CONFIDENTIAL

LED TV
SERVICE MANUAL
CHASSIS : UD74Q

MODEL : 65UJ67*V 65UJ67*V-ZC/ZD

65UJ655V 65UJ655V-ZC
65UJ701V 65UJ701V-ZC
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

P/NO : MFL69832202 (1801-REV02)

Copyright © 2017 LG Electronics Inc. All rights reserved. Only training and service purposes.
 CONTENTS

CONTENTS ............................................................................................... 2

SAFETY PRECAUTIONS ......................................................................... 3

SERVICING PRECAUTIONS..................................................................... 4

SPECIFICATION........................................................................................ 6

SOFTWARE UPDATE............................................................................... 11

BLOCK DIAGRAM ................................................................................... 12

EXPLODED VIEW ................................................................................... 25

DISASSEMBLY GUIDE .......................................................................... 26

TROUBLE SHOOTING GUIDE ................................................. APPENDIX

-2- Copyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes.
 SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance Leakage Current Hot Check (See below Figure)

An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed

metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

-3- Copyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes.
 SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precau-
tions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo-
sion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication
of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam-
age caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter-
natively, obtain and wear a commercially available discharg-
ing wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.
-4-
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo-
sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static type solder removal device. Some sol-
der removal devices not classified as “anti-static” can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads elec-
trically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective mate-
rial to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or cir-
cuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity suf-
ficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropri-
ate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the compo-
nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remain-
ing on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
-5-
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed when-
ever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes.
 SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range 3. Test method

This specification is applied to the LED TV with UD74Q (1) Performance: LGE TV test method followed
chassis. (2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC specification
- Wireless : Wireless HD Specification (Option)
2. Requirement for Test
Each part is tested as below without special appointment.
(1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C
(2) Relative Humidity: 65 % ± 10 %
(3) Power Voltage
: Standard input voltage (AC 100~240 V, 50/60 Hz)
* Standard Voltage of each products is marked by models.
(4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
(5) The receiver must be operated for about 20 minutes prior
to the adjustment.

4. Model General Specification

No. Item Specification Remarks
DTV & Analog (Total 37 countries)

DTV (MPEG2/4, DVB-T) : 26 countrie

Germany, Netherland, Switzerland, Hungary, Austria, Slovenia, Bulgaria,
France, Spain, , Belgium, Luxemburg, Greece, Czech, Turkey, Morocco,
Ireland, Latvia, Estonia, Lithuania, Poland, Portugal, Romania, Albania,
Bosnia, Slovakia, Belarus

DTV (MPEG2/4, DVB-T2) :11 countries

UK(Ireland), Sweden, Denmark, Finland, Norway, Ukraine, Kazakhstan,
Russia, Italy, Croatia, Serbia

DTV (MPEG2/4, DVB-C) : 37 countries

Germany, Netherland, Switzerland, Hungary, Austria, Slovenia, Bulgaria,
France, Spain, Italy, Belgium, Russia, Luxemburg, Greece, Czech, Croa-
tia, Turkey, Morocco, Ireland, Latvia, Estonia, Lithuania, Poland, Portugal,
1 Market EU/CIS(PAL Market-37Countries) Romania, Albania, Bosnia, Serbia, Slovakia, Belarus, UK, Sweden, Den-
mark, Finland, Norway, Ukraine, Kazakhstan

DTV (MPEG2/4,DVB-S) : 37 countries

Germany, Netherland, Switzerland, Hungary, Austria, Slovenia, Bulgaria,
France, Spain,Belgium, Luxemburg, Greece, Czech, Turkey, Morocco,
Ireland, Latvia, Estonia, Lithuania, Poland, Portugal, Romania, Albania,
Bosnia, Slovakia, Belarus, UK(Ireland), Sweden, Denmark, Finland, Nor-
way, Ukraine, Kazakhstan,Russia, Italy, Croatia, Serbia

Supported satellite : 35 satellites

ABS1 75.0E , AMOS 4.0W , ASIASAT3S 105.5E , ASTRA 19.2E , ASTRA
23.5E , ASTRA 28.2E , ASTRA 4.8E, ATLANTIC BIRD2 8.0W , ATLANTIC
BIRD3 5.0W , BADR 26.0E , DIRECTV-1R 56.0E , EUROBIRD 9A 9.0E ,
EUROBIRD3 33.0E , EUTELSAT 36 A/B 36.0E ,
EUTELSAT W2A 10.0E , EUTELSAT W3A 7.0E , EUTELSAT7WA 7.3W

-6- Copyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes.
No. Item Specification Remarks

