Applications
●● Lighting Systems
●● Industrial Control
●● Telecom
●● Security Systems
●● Instrumentation
DC Electrical Characteristics
(VCC = 3.3V ±10%, TA =TMIN to TMAX, unless otherwise noted. Typical values are at VCC = 3.3V and TA = +25°C.) (Note 1)
ESD PROTECTION
ESD Protection for Y, Z, A, and B Human Body Model ±15 kV
Note 1: All currents into the device are positive. All currents out of the device are negative. All voltages are referred to device
ground, unless otherwise noted.
Note 2: ΔVOD and ΔVOC are the changes in VOD and VOC, respectively, when the DI input changes state.
Note 3: The short-circuit output current applies to peak current just prior to foldback current limiting. The short-circuit foldback output
current applies during current limiting to allow a recovery from bus contention.
Switching Characteristics
MAX3070E toc02
MAX3070E toc03
25 30
0.9
OUTPUT CURRENT (mA)
25
DE = VCC 20
0.8
20
15
DE = 0
15
0.7
10
10
0.6
5 5
0.5 0 0
-50 -25 0 25 50 75 100 125 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
TEMPERATURE (°C) OUTPUT HIGH VOLTAGE (V) OUTPUT HIGH VOLTAGE (V)
RECEIVER OUTPUT HIGH VOLTAGE RECEIVER OUTPUT LOW VOLTAGE DRIVER OUTPUT CURRENT
vs. TEMPERATURE vs. TEMPERATURE vs. DIFFERENTIAL OUTPUT VOLTAGE
3.30 0.8 100
MAX3070E toc06
MAX3070E toc04
MAX3070E toc05
IO = -1mA IO = -1mA
90
0.7
3.25
80
OUTPUT HIGH VOLTAGE (V)
0.6
OUTPUT CURRENT (mA)
70
3.20
0.5 60
3.15 0.4 50
40
0.3
3.10
30
0.2
20
3.05
0.1 10
3.00 0 0
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
TEMPERATURE (°C) TEMPERATURE (°C) DIFFERENTIAL OUTPUT VOLTAGE (V)
DRIVER DIFFERENTIAL OUTPUT VOLTAGE OUTPUT CURRENT OUTPUT CURRENT
vs. TEMPERATURE vs. TRANSMITTER OUTPUT HIGH VOLTAGE vs. TRANSMITTER OUTPUT LOW VOLTAGE
2.60 160 180
MAX3070E toc09
MAX3070E toc08
XMAX3070E toc07
140
2.40 140
120
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
2.30
120
2.20 100
100
2.10 80
80
2.00 60
60
1.90
40 40
1.80
1.70 20 20
1.60 0 0
-50 -25 0 25 50 75 100 125 -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 0 2 4 6 8 10 12
TEMPERATURE (°C) OUTPUT HIGH VOLTAGE (V) OUTPUT LOW VOLTAGE (V)
MAX3070E toc11
MAX3070E toc12
1.8 DRIVER PROPAGATION DELAY (ns)
tDPLH tDPLH
1.4
400
1.2 800 tDPHL tDPHL
1.0 350
0.8 700
300
0.6
0.4 600
250
0.2
0 500 200
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
TEMPERATURE (°C) TEMPERATURE (°C) TEMPERATURE (°C)
DRIVER PROPAGATION DELAY RECEIVER PROPAGATION DELAY RECEIVER PROPAGATION DELAY
