FAKULTI KEJURUTERAAN ELEKTRONIK

DAN KEJURUTERAAN KOMPUTER

BASIC HAND SOLDERING

 INTRODUCTION
What students will learn:

Soldering
– What is soldering
– Soldering basic tools/materials: soldering iron, solder
tips, solder sucker, solder wick, solder wire, flux
– Soldering technique/process
– Acceptance/inspection standard for soldering
– Desoldering technique/process

Occupational Safety & Health matters related to the

to soldering process
What is Solder ?

Solder = Alloy;
commonly of Tin (Sn)
and Plumbum (Pb)

Cheapest in market Sn:Pb
= 60:40

Solder melting temperature ~ 180°C to

190°C
 Soldering Basic Concept
Copper Lead
(Base Metal)
Solder

Solder react with copper (on Joint
PCB & lead) to form PCB

Intermetallic Bond (a form

of alloy) Solder Connection

Intermetallic bond is
stronger if:
- temperature is not high
- high temperature
- contact is not too long
 SOLDERING TOOLS
Soldering Iron

Different wattage specification – the
higher the wattage spec. the more
heat will be stored in the soldering
iron. Common wattage spec e.g.
16w, 25w, 60w & 100w

Electronic component soldering
temperature = 240°C ~ 320°C
 Soldering Iron Tip

Different tip design
for different soldering
application

For through-hole
component (e.g.
carbon resistor with
copper leads), a
conical tip is suitable
 Flux

Contains activation agent
- corrosive

Typically either water
soluble or resin based

Purpose
- To remove oxide layer from the base of
metal surface Flux core
Solder
alloy
− To shield base metal surface from
oxygen which re-oxidize metal
Solder Wire
− To lower solder’s surface tension to
improve wetting
 SOLDERING TECHNIQUE

Prepare component for solder

Clean component lead – from dirt & smear

Insert component. Clinch lead

Apply flux to soldering point & proceed for
soldering work

Cut off excess wire
 SOLDERING TECHNIQUE

Prepare soldering iron for soldering work

Wet
sponge

Use only well-heated soldering iron

Clean soldering iron tip- use wet sponge

Apply a bit of solder to iron tip – make sure
solder are attached to tip
 SOLDERING TECHNIQUE

Solder the target/ point

Heat the soldering point –soldering iron must

contact both component lead and pcb copper

Apply solder wire –solder wire must contact both
component lead and pcb copper also
 SOLDERING TECHNIQUE

Finish off soldering

Pull away soldering iron from solder point when

solder becomes shiny

Timing is important! – Do not apply soldering
iron too long or too short.
 Soldering Technique Summary

Clean component’s leads

Insert component. Clinch it

Apply flux to soldering point

Clean soldering iron tip

Apply a bit of solder to iron tip

Heat both soldering point &
component lead

Apply solder wire to soldering point & comp. lead

Pull solder wire away. Then pull soldering iron
away after solder becomes shiny

Cut off excess wire
 INTERNATIONAL ACCEPTANCE
STANDARD

IPC-A-610 Class C
– IPC = associations of US electronic
companies and their suppliers

J-Std-001
– Joint standard of IPC and Electronic
Industry Association
 ACCEPTANCE CRITERIA

Base on IPC-A-610 and J-STD-
001 (Class 2)

Criteria:
– Circumferential fillet and
wetting = 270°
– Percentage of PCB copper
land area covered with solder
= 75%
– Visible good wetting
 ACCEPTANCE CRITERIA
Lead
Fillet Height Height

Criteria:
– Fillet Height = minimum ¼
Lead height or 0.05mm
– Note: Lead height after cut =
maximum 2.5mm
– Solder finish = glossy or shiny θ≤ 90°
– Solder contact angle ≤ 90°
 SOLDER JOINT PROBLEM

Cold solder
– Soldering iron heats up PCB and component
lead too short before solder is applied
– After solder is applied, soldering iron is pulled
away too fast from solder point
– Soldering iron touches PCB pattern only
– Solder wire applied at iron tip only
 SOLDER JOINT PROBLEM