1)PAL/SECAM B/G/I/D/K
2 Broadcasting system SECAM L/L’
2)DVB-T/T2, C, S/S2

1 ) Digital TV
-VHF, UHF
-C-Band, Ku-Band
2) Analogue TV
3 Program coverage
-VHF : E2 to E12
-UHF : E21 to E69
-CATV : S1 to S20
-HYPER : S21 to S47
► DVB-T
- Guard Interval(Bitrate_Mbit/s)
1/4, 1/8, 1/16, 1/32
- Modulation : Code Rate
QPSK : 1/2, 2/3, 3/4, 5/6, 7/8
16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8

Analog : Upper Heterodyne
4 Receiving system
Digital : COFDM, QAM
► DVB-T2
- Guard Interval(Bitrate_Mbit/s)
1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,
- Modulation : Code Rate
QPSK : 1/2, 2/5, 2/3, 3/4, 5/6
16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6

► DVB-C
- Symbolrate :
4.0Msymbols/s to 7.2Msymbols/s
- Modulation :
16QAM, 64-QAM, 128-QAM and 256-QAM

► DVB-S/S2
- Symbolrate
DVB-S2 (8PSK / QPSK) : 2 ~ 45Msymbol/s
DVB-S (QPSK) : 2 ~ 45Msymbol/s
- 9 iterbi
DVB-S mode : 1/2, 2/3, 3/4, 5/6, 7/8
DVB-S2 mode : 1/2, 2/3, 3/4, 3/5, 4/5, 5/6, 8/9, 9/10
5 Input Voltage AC 100 ~ 240V 50/60Hz

-7- Copyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes.
5. External Input Format
5.1. 2D Mode
5.1.1. Component input(Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed
1 720*480 15.73 59.94 13.50 SDTV ,DVD 480i
2 720*480 15.75 60.00 13.5135 SDTV ,DVD 480i
3 720*576 15.62 50.00 13.50 SDTV 576i
4 720*480 31.47 59.94 27.00 SDTV 480p
5 720*480 31.50 60.00 27.027 SDTV 480p
6 720*576 31.25 50.00 27.00 SDTV 576p
7 1280*720 44.96 59.94 74.175 HDTV 720p
8 1280*720 45.00 60.00 74.250 HDTV 720p
9 1280*720 37.50 50.00 74.250 HDTV 720p
10 1920*1080 28.12 50.00 74.250 HDTV 1080i
11 1920*1080 33.72 59.94 74.175 HDTV 1080i
12 1920*1080 33.75 60.00 74.250 HDTV 1080i
13 1920*1080 56.25 50.00 148.50 HDTV 1080p
14 1920*1080 67.43 59.94 148.350 HDTV 1080p
15 1920*1080 67.50 60.00 148.50 HDTV 1080p

5.1.2. HDMI Input (PC)

No Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed Remarks
1 640*350 31.46 70.09 25.17 EGA
2 720*400 31.46 70.08 28.32 DOS
3 640*480 31.46 59.94 25.17 VESA(VGA)
4 800*600 37.87 60.31 40.00 VESA(SVGA)
5 1024*768 48.36 60.00 65.00 VESA(XGA)
6 1152*864 54.34 60.05 80.00 VESA
7 1360*768 47.71 60.01 85.00 VESA(WXGA)
8 1280*1024 63.98 60.02 109.00 VESA(SXGA) FHD, UHD only
9 1920*1080 67.50 60.00 158.40 WUXGA(CEA 861D) FHD, UHD only
10 3840*2160 54.00 24.00 297.00 UDTV 2160P UHD only
11 3840*2160 56.25 25.00 297.00 UDTV 2160P UHD only
12 3840*2160 67.50 30.00 297.00 UDTV 2160P UHD only
13 4096*2160 53.95 23.97 296.703 UDTV 2160P UHD only
14 4096*2160 54.00 24.00 297.00 UDTV 2160P UHD only

