Information Sheet 1.

3-1
Mounting components
Learning Objectives:
After reading this INFORMATION SHEET, YOU MUST be able to:
1. Acquire knowledge how to of mount components such as
surface mount, thru-hole mount, and socket mount.
2. Perform mounting components such as surface mount, thru-
hole mount, and socket mount.
3. Understand the importance of mounting components such as
surface mount, thru-hole mount, and socket mount.

There are methods of placing components on a printed circuit board

(PCB). The first one is Through-Hole Mounting (THM) and the other one is
specified as Surface Mount Technology (SMT). At EPR we use SMT as well as
THM. Both methods have their advantages and disadvantages.

Methods in mounting components

1. Point-to-Point Mounting
The technology is characterized by:
 type of component terminals: (a) wire, (b) lug, (c) clamp, (d) plug;
 component mounting by: (a) screwing, (b) clamping, (c) soldering
to lugs, (d) insertion in a socket;
 interconnections are performed using: (a) hook-up wire, (b)
chassis.
Point-to-Point Mounting technology started together with the first electrical
and electronic appliances.

Fig.1. Point-to-Point Mounting

Date Developed: Document No. NTTA-TM1-01

Trainers July 2010 Issued by:
Methodology Level Date Revised:
I February 2012 Page 1 of 250
Developed by: NTTA
Templates Redilyn C.
Agub Revision # 01
 Lug Clamp Wire
(variable resistor) (capacitor) (resistor)

Fig.2. Different types of terminals in electronic components suitable for

point-to point mounting

Method of soldering in the case of Point-to-Point Mounting is manual

soldering using soldering iron.

2. Through-Hole Mount Technology (TMT) is the method of mounting of

electronic components with wire or wire-like stamped terminals by
insertion of terminals in special holes in printed circuit board followed
by soldering of the terminals to metalizes pads that surround the
mounting holes.

The technology is characterized by:

 Needle-like (wire or stamped) terminals of the components;
 Dielectric panel with holes (printed circuit board, PCB);
 Mounting pads around the holes and interconnections between
the pads formed from copper foil laminated to surface of dielectric
panel;
 Components mounting by insertion of wire terminals through the
holes in PCB;
 Wave Soldering Technology.

Dielectric panel and copper foil patterns laminated to its surface

constitute Printed Circuit Board (PCB). Through-Hole Mount
Technology is inseparably linked with PCB.

Date Developed: Document No. NTTA-TM1-01

Trainers July 2010 Issued by:
Methodology Level Date Revised:
I February 2012 Page 2 of 250
Developed by: NTTA
Templates Redilyn C.
Agub Revision # 01
 b

Fig.3. Cross-section of PCB with through-hole mounted components

(a).
Top view on PCB with mounted components (b).
Bottom view on PCB – "printed" copper conductors (c).

Advantages and disadvantages of Thru-hole Mount

Advantages
 Because there is a much stronger connection between the
components and the PCB, through-hole mounted technology is
much more reliable than surface mounted technology. For that
reason, most connectors are still using THM. It is also the
reason that THM is still used a lot in applications for the
military and applications that cause a lot of stress or fast
acceleration on a PCB.
 Because through-hole mounted components are a lot easier to
replace, it is much easier to test or prototype with through-hole
components instead of surface mounted components. Using a
breadboard in combination with through-hole components is
also an ideal combination for prototyping an application.
Disadvantages
 Through-hole components require a lot of space on a PCB in
comparison to surface mounted components.
Date Developed: Document No. NTTA-TM1-01
Trainers July 2010 Issued by:
Methodology Level Date Revised:
I February 2012 Page 3 of 250
Developed by: NTTA
Templates Redilyn C.
Agub Revision # 01
  Most through-hole mounted components need to be placed
manually.

3. Surface Mount Technology (SMT) is the method of mounting of

electronic components on flat surface of PCB without mounting holes.

The technology is characterized by the following features:

 Stamped “legs” in so called leaded component or metallized edges
of so called leadless component (chips) constitute the terminals (see
picture below).
 Component placement on PCB and soldering are completely
automated.
 PCB is similar to TMT PCB but without mounting holes.