vs. TEMPERATURE (16Mbps) vs. TEMPERATURE (250kbps AND 500kbps) vs. TEMPERATURE (16Mbps)
30 150
MAX3070E toc13
MAX3070E toc14
MAX3070E toc15
RECEIVER PROPAGATION DELAY (ns) 70
DRIVER PROPAGATION DELAY (ns)
25
120 60
20 50
tDPLH
90
tDPLH tDPLH 40
15 tDPHL
tDPHL tDPHL
60 30
10
20
30
5
10
0 0 0
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
TEMPERATURE (°C) TEMPERATURE (°C) TEMPERATURE (°C)
VA - VB
DI 1V/div
2V/div
VY - VZ RO
2V/div 2V/div
1µs/div 200ns/div
DRIVER PROPAGATION DELAY (500kbps) DRIVER PROPAGATION DELAY (16Mbps) RECEIVER PROPAGATION DELAY (16Mbps)
MAX3070E toc18 MAX3070E toc19 MAX3070E toc20
VA
1V/div
DI
DI 2V/div
2V/div VB
1V/div
VZ
1V/div
VY - VZ
2V/div
VY RO
1V/div 2V/div
3V
Y
DE
RL/2
Y
VOD DI VOD RL CL
RL/2 VOC Z
VCC
DI VCC/2
0
tDPLH tDPHL 1/2 VO
Z
VO
Y
1/2 VO
VDIFF = V (Y) - V (Z)
VO
VDIFF 0 90% 90%
10% 10%
-VO
tDR tDF
S1
0 OR 3V D OUT
CL RL = 500Ω
50pF
GENERATOR
50Ω
VCC
DE VCC / 2
tDZH, tDZH(SHDN)
0
0.25V VOH
VCC
RL = 500Ω
S1
0 OR 3V D OUT
CL
50pF
GENERATOR 50Ω
VCC
DE VCC / 2
tDZL, tDZL(SHDN)
0
tDLZ
VCC
OUT VOM = (VOL + VCC) / 2
VOL 0.25V
B -1V
B RECEIVER
OUTPUT
ATE VID R tRPLH
VOH
tRPHL
A 1.5V
VOL
RO
THE RISE TIME AND FALL TIME OF INPUTS A AND B < 4ns
Figure 6. Receiver Propagation Delay Test Circuit Figure 7. Receiver Propagation Delays
S1
+1.5V S3
VCC
1kΩ
-1.5V VID R
CL
15pF S2
GENERATOR 50Ω
S1 OPEN S1 CLOSED
S2 CLOSED S2 OPEN
S3 = +1.5V S3 = -1.5V
3V 3V
1.5V
RE RE
0 0
tRZH, tRZH(SHDN)
tRZL, tRZL(SHDN)
VOH VCC
RO
VOH / 2
(VOL + VCC) / 2
RO
0 VOL
S1 OPEN S1 CLOSED
S2 CLOSED S2 OPEN
S3 = +1.5V S3 = -1.5V
3V 3V
1.5V 1.5V
RE
0 RE
0
tRHZ
tRLZ
VCC
VOH
0.25V
RO
RO 0.25V
0 VOL
Pin Description
PIN
MAX3070E MAX3071E MAX3072E
MAX3073E MAX3074E MAX3075E MAX3079E
MAX3076E MAX3077E MAX3078E NAME FUNCTION
HALF- FULL- HALF-
FULL-DUPLEX
DUPLEX DUPLEX DUPLEX
DEVICES
DEVICES MODE MODE
Half-/Full-Duplex Select Pin. Connect H/F to VCC for half-
— — — 1 1 H/F duplex mode; connect to GND or leave unconnected for
full-duplex mode.
Receiver Output. When RE is low and if (A - B) ≥ -50mV,
2 2 1 2 2 RO
RO is high; if (A - B) ≤ -200mV, RO is low.
Receiver Output Enable. Drive RE low to enable RO; RO
is high impedance when RE is high. Drive RE high and DE
3 — 2 3 3 RE
low to enter low-power shutdown mode. RE is a hot-swap
input (see the Hot-Swap Capability section for details).
*MAX3079E only. In half-duplex mode, the driver outputs serve as receiver inputs. The full-duplex receiver inputs (A and B) still have
a 1/8-unit load, but are not connected to the receiver.
