Recycling and Retention of Tensile Strength
100 100
Retention of tensile strength (%)
Retention of tensile strength (%)

80 E4008 30% recycle 80 E6006L 30% recycle
E5008 30% recycle E6008 30% recycle
60 60
40 40
20 20
0 0
0 1 2 3 4 5 0 1 2 3 4 5
Repetition of recyclling Repetition of recyclling
Figure 2.9 Relation between Number of Repetition of Recycling and Mold Shrinkage
E4008 30% recycle E6006L 30% recycle

E5008 30% recycle E6008 30% recycle
1.5 1.5
Mold shrinkage (%)
Mold shrinkage (%)
TD
TD
1.0 1.0
0.5 0.5
MD
MD
0.0 0.0
0 1 2 3 4 5 0 1 2 3 4 5
Repetition of recyclling Repetition of recyclling

11
2.4 Flame Retardancy

SUMIKASUPER LCP possesses excellent flame retardancy without any flame retardant agents. In addition, the gases
produced as a result of combustion are mainly carbon dioxide and water.
• UL Standards
Each SUMIKASUPER LCP series product has been certified as "V−0" at 0.3 mm (t).
• Limiting Oxygen Index
SUMIKASUPER LCP possesses the highest limiting oxygen index (LOI) among all engineering plastics.
60 Amorphous polymer Crystalline polymer Liquid crystalline polymer
E5000 E4000 E6000

50 PEI Series Series Series
PPS
PAI
PES PEEK
40 PAR
LOI (%)
PSF
30
PC
20
10
2.5 Electrical Properties

Liquid crystalline polymer products all possess low, stable values for the dependence of dielectric constant and dielectric
dissipation factor on temperature and frequency. However, the absolute values for these properties are higher than those of
other engineering plastics (Figure 2.10 and Figure 2.11). In other words, although heat generation tends to be greater at
higher frequencies, this does not cause problems during actual usage, due to the extremely high deflection temperature
under load. Moreover, the dielectric dissipation factor for liquid crystal polymers is low within the GHz region.
Figure 2.10 Temperature Dependence of Dielectric Tangent Figure 2.11 Frequency Dependence of Dielectric Tangent
0.1 0.1
Dielectric tangent (60Hz)
PPS PC E6008
Dielectric tangent (23°C)
E4008
E4008 E6008 PET PES
0.01 0.01 PC
E5008L
E5008L PES
0.001 PPS
0.001
PSF
0.0001 0.0001
0 50 100 150 200 250 0 102 104 106 108 1010
Temperature (°C) Frequency (Hz)
Table 2.6 Electric Characteristics

Item Test Method Unit E5008L E5008 E4008 E4006L E6008 E6006L E6807LHF
Filler − Glass Glass Glass Glass Glass Glass Glass fiber/
fiber fiber fiber fiber fiber fiber Inorganic
10 Hz 3
4.7 4.7 4.5 4.4 4.4 4.3 4.3
Dielectric constant 106Hz 4.2 4.2 3.9 3.7 3.9 3.7 3.8
109Hz* − − − − 3.3 3.2 −
ASTM D150 −
103Hz 0.013 0.015 0.018 0.023 0.022 0.023 0.020
*Dielectric tangent 10 Hz6
0.031 0.031 0.034 0.034 0.032 0.034 0.030
109Hz* − − − − 0.005 0.005 −
Specific volume resistance ASTM D257 Ωm 1013 1013 1013 1013 1013 1013 1013
Dielectric Breakdown voltage Short time method MV/m 37 >40 36 >40 26 39 −
Electric arc resisrance ASTM D495 sec 128 128 130 130 130 130 180
Tracking resistance IEC method V 185 175 145 135 125 115 150
*Measurement method : Resonant Cavity method

12
2.6 Other Characteristics
Evolved Gases from Moldings
When SUMIKASUPER LCP moldings are heated, extremely low amounts of gases are generated, as is shown in Figure 2.13.
Figure 2.12 Mehtod of Analysis of Gas Generation from the Moldings
120˚C×20hr Head space

gaschromtograph chart
Moled product Sealed in glass bottle (~5g) Head space gaschromtograph

(Dumb-bell)
Figure 2.13 Amount of Gas Generation from SUMIKASUPER LCP

100
80
PBT
Generated gas volume (ppm)
60 PPS
40
E5008
20
E6008 E4008
Analysis device : Head space gaschromatograph
0
200 250 300 350 400 450 Specimen pre-treatment conditions : 120°C , 20hr heating
Molding temperature (˚C)
Water Absorption
SUMIKASUPER LCP shows very low water absorption of only 0.02%.

As well, even if left in water over extended periods of time, almost no changes in weight or dimensions will be observed
(Figure 2.14).
Figure 2.14 Changes in Weight and Dimensions due to Water Absorption (E6008)
0.05 0.05
0.04 E6008 0.04

Dimension change (%)
Weight change (%)
0.03 0.03
Weight change
0.02 0.02
Dimension change
0.01 0.01
0 0 Test piece : 64x64x3t mm

0 50 100 150 200 250 300
Water immersion time (hr)

13
Chemical Resistance
The table below shows data on chemical resistance for SUMIKASUPER LCP. SUMIKASUPER LCP possesses outstanding
chemical resistance and will not expand or deteriorate when exposed to oils, even at high temperatures.
However, the evaluation of effects should be conducted on actual moldings prior to usage.
Table 2.7 Chemical Resistance
Condition SUMIKASUPER LCP

Chemical name
Temperature (°C) Time Evaluation
Evaluation : ?=Reduction of tensile strength 5% or less Change of weight 2% or less

×=Not usable.
Hot Water Resistance
SUMIKASUPER LCP still demonstrates effective levels of strength, even after 2000 hours of soaking in hot water, at a
temperature of 80°C. However, when exposed to steam at temperatures of greater than 120°C, hydrolysis begin to occur,
causing large strength degradation and rendering the product unusable.
Figure 2.15 Hot Water Resistance (80°C)

Maintenance of strength by percentage (%)
100
E4008
80
E6008
60
40
20
0
0 50 1000 1500 2000
Immersion time (hr)

14
3. Injection Molding / Fabricating
3.1 Moldability
Figure 3.1 and Figure 3.2 shows the shear rate dependence and the temperature dependence, respectively, of the apparent
melt viscosity, for SUMIKASUPER LCP products. As compared to other engineering plastics, SUMIKASUPER LCP possess
both high temperature dependence and high shear rate dependence, on apparent melt viscosity. Under the appropriate
injection molding conditions, these products exhibit low viscosity.
Figure 3.1 Shear Rate Dependency of Apparent Melt Viscosity
103
Apparent viscosity (Pa.sec)
PBT (GF30%) 260°C

