Beginning of Presentation
CDEEP
VLSI Technology
(EE 669)
Autumn 2010 Prof. V. Ramgopal Rao
IIT Bombay Slide 2
OVERVIEW
• Environment for VLSI Technology
• Impurity Incorporation
• Oxidation
• Lithography
• CVD Techniques
• Metal Film Deposition
• Plasma and Rapid Thermal
Processing
• Process Integration
PRE-REQUISITES
REFERENCES
1.James D.Plummer, Michael D.Deal, Peter
B.Griffin, Silicon VLSI Technology:
Fundamentals, Practice & Modeling,
Prentice Hall.
2.T h e S c i e n c e a n d E n g i n e e r i n g o f
Microelectronic Fabrication, Stephen A.
Campbell, Oxford University Press.
REFERENCES
1.S.M. Sze (Ed), VLSI Technology, 2nd
Edition,McGraw Hill, 1988.
2.Research Papers.
VLSI Technology
Course Code : EE 669
Department : Electrical Engg.
Instructor : Prof. V. Ramgopal Rao
www.ee.iitb.ac.in/~rrao/
Module #1
Sub-Topics:
G.Moore, Intel
MOS Transistors-Enhancement
Mode
I-V Characteristics
Short-Channel Effects
Applications of Transistors
Applications of Transistors
Amplifier Oscillator
Applications of Transistors
MOS Capacitors
• “Metal” : metal, or
more frequently
heavily doped poly-
Si
• “Oxide” : silicon
dioxide, or some
other high k
dielectric
• “Semiconductor” :
Si , but can also
be SiGe, SiC
Linear Region:
Subthreshold Swing:
60 – 100 mV/decade
Subthreshold Swing:
60 – 100 mV/decade
Scaling
W=0.7, L=0.7, Tox=0.7
L a t e r a l a n d v e r t i c a l
dimensions reduce 30 %
Area Cap = C
= (0.7 X 0.7)/0.7 = 0.7
Capacitance reduces
by 30 %
Scaling
Vdd=0.7, Vt=0.7, T ox=0.7,
= 0.7
Exercise
Solution
IC Fabrication
•Clean Room
•Wafer Cleaning Technology
•Oxidation
•Lithography
•Etching
•Epitaxy
•D i e l e c t r i c a n d P o l y s i l i c o n F i l m
Deposition
IC Fabrication…
•D i f f u s i o n a n d I o n I m p l a n t a t i o n
Processes
•C onventional and Rapid Thermal
Annealing
•Metallization
•Planarization Techniques -Chemical-
Mechanical Polishing (CMP)
•Salicidation
•Process Integration
Fabrication-NMOSFET
(1)
(2)
(3)
Fabrication-NMOSFET…
(4)
(5)
(6)
Fabrication-NMOSFET (cont’d)
(7)
(8)
(9)
Fabrication-NMOSFET (cont’d)
(10)
(11)
Inverter in IC form
Fabrication-NMOS inverter
Bird’s beak,
limitation in LOCOS
Fabrication-NMOS inverter…