Function Tables
MAX3070E/MAX3073E/MAX3076E MAX3071E/MAX3074E/MAX3077E
TRANSMITTING TRANSMITTING
INPUTS OUTPUTS INPUT OUTPUTS
RE DE DI Z Y DI Z Y
X 1 1 0 1 1 0 1
X 1 0 1 0 0 1 0
0 0 X High-Z High-Z RECEIVING
1 0 X Shutdown INPUTS OUTPUT
RECEIVING A, B RO
INPUTS OUTPUT ≥ -50mV 1
RE DE A, B RO ≤ -200mV 0
0 X ≥ -50mV 1 Open/shorted 1
0 X ≤ -200mV 0
Open/
0 X 1
shorted
1 1 X High-Z
1 0 X Shutdown
MAX3079E
TRANSMITTING
INPUTS OUTPUTS
TXP RE DE DI Z Y
0 X 1 1 0 1
0 X 1 0 1 0
1 X 1 1 1 0
1 X 1 0 0 1
X 0 0 X High-Z High-Z
X 1 0 X Shutdown
RECEIVING
INPUTS OUTPUTS
H/F RXP RE DE A, B Y, Z RO
0 0 0 X > -50mV X 1
0 0 0 X < -200mV X 0
0 1 0 X > -50mV X 0
0 1 0 X < -200mV X 1
1 0 0 0 X > -50mV 1
1 0 0 0 X < -200mV 0
1 1 0 0 X > -50mV 0
1 1 0 0 X < -200mV 1
0 0 0 X Open/shorted X 1
1 0 0 0 X Open/shorted 1
0 1 0 X Open/shorted X 0
1 1 0 0 X Open/shorted 0
X X 1 1 X X High-Z
X X 1 0 X X Shutdown
X = Don’t care; shutdown mode, driver and receiver outputs are high impedance.
Detailed Description terminated bus with all transmitters disabled, the receiver’s
The MAX3070E–MAX3079E high-speed transceivers for differential input voltage is pulled to 0V by the termination.
RS-485/RS-422 communication contain one driver and With the receiver thresholds of the MAX3070E family, this
one receiver. These devices feature fail-safe circuitry, results in a logic high with a 50mV minimum noise margin.
which guarantees a logic-high receiver output when Unlike previous fail-safe devices, the -50mV to -200mV
the receiver inputs are open or shorted, or when they threshold complies with the ±200mV EIA/TIA-485 standard.
are connected to a terminated transmission line with Hot-Swap Capability
all drivers disabled (see the Fail-Safe section). The (Except MAX3071E/MAX3074E/MAX3077E)
devices also feature a hot-swap capability allowing line
insertion without erroneous data transfer (see the Hot- Hot-Swap Inputs
Swap Capability section). The MAX3070E/MAX3071E/ When circuit boards are inserted into a hot, or powered,
MAX3072E feature reduced slew-rate drivers that backplane, differential disturbances to the data bus can
minimize EMI and reduce reflections caused by improperly lead to data errors. Upon initial circuit board insertion,
terminated cables, allowing error-free data transmission the data communication processor undergoes its own
up to 250kbps. The MAX3073E/MAX3074E/MAX3075E power-up sequence. During this period, the processor’s
also offer slew-rate limits allowing transmit speeds up logic-output drivers are high impedance and are unable to
to 500kbps. The MAX3076E/MAX3077E/MAX3078Es’ drive the DE and RE inputs of these devices to a defined
driver slew rates are not limited, making transmit speeds logic level. Leakage currents up to ±10μA from the high-
up to 16Mbps possible. The MAX3079E’s slew rate is impedance state of the processor’s logic drivers could
selectable between 250kbps, 500kbps, and 16Mbps by cause standard CMOS enable inputs of a transceiver to
driving a selector pin with a three-state driver. drift to an incorrect logic level. Additionally, parasitic circuit
board capacitance could cause coupling of VCC or GND
The MAX3072E/MAX3075E/MAX3078E are half-duplex
to the enable inputs. Without the hot-swap capability,
transceivers, while the MAX3070E/MAX3071E/MAX3073E/
these factors could improperly enable the transceiver’s
MAX3074E/MAX3076E/MAX3077E are full-duplex transceivers.
driver or receiver.
The MAX3079E is selectable between half and full-duplex
communication by driving a selector pin (SRL) high or low, When VCC rises, an internal pulldown circuit holds DE
respectively. low and RE high. After the initial power-up sequence, the
pulldown circuit becomes transparent, resetting the hot-
All devices operate from a single 3.3V supply. Drivers are
swap tolerable input.
output short-circuit current limited. Thermal-shutdown circuitry
protects drivers against excessive power dissipation. When Hot-Swap Input Circuitry
activated, the thermal-shutdown circuitry places the driver The enable inputs feature hot-swap capability. At the input
outputs into a high-impedance state. there are two NMOS devices, M1 and M2 (Figure 9).
