The wafers Metal level tested after WD3 and WD4. As expected the metal level of
the wafers in WD3 is more than WD4. The metal level is showing improvement. So,
the WD3 will be running without Clair by using DIW.
Continue the process using DIW and not Clair. WD3 and WD4 passed internal
specification. More improvement needed to get better results of metal impurities such as
frequent tank cleaning and frequent entire checking of the cleaning machine.
Date:
RT ETR-001 Rev C Part B Page 1
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