PROIECT

MASURARI SI TRADUCTOARE / SENSORS AND TRANSDUCERS

SEMESTRU I - 2018

Cap. 1. MASURARI SI TRADUCTOARE / SENSORS AND TRANSDUCERS

1.1. Notiuni teoretice despre adaptoare si traductoare / Theoretical notions about adapters
and transducers.
1.2. Tipuri de senzori / Sensors Types
1.3. Marimi masurabile cu senzori / Measurable sizes with sensors

Cap. 2. MICROCONTROLLER-ul
2.1. Notiuni teoretice pentru microcontroller / Theoretical notions for microcontroller
2.2. Microcontroller ATmega
2.3. Interfete standard controlate direct cu microcontroller / Standard interface can be
controlled directly by microcontroller: ARDUINO, 8051, AVR, PIC, DSP, ARM, ARM, MSP430, TTL
logic

Cap. 3. Platforma de dezvoltare ARDUINO / ARDUINO Development Platform

3.1. ARDUINO NANO
3.1.1. Caracteristici tehnice / Technical specifications
3.1.2. Instructiuni / The instructions for ARDUINO
3.2. ARDUINO UNO
3.2.1. Caracteristici tehnice / Technical specifications
3.2.2. Instructiuni / The instructions for ARDUINO
3.3. ARDUINO MEGA
3.3.1. Caracteristici tehnice / Technical specifications
3.1.2. Instructiuni / The instructions for ARDUINO
3.4. ARDUINO DUE
3.4.1. Caracteristici tehnice / Technical specifications
3.1.2. Instructiuni / The instructions for ARDUINO
3.5. ARDUINO MEGA 2560
3.5.1. Caracteristici tehnice / Technical specifications
3.1.2. Instructiuni / The instructions for ARDUINO

Cap. 4. Program software ARDUINO

4.1. Structura / Structure;
4.2. Variabile / Variables;
4.3. Functii / Functions;

Cap. 5. Instalare software ARDUINO / Install the ARDUINO Software

Cap. 6. Module de Senzori compatibili cu ARDUINO / Sensor Module Kit for ARDUINO
Compatible
6.1. IR emission;
Specificatie tehnica. Fenomenul fizic care sta la baza conversiei, marimea masurata.
Mediul/modul de comunicatie / Technical specification. The physical phenomenon behind the
conversion, the measured size. Communication environment / mode.
 6.2. IR receiver;
Specificatie tehnica. Fenomenul fizic care sta la baza conversiei, marimea masurata.
Mediul/modul de comunicatie / Technical specification. The physical phenomenon behind the
conversion, the measured size. Communication environment / mode.
6.3. Ultrasonic sensor;
Specificatie tehnica. Fenomenul fizic care sta la baza conversiei, marimea masurata.
Mediul/modul de comunicatie / Technical specification. The physical phenomenon behind the
conversion, the measured size. Communication environment / mode.
6.4. Photoresistor;
Specificatie tehnica. Fenomenul fizic care sta la baza conversiei, marimea masurata.
Mediul/modul de comunicatie / Technical specification. The physical phenomenon behind the
conversion, the measured size. Communication environment / mode.
6.5. Laser emit;
Specificatie tehnica. Fenomenul fizic care sta la baza conversiei, marimea masurata.
Mediul/modul de comunicatie / Technical specification. The physical phenomenon behind the
conversion, the measured size. Communication environment / mode.
6.6. Shock;
Specificatie tehnica. Fenomenul fizic care sta la baza conversiei, marimea masurata.
Mediul/modul de comunicatie / Technical specification. The physical phenomenon behind the
conversion, the measured size. Communication environment / mode.
6.7. Water Level sensor;
Specificatie tehnica. Fenomenul fizic care sta la baza conversiei, marimea masurata.
Mediul/modul de comunicatie / Technical specification. The physical phenomenon behind the
conversion, the measured size. Communication environment / mode.
6.8. DS 3231 RTC Module;
Specificatie tehnica. Fenomenul fizic care sta la baza conversiei, marimea masurata.
Mediul/modul de comunicatie / Technical specification. The physical phenomenon behind the
conversion, the measured size. Communication environment / mode.
6.9. Magnetic Spring;
Specificatie tehnica. Fenomenul fizic care sta la baza conversiei, marimea masurata.
Mediul/modul de comunicatie / Technical specification. The physical phenomenon behind the
conversion, the measured size. Communication environment / mode.
6.10. Degital Temperature;
Specificatie tehnica. Fenomenul fizic care sta la baza conversiei, marimea masurata.
Mediul/modul de comunicatie / Technical specification. The physical phenomenon behind the
conversion, the measured size. Communication environment / mode.
6.11. Analog Temperature;
Specificatie tehnica. Fenomenul fizic care sta la baza conversiei, marimea masurata.
Mediul/modul de comunicatie / Technical specification. The physical phenomenon behind the
conversion, the measured size. Communication environment / mode.
6.12. Photo intrreuptor;
Specificatie tehnica. Fenomenul fizic care sta la baza conversiei, marimea masurata.
Mediul/modul de comunicatie / Technical specification. The physical phenomenon behind the
conversion, the measured size. Communication environment / mode.
6.13. Temperature and humidity;
Specificatie tehnica. Fenomenul fizic care sta la baza conversiei, marimea masurata.
Mediul/modul de comunicatie / Technical specification. The physical phenomenon behind the
conversion, the measured size. Communication environment / mode.
 6,14. Linear Hall ( Hall Magnetic, Analog Hall, Mini Reed);
Specificatie tehnica. Fenomenul fizic care sta la baza conversiei, marimea masurata.
Mediul/modul de comunicatie / Technical specification. The physical phenomenon behind the
conversion, the measured size. Communication environment / mode.
6,15. Rotary encoder
Specificatie tehnica. Fenomenul fizic care sta la baza conversiei, marimea masurata.
Mediul/modul de comunicatie / Technical specification. The physical phenomenon behind the
conversion, the measured size. Communication environment / mode.
6.16. Alte tipuri de senzori din gama ARDUINO / Other types of sensors in the
ARDUINO range