-8- Copyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes.
5.1.3. HDMI Input (DTV)
No Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed Remarks
1 640*480 31.46 59.94 25.13 SDTV 480P
2 640*480 31.50 60.00 25.13 SDTV 480P
3 720*480 15.73 59.94 13.50 SDTV, DVD 480I(525I)
4 720*480 15.75 60.00 13.51 SDTV, DVD 480I(525I) Spec. out but display
5 720*576 15.62 50.00 13.50 SDTV, DVD 576I(625I) 50Hz
6 720*480 31.47 59.94 27.00 SDTV 480P
7 720*480 31.50 60.00 27.03 SDTV 480P
8 720*576 31.25 50.00 27.00 SDTV 576P
9 1280*720 44.96 59.94 74.18 HDTV 720P
10 1280*720 45.00 60.00 74.25 HDTV 720P
11 1280*720 37.50 50.00 74.25 HDTV 720P
12 1920*1080 28.12 50.00 74.25 HDTV 1080I
13 1920*1080 33.72 59.94 74.18 HDTV 1080I
14 1920*1080 33.75 60.00 74.25 HDTV 1080I
15 1920*1080 26.97 23.97 63.30 HDTV 1080P
16 1920*1080 27.00 24.00 63.36 HDTV 1080P
17 1920*1080 33.71 29.97 79.12 HDTV 1080P
18 1920*1080 33.75 30.00 79.20 HDTV 1080P
19 1920*1080 56.25 50.00 148.50 HDTV 1080P
20 1920*1080 67.43 59.94 148.35 HDTV 1080P
21 1920*1080 67.50 60.00 148.50 HDTV 1080P
22 3840*2160 53.95 23.98 297.00 UDTV 2160P UHD only
23 3840*2160 54.00 24.00 297.00 UDTV 2160P UHD only
24 3840*2160 56.25 25.00 297.00 UDTV 2160P UHD only
25 3840*2160 61.43 29.97 297.00 UDTV 2160P UHD only
26 3840*2160 67.50 30.00 297.00 UDTV 2160P UHD only
27 3840*2160 112.50 50.00 594.00 UDTV 2160P(DVB) UHD only
28 3840*2160 134.86 59.94 593.41 UDTV 2160P UHD only
29 3840*2160 135.00 60.00 594.00 UDTV 2160P UHD only
30 4096*2160 53.95 23.98 297.00 UDTV 2160P UHD only
31 4096*2160 54.00 24.00 297.00 UDTV 2160P UHD only
32 4096*2160 56.25 25.00 297.00 UDTV 2160P UHD only
33 4096*2160 61.43 29.97 297.00 UDTV 2160P UHD only
34 4096*2160 67.50 30.00 297.00 UDTV 2160P UHD only
35 4096*2160 112.50 50.00 594.00 UDTV 2160P(DVB) UHD only
36 4096*2160 134.86 59.94 593.41 UDTV 2160P UHD only
37 4096*2160 135.00 60.00 594.00 UDTV 2160P UHD only

-9- Copyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes.
5.2. 3D Mode - DTV/HDMI/USB
5.2.1. RF Input
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed 3D input proposed mode
2D to 3D, Side by Side,
1 1280*720 37.50 50 74.25 HDTV 720P
Top & Bottom
2D to 3D, Side by Side,
2 1920*1080 28.13 50 74.25 HDTV 1080I
Top & Bottom

- 10 - Copyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes.
 SOFTWARE UPDATE
1. USB 2. NSU
(1) Insert the USB memory Stick to the USB port. (1) Menu -> All Settings -> General -> About This TV
(2) Automatically detect the SW Version and show the below
message

(2) C lick [CHEK FOR UPDATES] : system check newest

(3) Click [YES]: initiate the download and install of the update. version

(4) Click [Check Now]: move to “About This TV” page for (3) Click [DOWNLOAD AND INSTALL]
update. (4) TV is updating
(5) TV is updating.

(5) After finished the update, below Pop-up appear

(6) After finished the update, below Pop-up appear.

(6) Turn OFF the TV and On. Check the updated SW Version
and Tool Option
(7) Click [Yes] : TV will be DC OFF -> ON
(8) After TV turned on, Check the updated SW Version and
Tool Option.

- 11 - Copyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes.
 DDR3 2133 X 32 X_TAL
(512MB X 2EA) 27MHz
Hynix 20nm

K3L only. (K3Lp 256MB x 2ea SoC �엲 嬥)

P_TS_IN
DDR3 2133 X 32
M1 M0 CI Slot
(512MB X 2EA) P_TS_OUT

SMARTCARD_I/F B-CAS
EPI block B-CAS B-CAS
controller (JAPAN)
Level EPI PMIC I2C 6
shifter (SW50B3A) I2C 4 NVRAM (256Kb)

eMMC (4GB)
Vx1 51P (8 lane) : LGD 60/65/70/75 Toshiba 15nm
Vx1 / EPI Realtek OCP K3L only
1. K3Lp Block Diagram (External)

EPI 60Px2 (3G, 6 lane) : LGD 43/49/55 USB1 (3.0)

I2C 6
CEDS 68Px2 (1.5G, 12 lane) : BOE K3Lp USB2 (2.0)
OCP
USB3 (2.0)
HDMI1
I2S Out

- 12 -
MAIN Audio AMP HDMI2(ARC) HDMI 6G 4
(DTA2010M) I2C 4
HDMI3
HDMI4 (EEPROM)
TS
Sub Micom TS
X_TAL I2C 1 T2/C/S2 NIM tuner
(RENESAS
BLOCK DIAGRAM

32.768KHz R5F100GEAFB)

Copyright ©
Demode

USB_WIFI
SPDIF OUT

CVBS/YPbPr

ETHERNET
I2C 2 (T/C/S/T2/S2)

RF IC
IR / KEY(1Key)
LOGO LIGHT(Ready) LNB
MAX323

AMP

(DT1805)
WIFI/BT Combo Air/
DVB-S
MTK IC Cable

Only for training and service purposes.

