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CHAPTER 1

INTRODUCTION

Technology is developing day by day. This is the era of miniaturization. Computers


are changed from room size to laptops or palmtops, not only computers, manufacturers are
trying to reduce the size of every electronic devices with the help of micro sized elements
such as semi conductors, IC chips, etc. But only barrier in this case is heat transfer. Life of
each electronic device is directly proportional to effectiveness of heat transfer. Better
performance and effective life can achieve by enhancing heat transfer from the devices.
Cooling of electronic devices is an active research topic. Number of researches are done in
this field. Small increase in heat transfer can provide better performance and life.

Many researchers have come up with different technologies for the cooling
challenge throughout recent years, among which cooling with a high velocity fluid jet
directly impinging on heat transfer surface become a promising heat transfer method to
meet the needs of the electronic industry. Impinging jets have received considerable
attention due to their inherent characteristics of simple geometry and higher rates of heat
transfer. Such impinging flow devices allow for short flow paths on the surface and
relatively high rates of cooling from a comparatively small surface area. Various industrial
processes involving high heat transfer rates apply impinging jets.

Lots of researches are done in the field of impinging jets. Researches tried both
liquid and gas jet and they got promising results. Many prior studies are mostly on the jet
impinging over a flat and smooth surface. Studies find out that heat transfer depends on lots
of parameters. Altering any one of them will change the characteristics of jet impingement
cooling. Thus the area became further complicated. During developing stages only single
jet and flat plates are used. After understanding mass flow rate, multiple jets are introduced.
Multiple jets provide more mass transfer than a single jet. Later pulsating jets were
introduced.

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In this study numerical techniques were used to simulate the flow patterns and used
it to compare different geometries of the heat plates. Different turbulence models were
tested and Transition SST turbulence model was selected as the optimum model predicting
the results more closer to the experimental results was selected for the numerical study. The
study is conducted with the help of commercial CFD simulation package Ansys Fluent
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