INHB 1 36 CPE
CCCP 2 35 VDD
A16 3 34 A14
A15 4 33 NC
A12 5 32 WEB
A7 6 31 A13
A6 7 30 A8
A5 8 29 A9
A4 9 28 A11
A3 10 27 OEB W28C0108F Rad Hard 1Mb EEPROM
A2 11 26 A10
A1 12 25 CEB
A0 13 24 D7
D0 14 23 D6 The inner 32 pins are
JEDEC compatible with
D1 15 22 D5
D2 16 21 D4
VSS 17 20 D3 commercial parts such
CLK 18 19 VWR
as the Renesas
36 Pin Flatpack HN58C1001
-1.0
10 million cycles
-1.5 0.8 V
1 cycle = +7.5 V / 25 msec
plus -7.5 V / 75 msec
-2.0 ("100 msec cycling")
10 years
-2.5
1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 1.E+08 1.E+09
Time (s)
300C
Fail = 58 | Suspend = 0
CL: 95% 1-sided
Ea = 1.68 eV; sigma = 0.68
50%
+125 C
(projected)
10% 0.1% failures at 1.6E5
days (440 years)
5% 440
years 0.1% failures at 9.3E4
days (250 years) at
95% LL confidence
1% 250
years
0.5%
25
8
x
0.1%
0.01 0.10 1 10 100 1000 10000 1E+5 1E+6 1E+7
Time (days)
9 3/26/2008 9:22 AM Copyright 2007 Northrop Grumman Corporation
1Mb EEPROM Activation Energy Study
+125 C
1E+7 Arrhenius/Lognormal
10 +250 C 10 days
1
+300 C 0.5 days
0.1
100 125 145 190 235 280 325
Operating Temperature (C)
10 3/26/2008 9:22 AM Copyright 2007 Northrop Grumman Corporation
SONOS Memory Retention Screen Acceleration Effects
NSONOS transistor array - 1000 x 4 um x 0.8 um (7 parts)
0.5
+7.5 V / 25 msec 2 2600
0.0 days years
@+250C 10 years
@+125C
-0.5
Threshold Voltage (V)
+250 C +125 C
-1.0
-1.5 Calculated
1.73E3 sec
+250 C Ea = 1.86 eV
-2.0
+125 C 8E10 sec
-2.5
Time (s)
0.3
Part specification = < 2 mA
0.2
0.1
0.0
-55 25 125 Post Burnin 1000 hrs @ +150C 300 krad 1 Mrad
Temperature(oC) Test_Group RadLevel
150
Tce (nS)
0
-55 25 125 Post Burnin 1000 hrs @ +150C 300 krad 1 Mrad
Temperature (oC) Test_Group RadLevel
Northrop
NorthropGrumman’s
Grumman’sRad-Hard
Rad-HardEEPROM
EEPROMTechnology
Technology
2Kb
2KbBORAM
BORAMdevice
deviceprogrammed
programmedin
inDecember
December1976
1976
No
Nodropped
droppedbits
bitsas
asof
ofOctober
October18,
18,2007
2007––31
31 years
yearsof
ofretention!!
retention!!