SPDIF

LAN REAR(H)
Sub Assy
H/P
RS-232

AV/COMP

LG Electronics. Inc. All rights reserved.

2. K3Lp Block Diagram (Internal)

- 13 - Copyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes.
 K3L
Panel
3840x2160@120p

[EPI_TX0~EPI_TX15] Vx1 8Lane 41P

3.Vx1 Block Diagram

- 14 -
VX1_MSE

Copyright ©
AGP CTL
AGP_CTL

[EPI_TX0~EPI_TX15] Vx1 8Lane 51P

BIT[2/1/0] UD_V x 1 Lane

0/0/0 4K@120P(16Lanes) [GPIO_5_VBY_LOCK/EPLOCK] LOCKAn

[GPIO_4_VBY_HTPD/TCON_14]
0/0/1 4K@60P(8Lanes) HTPDA
HTPDAn
[GPIO_2_TCON_SCL/TCON_9] 2C SCL6/SDA
2C
I2C_SCL6/SDA6
0/1/0 5K@120P(20Lanes) [GPIO_1_TCON_SDA/TCON_

Only for training and service purposes.

5][GPIO08_DATA_FORMAT_0] DATA_FORMAT_0/1
0/1/1 OLED ULTRA HD
[GPIO09_DATA_FORMAT_1]
1/0/0 FHD@120 (4Lane)

1/0/1 FHD@60 (4Lane)

1/1/0 Reserved

1/1/1 Reserved

LG Electronics. Inc. All rights reserved.

H
HW Option TBD
 +3.3V_NORMAL
4. Tuner
+ DEMOD_CORE +3.3V_NORMAL

17Y Tuner [B1_+3.3V_RF] 3

1.8K ȳ
[+3.3V_DEMOD_TU] 11
[B3_+1.2V_DEMOD] 13 33 ȳ 5 [SCL]
LNB
6 [SDA]
LNB_TX IC7001
[LNB_TX1] 12 8 [TONECTRL]
[LNB] 26(Full NIM) / [LNB] 26(Half NIM) LNB_OUT 2 [LNB] DT1805
[SCL_RF] 1
[SDA_RF] 2 33 ȳ
I2C_SCL2 AA5 / Y4 [GPIO52_TUNER0_SCL]
I2C_SDA2 AA6 / AA4 [GPIO51_TUNER0_SDA]
[SCL_DEMOD] 36 33 ȳ
[SDA_DEMOD] 35 TU_JP AF4 [GPIO54_TUNER1_SCL] Reserved
Reserv Tuner_only
r ed for Dual Tuner_on
nly
l K3L
AF5 [GPIO53_TUNER1_SDA]
A

[M_ERROR] 14 FE_DEMOD1_TS_ERROR
FE_DEMOD1_TS_CLK AB5 / AB2 [GPIO57_TP0_CLK]
[M_MCLK] 15
FE_DEMOD1_TS_SYNC AB6 / AA3 [GPIO56_TP0_SYC]
[M_SYNC] 16
FE_DEMOD1_TS_VAL AB4 / AC2 [GPIO58_TP0_VAL]
[M_VALID] 17

FE_DEMOD1_TS_DATA [0-7]
FE_DEMOD1_TS_DATA[0-7] 18-25 [GPIO59~66_TP0_D0~TP0_D7]
FE_DEMOD2_TS_ERROR
[S_ERROR] 28 FE_DEMOD1_TS_1_DATA[4]
[S_MCLK] 33 FE_DEMOD1_TS_1_DATA[3]
[S_SYNC]30 FE_DEMOD1_TS_1_DATA[2]
[S_VAL] 31
K3Lp

- 15 -
FE_DEMOD1_TS_1_DATA[1] RTK
[S_DATA]32

+2.5V_Normal

[B4_+2.5V_DEMOD] 29

Copyright ©
TU_JAPAN /TU_RESET2
[/TU_RESET2_TU] 34 AA3 / M2 [VINGP_DEMOD_RESET]
/TU_RESET1
[/TU_RESET1_TU] 10 JAPAN_OPT AB2 / L1 [VINRP_TUNER0_REST]

IF_S_IP
[IF_S_IP_MAIN] 59 AF3 / W2 [IP_1]
IF_S_IN
[IF_S_IN_MAIN] 60 AG1 / W3 [IN_1]
IF_S_QP
[IF_S_QP_MAIN] 62 AG2 / Y2 [QP_2]
[IF_S_QN_MAIN] 61 IF_S_QN AG3 / Y3 [QN_2]

IF_P
[IF_P_TU] 8
AE1 / U2 [IF_P]
IF_N

Only for training and service purposes.

