Features
A
■ on-state rms current: 1.25 A
■ repetitive peak off-state voltage: 600 V and
800 V G
K
■ gate triggering current: 50 and 200 µA
A
Applications
G A
■ ground fault circuit interrupters
A G
K K
■ overvoltage crowbar protection in power
supplies SOT-223 TO-92
X02xxN X02xxA
■ capacitive ignition circuits
Description
A
The X02 SCR can be used as the on/off function
K
in applications where topology does not offer high
current for gate triggering. G
1 Characteristics
TO-92 TL = 63 °C
IT(RMS) On-state rms current (180 °Conduction angle) SOT-223 Ttab = 99 °C 1.25 A
SMBflat-3L Ttab = 111 °C
TO-92 TL = 63 °C
IT(AV) Average on-state current (180 °Conduction angle) SOT-223 Ttab = 99 °C 0.8 A
SMBflat-3L Ttab = 111 °C
tp = 8.3 ms 25
ITSM Non repetitive surge peak on-state current Tj = 25 °C A
tp = 10 ms 22.5
I²t I²t Value for fusing tp = 10 ms Tj = 25 °C 2.5 A2s
Critical rate of rise of on-state current
di/dt F = 60 Hz Tj = 125 °C 50 A/µs
IG = 2 x IGT , tr ≤ 100 ns
IGM Peak gate current tp = 20 µs Tj = 125 °C 1.2 A
PG(AV) Average gate power dissipation Tj = 125 °C 0.2 W
Tstg Storage junction temperature range - 40 to + 150
°C
Tj Operating junction temperature range - 40 to + 125
Min. 20
IGT µA
VD = 12 V, RL = 140 Ω Max. 200 50
VGT Max. 0.8 V
VGD VD = VDRM, RL = 3.3 kΩ , RGK = 1 kΩ Tj = 125 °C Min. 0.1 V
VRG IRG = 10 µA Min. 8 V
IH IT = 50 mA, RGK = 1 kΩ Max. 5 mA
IL IG = 1 mA, RGK = 1 kΩ Max. 6 mA
dV/dt VD = 67% VDRM, RGK = 1 kΩ Tj = 110 °C Min. 10 15 V/µs
0.8
D.C. (TO-92) 0.10
0.6 SOT-223
α = 180° (TO-92)
0.4
α = 180° (SOT-223)
0.2 α = 180° (SMBflat-3L)
Tamb(°C) tp(s)
0.0
0.01
0 25 50 75 100 125
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05
1.00 3.0
2.5
0.75 IH & IL
RGK = 1kΩ
2.0
1.5
0.50 1.0
IGT
0.5
0.25 RGK(kΩ)
0.0
Tj(°C)
1.E-02 1.E-01 1.E+00 1.E+01
0.00
-40 -20 0 20 40 60 80 100 120 140
Figure 7. Relative variation of dV/dt immunity Figure 8. Relative variation of dV/dt immunity
versus gate-cathode resistance versus gate-cathode capacitance
(typical values) (typical values)
dV/dt[RGK] / dV/dt[RGK=1kΩ] dV/dt[CGK] / dV/dt[RGK=1kΩ]
10.0 20
Tj = 125°C 18 VD = 0.67 x VDRM
VD = 0.67 x VDRM Tj = 125°C
RGK = 1kΩ
16
14
12
1.0 10
2
RGK(kΩ) CGK(nF)
0.1 0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 2 4 6 8 10 12 14 16 18 20 22
Figure 9. Surge peak on-state current Figure 10. Non repetitive surge peak on state
versus number of cycles current for a sinusoidal pulse and
corresponding value of I2T
ITSM(A) ITSM(A), I2t (A2s)
25 300
Tj initial = 25°C
15 Non repetitive
Tj initial=25°C
10 10
Repetitive
Tamb=25°C
5 I2t
Number of cycles
tp(ms)
0 1
1 10 100 1000 0.01 0.10 1.00 10.00
Figure 11. On-state characteristics (maximum Figure 12. Thermal resistance junction to
values) ambient versus copper surface
under tab (SOT-223, SMBflat-3L)
ITM(A) Rth(j-a)(°C/W)
3E+1 170
Tj max.: 160 Epoxy printed circuit board FR4,
Vt0=0.9V copper thickness 35 µm
Rd=200mΩ 150
1E+1
140
Tj=max
130
120
110
100
1E+0 Tj=25°C SMBF3L (typical)
90
80
SOT-223
70 (maximum)
60 S(cm²)
VTM(V) 50
1E-1
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0 1 2 3 4 5
X 02 02 M ZBlank 1BA2
3 Package information
F D E D 4.40 0.173
E 12.70 0.500
F 3.70 0.146
a 0.50 0.019
3.25
1.32
5.16 7.80
1.32
2.30 0.95
5.84
0.51 (0.230)
(0.020)
2.07 2.07
(0.082) (0.082)
0.51
(0.020)
1.20 3.44 1.20
(0.047) (0.136) (0.047)
millimeters
(inches)
Figure 16. Footprint and connectors for SOT-223 or SMBflat-3L (dimensions in mm)
5.84
3.42
3.25
2.92
1.19
1.32
1.50
SOT-223
Solder resist
1.35
1.30 1.20
1.20
1.08 1.08
0.61
0.51
0.46
1.95
2.07
2.22
7.80
2.07
SMBF3L
SMBF3L
Solder paste
Connector line
1.47
1.19
1.32
0.85
0.95
1.10
2.30
4 Ordering information
5 Revision history
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