102 PEEK (380G) 400°C
PES (3600G) 360°C
PPS (GF40%) 320°C
E5008 (400°C)
E6008 (350°C)
E6006L (350°C)
E4008 (380°C)
E6807L (340°C)
10
102 103 104 105
Shereing speed (sec−1)
Figure 3.2 Temperature Dependency of Apparent Melt Viscosity
104
Shearing speed103sec−1
E6008 / E6006L
Apparent viscosity (Pa.sec)
103 E6807LHF
E5008
E4008
PES
PBT
PPS PEEK
102
10
250 230 350 400 450
Temperature (˚C)

15
The moldability of each grade was measured, using the mold shown in Figure 3.3. Figure 3.4 depicts the thin-wall section
moldability (thickness of 0.2, 0.3mm) for each grade and Figure 3.5 indicates the bar flow length 1mm thickness.
Figure 3.3 Mold for Thin-wall Flow Length Measurement

10 10 10 15
46
Specimen thickness : 0.3mm
Runner : 4.0mmφ
Gate : 0.3t 1.5w 2.0L
2 Flow length is the average of 4 cavities.
Gate 1.5
thickness Specimen thickness : 0.2mm
Runner : 3.0mmφ
Runnner Gate : 0.2t 1.5w 2.0L
Flow length is the average of 4 cavities.
Sprue
Figure 3.4 Thin-wall Moldability

50 50
40 40
E6008
E6807LHF
0.3mmt Flow length (mm)
0.2mmt Flow length (mm)
E6807LHF E6006L
30 30 E4008
E6008 E5008
E6006L
E4008
20 E5008 20
10 10
PPS (GF40%) PPS (GF40%)
0 0
250 300 350 400 450 250 300 350 400 450
Temperature (°C) Temperature (°C)
Molding machine : Nissei Jushi Kogyo PS10E1ASE

Injection pressure : 0.2mmt : 90MPa
0.3mmt : 60MPa
Injection speed : 0.2mmt : 95%
0.3mmt : 60%
Mold temperature : 130°C
Figure 3.5 Flow length of Various Types of Engineering Plastics

500
E6008 E4008 E5008L
400
1mmt Flow length (mm)
300
200
PBT
100 PPS PEEK381G
PES3600G
PES3601GL20 PEEK450GL30
PC
0
250 300 350 400 450
Temperature (°C)

16
3.2 Injection Molding Conditions
General Molding Conditions
E5000 E4000 E6000 E6000HF

Series Series Series Series
Temperature about 130°C
Pre−drying
Time 4 to 24 hours
Rear 350~370 330~350 280~320 280~320
Center 370~390 350~370 320~350 320~340
Cylinder temperature (°C)
Front 390~410 370~390 340~370 340~360
Nozzle 390~410 370~390 340~370 340~360
Suitable resin temperature (°C) 400 380 360 350
Tool Temperature (°C) 40~160
Injection pressure (MPa) 120160 80~160
Hold pressure (MPa) 40~60 20~40
crew back−pressure (MPa) 1~5
Injection speed Middle~High
Screw revolution (rpm) 50~100
If the cylinder temperature setting differs from the actual resin temperature, then LCP product molding must occur
at the actual resin temperature.
Pre−drying
It is not necessary to dry SUMIKASUPER LCP for a long time, as it has extremely low water absorption of 0.02%. In
general, the drying time required is between 4 hours and 24 hours, when a hopper dryer is utilized at a temperature of
approximately 130°C.
Molding Temperature
Figure 3.6 Tensile Strength Dependency on Figure 3.7 Mold Shrinkage Dependency on
Molding Temperature Molding Temperature
160 1.5
E6008 E4008
E4008
140 E5008
E6008
120
E5008
Mold shrinkage rate (%)
1.0
100
80
60
0.5 TD
40 MD
E6008 E4008
20
E5008
0 0.0
280 300 320 340 360 380 400 420 440 280 300 320 340 360 380 400 420 440
Molding temperature (°C) Molding temperature (°C)
Tool Temperature : 130°C

Injection pressure :ca. 130MPa (ca. 1300kg/cm2)
Injection speed : Medium
The temperatures for the front of the cylinder and the nozzle area must be set as follows; 390~410°C for the E5000 series;
370~390°C for the E4000 series; 340~370°C for the E6000 series; and 340~360°C for the E6000HF series. The tempera-
tures of these areas should not be greater than these values, as resin will tend to backflow toward the hopper during
injection. In particular, when molding products that have complex shapes requiring high moldability, or when molding
products with a high L/T, the temperature of the nozzle area must be set higher than that of the front cylinder area. Further-
more, if the metering time does not stabilize, decrease the temperature at the rear of the cylinder by 10~20°C. As proper
control of nozzle temperature is extremely important, ensure that the temperature adjustment sensor is correctly positioned
and that the appropriate temperature is always maintained.
If a discrepancy exists between the nozzle temperature setting and the actual resin temperature, then molding must be
controlled at resin temperature.
In order to ensure consistent physical properties of SUMIKASUPER LCP, the ideal molding temperature for each product

17
Mold Temperature
As the molecules of SUMIKASUPER LCP are rigid, there does not happen the entanglement of each molecular. The
polymer chains become oriented in the flow direction due to shearing forces at the time of molding. In addition, as solidifica-
tion occurs extremely rapidly, this orientation is maintained throughout the setting process. Therefore, the mechanical
properties are only slightly affected by the temperature of the mold.
When molding thin−walled products and when greater importance is placed on the molding cycle, the tool temperature
should be set to 70~100°C. When the weld strength and moldability of thin−walled products is to be considered, it is
recommended that the temperature be set to 120~150°C. When priority is placed on surface smoothness of moldings, it is
recommended that the temperature be set to 160~190°C.
Figure 3.8 Mold Temperature vs Physical Properties
170 6
150 E4008 E6008
Tensile elongation (%)

E6008 E4008
E5008
130
110 E5008
90 3
0 50 100 150 200 0 50 100 150 200
Mold temperature (°C) Mold temperature (°C)
Deflection temperature under load 1.82MPa (℃)
360
15
E4008
E5008
E5008
E6008 320 E4008
Flexural modulus (GPa)
10
E6008
280
5
240
0 200
0 50 100 150 200 0 50 100 150 200
Mold temperature (°C) Mold temperature (°C)
Injection Pressure and Injection Speed

SUMIKASUPER LCP does not require high injection pressures, as it possesses low melt viscosity and high moldability.
Using the E6000 series products as an example, raising the molding temperature to 350°C or greater enables the products
to demonstrate adequate moldability, even under a low pressure of approximately 40 MPa. In addition, even if injection
pressures are changed through the range from 65-160 MPa, changes to resulting tensile strengths are minimal.
The ideal injection speed for products having thin walls and complex shapes is a medium to high speed. However, when
molding products that have thicker walls where weld sections are critical, a medium to low speed of 20-40 mm/sec is
recommended for use, along with the consideration of air venting within the mold.