[IF_N_TU] 7
AE2 / U3 [IF_N]
[TU_SIF] 6 TUNER_SIF (OPT : TU_EXT_ATV)
AE3 / V2 [SIF]
[TU_CVBS_TU] 4 TU_CVBS (OPT : TU_EXT_ATV)
Y5 / R5 [VIN10P]
[IF_AGC_TU] 5 IF_AGC
Y4 / W4 [GPIO55_RF_IF_AGC1]

LG Electronics. Inc. All rights reserved.

 AV/COMP

AV1_CVBS_DET
[H5] AIO1L_AV1_CVBS_DET
COMP1/AV1/DVI_L_IN [M5] AI1L
SPDIF_OUT
COMP1/AV1/DVI_R_IN [M4] AI1R GPIO_6_SPDIF_OUT_0 [E3] SPDIF

[N3] VIN 3P
COMP1_Pb [P3] VIN 5P
COMP1_Pr [P2] VIN 4P
COMP1_Y/CVBS [H4] AI3R_COMP1_DET AUD_SCK
GPIO021_SCLK[C2] [38] CLK_I
5. Video & Audio IN/OUT

COMP1_DET AUD_LRCK SPK_L+ / L-

GPO_0_I2S_WCLK/SPDIF_OUT_1[D13] [8] WCK
AUD_LRCH [30, 33] LPF
GPIO15_D0 [B3] [7] SDATA SPK L
AI2R_AMP_SDA [G4] I2C_SDA/SCL_AMP MAIN AMP
[10,11]
AI3L_AMP_SCL [G5] DTA2010M
AMP_RESET_N SPK_R+ / R-
AI2L_AMP_RESET_N [F5] [36] (IC5800)
[18, 21] LPF SPK R
[12]

Realtek

- 16 -
TU_SIF K3Lp
[V2] SIF
AMP_MUTE

22

Tuner
MICOM

Copyright ©
26

SIDE_HP_MUTE

HP_LOUT_AMP
H/P AMP HP_ROUT_AMP
GPIO_35_HPOL [N5] HP_L/ROUT TPA6138A2
GPIO_36_HPOR [N4] LPF H/P Jack
(IC6300)
AIO2L_HP_DET[J5]
HP_DET
ST_GPIO_23_H0_ARC[AG13]

Only for training and service purposes.

HDMI_ARC
HDMI2

LG Electronics. Inc. All rights reserved.

 HDMI2.0_1_5V_DET
ST_GPIO_19_5V_DET_HDMI_0
HDMI2.0_1_HPD
ST_GPIO_18_H0_HPD
ST_GPIO_21_H0_SCL DDC_SCL1 / DDC_SDA1
ST_GPIO_20_H0_SDA
TMDS1 - D0/D1/D2/CLK
P0_CKN/P_RGB_N/P
6. HDMI 2.0 Block

HDMI1
HDMI_CEC
HDMI2.0_2_5V_DET
ST_GPIO_15_5V_DET_HDMI_1
HDMI2.0_2_HPD
ST_GPIO_14_H1_HPD
ST_GPIO_17_H1_SCL DDC_SCL2 / DDC_SDA2
ST_GPIO_16_H1_SDA

ST_GPIO_23_H0_ARC HDMI_ARC
TMDS2 - D0/D1/D2/CLK
P1_CKN/P_RGB_N/P HDMI2 with ARC

HDMI_CEC
REALTEK
HDMI2.0_3_5V_DET

- 17 -
K3Lp ST_GPIO_10_5V_DET_HDMI_2
HDMI2.0_3_HPD
ST_GPIO_11_H2_HPD
ST_GPIO_13_H2_SCL DDC_SCL3 / DDC_SDA3
ST_GPIO_12_H2_SDA
TMDS3 - D0/D1/D2/CLK
P2_CKN/P_RGB_N/P
HDMI3

Copyright ©
HDMI_CEC
HDMI2.0_4_5V_DET
ST_GPIO_07_5V_DET_HDMI_3
HDMI2.0_4_HPD
ST_GPIO_06_H3_HPD
ST_GPIO_09_H3_SCL DDC_SCL4 / DDC_SDA4
ST_GPIO_08_H3_SDA
TMDS4 - D0/D1/D2/CLK
P3_CKN/P_RGB_N/P
HDMI4

Only for training and service purposes.

MICOM
R5F100GEAFB
(IC3000)

LG Electronics. Inc. All rights reserved.