Cap. 7. Scheme electronice pentru platforma ARDUINO / Electronic schemes for the
ARDUINO development platform
7.1. Instalare software Fritzing App / Fritzing app install software
7.2. Proteus Desing Suite

Cap. 8. Aplicatii tehnice / Technical applications

IMPORTANT:
1. Pe platforma ARDUINO se utilizeaza intrarile pentru montajul senzorilor iar pe iesire se
monteaza elemente de executie / On the ARDUINO platform are used the inputs for the sensor
assembly and on the output are mounted elements of execution (actuators).
2. Fiecare aplicatie va utilize senzori, elemente de executie si LCD / Each application will
consist of: sensors (input), actuators (output) and LCD for viewing parameters
3. Pentru fiecare aplicatie (prezentatade mai jos) valorile de la senzori sau de la elementele de
executie sunt vizualizate pe LCD / For each application the sensor values or the values from the
execution elements are visualized on the LCD
8.1. Masurarea temperaturii / Temperature control
8.1.1. Specificatie tehnica pentru Senzorul de temperatura si ventilator / Tehnical
specification for Temperature Sensor and fan (cooler)
8.1.2. Schema electronica / Electronic schemes for the ARDUINO platform
8.1.3. Liniile de programare software / Software programming lines
8.2. Masurarea turatiei / The speed of rotation control
8.2.1. Specificatie tehnica pentru Rotary Encoder / Tehnical specification for Rotary
Encoder;
8.2.2. Schema electronica / Electronic schemes for the ARDUINO platform
8.2.3. Liniile de programare software / Software programming lines
8.3. Masurarea nivelului / Level control
8.3.1. Specificatie tehnica pentru senzorul de nivel / Tehnical specification for Water
Level Sensor;
8.3.2. Schema electronica / Electronic schemes for the ARDUINO platform
8.3.3. Liniile de programare software / Software programming lines
8.3. Masurarea inductiei magnetice / Magnetic induction control
8.4.1. Specificatie tehnica pentru senzorul Hall / Tehnical specification for Hall
Magnetic;
8.4.2. Schema electronica / Electronic schemes for the ARDUINO platform
8.4.3. Liniile de programare software / Software programming lines
8.5. Masurarea pierderilor (scurgerilor de gaz) / Gas leakage control
 8.5.1. Specificatie tehnica pentru senzorul IR emisie si IR receptie / Tehnical
specification for IR emission and IR receiver;
8.5.2. Schema electronica / Electronic schemes for the ARDUINO platform
8.5.3. Liniile de programare software / Software programming lines
8.6. Alte aplicatii / Other applications
8.5.1. Specificatie tehnica / Tehnical specification;
8.5.2. Schema electronica / Electronic schemes for the ARDUINO platform
8.5.3. Liniile de programare software / Software programming lines

SEMESTRU II - 2019
Proiectul se continua in semestru II - 2019 la cursul Magistrale de Comunicatie

Cap. 7. Interfete seriale

7.1. Standard RS 232
7.2. Standard RS 485
7.3. Convertor RS 232 – RS 485

Cap. 8 Magistrala de comunicatie I2C / Communication bus I2C

Cap. 9. Magistrala de comunicatie CAN / Communication bus CAN

Cap. 10. Magistrala de comunicatie FIELDBUS

Cap. 11. Magistrale de comunicatie PROFIBUS

Cap. 12. Magistrale de comunicatie ETHERNET

Cap. 10. Aplicatii tehnice complexe