18
Purging Methods
Purging methods for SUMIKASUPER LCP are explained here.
Recommended purging agents : Amte Clean AP series [manufactured by Amtec corporation]
The following precautions must be taken when performing purging operations:
• Please note that E4000 and E5000 series grades require high processing temperatures, thus may cause fuming, gas
emission and resin scattering.
• Ensure that none of the purging agent is left in the cylinder.
When Using the Same Grade
1 End of molding Shoot out all remaining resin (from within both hopper and cylinder).
2 Feeding of purging agent Perform purging while maintaining the cylinder temperature at the molding temperature.
3 Continuation of purging Set the cylinder temperature to a temperature 20-30°C lower than the molding temperature.
4 Displacement of resin As soon as all purging agent has been shot out, immediately feed in the SUMIKASUPER LCP, to
displace the cylinder contents with SUMIKASUPER LCP.
5 End of operation Turn OFF the power. (It is OK to power down while the temperature is decreasing.)
6 Resumption of operation Turn ON the power.
Set the cylinder temperature to a temperature 20-30°C lower than the molding temperature.
7 Pre-purging Perform purging using SUMIKASUPER LCP (5 shots) at a cylinder temperature that is 20-30°C lower
than the molding temperature.
8 Start of production Raise the cylinder temperature to the molding temperature.
Note) When using different colored resins from the same LCP grade, please omit the above procedures 5, 6 and 7.
Switching to SUMIKASUPER LCP
1 End of molding Shoot out all preceding resin (from within both hopper and cylinder).
2 Raising of cylinder temperature Set the cylinder temperature to a temperature 20-30°C lower than the molding temperature for
SUMIKASUPER LCP.
3 Feeding of purging agent As soon as the temperature has risen to the above temperature setting, immediately begin feeding
the purging agent.
(Note) Once the temperature has increased, ensure that the rotation prevention mechanism does not
become actuated.
4 Displacement of resin As soon as all purging agent has been shot out, immediately feed in the SUMIKASUPER LCP, to
displace the cylinder contents with SUMIKASUPER LCP.
5 Resumption of operation Set the cylinder temperature to the molding temperature for SUMIKASUPER LCP.
6 Start of production After the cylinder temperature has risen, purge with at least 5 shots of SUMIKASUPER LCP prior to
starting production.
Flashing Defect
SUMIKASUPER LCP produces minimal level of flash. This property makes it Figure 3.9 Tool for Evaluation of
suitable for the molding of compact electronic components that have thin Flash Properties
10 5
walls.
Figure 3.10 depicts evaluations of flashing defect for SUMIKASUPER LCP,
using the tool shown in Figure 3.9. Figure 3.10 indicates both narrow and
broad molding window (i.e., areas where short shots defect and flashing 36 Air vent (20μmt)
defect occur).
SUMIKASUPER LCP has a broad “molding window” where short shots defect
and flashing defect do not occur. However, with PPS and PBT, flash is often 10
Product thickness (0.5mmt)
occurred and the molding window is quit narrow when molding thin-walled
1 Gate thickness (0.3mmt)
products.
Figure 3.10 Flash Properties of Various Engineering Plastics (0.5/0.3mm Double Thicknesses)
[a] SUMIKASUPER LCP E6008 [b] PPS (40%) [c] PBT (30%)
90 90 90
80 80 80
Injection speed (%)
Injection speed (%)
Injection speed (%)
70 70 70
60 Barrs 60 Barrs 60 Barrs
50 Good 50 50
moldability
40 40 40
range
30 30 30
20 Short short 20 Short short 20 Short short
10 10 10
40 2060 80 40 20 60 80 20 40 60 80
Injection pressure (%) Injection pressure (%) Injection pressure (%)
Molding machine : JUshi Kogyo PS10E1ASE Injection speed : 32cm2/sec. Injection pressure : 100%=2015kg/cm2

19
3.3 Design of Injection Molding Machine and Tools
Selection of Injection Molding Machinery
SUMIKASUPER LCP can be molded using both the standard inline type and plunger type (ram fed) of injection molding
machines. Since the molding temperatures for the E4000 and E6000 series are <400°C, there are no problems with heater
capacity, even when standard injection molding machine is used. However, as the E5000 series requires a higher molding
temperature (up to 420°C), high temperature machine is required (specifications for handling 450°C).
Screws and Cylinders

• As the filler content of SUMIKASUPER LCP is quite high, it is preferable that materials with good abrasion resistance be
used.
• It is preferable that standard full flight screws be used. Sub-flight screws and high mixing screws are not recommended for
usage, as metering time will be extended.
It is recommended that screw heads with backflow prevention (check valve) be utilized.
• The moldability of SUMIKASUPER LCP is sensitive to temperature. Therefore, as the PID control method provides good
controllability, this method is recommended for the control of cylinder temperature.
Nozzles
• Nozzle materials must be suited to the particular screw and cylinder utilized.
• Open nozzles should always be used. Shut-off nozzles should not be used, as they have excessive dead space that can
trap and retain resin.
• The nozzle heaters used must have independent temperature control employing the PID control method. The PID control
method provides good controllability.
• When extension nozzles are used, they should be designed with consideration for consistent temperature distribution.
Injection Unit and Control System
• Both standard open loop control and closed loop control types of molding machines can be used for SUMIKASUPER
LCP.
• For molding thin-walled products, it is preferable to use a molding machine that possesses superior response for the initial
injection, as SUMIKASUPER LCP sets rapidly and possesses high shear rate dependence for melt viscosity.
Molding Machine Capacity
• In general, the best results are obtained from molding machines that are capable of continuously metering 1/3 - 3/4 of the
total injection capacity. If there is insufficient continuous metering capability, then excess remaining resin may cause
various molding defects.
Resin Temperature Control

For most LCPs’, including SUMIKASUPER LCP, the physical properties, such as mechanical characteristics and melt
viscosity, are highly dependent upon molding temperature. Therefore, unless temperatures are controlled correctly, the
desired physical properties may not be obtained. Injection molding machines are usually designed in a manner such that the
temperature of resin inside the cylinder and the cylinder temperature setting can equalize easily, for the molding tempera-
tures used by general-purpose resins (-30°C). However, within the higher molding temperature range of SUMIKASUPER
LCP (320-400°C), a temperature differential may occasionally occur between the temperature setting and the resin tempera-
ture.
For the above reason, in order to achieve the best performance from SUMIKASUPER LCP, the operator must have a
thorough understanding of resin temperatures inside the cylinder. The temperatures for each grade of LCP product must be
controlled accurately, in order to
maintain the resin at its optimum
The temperature of the strand shoud Molding machine nozzle
temperature.
The abovementioned resin tempera- be measured as clos as sossible to
the nois.
ture can be easily measured using a
(An accsurate temperature reading
spot type non-contact infrared will not be obtained if measured away
radiation thermometer that enables from the nozzle.)
the measurement of temperatures for
minute areas (The measurement
spot size should be smaller than the
351
diameter of a strand). ℃
Non-contact infrared radiation thermometer

