Failure Analysis Report

§§ Issue
Issue :: No
No Video
Video
§§ Model
Model :: LM201U05-SLL1
LM201U05-SLL1
Customer ::
§§ Customer Dell
Dell // Qisda
Qisda
§§ Date
Date :: Sep.
Sep. 2,
2, 2008
2008

Monitor Circuit Design Team

Monitor Development Department
IT Business Unit

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 1. Phenomenon

■ General
• Detailed information for this issue.

Model LM201U05-SLL1 Customer Dell(Qisda)

Project 2007FP Issued Date Aug. 22. 2008

Project Status MVT/CET Serial No 20187N8670109

Phenomenon No video Quantity 1 pcs / 1000 pcs

■ Phenomenon
No video phenomenon occurred at MVT
-. B/L on but No display

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 2. Analysis & Root cause
2. Analysis / Root cause
1] Voltage Check & Open short check TEST. (Measurement Position : Source PCB)
Normal Sample Abnormal Sample
Check point
Voltage Open & short Voltage Open & short
VCC 3.3V open 7.8mV short
VDD 15.7V open 7.7mV open
Power
VGH 21.3V open 200mV open
VGL -7.6V open -3.8V open
Pvcom Vcom 6.45V open 70mV open

▣ The upper test is to verify the section of the abnormal operation.

▣ All Voltages are abnormal condition.
▣ Vcc output voltage is abnormal condition.
2] Components operation test involved in Vcc
Vcc : 3.3V
Vin(18V) PWM IC ESD diode(#1)
open short

Timing controller IC
open

Pvcom IC
open

※ Vcc : operating voltage of circuit component Spread spectrum

open

EEPROM
open
▣ This test is to verify the abnormal component in Vcc section.
▣ After cutting the each part of the line to find the defect component, open & short test was done with GND.
▣ Through the test, we found that ESD diode got defected.

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 2. Analysis & Root cause
3] Mechanism of the no display
▣ Burnt ESD diode can make abnormal operation of circuit components.
-. No video display is especially related to T-con and EEPROM.
-. Vcc=GND means that circuit component has no power.
-. Through the burnt ESD diode, Vcc is connected to GND.
This phenomenon removes the most of the circuit power of the source PCB.

Vcc(3.3V)

T-con EEPROM
ESD diode

4] Cause of the ESD diode burning

▣ Burning ESD diode can take place with high voltage stress.
-. #1 ESD diode is connected to Vcc, SCL & SDA.
-. Vcc=SCL=SDA=3.3V
-. Short between pin#4 & #5 by inserting wrongly or metallic particle could be the
situation that makes this issue.

※ SCL & SDA is the line to make a write ODC data and to adjust the Vcom.

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 2. Analysis & Root cause
5] Specific Analysis for defect diode
▣ Analysis result after decap in KEC.
-. Diode damaged due to an external source
-. Refer to the X-ray inspection between VCC and GND shorted

< Silicon melting point on the defect sample >

6] After removing the defect diode

▣ This diode purpose is only to prevent ESD and the defect panel normally operates after removing the damaged diode

Removing the
defect Diode
Normal
Display

< Remove the defected diode > < Screen Display >

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 3. Countermeasure

3. Conclusion
1) No video phenomenon happened because the ESD diode burning.

2) This S/N 20187N8670109 sample passed LGD internal inspection & OBA

3) LGD assembled MVT sample at Nanjing MP line. This kind of the defect is obviously detected on the first
step of quality assurance process.

4) Thus, it is assumed that the short between pin #4 & pin #5 happened because of metallic foreign materials inflows

5) Actually. this connector has been used for LM190E08 and LM190WX1 series model from Mar. of this year,
there`s no this kind of issue happened

6) LGD regards this is not a reliability problem but handling issue and will not happen in MP process

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 Appendix 1. Assumption of the defect occurrence
Case1. Metallic Particle in the User connector Case2. Movable metallic Particle on the User connector

Vin(18~19V)
Vin(18~19V)
Damage Damage

GND
VCC
GND
VCC
Diode Diode

Pin4 : Vin (18V)

Pin4 : Vin (18V)
Mobile metallic Particle
Pin4 & Pin5

Pin5 : SCL
Pin5 : SCL
Short
Pin4 & Pin5
Metallic Particle
Short

#7 #6 #5 #4 #3 #2 #1 #7 #6 #5 #4 #3 #2 #1

※ ESD Protection Diode Spec

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 Appendix 2. Particle Reduce Plan in LGD
Mini Super Cleaning is an enhanced cleaning activity consisting of cleaning for concerned
facilities and cleaning for their environment together to minimize Manufacturing Productivity Loss.

Mini Super Cleaning ● Cleaning Activity

1. DSM : Defect Source Mapping per facility
2. HID Inspection based on DSM
3. Planning for Cleaning of detected F/M (Foreign Material)
Cleaning Activity Maintenance & Repair - Time Planning & Job Allocation
(Operator) (Tech/Eng’r)
4. Implementing Mini Super Cleaning
5. Review on Cleaning result and update in DSM.
DSM / Main.& Rep. items
Preliminary HID from Prior Process Assess.
Inspection ● Maintenance & Repair Activities

1. Preliminary Process Assessment for related factors

Cleaning Planning Main.&Rep. Planning 2. Sharing Process Assessment result and Improvement Plan
- Time Planning & Job Allocation
- List-up for required items to be prepared in advance

Main.&Rep. Execution
3. Implementing Mini Super Cleaning
Cleaning Execution
4. List up on Process Improvement & newly found items

Finding Improv. Finding Improv. ● Cycle of Mini Super Cleaning

Result Analysis Result Analysis

1. Initial Stage : Once a month

§DSM: Defect Source Mapping 2. Stabilization Stage : Once a quarter
§HID : High Intensity-Discharge Lamp
3. High Concerned facility : Twice a month

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 Appendix 3. Particle Reduce Plan in OBA

Item

Cleaning OBA room : 3times by shift

Cleaning inspection area : every 2 hrs
Environment □ cleaning in OBA site
Cleaning status is managed by shift leader & OBA QA (4times by shift)

QISDA (SZ) also perform audit every month

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