When VCC ramps from zero, an internal 10μs timer turns
Receiver Input Filtering
on M2 and sets the SR latch, which also turns on M1.
The receivers of the MAX3070E–MAX3075E, and the Transistors M2, a 500μA current sink, and M1, a 100μA
MAX3079E when operating in 250kbps or 500kbps mode, current sink, pull DE to GND through a 5kΩ resistor. M2 is
incorporate input filtering in addition to input hysteresis. designed to pull DE to the disabled state against an external
This filtering enhances noise immunity with differential parasitic capacitance up to 100pF that can drive DE high.
signals that have very slow rise and fall times. Receiver After 10μs, the timer deactivates M2 while M1 remains on,
propagation delay increases by 25% due to this filtering. holding DE low against three-state leakages that can drive
Fail-Safe DE high. M1 remains on until an external source overcomes
the required input current. At this time, the SR latch resets
The MAX3070E family guarantees a logic-high receiver
and M1 turns off. When M1 turns off, DE reverts to a standard,
output when the receiver inputs are shorted or open, or
high-impedance CMOS input. Whenever VCC drops
when they are connected to a terminated transmission
below 1V, the hot-swap input is reset.
line with all drivers disabled. This is done by setting the
receiver input threshold between -50mV and -200mV. If For RE there is a complementary circuit employing two
the differential receiver input voltage (A - B) is greater PMOS devices pulling RE to VCC.
than or equal to -50mV, RO is logic-high. If A - B is less
than or equal to -200mV, RO is logic-low. In the case of a
RC RD
1MΩ 1500Ω
IP 100% Ir PEAK-TO-PEAK RINGING
90% (NOT DRAWN TO SCALE)
CHARGE-CURRENT- DISCHARGE
LIMIT RESISTOR RESISTANCE
AMPS
HIGH- DEVICE 36.8%
VOLTAGE Cs STORAGE UNDER
DC 100pF CAPACITOR TEST 10%
SOURCE
0
0 TIME
tRL
tDL
CURRENT WAVEFORM
Figure 10a. Human Body ESD Test Model Figure 10b. Human Body Current Waveform
RC RD I
50MΩ TO 100MΩ 330Ω 100%
90%
CHARGE-CURRENT- DISCHARGE
LIMIT RESISTOR RESISTANCE
IPEAK
HIGH- DEVICE
VOLTAGE Cs STORAGE UNDER
DC 150pF CAPACITOR TEST
SOURCE 10%
tr = 0.7ns TO 1ns t
30ns
60ns
Figure 10c. IEC 1000-4-2 ESD Test Model Figure 10d. IEC 1000-4-2 ESD Generator Current Waveform
lower in the IEC 1000-4-2 model. Hence, the ESD withstand Applications Information
voltage measured to IEC 1000-4-2 is generally lower than
that measured using the Human Body Model. Figure 10c 256 Transceivers on the Bus
shows the IEC 1000-4-2 model, and Figure 10d shows The standard RS-485 receiver input impedance is 12kΩ
the current waveform for IEC 1000-4-2 ESD Contact (1-unit load), and the standard driver can drive up to
Discharge test. 32-unit loads. The MAX3070E family of transceivers has
a 1/8-unit load receiver input impedance (96kΩ), allowing
The air-gap test involves approaching the device with a
up to 256 transceivers to be connected in parallel on one
charged probe. The contact-discharge method connects
communication line. Any combination of these devices as
the probe to the device before the probe is energized.
well as other RS-485 transceivers with a total of 32-unit
Machine Model loads or fewer can be connected to the line.
The machine model for ESD tests all pins using a 200pF Reduced EMI and Reflections
storage capacitor and zero discharge resistance. The The MAX3070E/MAX3071E/MAX3072E feature reduced
objective is to emulate the stress caused when I/O pins slew-rate drivers that minimize EMI and reduce reflections
are contacted by handling equipment during test and caused by improperly terminated cables, allowing error-
assembly. Of course, all pins require this protection, not free data transmission up to 250kbps. The MAX3073E/
just RS-485 inputs and outputs. MAX3074E/MAX3075E offer higher driver output slew-
rate limits, allowing transmit speeds up to 500kbps.