Spot type (<φ2.5)
*Emissivity is set to 0.86

20
High-speed Injection Molding Technology
SUMIKASUPER LCP possesses special low flash production characteristics. Flash is not readily produced during molding
due to the low melt viscosity and rapid speed of setting. However, during the molding process for ultra thin-walled products
(<0.2mmt), resin does set in areas that contain very thin walls, thus hindering the achievement of sufficient flow length in
certain products. To remedy this situation, a molding machine should be utilized that possesses superior response capability
for the initial injection; such as equipment that an accumulator is installed.
Figure 3.11 Maximum Flow Length which Figure 3.12 Comparison of Pressure Wave Form
Accompanies No Flash (0.2mmt)
High speed Conventional
molding machine molding machine
30 100
Flow length (mm)
20
Speed (mm/sec) 50
10
0 0
High speed Conventional 0 0.1 0.2 0.3 0.4
molding machine molding machine Time (sec)
Hydraulic injection molding machine : (As shown above, when compared to Conventional molding machine, the high
UH-1000 (Nissei Jushi Kogyo) speed molding machine provides the high injection speed in the initial period
SG series (Sumitomo Juki Kogyo) and thereafter molding is performed at the specified injection speed.)
Power driven injection molding machine : Flow length measuring mold : The one shown in Figure3.13 is used.
Roboshot α-C series (Fanac) Molding temperature : 360°C
Panajection PJ-30 (Matsushita Densan) Grade used : E6008
High speed molding machine : Nissei Jushi Kogyo UH-1000
Injection speed 600mm/sec
V-Pchange over pressure : 60MPa
Conventional molding machine : Nissei Jushi Kogyo PS-40E5 ASE
Injection speed 90%
Injection pressure 90MPa (ca.900kg/cm2)
Mold Design
Injection molding, which is the process under share, causes the orientated molecules of SUMIKASUPER LCP to the flow
direction. elastic modulus, but also anisotropic properties.When designing tools, both flow patterns and anisotropy within
cavities, must be considered carefully.
Sprue
• The appropriate angle for use when drawing out the sprue is 1°-2°(per
side).
• In order to allow for the removal of cold slug, a cold slug well (4-5mmφ
x5mm or more) should be installed at the end of the sprue.
• A sprue lock should be installed in order to provide better sprue removal.
Undercut Spin spurue lock Taper
Runner
• Standard runners having either a circular, semicircular or trapezoidal cross-sectional shape can be utilized. However, it is
recommended that runners having a circular or trapezoidal cross-sectional shape be utilized, as they are most efficient in
terms of pressure loss and processability.
As SUMIKASUPER LCP possesses outstanding moldability, runner diameters can be decreased.
Standard runner diameter : 2-5mmφ
Guideline for runner diameters : 2/3-1/2 of that used for PPS and PBT (smallest : 2mmφ)

21
Figure 3.13 Tool to Measure Thin-Wall Figure 3.14 Runner Diameter Dependence
Flow Length
Injection pressure : 90MPa
10 10 10 15 50 Product thickness : 0.3mm
Injection temperature : 95%
40 Molding temperature
5
Fluidity at thin-wall section (mm)

E5008 400˚C
E6008 360˚C
30
46
20
PBT (GF30%) 260˚C

2
10 PPS (GF40%) 320˚C
Gate 1.5 Linear PPS (GF40%) 320˚C
thickness PES (GF20%) 360˚C
0
Runnner Runner diameter 2φ 2φ 3φ 4φ (mm)
Semi-circular
Gate thickness 0.2 0.2 0.2 0.3 (mm)
Sprue
Moldings wall thickness : 0.3mm, flow length is
the average of 4 cavities.
• When using multi-cavity tool, it is recommended that runners be correctly balanced so that individual cavities will fill
simultaneously with resin.
• Cold slug wells should also be installed at the ends of runners.
Gate
• As the weld strength of SUMIKASUPER LCP is lower than that of
other engineering plastics, it is necessary to ensure that gate
Width
locations are limited to only 1-2 places, in order to avoid the
formation of welds.
• Side Gates Land < 1mm
The appropriate land length is 1 mm or less, with a width of no Depth

PL
more than 5mm. Guidelines for land depths are 0.7x the thickness
of the molding, with a minimum depth of 0.2mm.
• Pinpoint Gates
The appropriate gate diameter ranges from 0.3-1.5mm, with a land
d
length of up to 1mm.
Runner d=0.3~1.0mm
If the gate diameter is increased, stringing and gate warpage may
φ=45~60°
occur.
• Submarine (Tunnel) Gates
Although the utilization of film gates and ring gates is possible, they φ
are not commonly used in LCP molding.
Extraction Taper
• The ideal angular ranges for the extraction taper are: 0.5°(1/90) -1°(1/60) for thin-walled moldings; and 1°(1/60) -2°(1/30)
for thick-walled moldings.
• Using MR grades, moldings can be released from tool easier than general grades. The releasing force with MR grades is
nearly the half of that with general grades However, the extraction taper must be enlarged when molding products that
have greater depths.
Air Venting (Gas Drainage)

• As SUMIKASUPER LCP is often molded under high-speed injection molding conditions, the installation of mold air venting
is recommended, in order that the air remaining in the mold can be discharged effectively.
• When welds occur in thin-walled products or at the ends of the flow, short shots defect tend to occur. Therefore, it is
recommended that air venting be installed to remedy this problem.
• SUMIKASUPER LCP has low melt viscosity and excellent moldability. However, as solidification occurs extremely rapidly,
flash defect will not occurred easily, even with the installation of air venting.
• The recommended depth for air vents ranges from 0.005-0.02mm.

22
Anisotropy (Mold Shrinkage)
• As the difference between molding direction (MD) and transverse direction (TD) properties (anisotropy) has a substantial
effect on LCP mold shrinkage, the mold shrinkage must be specified for the correctable direction, based on the mean
value of the MD and TD values.
• For compact size and / or thin-walled molding, it is recommended that the design shrinkage be specified as 0% in the
molding direction (MD).
Table 3.1 Anisotropy

Item Thickess Direction Unit E5008L E5008 E4008 E6008 E6006L
MD % 0.05 0.08 0.10 0.18 0.19
3mm
TD % 0.81 1.25 1.32 1.16 0.74
Molding shrinkage
MD % 0.13 0.05 0.06 0.09 0.10
1mm
TD % 0.43 0.70 0.78 0.80 0.49
MD MPa 137 130 138 136 156
Flexural strength 3mm
TD MPa 58 56 57 61 92
MD GPa 13.4 12.6 12.7 12.2 11.4
Flexural modulus 3mm
TD GPa 3.7 3.3 3.0 4.4 4.7
Figure 3.15 Mold Shrinkage Rate of E6008 Figure 3.16 Mold Shrinkage Rate of E5008
1.4 1.4
3mmt 3mmt
1.2 1.2
Molding shrinkinkage rage (%)
Transverse Transverse
Molding shrinkinkage rage (%)
1.0 1.0
direction 1mmt direction
0.8 1mmt 0.8
0.6 0.6
0.4 0.4
Flow (machine) 3mmt Flow (machine)
0.2 direction 0.2 direction
3mmt
1mmt
1mmt
0.0 0.0
0 20 40 60 80 100 0 20 40 60 80 100
Holding pressure (MPa) Holding pressure (MPa)
Tool Material
• The standard grades of SUMIKASUPER LCP contain glass fiber as filler. Therefore, for tools that require high dimensional
accuracy, as well as for those used in mass production, tools should be made of a steel alloy with rigidity equivalent to
SKD11 and a hardness of HRC55 - 62 (i.e., HPM31, PD613 and RIGOR).
• As SUMIKASUPER LCP emit almost no corrosive gases, mold corrosion does not occur, thus general-purpose tool
material can be used.