Fig.4. Surface mounted components on PCB

Advantages and disadvantages of Surface Mount Technology

Advantages
 SMD components are much smaller than THM components.
This will increase the overall density of the board tremendously.
 SMD components can be placed on both sides of a PCB.

Date Developed: Document No. NTTA-TM1-01

Trainers July 2010 Issued by:
Methodology Level Date Revised:
I February 2012 Page 4 of 250
Developed by: NTTA
Templates Redilyn C.
Agub Revision # 01
  Using a Pick and Place machine for placing the components will
reduce production time.
 SMD components are mostly cheaper compared to THM
components.
Disadvantages
 Most SMD components are not suitable for high-power
applications.
 SMD components are not suitable for prototyping or testing of
small circuits.

SELF-CHECK 1.3-1

Direction: Identify the following items.

1. Mounting procedures Interconnections are performed using hook-up

wire, and chassis.
a. thru-hole mount
b. surface mount
c. point to point mount
2. is the method of mounting of electronic components with
wire or wire-like stamped terminals by insertion of terminals
in special holes in printed circuit board.
a. thru-hole mount
b. surface mount
c. point to point mount
3. The method of mounting of electronic components on flat surface of
PCB without mounting holes.
a. thru-hole mount
b. surface mount
c. point to point mount
4. Components mounting by insertion of wire terminals through the
holes in PCB
a. thru-hole mount
b. surface mount
c. point to point mount
5. The technology is characterized by type of component terminals
wire, lug, clamp, and plug.
a. thru-hole mount
b. surface mount
c. point to point mount

Date Developed: Document No. NTTA-TM1-01

Trainers July 2010 Issued by:
Methodology Level Date Revised:
I February 2012 Page 5 of 250
Developed by: NTTA
Templates Redilyn C.
Agub Revision # 01
 Date Developed: Document No. NTTA-TM1-01
Trainers July 2010 Issued by:
Methodology Level Date Revised:
I February 2012 Page 6 of 250
Developed by: NTTA
Templates Redilyn C.
Agub Revision # 01
 ANSWER KEY 1.2-1

1. c
2. a
3. b
4. a
5. c

Date Developed: Document No. NTTA-TM1-01

Trainers July 2010 Issued by:
Methodology Level Date Revised:
I February 2012 Page 7 of 250
Developed by: NTTA
Templates Redilyn C.
Agub Revision # 01
TASK SHEET 1.3-1

Title: Mounting components

Performance Objective: You should be able to perform in mounting

components in point to point mount, thru-
hole mount, and surface mount.
Supplies/Materials : Soldering iron, Solder lead, pliers,
desoldering tools, screwdrivers, utility wife, cleaning brush, assorted
components and PCB’s.
Equipment : N/A

Steps/Procedure:
Procedure in PCB designing

1. Prepare the tools and materials needed in mounting components

Tools and materials needed:

 Soldering iron
 Solder lead
 Pliers
 desoldering tools
 screwdrivers
 utility wife
 cleaning brush
 assorted components and PCB’s.

2. Prepare the schematic diagram of the circuit.

3. Make the PCB design. Arrange the components terminals on a
graphing paper or a piece of paper to show/illustrate the
interconnection of the components based on the schematic diagram
given.
4. Interconnect the traces to the pads/terminals of the components
depending on the connections of the components to one another.
Make sure that the traces will be the same as the connection of the
schematic diagram.
5. Finalized your design with the actual size of the component, terminals
and size of the PCB (1 ½ ” x 2”) to check the spacing of the
components. It should not be on top of the other components.
6. Let your work check by the trainer.
7. Discuss your answers with the trainer
8. Apply the safety precautions following the OH&S policies and
Procedures

Assessment Method:

Written - Oral Questioning

Performance Criteria checklist
 Performance Criteria Checklist 1.2-1

CRITERIA
Did you…. YES NO
1. Interconnect base on the schematic diagram?
2. Used appropriate tools and materials in PCB
designing?
3. Position the terminals not overlapping to each
components?
4. Used correct PCB size?

5. Position the terminal of the input , output and

auxiliary components accessible?
6. Provide space for the bolts and nuts?
7. Provide proper grounding on your design?