The MAX3079E with SRL = VCC or unconnected, are
slew-rate limited. With SRL unconnected, the MAX3079E
error-free data transmission is up to 250kbps; with SRL
connected to VCC the data transmit speeds up to 500kbps.
120Ω 120Ω
DE
B B
DI
D D
DI
DE A B A B A A
RO R R RO
RE RE
R R
D D
MAX3072E
MAX3075E
MAX3078E
MAX3079E (HALF-DUPLEX) DI DE RO RE DI DE RO RE
A Y
120Ω 120Ω
RO R D DI
B
RE
Z
DE
DE
Z B
RE
120Ω 120Ω
DI D R RO
Y
A
Y Z B A Y Z B A
R R
MAX3070E
D D
MAX3073E
MAX3076E
MAX3079E (FULL-DUPLEX)
DI DE RE RO DI DE RE RO
Selector Guide
RECEIVER/
HALF/FULL- DATA RATE SLEW-RATE LOW-POWER TRANSCEIVERS
PART DRIVER PINS
DUPLEX (MBPS) LIMITED SHUTDOWN ON BUS
ENABLE
MAX3070E Full 0.250 Yes Yes Yes 256 14
MAX3071E Full 0.250 Yes No No 256 8
MAX3072E Half 0.250 Yes Yes Yes 256 8
MAX3073E Full 0.5 Yes Yes Yes 256 14
MAX3074E Full 0.5 Yes No No 256 8
MAX3075E Half 0.5 Yes Yes Yes 256 8
MAX3076E Full 16 No Yes Yes 256 14
MAX3077E Full 16 No No No 256 8
MAX3078E Half 16 No Yes Yes 256 8
MAX3079E Selectable Selectable Selectable Yes Yes 256 14
VCC MAX3070E
DE VCC RE
4 14 0.1µF MAX3073E
MAX3076E
N.C. 1 14 VCC 9 Y
5 Rt
RO 2 R 13 N.C. DI D R RO
10
RE 3 12 A Z
12 A
DE 4 11 B 2 Rt
RO R D DI
DI 5 11
10 Z
D B
1, 8, 13
GND 6 9 Y N.C. GND
3 6, 7
GND 7 8 N.C. GND DE
RE
TYPICAL FULL-DUPLEX OPERATING CIRCUIT
DIP/SO
0.1µF
MAX3071E VCC
VCC 1 MAX3074E
MAX3077E
VCC 1 8 A
R 5 Y
RO 2 7 B 3 Rt
DI D R RO
6
DI 3 6 Z Z
D 8 A
GND 4 5 Y
2 Rt
RO R D DI
7
B
DIP/SO
GND
4
GND
TYPICAL FULL-DUPLEX OPERATING CIRCUIT
0.1µF
MAX3072E
MAX3075E DE
MAX3078E
1 8 VCC DI
RO 1 R 8 VCC RO R D
2 7 A A
RE 2 7 B RE Rt Rt
3 6
DE 3 6 A DE
B B
4 5 RO
DI 4 D 5 GND DI D R
GND
RE
DIP/SO
TYPICAL HALF-DUPLEX OPERATING CIRCUIT
VCC RE
MAX3079E
TOP VIEW RO
H/F 1 14 VCC B
RXP
RO 2 13 RXP
RE 3 12 A
DE 4 MAX3079E 11 B
H/F
Z
DI 5 10 Z
TXP
SRL 6 9 Y
GND 7 8 TXP
Y
DIP/SO DI
Revision History
REVISION REVISION PAGES
DESCRIPTION
NUMBER DATE CHANGED
0 10/02 Initial release. —
Added /PR information to reflect new characterization information for military 2, 3, 7, 8, 12, 13, 19,
2 4/09
temperature version. 22–25
Updated Benefits and Features section and added MAX3077EESA/V+ to Ordering
3 9/15 1, 22
Information section for automotive customers
4 1/16 Replaced leaded part numbers with lead-free part numbers 1, 18, 22
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com.
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
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