23
Usage of Hot Runners
The following precautions must be observed when using hot runners:
During long-term continuous molding, some resin will generally tend to remain within the dead spaces of the molding
machine and hot runner manifold. This residual resin deteriorates and may cause discoloration. Due to its extremely low
melt viscosity, LCP will tend to remain within these dead spaces.
In order to address this deficiency with LCP, the use of hot runners is recommended. In particular, it is important to ensure
that residual resin does not accumulate, in order to prevent the occurrence of black specks and cold slag.
Precautions for the Usage of Hot Runners with SUMIKASUPER LCP

• The system must be capable of producing high levels of heating with a uniform temperature distribution.
Heater: an integrated type of heating unit is preferable. The manifold and nozzle temperatures should not be maintained
at too high. The areas coming into contact with the tool (gate areas) must be maintained at high temperatures.
Temperature specification of hot-runner (MAX)

E6000 Series ~380°C
• The hot runner layout must be as free as possible from dead space within the flow channels.
(To avoid resin retention and the resulting production of black specks.)
External heating should be used, rather than internal heating, and the use of narrower flow channels will help to reduce
the creation of dead space.
• The hot runner layout should be designed such that cold slag cannot easily mix into the hot resin.
(To avoid cold slag being contaminated into the molding.)
When using open gates, it is recommended that the installation of sub-runners be considered (sprue-less molding).
Usage of Hot Runners
The table below provides details of hot runner usage for SUMIKASUPER LCP.
Table 3.2 Hot Runner Usage for SUMIKASUPER LCP
Application to
Runner section Gate seal SUMIKASUPER LCP
Remarks
ON,OFF ON,OFF
Internal External Thermally Complete Sprue-less
at every at every
heating heating constant hot-runner molding
heat shot heat shot
φ4
Juuo614 system Electromagnetic
Meisei Kinzoku induction heating
Mini-Runner
Seiki Kogyo
B type
Spear (conventional)
System
EH type
Mold Master
Master Shot
Saito Koki
Plagate System

24
3.4 Fabricating
Adhesion
SUMIKASUPER LCP can be bonded using the off-the-shelf adhesives (Table 3.3), without requiring any particular surface
treatment. The surface bond retains its effective strength, even after being heat aged at a temperature of 250°C. Moreover,
although crystalline resins, such as PPS, may experience "warpage" if the curing temperature is increased, SUMIKASUPER
LCP experiences almost no such "warpage", even if cured at relatively high temperatures of between 120-150°C. This
characteristic allows for shortened bonding times.
Table 3.3 Adhesive Strength Given by Ordinary Adhesives Sold on The Market (Unit : MPa)
Adhesive
TB2234D Sumimac ECR-9173K Amicon A164-1 Amicon A316BP
(Three Bond) (Sumitomo Bakelite) (Grace Japan) (Grace Japan)
After 250°C,1Hr 230°C,1min After 250°C,1Hr After 250°C,1Hr After 250°C,1Hr
hardening Heat aging IR reflow hardening Heat aging hardening Heat aging hardening Heat aging
E5008 9.2 3.0 9.2 9.1 3.8 8.6 4.5 9.1 4.2
E6008 7.7 2.8 7.8 8.8 3.5 10.7 3.8 8.5 3.9
Adhesive
Technodyne AH 7052T Technodyne AH 6072T Technodyne AH 062K
(Taoka Chemical) (Taoka Chemical) (Taoka Chemical)
After 250°C,1Hr After 250°C,1Hr After 250°C,1Hr
hardening Heat aging hardening Heat aging hardening Heat aging
E5008 6.2 4.6 6.7 4.3 6.6 3.8
E6008 7.0 4.4 6.1 4.2 5.6 5.0
Method of Measuring Bond Strength

• Test Specimens
10mm
ASTM No.1 test specimens (3.2mmt)
Adhesive
• Test Method
The adhesive is applied to the test specimens, which are then pressed Test specimen
together to overlap and create a bond10mm in length. The bonded section is
then cured in a hot air convection oven.
• Measurement of Bond Strength
The shear strength is measured at a tensile rate of1.67x10-4m/s.
Ultrasonic Welding
All grades of SUMIKASUPER LCP can be welded Table 3.4 Welding Property by Ultrasonic Welder (Unit : N)
with Ultrasonic Welding (Table 3.4). Changes to Welding strength
the strength of the bonded surface are minimal, Welding strength After welding 250°C,1Hr thermal aging
even after being heat aged at a temperature of E5008L 650 570
250°C. E5008 510 400
E4008 460 460
E6008 740 740
E6006L 710 650
Method of Measuring Weld Strength

• Test Specimens
Two test specimens with dimensions of 12.7x78x1.6mmt
(One of the test specimens possesses a protruding section, as shown in the accompanying figure.)
• Welding Procedure
The test specimens are positioned as depicted in the accompanying figure. Ultrasonic excitation is then performed for 0.6 -
0.8 seconds under the following conditions: frequency of 19.5 kHz;
amplitude of 34μm and load of 176.4N.
• Measurement of Weld Strength 0.3
The shear strength is measured at a tensile rate of 1.67x10 m/s.
-4
0.3
10

25
4. Applcations
4.1 Electrical Components
Grade Selection Guide
The table below shows the main grade lineup for SUMIKASUPER LCP. When choosing a grade of SUMIKASUPER LCP,
please select the series that has the most suitable heat resistance for your specific application.
• Standard grades in the E6000 and E6000HF series have well-balanced properties, including adequate heat resistance for
bare surface mounting of electronic components (SMT) and moldability is similar to that of general-purpose engineering
plastics. These characteristics allow them to be utilized in a variety of applications.
• Extra precautions must be observed when using E5000 and E4000 series products, as they possess high heat resistance
and require high molding temperatures. Their proper application requires molding machinery with high temperature
specifications, as well as frequent maintenance for such machine. These two high heat resistant grades should be utilized
for high temperature dip soldering (> 350°C) applications. In addition, prior to selecting a grade from among these series
of products, you should ensure that adequate consultation is received from our sales representatives.
Next, methods for selecting the appropriate composition are introduced below.
• SUMIKASUPER LCP series products containing milled GF (crushed glass fiber), such as the E6008 and E6006 series,
are recommended for the molding of thin-walled, compact-sized components.
• For applications requiring greater strength, choose a grade that incorporates chopped glass fiber (long fibers). The grades
numbers contain the letter "L", such as E6006L or E6006LHF.
• For applications requiring lower warpage and less anisotropy, choose a grade that incorporates Inorganic filler and glass
fiber, such as E6810 or E6807LHF.
Table 4.1 Main Grade Line-up