 +5V_USB2.0_3
USB_OCD3 [AG22] DCDC OCP
USB_CTL3 [AH19] BD2242G
(IC4700)

DCDC OCP +5V_USB2.0_2

USB_OCD2 [AJ18]
BD2242G
USB_CTL2 [AG20]
(IC4501)

USB2.0_2_DM / DP
HSDM1[AM24] USB1
HSDP1[AL24]

HSDM2[AM25] USB2.0_3_DM / DP
USB2
HSDP2[AL25]

HSDM0 [G1] WIFI_DM / DP

Realtek HSDP0 [G2]
5 WOL/WIFI_POWER_ON
K3Lp 7 BT_RESET
Wafer 9 BT_WAKEUP_DEVICE
(P4000)10 BT_WAKEUP_HOST

- 18 -
19 IR
7. USB / WIFI / M-REMOTE / UART(Debug)

20
LED_R
23
24 KEY2
DEBUG UART DEBUG_RX / TX [AH5] ST_GPIO_02_VGA_SDA KEY1
Wafer [AG5] ST_GPIO_01_VGA_SCL
(P201)
PHONE JACK

Copyright ©
SOC_RX / TX RS232C
ST_GPIO_25_UART0/1[AH13]
ST_GPIO_24_UART0/1[AG14] (IC7200) DOUT1
RIN1
Wafer
(P200)
MICOM
R5F100GEAFB
SOC_RX / TX (IC3000)

Only for training and service purposes.

LG Electronics. Inc. All rights reserved.
 EPI / CEDS only

SW50B3A(LGD) I2C_SCL6
SW5253A(BOE) [GPIO_2_TCON_SCL/TC
33 ȳ I2C_SDA6 ON_9]
8. K3Lp I2C Map

EPI PMIC [GPIO_1_TCON_SDA/TC

ON_5]

1.8k ȳ
1.8k ȳ
I2C_SCL4
[AI3L_AMP_SCL] DTA2010M
I2C_SDA4 100ȳ
[AI2R_AMP_SDA] AMP
+3.3V_NOR

1.8k ȳ
1.8k ȳ
33 ȳ FT24C256A-ESR-T
K3Lp NVRAM

+3.3V_NOR

- 19 -
I2C_SCL_1 I2C_SCL2

Copyright ©
[ST_GPIO_27_MICRO_SCL][GPIO_52_TUNER0_SCL]
R5F100GEAFB#30 DT1805
33 ȳ I2C_SDA_1 [ST_GPIO_26_MICRO_SDA] I2C_SDA2 33 ȳ
MICOM [GPIO_51_TUNER0_SDA] LNB

33 ȳ
1.8 k ȳ
1.8 k ȳ

1.8k ȳ
1.8k ȳ
+3.3V_NOR TDJN-G501D
+3.5V_ST
TUNER

Only for training and service purposes.

LG Electronics. Inc. All rights reserved.
 INSTANT_BOOT [ST_GPIO_00_WOL_WAKE_UP]
MICOM WOL/ETH_POWER_ON [ST_GPIO_05_IR_RX]
SOC_RESET [RST]
9. GPIO(K3Lp)

VID_CORE
[VINBN_VIDCORE] CORE DCDC
HW option BIT0~4 [AH16,AH17,AG16,AG17,AJ16]
ADC 1~5
/TU_RESET1
[VINRP_TUNER0_REST]
/TU_RESET2 Tuner
[VINGP_DEMOD_RESET]

AMP_RESET_N
[AI2L_AMP_RESET_N] Audio AMP

PCM_RESET
[GPIO_119_PC_RST]
CI_SLOT CI power PCM_5V_CTL [AIO2R_CMD_VCC_SC] COMP1_DET
enable control [AI3R_COMP1_DET] Component/AV Jack
AV1_CVBS_DET
[AIO1L_AV1_CVBS_DET]

K3Lp
LOCKAn HP_DET

- 20 -
[GPIO_5_VBY_LOCK/EPLOCK] [AIO2L_HP_DET] H/P Jack
Panel

SMARTCARD_PWR_SEL
[VDBSOUT_SC_PWR_SEL] Japan B-CAS

Copyright ©
EPI_GCLK
[GPO_1_TCON_I2C_EN/TCON_2]
PMIC EPI_MCLK [GPIO_4_VBY_HTPD/TCON_14]
PMIC_RESET [GPIO7_PMIC_RESET]

PWM_DIM [GPIO010_PWM_DIM_0]
PWM_DIM2 [GPO011_PWM_DIM_1]
[GPIO_79_USB_PWR0_SD_WP] USB_CTL2
L/DIM_M0_SCLK [GPO012_LD_SPI1_SCK] /USB_OCD2 USB2_2.0 OCP USB2
POWER [RTC_XO_USBOCD0]
L/DIM_M0_MOSI [GPO013_LD_SPI1_SDO]
L/DIM_M0_VS [GPO014_LD_SPI1_SYNC] [GPIO_78_USB_PWR1_SD_CD] USB_CTL3

Only for training and service purposes.

/USB_OCD3 USB3_2.0 OCP USB3
[RTC_XI_USBOCD1]

LG Electronics. Inc. All rights reserved.

