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W .C OM INFORMATION WW.
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THERMAL RESISTANCE MAXIMUM
WW RATINGS . C Device
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†

.1 00Y M .TW W . 1 M
W O Value Unit WW 00Y.CO
WW .100Y.C M.TW
Parameter Symbol NTMFS4119NT1G SO−8 FL 1500 Tape & Reel
W . 1
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WW
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W O M NTMFS4119NT3G SO−8 FL 5000 Tape & Reel
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W OM
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WW .1R0qJA 0Y.C138.5 †For information on tape and reel specifications,
Stresses exceeding Maximum Ratings may damage W the device. Maximum including part orientation and tape sizes, please
Ratings are stress ratings only. Functional operation WW above the Recommended refer to our Tape and Reel Packaging Specification
Operating Conditions is not implied. Extended exposure to stresses above the Brochure, BRD8011/D.
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
2. Surface mounted on FR4 board using the minimum recommended pad size
(Cu area = 0.412 in sq).

© Semiconductor Components Industries, LLC, 2006 1 Publication Order Number:

March, 2006 − Rev. 4 NTMFS4119N/D
 W.1 Y.COM W . WW 00Y.CO .TW
W WW 00Y.CO .TW W
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2
 W.1 Y.COM W . WW 00Y.CO .TW
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ID, DRAIN CURRENT (AMPS)

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Figure 5. On−Resistance Variation with Figure 6. Drain−to−Source Leakage Current

Temperature vs. Voltage

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3
 W.1 Y.COM W . WW 00Y.CO .TW
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