High Strength
Standard Low warpage
Thin-walled / chopped GF
Required heat resistance molding Low anisotropy
Compact-sized Low warpage
Characteristics temperature both inorganic
Milled GF Low anisotropy
(°C) filler
GF and inorganic filler
Special ultra-high heat resistance E5002L
E5000 Withstands solder dip E5008
400 E5006L --
Series Withstands high temperature re-flow E52008
High rigidity at temperatures over 200°C E5008L
Ultra-high heat resistance E4006

E4000 E4006L
Withstands high temperature re-flow 380 E4008 --
Series E4008L
High rigidity at temperatures over 200°C E4009
High heat resistance

E6006
E6000 E6008
Withstands re-flow 360 E6006L E6810 MR
Series General-purpose grade E6008 MR
(Easy-releasing type)
High heat resistance
E6000HF Withstands re-flow E6807LHF
350 -- E6007LHF
Series High-flow grade E6808LHF
For connector applications

26
Grade Selection Guide for Usage in Connectors
Properties Required by Connector Materials

The term "connector" includes a wide variety of components that are used for Figure 4.1 Mounting Defects Caused
purposes such as: mounting LSI chips onto circuit boards; connecting cables by Connector Warpage
to circuit boards; and providing interconnection between circuit boards.
Connectors are increasingly becoming multipolar and further miniaturized, in
keeping with recent trends toward the manufacture of advanced electronic
devices that are smaller, thinner and lighter than ever before. Moreover, the
primary means of mounting connectors is gradually shifting toward the use of
Surface Mount Technology (SMT), in which connectors are soldered at a high
temperature of 240-260˚C. For these reasons, LCP products are often utilized, If the connector is warped...
then the terminal pins may separate from the
due to their high precision moldability and high heat resistant properties.
circuit board, thus resulting in poor soder jints.
However, the major shortcoming of LCP is its high anisotropy. Connectors
composed of LCP are produced by the injection molding process. During
production, the level of LCP resin shrinkage within the mold is different in the resin flow direction (MD: Machine Direction)
than the shrinkage that occurs perpendicularly (TD: Transverse Direction). This differential shrinkage leads to connector
"warpage", which may subsequently cause defects when connectors are soldered during the SMT process (Figure 4.1).
Since LCP is an anisotropic resin, it is difficult to mold without the addition of a filler. In order to reduce the degree of
anisotropy, LCP should be combined with a filler, such as glass fiber or inorganic filler. An important difference between LCP
and standard resins is that the addition of fillers to standard resins causes increased anisotropy, yet the addition of a filler,
such as glass fiber, to LCP actually reduces the degree of anisotropy.
Grade Selection Guide for Usage in Connectors
The connector guide for SUMIKASUPER LCP introduces LCP products that incorporate fillers, such as glass fiber or
inorganic filler. It is necessary to understand that the appropriate grade (with less warpage) may vary, depending upon the
particular shape of the connector (especially depending upon the wall thickness of the molding).
Figure 4.2 shows selection examples.
>> DIMM sockets with relatively thick walls: E6006LHF and E6006LMR
>> Flat multipolar PGA sockets: E6807LHF and E6808LHF
>> Flat PCMCIA sockets with no holes or ribs, and card connectors for memory cards: E6810MR
>> Thin board-to-board connectors of reduced heights: E6008, E6808THF and E6808GHF
Figure 4.2 Application of SUMIKASUPER LCP Grades for Usage in Connectors
DDR, RIMM
CPU Socket
E6007LHF
higher strength E6807LHF E6808LHF
higher rigidity
higher flow
lower warpage
lower warpage SUMIKASUPER

LCP
higher flow
PCMCIA
higher flow lower warpage
S/O, DIMM
much lower warpage
E6807LHF
Card Connector
E6810LHF
Board to board, FPC
E6808UHF

27
• Physical Properties of Standard Grades
Table 4.2 shows the physical properties of our standard grades. The levels of warpage within the table have been
evaluated using molds designed by our company. Therefore, there may be differences between these values and actual
warpages (may be compared with our previous grades).
Table 4.2 Standard Physical Properties of SUMIKASUPER LCP Grades for Usage in Connectors
Measuring E6000HF (High Flow) series

Item method Unit
E6007LHF E6807LHF E6808LHF E6808UHF E6810LHF E6810GHF
Glass Fiber/ Glass Fiber/ Glass Fiber/ Glass Fiber/ Glass Fiber/
Glss Fiber Inorganic Filler Inorganic Filler Inorganic Filler Inorganic Filler Inorganic Filler
Filler (Chopped) (Chopped) (Chopped) (Milled) (Chopped) (Chopped)
35 wt% 35 wt% 40 wt% 40 wt% 50 wt% 50 wt%
Specific gravity ASTM D792 - 1.65 1.67 1.7 1.72 1.82 1.84
MD Sumitomo 0.2 0.11 0.17 0.22 0.13 0.13
Mold shrinkage Chemical %
TD Mthod 0.6 0.63 0.4 1.02 0.38 0.38
Tensile strength Mpa 157 134 130 100 105 118
ASTM D638
Elongatin at break % 5.1 4.5 4.5 5.0 4.0 4.1
Flexural strength MPa 158 145 140 120 133 138
ASTM D790
Flexural modulus Gpa 11.8 12.1 12.5 9.4 12.6 13
Izod impact strength ASTM D256 J/m 251 343 270 350 200 264
DTUL (1.82MPa) ASTM D648 ̊C 269 270 270 240 266 269
Sumitomo
Soldering resistance Chemical ̊C 300 295 280 290 280 300
Mthod
Warpage Characteristics of Each Grade

• Method of Measuring the Level of Warpage of Long Connector
The level of warpage of long connectors was measured using the type of tool shown in Figure 4.3. Figure 4.4 depicts the
results of these measurements.
Figure 4.3 Method of Measuring the Level of Warpage of Figure 4.4 Level of Warpage of Long Connector
Long Connector
0.10
Amount of curvature of long connectors (mm)
0.3mm
0.08
Warpage
0.06
0.75mm
0.04
1.75mm E6810GHF
E6808UHF
E6007LHF
E6807LHF
E6808LHF
E6810LHF
Gate 0.02
68.6mm(length)x7mm(width)x6mm(height)
0

28
• Method of Measuring the Level of Warpage of Disc
The level of warpage of disc was measured using the type of tool shown in Figure 4.5 and Figure 4.6 depicts the results of
these measurements.
Figure 4.5 Method of Measuring the Level of Figure 4.6 Level of Warpage of Disc
Warpage of Disc
2.5
Gate
Amount of lwarpage of discs (mm)

2.0
1.5
Warpage
1.0
64mm(diameter)x 0.5mm (thickness)
E6810GHF
E6808UHF
E6007LHF
E6807LHF
E6808LHF
E6810LHF
0.5
• Levels of Warpage of Long Connector Before and After IR Re-flow Process

The temperature profile for IR re-flow process is shown in Fig. 4.7.
Figure 4.8 depict the level of warpage of long connector, before and after IR re-flow process. In addition, the level of
warpage of the product with each grade are also shown in Fig.4.8
Figure 4.8 Levels of Warpage of Long Connectors Before and

Figure 4.7 Temperature Profile of IR Re-flow Process After IR Re-flow Process
300 0.10
Before
Amount of curvature of discs (mm)
250
0.08 After
200
Temperature (˚C)
150 0.06
100
0.04
50 E6808UHF
E6007LHF
E6807LHF
E6808LHF
E6810LHF
0 0.02
0 240 480 720 960 1200 1440
Elapsed time (sec.)
0
Molding Conditions
Table 4.3 shows the standard molding conditions.
Table 4.3 Standard Molding Conditions

E6000HF series
Drying conditions Approximately 130˚C x 4-24 hours
Rear 280~320
Cylinder temperature (˚C) Center 320~340
Front 340~360
Nozzle 340~360
Proper resin temperature (˚C) 350
Tool temperature (˚C) 40~120
Injection speed Medium - high speed
Injection pressure (MPa) 80~140
Maintained pressure (MPa) 20~40
Screw back pressure (MPa) 1~5
Screw rotation speed (rpm) 50~100

29
Grade Selection Guide for Optical Pickup Bobbins
What are Optical Pickup Bobbins?
Optical pickup bobbins are critical components used in the following devices: optical disc reading units for music CD players;
optical disc reading units used in PCs for both and CD-ROM and DVD-ROM devices; and optical disc reader/writer units
used for playing and recording music MDs, CD-R/RW discs and DVD discs (i.e., in optical disc drives and optical disc
recorders). Optical pickup bobbins are commonly manufactured out of SUMIKASUPER LCP.
Properties Required for Optical Pickup Bobbin Material
Optical disc drives are able to perform data reading and writing operations by applying laser beam onto minute pits on the
disc, with dimensions in the μm (1/1000 mm), that have been engraved into optical discs. When reading and writing data,
the focusing lens itself must be moved at extremely high speeds, using magnetic forces, in order to be able to focus the
laser beam onto the correct sections of the disc, as it rotates at high speed. Coils are utilized to provide the magnetic force
to move the lens. The lens is mounted on top of the optical pickup bobbin, as shown in the figure below, thus the bobbin can
also be referred to as the "lens holder".
Structure of the Beam Pickup Bobbin
Optical disc
Lens
Applicable to
high-temperature
Vibration
dip soldering Beam Pickup Bobbin
Resin Terminals
Recommended grades Vibration
E5002L Laser Beam
E5006L
The properties required of optical pickup bobbins are shown in the table below. SUMIKASUPER LCP meets these
requirements, thus can be considered as a material suitable for the manufacture of optical pickup bobbins.
Requirements Reasons of the Requirements Characteristics of SUMIKASUPER LCP

Compact size and For power saving and high sensitivity • Low specific gravity
low weight • A moldability that enables precision molding
Reading signals If resonation occurs at less than the • High rigidity (Flexural Modulus at a thickness
accurately operating frequency (-20kHz), the signal of 0.5mm = approximately 30 GPa)
can not be read. The resonant • Low specific gravity
frequency of low specific gravity and
high elastic modulus material is high.
Low cost Can be mass-produced through • A moldability that enables precision molding
injection molding. • Resistance to heat from dip soldering
As dip soldering can be performed
during the assembly process (350-
400̊C x several seconds), the process
of inserting metal terminals is no longer
required as cost.

30
Grades for Usage in Optical Pickup Bobbins
SUMIKASUPER LCP grades that possess the above required properties for use in optical pickup bobbins, are shown in the
table below. E5006L, one of the standard grades, is the most suitable grade for usage in optical pickup bobbins. E5002L is
also suitable for many high performance applications due to its low specific gravity. However, it has the following
shortcomings:
• As LCP has the disadvantage of possessing extremely high anisotropy, precise dimensional accuracy of moldings cannot
easily be attained.
• As it contains only a minimal amount of filler (10% chopped glass filler), it tends to remain inside the molding machine and
then generating carbonized material. (Since it requires more frequent disassembly cleaning of molding machine than
when E5006L is used, productivity will decrease.)
• The molding conditions window is narrower, thus making the molding operation more difficult to control.
Therefore, E5006L is recommended for the usage as possible. The usage of E5002L should be limited to occasions when
adequate optical pickup bobbin performance cannot be achieved with E5006L. In addition, E5008L may be utilized for
situations in which cost is the primary issue, such as for CD-DA (audio) applications and in slower CD-ROM drives.
Grade Selection Guide for Usage in Bobbins
Optical Bobbin Structure and Properties Required for Material

A bobbin is a cylindrical or polygonal spool around which a coil of electrical wire (helix winding) has been wound. Most
bobbin material is composed of a resin that possesses insulating properties. Although metal is often utilized for bobbin
terminals, its usage adds an additional component to the bobbin, thus increasing the cost of manufacture. To address this
issue, resin terminal bobbins have been developed that are composed entirely of resin.
Metal terminals
or
Resin terminals
In order for the electrical wire to conduct electricity, the wire is coated insulator material (such as urethane), the coating must
be removed from the wire ends that contact the terminals. One of the methods used to remove the wire insulation is to dip
the wire into a high temperature solder bath (300-400˚C).
When metal terminals are present, most of the heat received from dipping the terminals into the solder bath will not be
conducted into the bobbin itself, thus making possible the utilization of resin that has a relatively low heat resistance.
However, bobbins with resin terminals must be composed of resin having high heat resistance, so that the terminals will not
melt or become deformed. Yet, as recent developments have resulted in the further miniaturization and reductions in weight
for consumer electronics products, smaller bobbins are also being produced. These smaller bobbins contain shorter
terminals, allowing heat to be conducted more readily to the resin itself. Therefore, even bobbins with metal terminals must
now be composed of resin having high heat resistance.
For this reason, high heat resistance (300-400˚C x several seconds) and precision moldability have taken on added impor-
tance as properties that are required in bobbin applications, due to current demands for smaller, lighter bobbins. Further-
more, thermoplastic resins are now receiving increased appreciation from the perspective of environmental protection, thus
making LCP the main material of choice for bobbin manufacture.

31
Grade Selection Guide for Bobbins
The E5000 series, ultra-high heat resistant grade, is required for usage in resin terminal bobbins. The E5000 series can also
be utilized for metal terminal bobbins, however, the additional heat resistance may not be needed. One disadvantage with
E5000 is that although short-term heat resistance is high, the molding temperature is also extremely high, at 400̊C. This
high molding temperature can lead to problems within the injection molding machine due to the deterioration of any residual
resin. Furthermore, both the molding machine and the molds require more frequent maintenance than if E4000 or E6000
series grades are utilized. Therefore, it is recommended that the particular heat resistance requirements for each bobbin be
thoroughly understood, and if ultra-high heat resistance is not an imperative, then E4000 series or more preferably, E6000
series grades, should be utilized.
Type of Bobbin Recommended Grade
Resin Terminal Bobbin E5000series (E5008L, E5008 and other grades)
Metal Terminal Bobbin E5000series (E5008L, E5008 and other grades)

(Small) E4000series (E4008L, E4006L, E4008 and other grades)
Metal Terminal Bobbin E5000series (E5008L, E5008 and other grades)

(Medium to Large) E4000series (E4008L, E4006L, E4008 and other grades)
E6000series (E6006L, E6008 and other grades)

TECHNICAL NOTE
Electronic Materials Division

Sumitomo Chemical Co., Ltd. Electronic Materials Div.
<Customer Support Center>
6, Kitahara, Tsukuba-shi, Ibaraki 300-3294, Japan
Tel : +81-29-864-4177 Fax : +81-29-864-4745
Sumitomo Chemical Co., Ltd. Electronic Materials Div.
Tokyo Sumitomo Twin Building East
27-1, Shinkawa 2-chome, Chuo-ku, Tokyo 104-8260, Japan
Tel : +81-3-5543-5845 Fax : +81-3-5543-5939
Sumika Electronic Materials, Inc.
3832 East Watkins Street, Phoenix, AZ 85034, USA
Tel: +1-602-659-2500 Fax: +1-602-438-2277
Sumitomo Chemical Europe S.A./N.V.
Woluwelaan 57, B-1830 Machelen, Belgium
Tel: +32-2251-0650　Fax: +32-2251-2991
Sumitomo Chemical Singapore Pte Ltd.
150 Beach Road, #19-05 Gateway West, Singapore 189720
Tel: +65-6291-9636　Fax: +65-6296-3779
Dongwoo Fine-Chem Co., Ltd.
8th FL., City Air Tower, 159-9, Samsung-dong, Kangnam-gu, Seoul, 135-973, Korea
Tel: +82-2-6250-1162　Fax: +82-2-6250-1198
Sumika Electronic Materials (Shanghai) Co., Ltd.
1204-05 Financial Square, 333 Jiujiang Rd., Shanghai, 200001, China
Tel: +86-21-6360-6400　Fax: +86-21-6350-3678
Sumika Electronic Materials (Shanghai) Co., Ltd.
<Customer Support Center>
B-1F, 15#, No.89, Xiya Road, Waigaoqiao Free Trade Zone, Shanghai, 200131, China
Tel: +86-21-5046-2296　Fax: +86-21-5046-3989
Sumika Electronic Materials (Hong Kong)
<ShenZhen Office>
29H, Tower A of World Finance Center, No.4003 Shenzhen Road East, Luhu Distcrict,
Shenzhen, 518001, CHINA
Tel: +86-755-2598-1598　Fax: +86-755-2598-1597
The products of SUMIKASUPER E5000 series, E4000 series, E6000 series, SZ4000 series and SZ6000 series
are on the control list of the Foreign Exchange and Foreign Trade Control Act of Japan.
The SUMIKASUPER E6000HF series and SZ6000HF series are not on the control list but implemented in
catch-all control/
http://www.sumitomo-chem.co.jp/sep/english/
Version 01 / Sep. 2010 Electronic Materials Division

LCP Technote e

Diunggah oleh

Informasi Dokumen

Judul Asli

Hak Cipta

Format Tersedia

Bagikan dokumen Ini

Bagikan atau Tanam Dokumen

Opsi Berbagi

Apakah menurut Anda dokumen ini bermanfaat?

Apakah konten ini tidak pantas?

Hak Cipta:

Format Tersedia

LCP Technote e

Diunggah oleh

Hak Cipta:

Format Tersedia

TECHNICAL NOTE

Version 01 / Sep. 2010 Electronic Materials Division

Proper Use of SUMIKASUPER LCP

[1] Safety and Health

SUMIKASUPER LCP Technical Notes Index

Version 01 / Sep 2010 Electronic Materials Division ©

1. General Characteristics and Grade Line-up

Para-hydroxybenzonic acid Biphenol Phthalic acid

Darkness in the case of

Version 01 / Sep 2010 Electronic Materials Division ©

Figure 1.4 Characteristics of Liquid Crystalline Polymer (LCP)

Thermotoropic liquid crystalline polymer Crystalline polymer

Characteristics Based on Whollyaromatic Liquid Crystalline Polymer

Version 01 / Sep 2010 Electronic Materials Division ©

1.2 Grade Line-up

Brands and Special Features

Table 1.1 Characteristic and Grade Line-up

Figure 1.5 Grade Line-up

Milled GF Chopped GF GF/Inorganic Standard processing

High E5000 Series E5008 E5006L 400˚C

Low Anisotropy Low shrinkage

Version 01 / Sep 2010 Electronic Materials Division ©

2.1 General Physical Properties

Table 2.1 General Physical properties of SUMIKASUPER LCP -A

Izod impact 6.4t notched J/m 49 109 88 175 — 108 137 —

Linear expansion MD Sumitomo 10 /K

Version 01 / Sep 2010 Electronic Materials Division ©

Table 2.1 General Physical properties of SUMIKASUPER LCP -B

Version 01 / Sep 2010 Electronic Materials Division ©

2.2 Heat Resistance

Thermal Decomposition Temperature

Figure 2.1 TGA Curve Table 2.2 Thermal Decomposition Temperature

−40 Measuring instrument : TG50 model by Simadzu Seisakusho

Deflection Temperature Under Load

E5000 Series 330~360˚C

Long-term Heat Resistance

SUMIKASUPER LCP possesses outstanding long-term heat resistance.

E4008 200 200 240 E6008

Version 01 / Sep 2010 Electronic Materials Division ©

Figure 2.3 Continuous Service Temperature and DTUL

200 SUMIKASUPER LCP

0 100 200 300

Soldering Heat Resistance

Solder bath temperature (˚C)

220 240 260 280 300 320 340 360

E5000 Series >60 5

Dimensions of specimen : JIS K7113 1(1/2) dumbbell 1.2mmt,

Version 01 / Sep 2010 Electronic Materials Division ©

2.3 Mechanical Properties

Thickness dependence of moldings

Table 2.4 Strength Dependant on Specimen Thickness

Anisotropy of Physical Properties

Version 01 / Sep 2010 Electronic Materials Division ©

Figure 2.6 Weld Strength of SUMIKASUPER LCP

Temperature Dependence of the Flexural Modulus

Figure 2.7 Temperature Dependence of Flexural Modulus

PES (30% GF content)

Version 01 / Sep 2010 Electronic Materials Division ©

Retention of tensile strength (%)

E4008 30% recycle E6006L 30% recycle

Mold shrinkage (%)

Version 01 / Sep 2010 Electronic Materials Division ©

2.4 Flame Retardancy