 13V-5V NORMAL DCDC 3.3V NORMAL DCDC
I2C_SCL_MICOM / I2C_SDA_MICOM POWER_ON/OFF1
[P17/TI02/TO02] 15 IC2500 IC2300
1 [P60/SCLA0] / 2 [P61/SDAA0]
WOL/ETH_POWER_ON TPS564208 TPS563208
RTK ˀ K3L 13 [P50//INTP1/SI11/SDA11]
IC100 SOC_RESET 18 [P14/RXD2/SI20/SDA20] 1.5V DCDC
35 [P00/TI00/TXD1] IC2303
INSTANT_BOOT [P01/TO00/RXD1] 34 POWER_ON/OFF2_4 SYVL83
SYSTEM_DEBUG 33 [P130]
POWER_ON/OFF2_3 0.95V CORE/CPU DCDC 1.8V eMMC LDO 1.2V Demod LDO
[P72/KR2/SO21] 9 IC2302 IC2301 IC6900
RS232C SOC_RX/TX 20 [P12/SO00/TXD0/TOOLTXD] TPS51362RVER TJ4320GDP-ADJ TJ4320GDP-ADJ
CONTROL I/F
IC7200 21 [P11/SI00/RXD0/TOOLRXD/SDA00]

AMP OPT0 NON LOGO LCD/LOGO LCD

AMP_MUTE
IC5800 22 [P10/SCK00/SCL00] [P25/ANI5] 27
NON LOGO OLED/LOGO OLED
DTA2010M [P24/ANI4] 28 MODEL1_OPT_0/1/2/ 3 OPT1 TV-NON EPI/BOX/TV EPI/BOX
1.0V DCDC Eth STDBY WOL_CTL [P23/ANI3] 29
OTP2 RESERVED/ RESERVED/9_KEY/9_KEY_NON
IC2307 17 [P15/PCLBUZ1/SCK20/SCL20] [P22/ANI2] 30
OPT3 M16/RTK/H15
TLV62565DBVR
HP AMP SIDE_HP_MUTE
IC6300 26 [P26/ANI6] MICOM_DEBUG MICOM DEBUG 4P
[P40/TOOL0] 39
TPA6138A2 P3000
[RESET] 40 MICOM_RESET
10. GPIO(MICOM – RENESAS)

12507WS-04L
RESET IC POWER_DET
14 [P51/INTP2/SO11] MICOM X-TAL
IC1300 [P124/XT2/EXCLKS] 41
X3000
[P123/XT1] 42
32.768KHz

HDMI 1 / 2 / 3 /4 HDMI_CEC 7 [P74/KR4/INTP8/SI01/SDA01]

JK3101/JK3102/JK3103/JK3104

INV_CTL 4 [P63] EWBS_TUNER

[P16/TI01/TO01/INTP5] 16 EWBS_TU

- 21 -
POWER WAFER MODE_SELECT_PWM1 5 [P31/TI/03/TO03/INTP4] TUxxxx
P1001 36 [P140/PCLBUZ0/INTP6]
RL_ON
EDID_WP HDMI EXT EDID
[P146] 23 IC3401
IR 6 [P75/KR5/INTP9/SCK01/SCL01] BR24G02FJ
EYE_SCL / EYE_SDA 10 [P71/KR1/SI21/SDA21] / 11 [P70/KR0/SIK21/SCL21]
AM_MODE_DET_OLED
BT_WAKEUP_DEVICE 8 [P73/KR3/SO01] [P137/INTP0] 43

Copyright ©
IR / KEY/WIFI/BT WOL/WIFI_POWER_ON 12 [P30/INTP3/RTC1HZ/SCK11/SCL11]] T_CON_SYS_POWER_OFF_OLED
P4000 [P122/X2/EXCLK] 44
COMBO_RESET 24 [P147/ANI18]
BT_WAKEUP_HOST 25 [P27/ANI7] RETENTION_DISABLE
[P121/X1] 45
KEY1 / KEY2 31 [P21/ANI1/AVREFM] / 32 [P20/ANI0/AVREFP]
3D&L_DIM_EN
LED_R 38 [P41/TI07/TO07] [P62] 3 51P VX1 Wafer

GND WIFI_EN
37 [P120/ANI19] * Depending on Model
+3.5V WIFI

Only for training and service purposes.

GND
19 [P13/TXD2/SDA20]
+13V TO PANEL_VCC PANEL_CTL

LG Electronics. Inc. All rights reserved.