Fractured solder
– Cold solder joint breaks off
– Solder wire applied at iron tip
only

Excessive solder
– Solder wire applied at
component lead only
– Solder wire applied at iron tip
only
– Too much solder applied to
solder point
 SOLDER JOINT PROBLEM

No wetting
– Soldering iron touches component
lead only
– Soldering iron heats up both PCB
and component lead too fast
before solder is applied
– After solder is applied, soldering
iron is pulled away too fast from
solder point
 SOLDER JOINT PROBLEM

Solder Bridging
– Short circuit due to solder

Burnt solder
– After solder is applied,
soldering iron is pulled away
too slow from solder point
 Touch Screen Resistance PCB

Material: 400 ohm

– Strip Board
– Resistors: 8 PCB
400 ohm 400 ohm
pcs of 200
ohm
– Jumper wire: 2
400 ohm

Specification:
– Corner to corner resistance = 400 Ω
– Use all provided material
– Do not cut any PCB trace
 Touch Screen Resistance PCB

Strip Board

PCB
 Construction Method with Strip
Board

Understanding the problem
– Specification:
400 ohm resistance on each side on 4 sides
– Limitation:
Given: 8 pcs of 200 ohm resistors, 2 pcs of
jumper wires and a strip board
-Strip board cannot be cut
 Construction Method with Strip
Board

Draw schematics / circuit diagram
A 200 200 B

200 200

200 200
D 200 200 C
 Construction Method with Strip
Board

Identify each node / net on circuit
diagram 1 9 10

200 200
200 200
Total Node / 2 8

Net = 10 3 7

200 200
4
200 200 6
5
 Construction Method with Strip
Board

Assigna copper track or part of a
copper track for each node
6 5 7 8 9 10

4 3 2 1
 Construction Method with Strip
Board

Mount component according to node
6 7 8 10

5 9

4 3 2 1
DESOLDER

Removing solder

Common Tools:
– Solder sucker (cheap but not
clean & not safe to PCB)
– Solder wick (more expensive
but clean and safe to PCB)
– Desoldering iron (more
expensive but clean, safe and
easy to use)
DESOLDERING TECHNIQUE

Using Solder Sucker

Heat up solder point with soldering iron

Prepare solder sucker - press suction spring

After solder melts, place solder sucker on top of
solder point

Release suction spring
DESOLDERING TECHNIQUE

Using Solder Wick (solder net)

Place solder wick on top of solder point

Place soldering iron on top of solder wick to heat
it up

When solder melt, capillary action will suck the
solder into the net of solder wick

Use part of solder wick that has not catch solder
HEALTH AND SAFETY DURING
SOLDERING

Lead Absorption into body system:
- By inhalation and ingestion
- Lead fumes generated by heating & melting
lead
- Handling metallic lead & lead compounds can
contaminate hands and lead to ingestion
- Once absorbed into body, lead will circulate in
the blood system and finally deposited in bones
and teeth
 HEALTH AND SAFETY DURING
SOLDERING

Health effect:
- Gastro intestinal disturbances including
constipation, discomfort and sometimes severe
pain
- Weakness and lost weight
- Anaemia (lead interfere the red blood cell
production)
- Kidney damage
- Brain nervous system damage to unborn
children
 CONTROLS

Hygiene control aims at preventing the inhalation
or ingestion

Other control :
a) medical surveillance
b) biological monitoring

Personal hygiene measures –washing and showers
are necessary to prevent ingestion

Personal protection- use respirators, gloves
Clean Touch Screen Resistance
PCB

Material:
– Touch Screen
Resistance PCB PCB

Method:
– Remove all components from PCB
– Make sure all PCB holes and copper
tracks are clean
Summary

What has been learned
- What is solder and how to solder
- Basic soldering tools
- Acceptance standard
- How to desolder
- Occupational Safety & Health requirement related
to the soldering work and control methods