 K3L_DDR_0_ADDR_[0:14]
DDR3 IC400 DDR3 IC401
DC1_A [0:14] A[0:14] A[0:14]
11. DDR Block

DC1_CSB K3L_DDR_0_CON_CS 0
~CS K3L_DDR_0_CON_CS 1
DC1_CSB_1 ~CS
K3L_DDR_0_CON_BA[
DC1_BA [0:2] BA[0:2] BA[0:2]
0:2]
K3L_DDR_0_CLK_ P/N
DC1_CLK / CLKB CK / ~CK CK / ~CK
K3L_DDR_0_CON_CKE
DC1_CKE CKE CKE
K3L_DDR_0_CON_ODT
K3Lp DC1_ODT ODT ODT
K3L_DDR_0_CON_RA 1k ohm

- 22 -
DC1_RAS / CAS SN /CASN RAS/CAS RAS/CAS
K3L_DDR_0_CON_WEN
DC1_WE WEN WEN

Copyright ©
K3L_DDR_0_DQS_0_P/N
DC1_DQS0 / DQS0B LDQS/~LDQS
K3L_DDR_0_DQS_1_P/N
DC1_DQS1 / DQS1B UDQS/~UDQS
K3L_DDR_0_DQS_2_P/N
DC1_DQS2 / DQS2B LDQS/~LDQS
K3L_DDR_0_DQS_3_P/N
DC1_DQS3 / DQS3B UDQS/~UDQS

Only for training and service purposes.

K3L_DDR_0_DQ [0:15]
DC1_DQ [0:15] DQ[0:15] DQ[0:15]
K3L_DDR_0_DQ [16:31]
DC1_DQ [16:31]

LG Electronics. Inc. All rights reserved.

 DCDC LDO FET

MICOM
3.5V ST
4A IR hšš˅ 
IC2305
RS-232

FET(Q4101) WiFi Module

L311 SoC(STB3V3_1)
12. K3Lp Power Block

FET(Q203) SoC(STB3V3_2)

L6504 Tuner(+3.5V_ST)

1V WOL
1A SoC(Ethernet)
IC2307
FET(Q202) L300 SoC(USB1V0)

L302 SoC(LV1V0)

L305 SoC(HDRX1V0)
D13.2V
1.5V DDR

- 23 -
3.5A SoC(DDR)
IC2303
DDR3(IC401)
L400
DDR3(IC402)

FET(Q201) L303 SoC(LV1V5_1~2)

Copyright ©
0.75V, 1.5A DDR VTT
IC410

SoC(CPU1V0)
D1V0
10A
IC2302 SoC(C01V0)

PMIC(IC9200)

Only for training and service purposes.

L1100 FET(Q1101) Panel_VCC
SubPMIC(IC9300)

LG Electronics. Inc. All rights reserved.

 CI Detect
3.3V NORM
3A HP Amp
IC2300
NVRAM

SPDIF OUT

Pull up

L306 SoC(D3V3,A3V3)
13. K3Lp Power Block2

FET(Q302) SoC(HDRX3V3)

1.8V
2A L2305 SoC(EMMC1V8)
IC2301 EMMC VCCQ

L2304 EMMC VCC

L5801 Audio Amp

L6401 BCAS
D13.2V
Demod
Core Tuner Demod
2A

- 24 -
IC6900
*Japan Only
2.5V
2A Tuner 2.5V
IC6800
L6505 Tuner (+3.3V_TU)

Copyright ©
L6503 Tuner (+3.3V_TU)

L7001 Tuner (LNB)

USB1 OCP
5V NORM
4A USB2 OCP
IC2500
EDID EEPROM

CI OCP & CI IF

Only for training and service purposes.

L6400 BCAS(Japan)

A13.2V Audio Amp

LG Electronics. Inc. All rights reserved.

 EXPLODED VIEW (SET)
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

400

910

900
800

810

120
121
530

570
411

500
521

700
540
LV1

A9
820

A10
AR2
200P

ARC1
200T

AR1
200A

- 25 - Copyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes.
 EXPLODED VIEW (MODULE)
IMPORTANT NOTICE

MRC use only

* MRC : Module Repair Center

Optical Sheet
200PPR

POL(Rear)
200SR2

200SR1
Rear Side
200P

200SL2

Ass’y
Panel
200PF
200SL1
200PPF

200PC

POL(Front)

- 26 - Copyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes.
 DISASSEMBLY GUIDE
1. Disassemble Stand-screw

M4*20 4EA

- Detach the stand.

2. Disassemble screw

M3*5.5 13EA
M4*10 6EA

-put up the back cover.

- 27 - Copyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes.
3. Disassemble screw

-Detach the wafer.

M3*5.5 4EA

-Detach the cable.(blue and black)

4. Disassemble Bottom Cover, and Wifi PCBA

-.put up the Bottom cover.

- 28 - Copyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes.
5. Disassemble screw

Detach the wafer.

M3*5.5 15EA

6. Disassemble IR

push

-push side and raise up.

-pushing red point and pull out side.

- 29 - Copyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes.
7. Disassemble screw
M5*20 4EA

- 30 - Copyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes.